CN106516422A - Electronic assembly winding belt packaging structure and method for packaging electronic assembly - Google Patents
Electronic assembly winding belt packaging structure and method for packaging electronic assembly Download PDFInfo
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- CN106516422A CN106516422A CN201510570018.XA CN201510570018A CN106516422A CN 106516422 A CN106516422 A CN 106516422A CN 201510570018 A CN201510570018 A CN 201510570018A CN 106516422 A CN106516422 A CN 106516422A
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- electronic building
- building brick
- glued membrane
- winding belt
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Abstract
The invention discloses an electronic assembly winding belt packaging structure and a method for packaging an electronic assembly. The electronic assembly winding belt packaging structure comprises a carrying belt, an upper coating glue film and a lower coating glue film; the carrying belt is provided with a plurality of first openings penetrating the upper surface and the lower surface of the carrying belt, the first openings are arranged at intervals in the long side direction of the carrying belt, the periphery of each first opening extends from the lower direction in the direction away from the lower surface to form a side wall surrounding the periphery of the corresponding first opening, and a second opening is formed in the bottom of each side wall. The upper coating glue film is pasted on the upper surface of the carrying belt, and the first openings of the carrying belt are closed. The lower coating glue film is pasted on the bottoms of the side walls to close the second openings, and the lower coating glue film and the side walls jointly form multiple containing spaces for containing the electronic assembly.
Description
Technical field
The present invention relates to a kind of electronic building brick winding belt package structure and with the winding belt package structural packaging electronics
The method of component, more particularly to a kind of electronic building brick winding belt package structure with double-deck coating glued membrane
And specific face-up packing method is carried out to electronic building brick using the winding belt package structure.
Background technology
After electronic building brick (such as IC or MEMS) completes, it usually needs to electronic assembly test,
To confirm the quality and the good and the bad of electronic building brick, and need to be packed, and carry out the fortune of electronic building brick
Defeated and distribution.Coil type (tape-and-reel) is general conventional manner of packing, and which is with a carrying
Band (or claiming winding) loads electronic building brick, and furls carrying belt (or claiming winding) with reel.Please
Refering to shown in Figure 1A and Figure 1B, Figure 1A illustrates general existing known electronic building brick winding belt package knot
Structure 1, and Figure 1B then illustrates (the i.e. vertical length side in the width direction of electronic building brick winding belt package structure 1
To) cross-section structure.Electronic building brick winding belt package structure 1 by carrying 20 under the strip of plastic shaping,
And carrier band 10 is constituted on the rippability that can be sticked together with lower carrier band 20.Along which on lower carrier band 20
Length bearing of trend is formed with continuously arranged capsule band portion 202, and electronic building brick 60 is then contained in capsule band portion
202, and then there is 202 bottom of capsule band portion pore 204 to prevent electronic building brick 60 and 202 bottom of capsule band portion
Portion is excessively closely sealed, and upper carrier band 10 is then attached on lower carrier band 20 and electronic building brick 60 is packaged in electronics
In component winding belt package structure 1.
In general, the front of electronic building brick (such as IC or MEMS) makes mostly more sensitive and easily outer
The circuit of power infringement or micro structure, such as micro structure on circuit, electric component of microcomputer (MEMS) on IC
(such as sensing component, sound source wire, MIC etc.), so when final test (FT) is carried out, greatly
Be mostly by it is brilliant back up in the way of carry out pickup, test and the placement of electronic building brick, to avoid to electricity
Circuit on sub-component front produces injury with micro structure.That is, when tester table is tested,
That the brilliant back of the body for drawing electronic building brick with vacuum slot is moved, test and placement mostly, with avoid because
Contact and collision with vacuum slot, and to breaking that the circuit on electronic building brick front or micro structure are produced
Bad and damage.Therefore, after test completion, electronic building brick remain by it is brilliant back up in the way of put
It is placed in tray (tray).With the development of electronic building brick, generally require in response to different demands and by
The electronic building brick that Jing completes to test carries out the packaging of multi-form, for example sometimes for make electronic building brick with
Back side up mode is packed, and then needs sometimes to make electronic building brick enter in the way of facing up
Row packaging.Particularly when needing to make electronic building brick be packed in the way of facing up, it is necessary to
Form of one turning device by the electronic building brick for completing to test by the back side (or brilliant back of the body) upwards is turned into front
Form upwards, then with suction nozzle to draw the positive mode of electronic building brick, by inverted for just facing
On electronic building brick inserted in capsule band portion one by one, and which is packaged in the way of facing up electronics group
In part winding belt package structure.However, increasing this upset electronic building brick step, electronics can be not only complicated
The flow process of component shipment packaging, more can increased electronic building brick because needs buy more specific turning device
The cost of shipment packaging, and also because overturning electronic building brick and electronic building brick front can be drawn with suction nozzle
The infringement of circuit on electronic building brick front or micro structure Deng action, is caused, the consumption of production capacity is in turn resulted in
Damage.
