CN106532413A - Heat pipe radiator for laser and assembling method - Google Patents
Heat pipe radiator for laser and assembling method Download PDFInfo
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- CN106532413A CN106532413A CN201611192704.9A CN201611192704A CN106532413A CN 106532413 A CN106532413 A CN 106532413A CN 201611192704 A CN201611192704 A CN 201611192704A CN 106532413 A CN106532413 A CN 106532413A
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- heat sink
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- radiating fin
- heat pipe
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Links
- 238000000034 method Methods 0.000 title claims description 28
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 29
- 239000000741 silica gel Substances 0.000 claims abstract description 29
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 29
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 23
- 239000004519 grease Substances 0.000 claims abstract description 21
- 238000007789 sealing Methods 0.000 claims description 24
- 238000003825 pressing Methods 0.000 claims description 5
- 238000007790 scraping Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000002775 capsule Substances 0.000 claims 1
- 230000005540 biological transmission Effects 0.000 abstract description 3
- 230000017525 heat dissipation Effects 0.000 description 19
- 230000003287 optical effect Effects 0.000 description 6
- 238000009434 installation Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000002918 waste heat Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/0405—Conductive cooling, e.g. by heat sinks or thermo-electric elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
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- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a heat pipe radiator for a laser. The heat pipe radiator comprises heat pipes, a radiating fin, fans, laser connecting heat sinks and a radiating fin connecting heat sink, wherein the heat pipe comprises a hot end and a cold end which are arranged in a mutual perpendicular manner, the hot end is fixed on a laser heat sink connected with the laser through the laser connecting heat sink, the cold end is fixed on the radiating fin through the radiating fin connecting heat sink, and the cold end and a contact surface of the radiating fin are provided with a heat conducting silica gel pad therebetween; contact surfaces of the laser connecting heat sinks and the radiating fin connecting heat sink with the heat pipes are uniformly coated with heat conducting silicone grease; the radiating fin connecting heat sink is provided with a threaded hole, the radiating fin connecting heat sink is tightened through a screw on the radiating fin so as to enable the heat conducting silica gel pad to be sufficiently clamped, and heat of the heat pipes is conducted to the radiating fin; and the fans are located above the radiating fin. The heat pipe radiator disclosed by the invention not only enables heat of the laser to be conducted outside a sealed cabin through the heat pipes, but also avoids a problem of temperature gradient in the heat pipe transmission process because of close contact among the devices at the same time.
Description
Technical Field
The invention relates to the technical field of laser heat dissipation, in particular to a heat pipe radiator for a laser and an assembling method thereof.
Background
The laser is used as an active light source for military photoelectric detection, has wide application prospect in the fields of target positioning and orientation, distance measurement, photoelectric interference and the like, and is usually arranged in platforms such as a photoelectric turntable, a nacelle and the like. In order to be able to adapt to the platform of the turntable and the nacelle, the volume and weight are strictly required. Therefore, the laser usually adopts a non-water-cooling heat dissipation method, and the commonly used non-water-cooling heat dissipation method is a method of adding a fan to a heat dissipation fin, namely, the heat dissipation fin is tightly combined with the heat dissipation sink of the laser, absorbs the heat conducted to the heat sink when the laser works, and dissipates the heat to the environment around the laser through the forced convection of the fan.
For conventional open environments, the heat sink plus fan heat dissipation can meet the high temperature (typically up to 65 ℃) requirements of the laser. However, if the laser works in a closed cabin (such as a nacelle and a box) for a long time, the heat dissipated into the closed cabin by the laser will cause the temperature in the closed cabin to rise rapidly even exceeding the limit service temperature (65 ℃) of the laser due to the very poor heat exchange condition between the closed cabin and the external large environment, and then the laser cannot work continuously. Even if the laser can operate for a short period of time (before the temperature rises to 65 c), the heat generated by the laser is very detrimental to the proper operation of other equipment in the cabin. However, for a laser used in a closed cabin, how to conduct heat to the outside of the closed cabin is a technical problem to be solved urgently at present.
Disclosure of Invention
The invention provides a heat pipe radiator for a laser and an assembling method thereof, and aims to solve the problem of how to conduct heat of the laser to the outside of a closed cabin when the laser is used in the closed cabin.
