CN106517445A - Preparation method for electroporation electrode structure and application - Google Patents
Preparation method for electroporation electrode structure and application Download PDFInfo
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- CN106517445A CN106517445A CN201611114099.3A CN201611114099A CN106517445A CN 106517445 A CN106517445 A CN 106517445A CN 201611114099 A CN201611114099 A CN 201611114099A CN 106517445 A CN106517445 A CN 106517445A
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- sputtering
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- electroporation
- heat treatment
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- 238000004520 electroporation Methods 0.000 title claims abstract description 36
- 238000002360 preparation method Methods 0.000 title claims abstract description 25
- 238000004544 sputter deposition Methods 0.000 claims abstract description 35
- 238000010438 heat treatment Methods 0.000 claims abstract description 23
- 239000007769 metal material Substances 0.000 claims abstract description 19
- 230000001590 oxidative effect Effects 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 12
- 230000003647 oxidation Effects 0.000 claims abstract description 11
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 10
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 60
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 claims description 28
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 23
- 229910001870 ammonium persulfate Inorganic materials 0.000 claims description 16
- 229910001868 water Inorganic materials 0.000 claims description 13
- 239000008367 deionised water Substances 0.000 claims description 10
- 229910021641 deionized water Inorganic materials 0.000 claims description 10
- 230000008569 process Effects 0.000 claims description 10
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 239000004332 silver Substances 0.000 claims description 7
- 238000004659 sterilization and disinfection Methods 0.000 claims description 6
- 238000005034 decoration Methods 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 5
- 230000001954 sterilising effect Effects 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims description 2
- 150000004968 peroxymonosulfuric acids Chemical class 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 abstract description 7
- 238000005530 etching Methods 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 5
- 239000010949 copper Substances 0.000 description 18
- 235000011121 sodium hydroxide Nutrition 0.000 description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 17
- 229910052802 copper Inorganic materials 0.000 description 17
- 239000006260 foam Substances 0.000 description 12
- 239000000243 solution Substances 0.000 description 12
- 239000000047 product Substances 0.000 description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 7
- 229960000935 dehydrated alcohol Drugs 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 5
- 230000005684 electric field Effects 0.000 description 5
- 239000012467 final product Substances 0.000 description 4
- 229910044991 metal oxide Inorganic materials 0.000 description 4
- 150000004706 metal oxides Chemical class 0.000 description 4
- 241000588724 Escherichia coli Species 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 210000004027 cell Anatomy 0.000 description 3
- 239000000356 contaminant Substances 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 2
- 238000004220 aggregation Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 210000000170 cell membrane Anatomy 0.000 description 2
- 238000005660 chlorination reaction Methods 0.000 description 2
- JJLJMEJHUUYSSY-UHFFFAOYSA-L copper(II) hydroxide Inorganic materials [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 description 2
- AEJIMXVJZFYIHN-UHFFFAOYSA-N copper;dihydrate Chemical compound O.O.[Cu] AEJIMXVJZFYIHN-UHFFFAOYSA-N 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000006262 metallic foam Substances 0.000 description 2
- 244000005700 microbiome Species 0.000 description 2
- 239000002086 nanomaterial Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000005751 Copper oxide Substances 0.000 description 1
- 206010054949 Metaplasia Diseases 0.000 description 1
- 239000007832 Na2SO4 Substances 0.000 description 1
- 206010028980 Neoplasm Diseases 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 description 1
- 229910052921 ammonium sulfate Inorganic materials 0.000 description 1
- 230000000844 anti-bacterial effect Effects 0.000 description 1
- 230000001580 bacterial effect Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 201000011510 cancer Diseases 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 230000001086 cytosolic effect Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000010353 genetic engineering Methods 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 230000002779 inactivation Effects 0.000 description 1
- 230000010534 mechanism of action Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000015689 metaplastic ossification Effects 0.000 description 1
- 230000000813 microbial effect Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 102000039446 nucleic acids Human genes 0.000 description 1
- 108020004707 nucleic acids Proteins 0.000 description 1
- 150000007523 nucleic acids Chemical class 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 150000003904 phospholipids Chemical class 0.000 description 1
- 102000004169 proteins and genes Human genes 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/46—Treatment of water, waste water, or sewage by electrochemical methods