In view of this, need the winding belt package structure and electronic building brick packing method for wanting a kind of electronic building brick badly,
Can be in response to a variety of packaging demands, without being turned over to electronic building brick with any turning device
Turn, and different packing instructions can be reached in the way of drawing the brilliant back of the body of electronic building brick, and then simplify electronics
The flow process of component shipment packaging, reduces the cost of electronic building brick shipment packaging, and reduces into electronics group
The risk that circuit or micro structure on part front suffers damage.
The content of the invention
It is an object of the present invention to overcome the defect that existing electronic building brick winding belt package structure is present,
And a kind of new electronic building brick winding belt package structure is provided, technical problem to be solved is to make which can be with
In response to a variety of packaging demands, and simplify flow process and the cost of electronic building brick shipment packaging, and
Circuit or micro structure on reduction electronic building brick front is because overturning or being drawn the possibility for suffering damage.
Another object of the present invention is to, overcome the side of existing winding belt package structural packaging electronic building brick
The defect that method is present, and a kind of method of new packaging electronic building brick is provided, technology to be solved is asked
Topic is to allow which to reach a variety of packaging demands, can not only simplify electronic building brick shipment packaging
Flow process and cost, and reduce circuit on electronic building brick front or micro structure because overturning or being drawn
The possibility for suffering damage, more can be according to subsequent technique demand neatly by taking out electronics in winding belt package
Component.
The object of the invention to solve the technical problems employs the following technical solutions to realize.Foundation
A kind of electronic building brick winding belt package structure proposed by the present invention.This electronic building brick winding belt package structure is included
Carrier band, overlying strata glued membrane and lower coating glued membrane.The carrier band have it is multiple through the carrier band upper surface with
First opening of lower surface, these first openings are spaced along the long side direction of carrier band, each to be somebody's turn to do
Formed around first opening four towards leaving the lower surface direction and extend by the lower surface around first opening
The side wall in week, and form second in each sidewall bottom and be open.The overlying strata glued membrane then sticks in this
On the upper surface of carrier band, and the first closure of openings that this is carried.The lower coating glued membrane is then sticked in
The bottom of these side walls and by these the second closure of openings, and the lower coating glued membrane is common with these side walls
Form multiple accommodation spaces to holding electronic component.House in this electronic building brick winding belt package structure
Space has different openings (the first opening and the second opening), and provides the different road of electronic building brick
Footpath enter accommodation space (inserted by electronic building brick winding belt package superstructure or lower section is inserted), and by
Roll coating glued membranes (overlying strata glued membrane and lower coating glued membrane) different in electronic building brick winding belt package structure
Select different paths (or opening) so that although electronic building brick takes the mode for drawing the brilliant back of the body to be wrapped
Dress, but can be the accommodating sky for inserting electronic building brick winding belt package structure by different paths or opening
Between in, and reach different packaging demand (manner of packing that for example crystalline substance is dorsad gone up or crystalline substance dorsad under packaging
Mode), so and first electronic building brick need not be overturn with turning device, be also not required to draw electronics
The front of component, and flow process and the cost of electronic building brick shipment packaging can be simplified, and reduce electronics
Circuit or micro structure on component front is because overturning or being drawn the possibility for suffering damage.
The object of the invention to solve the technical problems can also be applied to the following technical measures to achieve further.
Aforesaid electronic building brick winding belt package structure, each of which side wall are convex also comprising what is stretched out
Go out portion, area is pasted to increase the side wall and the lower coating glued membrane.
Aforesaid electronic building brick winding belt package structure, the wherein corresponding each accommodating sky of the lower coating glued membrane
Between region in have perforate, to avoid the electronic building brick in each accommodation space with lower coating glue
Film is completely closely sealed.
Aforesaid electronic building brick winding belt package structure, the wherein bore of first opening and second opening
Bore all more than the size of the electronic building brick, and allow the electronic building brick via the first opening and the
Two openings are entered or remove the accommodation space.
Aforesaid electronic building brick winding belt package structure, the wherein thickness of the lower coating glued membrane are more than the overlying
Layer glued membrane, with provide carry the electronic building brick support force, and avoid the lower coating glued membrane winding when
Produce disrepair phenomenon.