In order to achieve the above object, the present invention provides a heat pipe radiator for a laser, comprising a heat pipe, a heat sink, a fan, a laser connecting heat sink and a heat sink connecting heat sink: wherein,
the heat pipe comprises a hot end and a cold end which are perpendicular to each other, the hot end is fixed on a laser heat sink connected with the laser through the laser connecting heat sink, the cold end is fixed on the radiating fin through the radiating fin connecting heat sink, and a heat-conducting silica gel pad is arranged between the contact surfaces of the cold end and the radiating fin; the contact surfaces of the laser connecting heat sink and the radiating fin connecting heat sink and the heat pipe are uniformly coated with heat-conducting silicone grease; the heat-conducting silica gel pad is fully clamped by tightening the heat-conducting silica gel pad through a screw on the heat radiating fin so as to conduct heat of the heat pipe to the heat radiating fin; the fan is located above the heat sink.
Optionally, the error of the perpendicularity plane of the hot end and the cold end is less than 0.1 mm.
Optionally, the flatness error of the hot end is less than 0.15 mm.
Optionally, the laser connection heat sink and the heat sink connection heat sink are made of pure aluminum or red copper materials.
Optionally, the heat pipe is in the shape of an arc tube with the contact surface of the laser connecting heat sink and the heat sink connecting heat sink, and is in the shape of a plane with the contact surface of the laser heat sink and the heat sink.
Optionally, the heat dissipation fin is a cylindrical surface, and the roughness of the cylindrical surface is not greater than 1.6 um.
Optionally, the thickness of the heat-conducting silicone grease is 0.1 mm.
Optionally, the heat pipe radiator further comprises a bracket and a top pillar; the support is positioned at the lower end of the radiating fin connected with the heat sink, and the radiating fin connected with the heat sink is fixed on the support through the top column.
Optionally, a sealing pressing ring and a sealing ring are arranged on the heat sink, and are used for enabling the heat sink to be in sealing contact with the sealed cabin.
The invention also provides an assembling method, which is used in the heat pipe radiator and comprises the following steps:
step 1, grinding and matching contact surfaces of a heat pipe and a laser heat sink, a laser connecting heat sink and a radiating fin connecting heat sink so as to enable the heat pipe to be fully contacted with each heat sink;
step 2, coating heat-conducting silicone grease on the contact surface of each heat sink and the heat pipe, scraping the heat-conducting silicone grease to a uniform thin layer, fixing the hot end of the heat pipe on the heat sink of the laser, and connecting the laser with the heat sink and fixing the laser on the outer side of the heat pipe; before the hot end of the heat pipe is fixed, measuring the flatness of a plane in the hot end, adjusting the flatness to be less than 0.15mm, and wiping off redundant heat-conducting silicone grease overflowing from a gap;
and 3, mounting the laser heat sink provided with the heat pipe on the laser, assembling a radiating fin coated with heat-conducting silicone grease below the cold end to be connected with the heat sink, and mounting a support and a top column below the radiating fin to be connected with the heat sink.
Step 4, adhering a heat-conducting silica gel pad on the cold end;
step 5, placing the radiating fins above the cold ends, connecting and fastening the radiating fins and the radiating fins below the heat pipes with a heat sink, flattening and thinning the heat-conducting silica gel pads, and removing the extruded redundant heat-conducting silica gel pads on the planes of the cold ends;
step 6, fastening the radiating fins to the bracket, and rotating the top column until the radiating fins above the locking part are connected with a heat sink;
and 7, covering the sealing cabin cover, adjusting the position to be uniform with the gap of the cylindrical surface of the radiating fin, and sleeving a sealing ring and a sealing pressing ring on the cylindrical surface of the radiating fin.
The invention has the following beneficial effects:
the heat pipe radiator provided by the invention is respectively connected with the heat radiating fins and the laser heat sink at the cold end and the hot end of the heat pipe through the heat sink, the contact position of the heat sink and the heat pipe is coated with the heat conducting silicone grease, and the contact position of the heat radiating fins and the heat pipe is provided with the heat conducting silicone pad, so that the heat of the laser is conducted to the outside of the closed cabin through the heat pipe, and all devices are in close contact with each other, and the problem of temperature gradient in the heat pipe transmission process can be effectively solved.