- C02F1/461—Treatment of water, waste water, or sewage by electrochemical methods by electrolysis
- C02F1/46104—Devices therefor; Their operating or servicing
- C02F1/46109—Electrodes
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/46—Treatment of water, waste water, or sewage by electrochemical methods
- C02F1/461—Treatment of water, waste water, or sewage by electrochemical methods by electrolysis
- C02F1/467—Treatment of water, waste water, or sewage by electrochemical methods by electrolysis by electrochemical disinfection; by electrooxydation or by electroreduction
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
- C23C28/322—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
- C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/46—Treatment of water, waste water, or sewage by electrochemical methods
- C02F1/461—Treatment of water, waste water, or sewage by electrochemical methods by electrolysis
- C02F1/46104—Devices therefor; Their operating or servicing
- C02F1/46109—Electrodes
- C02F2001/46133—Electrodes characterised by the material
- C02F2001/46138—Electrodes comprising a substrate and a coating
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2303/00—Specific treatment goals
- C02F2303/04—Disinfection
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Inorganic Chemistry (AREA)
- Electrochemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Hydrology & Water Resources (AREA)
- Environmental & Geological Engineering (AREA)
- Water Supply & Treatment (AREA)
- Apparatus For Disinfection Or Sterilisation (AREA)
- Water Treatment By Electricity Or Magnetism (AREA)
Abstract
The invention discloses a preparation method for an electroporation electrode structure. The method comprises the steps that (1) a metallic material is soaked in an oxidizing solution for oxidation etching at the room temperature; (2) the metallic material subjected to oxidation etching is placed in a calorstat for heat treatment after being washed; (3) the metallic material subjected to heat treatment is subjected to nano-silver sputtering; and (4) the electrode structure subjected to sputtering is washed then placed in the calorstat to be dried, and the electroporation electrode structure is obtained. The technical problems that an electroporation technology needs high voltage and high cost are solved, and the preparation method capable of achieving the electroporation effect under low voltage for the electrode structure is provided.
Description
Technical field
The invention belongs to electrode structure technical field, and in particular to a kind of electrode structure preparation side for electroporation device
Method.
Background technology
Electroporation technology is the electric field action by high intensity, instantaneously improves membrane passage, by nucleic acid, albumen and
Other molecules import the high efficiency technical of various kinds of cell, are widely used to the fields such as biologic medical and genetic engineering.Electroporation sets
The standby high field for producing is realized by applying thousands of to tens thousand of volts of high voltages at electrode two ends.In order to ensure that electricity is worn
Hole equipment steady operation, proposes high requirement to the performance of electrode structure, causes the electrode structure of existing electroporation device
With high costs, power control system is complicated, high energy consumption, limits the application of electroporation device.
In water treatment field, chlorination is wide variety of disinfection technology, but during chlorination, easily produces cause
The by-product of cancer, affects human health.High field is produced using electroporation technology can be carried out quickly to microorganism in water
Electroporation is sterilized, and improves disinfection efficiency.But current electroporation technology is relatively costly, is not suitable for water treatment field.
The content of the invention
The present invention needs high voltage for electroporation technology, causes the technical problem of high cost, there is provided one kind can be low
The preparation method of the electrode structure of electroporation effect is realized under voltage.
To achieve these goals, the present invention is achieved using following technical proposals：
A kind of preparation method of electroporation electrodes structure, step is 1）At room temperature, metal material is immersed in oxidizing solution
Carry out oxide etch；2）After metal material after oxide etch is rinsed, in being put in calorstat, heat treatment is carried out；3）By heat treatment
Metal material afterwards carries out nanometer silver sputtering；4）Electrode structure after sputtering is cleaned, is then placed in calorstat and is dried
It is dry, obtain electroporation electrodes structure.
In order to metal material framework surface oxidation generate needle-like array structure, the oxidizing solution be sodium hydroxide,
The mixture of Ammonium persulfate. and deionized water.
In order to ensure that needle-like array structure keeps the mole dense of regular geometry, the sodium hydroxide and Ammonium persulfate.
Degree ratio is 20-30:1；The concentration of the sodium hydroxide is 2-3mol/L.Further, the time that decorations are carved in the oxidation is 10-
30min。
In order to ensure that needle-like array structure is changed from hydroxide to oxide, and prevent needle-like array structure from caving in, institute
The temperature for stating heat treatment is 150-200 DEG C, and heat treatment time is 3-6h.