The object of the invention to solve the technical problems also employs the following technical solutions to realize.According to this
A kind of method of packaging electronic building brick that invention is proposed, can take the mode that crystalline substance is drawn to be packed,
And first electronic building brick need not be overturn with turning device, you can with (i.e. electric under reaching crystalline substance dorsad
Sub-component faces up) packaging effect.The method of this packaging electronic building brick is comprised the steps of：(1)
Electronic building brick winding belt package structure is provided, this electronic building brick winding belt package structure includes carrier band, overlying strata
Glued membrane and lower coating glued membrane, wherein, the carrier band has multiple through the carrier band upper surface and lower surface
The first opening be spaced along the long side direction of the carrier band, by under this around each first opening
Surface court leaves the lower surface direction and extends the side wall to be formed around the first opening surrounding, and each
The sidewall bottom forms second and is open, and overlying strata glued membrane is sticked on the upper surface of the carrier band, and is closed
First opening of carrier band, lower coating glued membrane then stick in the bottom of the side wall and close these the second openings,
And the lower coating glued membrane is collectively forming the accommodation space of multiple holding electronic components with these side walls；(2) will
The electronic building brick winding belt package structure is placed in the way of upward by the lower coating glued membrane, and by the lower coating
Glued membrane is rolled and exposes second opening and the accommodation space；(3) electronic building brick second is opened via this
Mouth is inserted in the accommodation space；And (4) by the lower coating glued membrane stick in again the side wall bottom and
Second opening is closed, and the electronic building brick is closed in the accommodation space.In this method, by
Then the mode for drawing the brilliant back of the body of electronic building brick is taken, electronic building brick is inserted into electronic building brick by the second opening
In the accommodation space of winding belt package structure, so that the front of electronic building brick need not overturn facing
The top surface (or overlying strata glued membrane) of electronic building brick winding belt package structure, reaches what electronic building brick faced up
Packing instructions.Therefore, the method for this packaging electronic building brick can be saved and be spent needed for upset electronic building brick
Time and cost, and reach the flow process of simplified electronic building brick shipment packaging and the purpose of cost, more because
Electronic building brick need not be overturn and electronic building brick front is drawn, and electronic building brick can be greatly reduced into
Circuit or micro structure on front is because overturning or being drawn the risk for suffering damage.
The object of the invention to solve the technical problems can also be applied to the following technical measures to achieve further.
The method of aforesaid packaging electronic building brick, wherein also comprising upset, the electronic building brick winding belt package is tied
Structure, to this after step 4, the electronic building brick winding belt package for being packaged with electronic building brick is tied
Structure is placed in the way of upward by the overlying strata glued membrane, and makes facing up for the electronic building brick.
The method of aforesaid packaging electronic building brick, wherein also rolls step comprising overlying strata glued membrane, to
The overlying strata glued membrane is rolled and first opening and the accommodation space is exposed, and then exposes the appearance
The electronic building brick between being empty.
The method of aforesaid packaging electronic building brick, wherein also takes out step comprising electronic building brick, via this
First is open and takes out the electronic building brick in the accommodation space, for follow-up use.
The method of aforesaid packaging electronic building brick, wherein also rolls step comprising lower coating glued membrane, to
The lower coating glued membrane is rolled and second opening and the accommodation space is exposed, and then exposes the appearance
The electronic building brick between being empty.
The method of aforesaid packaging electronic building brick, wherein also takes out step comprising electronic building brick, via this
Second is open and takes out the electronic building brick in the accommodation space, for follow-up use.
The present invention has clear advantage and beneficial effect compared with prior art.By above-mentioned technical side
Case, electronic building brick winding belt package structure of the present invention and the side with the winding belt package structural packaging electronic building brick
Method at least has following advantages and beneficial effect：The present invention provide electronic building brick winding belt package structure with
Electronic building brick packing method, can be in response to a variety of packaging demands, without being filled with any upset
Put and electronic building brick is overturn, and different packagings can be reached in the way of drawing the brilliant back of the body of electronic building brick
Require, and then simplify the flow process of electronic building brick shipment packaging, reduce the cost of electronic building brick shipment packaging,
And the risk that the circuit on reduction electronic building brick front or micro structure suffer damage.
Described above is only the general introduction of technical solution of the present invention, in order to better understand the present invention's
Technological means, and being practiced according to the content of description, and in order to allow the above-mentioned of the present invention and
Other purposes, feature and advantage can become apparent, and below especially exemplified by preferred embodiment, and coordinate attached
Figure, describes in detail as follows.