The foregoing description is only an overview of the technical solutions of the present invention, and the embodiments of the present invention are described below in order to make the technical means of the present invention more clearly understood and to make the above and other objects, features, and advantages of the present invention more clearly understandable.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a heat pipe radiator for a laser according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a heat pipe heat sink mounted to a laser according to an embodiment of the present invention;
FIG. 3 is a schematic view of the heat pipe radiator integrally installed in the cabin according to the embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention comprises the appearance design of the heat pipe, the connecting and installing process of the heat pipe, the laser and the radiating fins, the supporting and adjusting process of the radiator, and the sealing process between the radiator and the sealed cabin body, thereby ensuring the heat dissipation, the light path stability and the sealing of the radiator.
Specifically, as shown in fig. 1 to fig. 2, the heat pipe radiator for a laser according to the embodiment of the present invention includes a heat pipe 1, a heat sink 2, a fan 3, a laser connection heat sink 4, and a heat sink connection heat sink 5; wherein,
the heat pipe 1 comprises a hot end and a cold end which are arranged vertically, and is used for conducting waste heat generated by the operation of the laser to the radiating fin 2 which is in contact with the outside; the hot end is fixed on a laser heat sink 7 connected with a laser 6 through a laser connecting heat sink 4, and the cold end is fixed on a radiating fin 2 through a radiating fin connecting heat sink 5; a heat-conducting silica gel pad 8 is arranged between the contact surfaces of the cold end and the radiating fin 2 and is used for ensuring the full contact between the heat pipe 1 and the radiating fin 2; the contact surfaces of the laser connecting heat sink 4 and the radiating fin connecting heat sink 5 and the heat pipe 1 are uniformly coated with heat-conducting silicone grease for ensuring that the heat pipe 1 is fully contacted with each heat sink; the radiating fin is connected with a threaded hole on the heat sink 5, and the radiating fin is tensioned through a screw on the radiating fin 2 to be connected with the heat sink 5, so that the heat-conducting silica gel pad 8 is sufficiently clamped, and the heat of the heat pipe 1 is conducted to the radiating fin 2; the fan 3 is disposed above the heat sink 2.
The heat pipe radiator provided by the invention is characterized in that the cold end and the hot end of a heat pipe 1 are respectively connected with a heat sink 2 and a laser heat sink 7 through the heat sink, meanwhile, heat-conducting silicone grease is coated at the contact position of the heat sink and the heat pipe 1, and a heat-conducting silicone pad 8 is arranged at the contact position of the heat sink 2 and the heat pipe 1, so that the heat of the laser is conducted to the outside of a closed cabin through the heat pipe 1, and meanwhile, all devices are in close contact with each other, and the problem of temperature gradient in the transmission process of the heat pipe 1 can be effectively solved.
Wherein, except that hot junction and cold junction among the heat pipe 1 set up mutually perpendicular, the straightness plane error that hangs down of hot junction and cold junction place plane need be less than 0.1mm, can guarantee like this that hot junction and cold junction can be in close contact with laser heat sink 7 and fin 2.
Optionally, the contact surfaces of the heat pipe 1 and the laser connecting heat sink 4 and the radiating fin connecting heat sink 5 are in the shape of an arc tube, and the contact surfaces of the heat pipe 1 and the laser heat sink 7 and the radiating fin 2 are in the shape of a plane.
Optionally, the thickness of the heat-conducting silicone grease coated on each heat sink is about 0.1 mm.
Optionally, each heat sink is made of a material with a high thermal conductivity coefficient, preferably pure aluminum or red copper.
Optionally, the flatness error of the hot end of the heat pipe 1 is less than 0.15mm, so as to solve the problem that the mounting stress generated by rigid connection of a heat pipe radiator affects the optical axis of the laser. In particular, the measurement can be made by a horizontal caliper.
In the above, the heat-conducting silica gel pad 8 is arranged between the cold end of the heat pipe 1 and the heat sink 2, and the flatness error of the heat pipe 1 is compensated by the deformation of the heat-conducting silica gel pad 8, so that the installation stress caused by the flatness error of the heat pipe 1 is effectively overcome.
Optionally, the appearance design of fin 2 is the face of cylinder, and the roughness less than or equal to 1.6um on the face of cylinder effectively guarantees the sealed between radiator and the cabin body, avoids great installation stress and influences the optical axis stability of laser instrument.