In order to the silverskin of nano thickness is sputtered in needle-like array structure outer layer, the sputtering voltage is 1000-3000V, electric
Current density is 0.5-2mA/cm2, operating air pressure 0-10Pa, sputtering time are 3-30min.
In order to ensure drying effect, the drying temperature is 50-70 DEG C, and the time is 10-30min.
The electrode structure obtained by above-mentioned preparation method in the present invention can apply to water process sterilization.
Compared with prior art, advantages of the present invention and good effect are：The preparation method of the present invention is first by metal material
Material carries out oxide etch, forms metal hydroxidess needle-like array structure, then carry out heat in the frame structure of metal material
Process, metal hydroxidess are converted into metal-oxide, form a length of tens microns, metal of a diameter of tens to hundreds of nanometer
Oxide needle-like array structure；Then sputtering silver is carried out, and one layer of nanometer is obtained in metal-oxide needle-like array structure outer surface
Silverskin, for protecting interior metal, prevents electrode to be corroded, and gives whole electrode structure good electric conductivity.Present invention system
In the standby electrode structure for obtaining, needle-like micro nano structure can form high pressure in its tip aggregation electric charge, in holding electrode spacing phase
Meanwhile, can greatly strengthen the electric field intensity between positive and negative electrode.Therefore, under relatively low running voltage, can between positive and negative electrode
The strong electric field needed for electroporation effect is realized in generation, effectively reduces work difficulty.
Description of the drawings
Fig. 1. electroporation electrodes structure preparation flow figure in the present embodiment；
Fig. 2. in embodiment, foam copper product is before oxide etch heat treatment（A, b）, after（C, d）Microscopic appearance；
Fig. 3. the stereoscan photograph of Bacillus coli cells perforation is carried out using electroporation electrodes structure manufactured in the present embodiment.
Specific embodiment
Technical scheme is described in further detail with reference to specific embodiment.
Present embodiments provide a kind of preparation method of electroporation electrodes structure, including oxide etch, heat treatment, sputtering and
Four key steps of cleaning, as shown in figure 1, being specially：
1）At room temperature, metal material is immersed in oxidizing solution carries out oxide etch so that give birth on metal material framework surface
Into needle-like array structure.
The metal material can be using common metals such as copper, nickel, aluminum, titaniums.
The oxidizing solution refers to sodium hydroxide NaOH, Ammonium persulfate. (NH4)2S2O8With the mixture of deionized water, institute
The molar concentration rate for stating sodium hydroxide and Ammonium persulfate. is 20-30:1, the wherein concentration of sodium hydroxide is 2-3mol/L, aoxidizes and carves
The time of decorations is 10-30min.
In the oxidizing solution, sodium hydroxide is oxidation promoter, and Ammonium persulfate. is oxidant.The Ammonium persulfate. it is dense
Degree is bigger or the decorations time at quarter is longer, and the needle-like array structure that metal material framework surface can generate is longer, but Ammonium persulfate.
Concentration is excessive or quarter decorations overlong time needle-like array structure will be difficult to keep its regular geometry.
2）Metal material deionized water after oxide etch is rinsed 3-5 time, sodium hydroxide is washed away and Ammonium persulfate. is residual
Stay, then placing 3-6h in 150-200 DEG C of calorstat carries out heat treatment, and metal hydroxidess are converted into metal-oxide.
In the present embodiment, by taking foam copper as an example, microscopic appearance of the foam copper product before and after oxide etch, heat treatment is such as
Shown in Fig. 2, the foam copper of wherein Fig. 2 a, Fig. 2 b for before processing, Fig. 2 c, Fig. 2 d are the foam copper after processing.Can from figure
Go out, after oxidized etching, heat treatment, define in the frame structure of foam copper product a length of tens microns, a diameter of tens to
Hundreds of nanometer of copper oxide needle-like array structure.Its related chemistry reaction equation is：
Oxide etch：2NaOH+(NH4)2S2O8+Cu→Cu(OH)2+Na2SO4+(NH4)2SO4
Heat treatment：Cu(OH)2→CuO+H2O
Heat treatment temperature is too low or process time is too short, and prepared array structure cannot complete hydroxide turning to oxide
Become, heating-up temperature is too high, and needle-like array structure can be caused to cave in.
