CN106531660A - Device for baking wafer - Google Patents
Device for baking wafer Download PDFInfo
- Publication number
- CN106531660A CN106531660A CN201510697328.8A CN201510697328A CN106531660A CN 106531660 A CN106531660 A CN 106531660A CN 201510697328 A CN201510697328 A CN 201510697328A CN 106531660 A CN106531660 A CN 106531660A
- Authority
- CN
- China
- Prior art keywords
- temperature
- baking
- temperature monitor
- wafer
- computer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention discloses a device for baking a wafer and relates to the technical field of semiconductor manufacturing equipment. The device comprises an oven, a time-delay relay, a temperature monitor, an alarm apparatus and a computer, wherein a plurality of temperature sensors are arranged in the oven and connected with the temperature monitor; the oven is connected with the temperature monitor through the time-delay relay; the temperature monitor is connected with the computer through a bus; and the alarm apparatus is connected with the temperature monitor. According to the device for baking the wafer, the plurality of temperature sensors are arranged in the oven and connected with the temperature monitor, so that multipoint over-temperature automatic alarming can be achieved; and the temperature monitor imports temperature data into the computer through cooperation with an RS485 bus or an RS232 bus interface, and records each baking temperature curve through the computer, thereby facilitating subsequent tracing of product exception.
Description
Technical field
The present invention relates to semiconductor manufacturing facility technical field, more particularly to a kind of to be used for wafer-baking
Device.
Background technology
Wafer refers to the silicon used by silicon semiconductor production of integrated circuits, generally circular in shape due to which,
Therefore referred to as wafer.Various circuit component configurations can be manufactured on the silicon die, and becoming has specific
The IC products of electrical functionality.Usually test-the wafer of the manufacture-wafer of chip circuit design-wafer
Cutting and grinding-chip encapsulation-finished chip test.Cost control of the test of wafer to the chip
System is even more important, and the chip of functional defect can be found out by the test of wafer, not enter the later stage compared with great achievement
In this encapsulation, the cost of entirety has been saved.
Wafer-baking requires very accurate to temperature and time.Currently advanced industrial baking oven is used for wafer
There is more defect during baking for example：The tiny temperature difference in multizone in baking box cannot be monitored；Baking box
Suddenly power-off, time and temperature that personnel have been toasted before can not reviewing when finding；During baking box voltage instability
Have temperature exceed or less than design temperature specification when which cannot be followed the trail of so that later stage chip
Flow process is toasted when abnormal without reviewing record.
The content of the invention
The purpose of the present invention is exactly for the problem for overcoming above-mentioned existing wafer-baking, there is provided Yi Zhongyong
In the device of wafer-baking, 6 temperature sensors, temperature sensor and temperature are set in the device baking box
Degree monitor is connected, it is possible to achieve multi-point temp overtemperature automatic alarm；Temperature monitor coordinates RS485
Bus or RS232 EBIs, are imported computer temperature data, are toasted by computer recording every time
Temperature curve, it is convenient after product it is abnormal chases after the first day of the lunar month.
The required technical problem for solving of the invention can be achieved through the following technical solutions：
A kind of device for wafer-baking, including baking box, also including time-delay relay, temperature monitoring
Instrument, alarm and computer, are provided with temperature sensor in the baking box, the temperature sensor with
Temperature monitor is connected, and the baking box is connected with temperature monitor by time-delay relay, the temperature
Monitor is connected with computer by bus, and the alarm is connected with temperature monitor.
Further, the temperature sensor has 6.
Further, the temperature monitor includes 6 way code display channels.
Further, 6 temperature sensors by RS485 buses respectively with temperature monitor
6 way code display channels are connected.
Further, the temperature monitor passes through RS485 buses or RS232 buses and computer phase
Even.
Further, the reference time delay of the time-delay relay is 0.1 second to 99 minutes.
Beneficial effects of the present invention：6 temperature are set in a kind of device for wafer-baking, baking box
Sensor, temperature sensor are connected with temperature monitor, it is possible to achieve multi-point temp overtemperature automatic alarm；
Temperature monitor coordinates RS485 buses or RS232 EBIs, and temperature data is imported computer,
The temperature curve for being toasted by computer recording every time, what convenient product later was abnormal chase after the first day of the lunar month.
Description of the drawings
Fig. 1 is apparatus of the present invention theory diagram.
Specific embodiment
In order that technological means, creation characteristic, reached purpose and effect that the present invention is realized are readily apparent from
Understand, with reference to being specifically illustrating, the present invention is expanded on further.
When being embodied as, with reference to Fig. 1, a kind of device for wafer-baking, including baking box, time delay
Relay, temperature monitor, alarm and computer.Temperature sensor, temperature are installed in baking box
Sensor is connected with temperature monitor, and baking box is connected with temperature monitor by time-delay relay；Temperature
Monitor is connected with computer by bus, and alarm is connected with temperature monitor.