The heat pipe radiator is provided with a bracket 9 and a top column 10 below a radiating fin 2; the support 9 is located below the heat dissipation sheet 2, and after the heat dissipation sheet 2 is installed, the top column 10 is used for fixing the heat dissipation sheet to the heat sink 7 on the support 9, so that the heat pipe 1 and the heat dissipation sheet 2 are supported. The stability problem caused by the cantilever structure of the radiator is effectively solved by installing the support 9 and the top column 10 below the radiating fin 2.
The heat pipe radiator also comprises a sealing ring 11 and a sealing pressing ring 12. As shown in FIG. 3, when the laser with the heat pipe radiator is completely installed in place, a circular hole slightly larger than the heat sink 2 is formed in the cover plate of the cabin body of the sealed cabin 11, the circular hole is sleeved on the heat sink 2, the sealing ring 11 is sleeved on the cylindrical surface of the heat sink 2, and the sealing performance of the cabin body is guaranteed after the circular hole is tightly pressed.
The invention also provides an assembling method, which is used in the heat pipe radiator and specifically comprises the following steps:
step 1, grinding and matching the contact surfaces of a heat pipe 1 and a laser heat sink 7, a laser connecting heat sink 4 and a radiating fin connecting heat sink 5 to ensure that the heat pipe 1 is fully contacted with each heat sink;
in this step, since the heat pipe 1 includes the circular arc pipe surface and the flat surface; the two planes of the heat pipe 1 and the positions of the radiating fin connecting heat sink 5 and the laser heat sink 7, the laser connecting heat sink 4 and the radiating fin connecting heat sink 5 which are contacted with the two planes are ground and matched, so that the circular arc plane and the planes can be fully contacted. Of course, the present invention is not limited to the grinding fit, and any method that can make the two planes of the heat pipe 1 and the heat sink contact sufficiently by machining means is within the protection scope of the present invention.
Step 2, coating heat-conducting silicone grease on the contact surface of each heat sink and the heat pipe 1, scraping the heat-conducting silicone grease to a uniform thin layer, fixing the hot end of the heat pipe 1 on a laser heat sink 7, and fixing a laser connecting heat sink 4 on the outer side of the heat pipe 1; before the hot end of the heat pipe 1 is fixed, the flatness of the middle plane of the hot end is measured, the flatness is adjusted to be less than 0.15mm, and redundant heat-conducting silicone grease overflowing from the gap is wiped.
In this step, for the heat sink with the heat pipe 1 in planar contact, a blade scraping manner can be used so that the uniform thin layer is less than 0.1 mm. And for the heat sink contacted with the arc surface of the heat pipe 1, the arc surface can be scraped to a uniform thin layer by using a cylindrical tool. The laser connecting heat sink 4 is fixed outside the heat pipe 1, and can be fastened by screws.
The flatness of the hot end plane of the heat pipe 1 can be measured by a horizontal caliper. The flatness precision is adjusted to be not limited to 0.15mm, and when two or more heat pipes 1 are used simultaneously, the method for detecting and adjusting the flatness precision between the heat pipes 1 through various detection devices is within the protection scope of the invention.
And 3, mounting the laser heat sink 7 provided with the heat pipe 1 on the laser, assembling a radiating fin coated with heat-conducting silicone grease below the cold end to connect with the heat sink 5, and mounting a support 9 and a top column 10 below the radiating fin to connect with the heat sink 5.
In this step, the support 9 with the top post 10 is mounted in place before the laser is placed in the tank and the laser is then loaded into the tank in the corresponding position.
And 4, mounting a heat-conducting silica gel pad 8 on the upper plane of the cold end of the heat pipe 1, wherein the size of the heat-conducting silica gel pad 8 is 3-5 mm smaller than that of each of the four sides of the plane of the cold end of the heat pipe 1. Considering that after the heat radiating fins 2 are installed, the heat-conducting silica gel pad 8 can deform and extend due to the extrusion of the clamping force of the heat sink and the heat radiating fins 2, so that the initial shape of the heat-conducting silica gel pad 8 is reduced; the invention relates to an installation mode that the heat sink and the radiating fins 2 clamp the heat pipe 1 and the heat-conducting silica gel pad 8 tightly and a use method for reducing the heat-conducting silica gel pad 8, which are both in the protection scope of the invention.