3）Metal material after heat treatment is placed in the sample base of sputtering equipment, nanometer silver sputtering is carried out with silver-colored target,
Nano-silver layer is formed in metal oxide surface.Sputtering voltage is 1000-3000V, and electric current density is 0.5-2mA/cm2, work
Air pressure 0-10Pa, sputtering time are 3-30min.It is isoparametric by sputtering voltage, electric current density, operating air pressure, sputtering time
The thickness of the controllable nano-silver layer of regulation and control.
4）Electrode structure after sputtering is cleaned, cleanout fluid adopts dehydrated alcohol, rinsed 3-5 time, then in 50-70
10-30min drying is placed in DEG C calorstat, electroporation electrodes structure is obtained final product.
Electrode structure obtained in the present embodiment can reach higher sterilization rate using DC source or alternating current power supply.It is preferred that
Using alternating current power supply, advantage is can be with rapid cleaning electrode surface, effective service life for extending electrode structure.By the electricity
Pole structure is connected with the alternating source of electroporation device, to containing micro- under the conditions of 1-15 V voltages, flow rate of water flow 0.5-3L/min
Biological water body is processed, it is possible to achieve the perforation of the microbial cell such as escherichia coli is dead（Fig. 3）, sterilization rate is up to 99%.
Electrode structure obtained in the present embodiment realizes that the mechanism of action of electroporation effectiveness is at lower voltages：Oxidized etching
Metal material surface afterwards generates needle-like array structure, and after Jing sputtering silvers, the silverskin protection interior metal on top layer simultaneously gives
The good electric conductivity of whole electrode structure.As needle-like array structure is the geometry with regular micro/nano level, outside
In the case that boundary's voltage is certain, needle-like micro nano structure can form high pressure in its tip aggregation electric charge, in holding electrode spacing
When identical, can greatly strengthen the electric field intensity between positive and negative electrode.The microorganisms such as escherichia coli with current enter both positive and negative polarity it
Between electric field region when, electric energy produce mechanical compress act on cause bacterial cell membrane phospholipid bilayer and protein lose
Surely, cell membrane expands rupture, and cytoplasmic compartment or all outflow cause antibacterial finally dead.
The application of electrode scope of the present invention is wider, be able to can use in the case of 1-15V external voltages.When increase is containing micro-
During the flow velocity of biological water body, can accordingly increase running voltage, carry out efficient inactivation treatment.
Electroporation electrodes structure preparation method in the present invention is simple, and preparation cost is cheap, is adapted to large-scale industry metaplasia
Produce.Electrode structure can be in low-voltage（≤20 V）Under realize electroporation effectiveness, the requirement to power-supply system can be substantially reduced, if
It is standby to safeguard simpler.The electrode structure prepared by the electroporation electrodes structure preparation method in the present invention can be used for small electrical and wear
Hole equipment, and expand range of application of the equipment in fields such as water body purifications.
Embodiment 1
A kind of preparation method of electroporation electrodes structure, step is, 1）By sodium hydroxide and Ammonium persulfate. be successively added to from
Oxidizing solution is prepared in sub- water, the wherein concentration of sodium hydrate aqueous solution is 2mol/L, the sodium hydroxide and Ammonium persulfate.
Molar concentration rate be 20:1, it is cooled to room temperature stand-by；Will be initial metallic foam copper dehydrated alcohol or acetone etc. organic
Solvent and deionized water cleaning, remove surface and oil contaminant and other impurities；Cleaned foam copper is completely immersed in into above-mentioned oxidisability
In solution, oxidation processes 30min.2）The copper product after above-mentioned oxidation processes is taken out, deionized water is rinsed 3-5 time, Ran Houfang
Heat treatment 3h is carried out in entering 200 DEG C of calorstat.3）Foam copper product after oxidized etching, heat treatment is placed in into sputtering equipment
Sample base on, nanometer silver sputtering is carried out with silver-colored target, sputtering voltage is 1000V, and electric current density is 2mA/cm2, operating air pressure
10Pa, sputtering time are 20min.4）Foam copper product after sputtering is rinsed 3-5 time with dehydrated alcohol, then in 50 DEG C of calorstats
30 min of middle placement, obtain final product electroporation electrodes structure.