Description of the drawings
Figure 1A is the schematic diagram of existing known electronic building brick winding belt package structure.
Figure 1B is the profile of existing known electronic building brick winding belt package structure.
Fig. 2A is the schematic diagram of the electronic building brick winding belt package structure of one embodiment of the invention.
Fig. 2 B are the profiles of the electronic building brick winding belt package structure of one embodiment of the invention.
Fig. 2 C are the profiles of the electronic building brick winding belt package structure of another embodiment of the present invention.
Fig. 2 D are the profiles of the electronic building brick winding belt package structure of another embodiment of the present invention.
Fig. 2 E are the profiles of the electronic building brick winding belt package structure of one more embodiment of the present invention.
Fig. 3 A-1 to Fig. 3 D-2 are the flow processs of the method for the packaging electronic building brick of one embodiment of the invention
Figure.
1：Existing known electronic building brick winding belt package structure
2、2'、2A、2A'：Electronic building brick winding belt package structure
10：Upper carrier band
20：Lower carrier band
202：Capsule band portion
204：Pore
30：Overlying strata glued membrane
40：Carrier band
402：Upper surface
404：Lower surface
406：First opening
408：Side wall
410：Second opening
412：Protuberance
50：Lower coating glued membrane
502：Perforate
60：Electronic building brick
602：The front of electronic building brick
604：The brilliant back of the body of electronic building brick
606：Circuit or micro mechanism
t1：Lower coating film thickness
t2：Overlying strata film thickness
Specific embodiment
For further illustrating the present invention for reaching technological means and the work(taken by predetermined goal of the invention
Effect, below in conjunction with accompanying drawing and preferred embodiment, to tying according to electronic building brick winding belt package proposed by the present invention
Structure and with method its specific embodiment of the winding belt package structural packaging electronic building brick, structure, method,
Step, feature and its effect, describe in detail as after.
Some embodiments of the present invention will be described in as follows.But, in addition to following description, the present invention
Widely can also implement in other embodiment, and protection scope of the present invention is not by embodiment
Limit, which is defined by scope of the claims.Furthermore, it is clearer description to be provided and is easier
Understand the present invention, each several part is not drawn according to its relative size in schema, some sizes and other
Scale dependent is compared and is exaggerated；Incoherent detail section is not also shown completely, in the hope of schema
It is succinct.
Please refer to shown in Fig. 2A and Fig. 2 B, Fig. 2A is the electronic building brick of one embodiment of the invention
The schematic diagram of winding belt package structure 2, and Fig. 2 B are then electronic building brick winding belt package structures 2 along width side
To profile.Electronic building brick winding belt package structure 2 comprising overlying strata glued membrane 30, carrier band 40 and under
Coating glued membrane 50.Carrier band 40 for plastic shaping strips carry, its have upper surface 402 with it is relative
Multiple upper surfaces through carrier band 40 are formed with the lower surface 404 of upper surface 402, carrier band 40
402 with the first of lower surface 404 the opening 406, long side of these first openings 406 along carrier band 40
Direction is spaced.By lower surface 404 towards leaving 404 side of lower surface around per one first opening 406
To (i.e. downward) the side wall 408 for extending and being formed around the first 406 surroundings of opening, and in every side wall
408 bottoms form or define the second opening 410.The bore of the first opening 406 and the second opening 410
Bore all more than electronic building brick 60 size, and allow electronic building brick 60 via first opening 406
Enter with the second opening 410 and remove accommodation space.
Overlying strata glued membrane 30 is sticked on the upper surface 402 of carrier band 40, and closes the first of carrier band 40
Opening 406, wherein, overlying strata glued membrane 30 is rippability glued membrane, and which is heated when pressurizeing and can stick together
On carrier band 40.Lower coating glued membrane 50 then sticks in the side wall 408 extended by 40 lower surfaces 404 of carrier band
Bottom, and close the second opening 410 so that lower coating glued membrane 50 is collectively forming many with side wall 408
The accommodation space of individual holding electronic component 60.In addition, the corresponding each accommodation space of lower coating glued membrane 50
Region in have perforate 502, cover with to the electronic building brick 60 for avoiding being positioned in accommodation space
Layer glued membrane 50 is completely closely sealed, and produce be not easily taken out of problem.
The accommodation space being compared in existing known electronic building brick winding belt package structure 1 only has single
One gateway and single discrepancy path, by overlying in the electronic building brick winding belt package structure 2 of the present invention
The accommodation space constituted by layer glued membrane 30, side wall 408 and lower coating glued membrane 50 is relative with two
Gateway (the first opening 406 and the second opening 410), namely which has two different discrepancy paths.