And step 5, placing the radiating fins 2 above the cold ends, connecting and fastening the radiating fins 2 and the radiating fin connecting heat sink 5 below the heat pipe 1, flattening and thinning the heat-conducting silica gel pads 8, and removing the extruded redundant heat-conducting silica gel pads 8 on the planes of the cold ends.
In the step, the heat dissipation sheet 2 is placed above the cold end of the heat pipe 1, after corresponding mounting holes (corresponding hole positions of the heat dissipation sheet 2 and the heat dissipation sheet connecting heat sink 5 and mounting hole positions of the heat dissipation sheet 2 and the bracket 9) are formed, the heat dissipation sheet 2 and the heat dissipation sheet connecting heat sink 5 below the heat pipe 1 are connected and fastened through screws, the heat-conducting silica gel pad 8 is extruded, the heat-conducting silica gel pad 8 is pressed to be flat and thin, and the extruded heat pipe 1 cold end plane heat-conducting silica gel pad 8 is removed.
Step 6, fastening the radiating fins 2 on the support 9, and rotating the top column 10 until the radiating fins above the locking part are connected with the heat sink 5;
in this step, the heat sink 2 is fastened to the bracket 9 by screws, and a right angle wrench is used to pass through the locking holes of the top pillar 10, and the top pillar 10 is rotated to lock the heat sink 5 to the heat sink above. The method for installing the fixing and supporting device below the heat radiating fin 2 is not limited to the mode of the bracket 9 and the top column 10, and the mode of installing the supporting device at the heat radiating cold end of the heat pipe 1 to ensure that the deformation of the cold end of the heat pipe 1 under various conditions does not influence the stability of the optical axis of the laser belongs to the scope of the claims of the invention.
And 7, covering the sealing cabin cover, adjusting the position to be uniform with the gap of the cylindrical surface of the radiating fin 2, sleeving a sealing ring 11 and a sealing pressing ring 12 on the cylindrical surface of the radiating fin 2, and compacting and fastening by screws. Of course, the sealing manner is not limited to the sealing ring, and any sealing manner in which the heat sink 2 of the heat pipe 1 is processed into a cylindrical surface is adopted is within the scope of the claims of the present invention.
The invention solves the problem that the laser is placed in the closed cabin body to radiate heat outwards by using the heat pipe 1, and simultaneously solves various engineering technical problems caused by the use of the heat pipe 1, such as the problem that the rigid mounting stress of the heat pipe 1 influences the optical axis of the laser, the problem that the cantilever structure of the heat pipe radiator has vibration impact on the optical path stability of the laser, and the problem of sealing between the heat pipe radiator and the shell of the closed cabin, and provides a new solution and a technical approach for radiating the laser in the cabin.
The embodiments in the present specification are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. For the system embodiment, since it is basically similar to the method embodiment, the description is simple, and for the relevant points, refer to the partial description of the method embodiment. Also, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
In addition, it is understood by those skilled in the art that all or part of the steps for implementing the above embodiments may be implemented by hardware, or may be implemented by hardware related to instructions of a program, where the program may be stored in a computer readable storage medium, where the above mentioned storage medium may be a read-only memory, a magnetic disk or an optical disk, and the program may include the procedures of the embodiments of the methods described above when executed.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. A heat pipe radiator for a laser is characterized by comprising a heat pipe, a radiating fin, a fan, a laser connecting heat sink and a radiating fin connecting heat sink: wherein,
the heat pipe comprises a hot end and a cold end which are perpendicular to each other, the hot end is fixed on a laser heat sink connected with the laser through the laser connecting heat sink, the cold end is fixed on the radiating fin through the radiating fin connecting heat sink, and a heat-conducting silica gel pad is arranged between the contact surfaces of the cold end and the radiating fin; the contact surfaces of the laser connecting heat sink and the radiating fin connecting heat sink and the heat pipe are uniformly coated with heat-conducting silicone grease; the heat-conducting silica gel pad is fully clamped by tightening the heat-conducting silica gel pad through a screw on the heat radiating fin so as to conduct heat of the heat pipe to the heat radiating fin; the fan is located above the heat sink.
2. A heat pipe radiator as claimed in claim 1 wherein said hot side and said cold side have a perpendicularity plane error of less than 0.1 mm.