Embodiment 2
A kind of preparation method of electroporation electrodes structure, step is, 1）By sodium hydroxide and Ammonium persulfate. be successively added to from
Oxidizing solution is prepared in sub- water, the wherein concentration of sodium hydrate aqueous solution is 2.5mol/L, the sodium hydroxide and persulfuric acid
The molar concentration rate of ammonium is 30:1, it is cooled to room temperature stand-by；Will be initial metallic aluminum dehydrated alcohol or acetone etc. organic molten
Agent and deionized water cleaning, remove surface and oil contaminant and other impurities；Cleaned aluminum is completely immersed in above-mentioned oxidizing solution,
Oxidation processes 20min.2）The aluminum after above-mentioned oxidation processes is taken out, deionized water is rinsed 3-5 time, is then placed in 180 DEG C
Calorstat in carry out heat treatment 5h.3）Foamed aluminium material after oxidized etching, heat treatment is placed in into the sample of sputtering equipment
On base, nanometer silver sputtering is carried out with silver-colored target, sputtering voltage is 1500 V, and electric current density is 1 mA/cm2, 1 Pa of operating air pressure,
Sputtering time is 10 min. 4）Aluminum after sputtering dehydrated alcohol is rinsed 3-5 time, is then placed in 60 DEG C of calorstats
20 min, obtain final product electroporation electrodes structure.
Embodiment 3
A kind of preparation method of electroporation electrodes structure, step is, 1）By sodium hydroxide and Ammonium persulfate. be successively added to from
Oxidizing solution is prepared in sub- water, the wherein concentration of sodium hydrate aqueous solution is 3mol/L, the sodium hydroxide and Ammonium persulfate.
Molar concentration rate be 25:1, it is cooled to room temperature stand-by；Will be initial metallic foam copper dehydrated alcohol or acetone etc. organic
Solvent and deionized water cleaning, remove surface and oil contaminant and other impurities；Cleaned foam copper is completely immersed in into above-mentioned oxidisability
In solution, oxidation processes 10min.2）The copper product after above-mentioned oxidation processes is taken out, deionized water is rinsed 3-5 time, Ran Houfang
Heat treatment 6h is carried out in entering 150 DEG C of calorstat.3）Foam copper product after oxidized etching, heat treatment is placed in into sputtering equipment
Sample base on, nanometer silver sputtering is carried out with silver-colored target, sputtering voltage is 3000V, and electric current density is 0.5mA/cm2, work gas
Pressure 5Pa, sputtering time is 3min.4）Foam copper product after sputtering is rinsed 3-5 time with dehydrated alcohol, then in 70 DEG C of constant temperature
10min is placed in case, electroporation electrodes structure is obtained final product.
Above example is only several in several preferred implementation of the invention, it is noted that be the invention is not restricted to
Above-described embodiment；For the person of ordinary skill of the art, still can be to the technical scheme described in previous embodiment
Modify, or equivalent is carried out to which part technical characteristic；And these modifications or replacement, do not make relevant art side
The essence of case departs from the spirit and scope of claimed technical solution of the invention.
Claims (8)
1. a kind of preparation method of electroporation electrodes structure, it is characterised in that step is
1）At room temperature, metal material is immersed in oxidizing solution carries out oxide etch；
2）After metal material after oxide etch is rinsed, in being put in calorstat, heat treatment is carried out；
3）Metal material after heat treatment is carried out into nanometer silver sputtering；
4）Electrode structure after sputtering is cleaned, and then drying is placed in calorstat, is obtained electroporation electrodes structure.
2. preparation method according to claim 1, it is characterised in that the oxidizing solution is sodium hydroxide, persulfuric acid
The mixture of ammonium and deionized water.
3. preparation method according to claim 1, it is characterised in that the molar concentration of the sodium hydroxide and Ammonium persulfate.
Than being 20-30:1；The concentration of the sodium hydroxide is 2-3mol/L.
4. preparation method according to claim 1, it is characterised in that it is 10-30min that the time of decorations is carved in the oxidation.
5. preparation method according to claim 1, it is characterised in that the temperature of the heat treatment is 150-200 DEG C, at heat
The reason time is 3-6h.
6. preparation method according to claim 1, it is characterised in that the sputtering voltage is 1000-3000V, electric current is close
Spend for 0.5-2mA/cm2, operating air pressure 0-10Pa, sputtering time are 3-30min.
7. preparation method according to claim 1, it is characterised in that the drying temperature is 50-70 DEG C, and the time is 10-
30min。
8. the electrode structure that the preparation method according to any one of claim 1-7 is obtained is applied to water process sterilization.
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| CN103219503A (en) * | 2013-03-12 | 2013-07-24 | 北京理工大学 | Combined electrode material and preparation method thereof |
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