After the temperature of baking box reaches setting value for a period of time, can be supervised by temperature by time-delay relay
Survey instrument to start working, the reference time delay of time-delay relay can be 0.1 second to 99 minutes.In order to realize
The multipoint temperature monitoring of baking box, can monitor the tiny temperature difference in multizone in baking box.In baking box
6 temperature sensors are provided with inside.Temperature monitor is provided with temperature value digital-scroll technique passage, temperature value
Digital-scroll technique passage has 6 passages.Temperature sensor is corresponded with temperature value digital-scroll technique passage, and 6
Individual temperature sensor is connected with 6 way code display channels of temperature monitor respectively by RS485 buses.
Temperature monitor realizes the overtemperature automatic alarm of multi-point temp by external alarm.
Temperature monitor can pass through RS485 buses or RS232 buses are connected with computer, temperature
Data import computer, and by the temperature curve of each baking of computer recording, computer can be with
Multiple stage baking box is controlled simultaneously, and what convenient product later was abnormal chases after the first day of the lunar month.
6 temperature sensors, temperature sensor are set in a kind of device for wafer-baking, baking box
It is connected with temperature monitor, it is possible to achieve multi-point temp overtemperature automatic alarm；Temperature monitor coordinates
RS485 buses or RS232 EBIs, import computer temperature data, every by computer recording
The temperature curve of secondary baking, what convenient product later was abnormal chase after the first day of the lunar month.
Ultimate principle, principal character and the advantages of the present invention of the present invention has been shown and described above.This
The technical staff of industry it should be appreciated that the present invention is not restricted to the described embodiments, above-described embodiment and
Merely illustrating the principles of the invention described in description, before without departing from spirit and scope of the invention
Put the present invention and also have various changes and modifications, these changes and improvements both fall within claimed sheet
In invention scope.The claimed scope of the invention is defined by appending claims and its equivalent.
Claims (6)
1. a kind of device for wafer-baking, including baking box, it is characterised in that：Also include
Time-delay relay, temperature monitor, alarm and computer, are provided with temperature in the baking box
Sensor, the temperature sensor are connected with temperature monitor, and the baking box passes through time delay relay
Device is connected with temperature monitor, and the temperature monitor is connected with computer by bus, described
Alarm is connected with temperature monitor.
2., according to a kind of device for wafer-baking described in claim 1, its feature exists
In：The temperature sensor has 6.
3., according to a kind of device for wafer-baking described in claim 2, its feature exists
In：The temperature monitor includes 6 way code display channels.
4., according to a kind of device for wafer-baking described in claim 3, its feature exists
In：6 temperature sensors pass through RS485 buses 6 ways respectively with temperature monitor
Code display channel is connected.
5., according to a kind of device for wafer-baking described in claim 1, its feature exists
In：The temperature monitor passes through RS485 buses or RS232 buses are connected with computer.
6., according to a kind of device for wafer-baking described in claim 1, its feature exists
In：The reference time delay of the time-delay relay is 0.1 second to 99 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510697328.8A CN106531660A (en) | 2015-10-22 | 2015-10-22 | Device for baking wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510697328.8A CN106531660A (en) | 2015-10-22 | 2015-10-22 | Device for baking wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106531660A true CN106531660A (en) | 2017-03-22 |
Family
ID=58348439
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510697328.8A Withdrawn CN106531660A (en) | 2015-10-22 | 2015-10-22 | Device for baking wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106531660A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202306358U (en) * | 2011-09-26 | 2012-07-04 | 华润赛美科微电子(深圳)有限公司 | Drying oven temperature recording device |
| CN103365313A (en) * | 2012-04-09 | 2013-10-23 | 南茂科技股份有限公司 | Baking system |
| CN203465028U (en) * | 2013-08-16 | 2014-03-05 | 肇庆爱晟电子科技有限公司 | Multi-channel temperature monitor based on NTC temperature sensor |
| CN205177794U (en) * | 2015-10-22 | 2016-04-20 | 安徽超元半导体有限公司 | A device for wafer toasts |
-
2015
- 2015-10-22 CN CN201510697328.8A patent/CN106531660A/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202306358U (en) * | 2011-09-26 | 2012-07-04 | 华润赛美科微电子(深圳)有限公司 | Drying oven temperature recording device |
| CN103365313A (en) * | 2012-04-09 | 2013-10-23 | 南茂科技股份有限公司 | Baking system |
| CN203465028U (en) * | 2013-08-16 | 2014-03-05 | 肇庆爱晟电子科技有限公司 | Multi-channel temperature monitor based on NTC temperature sensor |
| CN205177794U (en) * | 2015-10-22 | 2016-04-20 | 安徽超元半导体有限公司 | A device for wafer toasts |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20211111 Address after: 226100 room 108, building 310, worker's new village, Sanchang street, Haimen City, Nantong City, Jiangsu Province Applicant after: Yin Guwei Address before: 247100 workshop 17, electronic information industrial park, Chizhou economic and Technological Development Zone, Anhui Province Applicant before: ANHUI CHAOYUAN SEMICONDUCTOR Co.,Ltd. |
|
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20170322 |