3. A heat pipe heat sink as recited in claim 1 wherein said hot side has a flatness error of less than 0.15 mm.
4. The heat pipe radiator of claim 1 wherein the laser connection heat sink and the heat sink connection heat sink are made of pure aluminum or red copper.
5. A heat pipe radiator as claimed in claim 1 wherein the heat pipe is in the shape of an arc tube in contact with the laser attachment heat sink and the heat sink attachment heat sink, and is planar in contact with the laser heat sink and the heat sink.
6. A heat pipe radiator as claimed in claim 1 wherein said fins are cylindrical and the roughness of said cylindrical surface is no greater than 1.6 um.
7. A heat pipe radiator as claimed in claim 1 wherein said thermally conductive silicone grease is 0.1mm thick.
8. A heat pipe radiator as claimed in claim 1, wherein said heat pipe radiator further comprises a bracket and a top post; the support is positioned at the lower end of the radiating fin connected with the heat sink, and the top column is used for fixing the radiating fin connected with the heat sink on the support.
9. A heat pipe radiator as claimed in claim 1 wherein said fins are provided with sealing rings and rings for sealing contact between said fins and said capsule.
10. An assembling method for use in the heat pipe radiator as claimed in any one of claims 1 to 9, the method comprising:
step 1, grinding and matching contact surfaces of a heat pipe and a laser heat sink, a laser connecting heat sink and a radiating fin connecting heat sink so as to enable the heat pipe to be fully contacted with each heat sink;
step 2, coating heat-conducting silicone grease on the contact surface of each heat sink and the heat pipe, scraping the heat-conducting silicone grease to a uniform thin layer, fixing the hot end of the heat pipe on the heat sink of the laser, and connecting the laser with the heat sink and fixing the laser on the outer side of the heat pipe; before the hot end of the heat pipe is fixed, measuring the flatness of a plane in the hot end, adjusting the flatness to be less than 0.15mm, and wiping off redundant heat-conducting silicone grease overflowing from a gap;
and 3, mounting the laser heat sink provided with the heat pipe on the laser, assembling a radiating fin coated with heat-conducting silicone grease below the cold end to be connected with the heat sink, and mounting a support and a top column below the radiating fin to be connected with the heat sink.
Step 4, adhering a heat-conducting silica gel pad on the cold end;
step 5, placing the radiating fins above the cold ends, connecting and fastening the radiating fins and the radiating fins below the heat pipes with a heat sink, flattening and thinning the heat-conducting silica gel pads, and removing the extruded redundant heat-conducting silica gel pads on the planes of the cold ends;
step 6, fastening the radiating fins to the bracket, and rotating the top column until the radiating fins above the locking part are connected with a heat sink;
and 7, covering the sealing cabin cover, adjusting the position to be uniform with the gap of the cylindrical surface of the radiating fin, and sleeving a sealing ring and a sealing pressing ring on the cylindrical surface of the radiating fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611192704.9A CN106532413B (en) | 2016-12-21 | 2016-12-21 | A kind of heat-pipe radiator and its assemble method for laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611192704.9A CN106532413B (en) | 2016-12-21 | 2016-12-21 | A kind of heat-pipe radiator and its assemble method for laser |
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| Publication Number | Publication Date |
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| CN106532413A true CN106532413A (en) | 2017-03-22 |
| CN106532413B CN106532413B (en) | 2019-03-22 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20200227880A1 (en) * | 2019-01-10 | 2020-07-16 | Hisense Laser Display Co., Ltd. | Laser light source and laser projection device |
| CN111596514A (en) * | 2019-02-20 | 2020-08-28 | 青岛海信激光显示股份有限公司 | Laser light source and laser projection equipment |
| US11592145B2 (en) | 2019-01-10 | 2023-02-28 | Hisense Laser Display Co., Ltd. | Laser light source and laser projection device |
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| US11570411B2 (en) * | 2019-01-10 | 2023-01-31 | Hisense Laser Display Co., Ltd. | Laser light source and laser projection device |
| US11592145B2 (en) | 2019-01-10 | 2023-02-28 | Hisense Laser Display Co., Ltd. | Laser light source and laser projection device |
| CN111596514A (en) * | 2019-02-20 | 2020-08-28 | 青岛海信激光显示股份有限公司 | Laser light source and laser projection equipment |
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|---|---|
| CN106532413B (en) | 2019-03-22 |
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