Therefore, both made all in accommodation space, of the invention using mobile electron component by the way of crystalline substance is carried on the back is drawn
Electronic building brick winding belt package structure 2 still can via choosing different gateways (or the path that comes in and goes out),
Different packaging effects (such as the packaging of brilliant dorsad under type and the packaging of brilliant dorsad upper type) are reached,
Without as compared with known electronic building brick winding belt package structure 1, first with turning device pair
Electronic building brick is overturn or is changed to draw the front of electronic building brick, can be only achieved different packaging effects
(the packaging effect of particularly brilliant dorsad under type).
For example, when the packaging for being intended to reach crystalline substance and dorsad go up (i.e. electronic building brick face down) mode is imitated
During fruit, it is only necessary to roll the overlying strata glued membrane 30 of the electronic building brick winding belt package structure 2 of the present invention,
And expose the first opening 406 and accommodation space, you can directly to draw the brilliant back of the body of electronic building brick, and
Which is inserted into accommodation space via the first opening 406, now the front of electronic building brick is met naturally
Bottom (or lower coating glued membrane 50) to electronic building brick winding belt package structure 2, and electronic building brick is reached
The packaging effect of (i.e. electronic building brick face down) mode is gone up dorsad to crystalline substance.Conversely, when crystalline substance to be reached
The back of the body 604 downwards the packaging effect of (i.e. the front 602 of electronic building brick 60 upwards) mode when, it is only necessary to will
The lower coating glued membrane 50 of the electronic building brick winding belt package structure 2 of the present invention is rolled, and is exposed second and opened
Mouthfuls 410 and accommodation space, you can directly to draw the brilliant back of the body 604 of electronic building brick 60, and by its via
Second opening 410 inserts accommodation space, and now the front of electronic building brick can face electronics group naturally
The top (or overlying strata glued membrane 30) of part winding belt package structure 2, and cause electronic building brick 60 to reach the brilliant back of the body
The 604 downward packaging effect of (i.e. the front 602 of electronic building brick upwards) mode.Both above-mentioned is all to adopt
The mode mobile electron component 60 for drawing the brilliant back of the body is simultaneously put in accommodation space, and all need not elder generation with
One turning device overturns electronic building brick, will not also draw the front 602 of electronic building brick 60, so not only
Step needed for upset electronic building brick, time and cost is eliminated, and is simplified electronic building brick and is gone out package
The cost of the flow process and reduction electronic building brick shipment packaging of dress, more because avoiding suction nozzle and turning device
It is positive with electronic building brick to contact and collision, and reduce the circuit or micro- on electronic building brick front 602
The risk that structure 606 suffers damage.
Refer to shown in Fig. 2 C, which is the electronic building brick winding belt package structure of another embodiment of the present invention
2' profiles in the width direction.Electronic building brick winding belt package structure 2' equally by overlying strata glued membrane 30,
Carrier band 40 and lower coating glued membrane 50 are constituted, shown in electronic building brick winding belt package structure 2' and Fig. 2 B
Electronic building brick winding belt package structure 2 it is roughly the same in structure, it is right in above for something in common
2 elaborate of electronic building brick winding belt package structure shown in Fig. 2 B, will not be described here.Electronic building brick
The difference between electronic building brick winding belt package structure 2 shown in winding belt package structure 2' and Fig. 2 B exists
In, 408 bottom of side wall of electronic building brick winding belt package structure 2' has the protuberance 412 for stretching out,
Area is pasted to increase side wall 408 and lower coating glued membrane 50, it is to avoid lower coating glued membrane 50 is because glutinous
Veneer is accumulated too small and is come off.
Fig. 2 D and Fig. 2 E is respectively electronic building brick winding belt package structure 2A of another embodiment of the present invention
Profile in the width direction, and the electronic building brick winding belt package structure of one more embodiment of the present invention
2A ' profiles in the width direction, wherein, shown in electronic building brick winding belt package structure 2A and Fig. 2A
Electronic building brick winding belt package structure 2 it is substantially similar, and electronic building brick winding belt package structure 2A ' with figure
Electronic building brick winding belt package structure 2 ' shown in 2C is substantially similar.Refer to shown in Fig. 2 D and Fig. 2 E,
The electronic building brick winding belt package structure of the present invention either takes the electronic building brick winding belt package shown in Fig. 2A
Electronic building brick winding belt package structure 2 ' shown in structure 2 or Fig. 2 C, can take lower coating glued membrane
Modes of the 50 thickness t1 more than the thickness t2 of overlying strata glued membrane 30, to provide carrying electronic building brick
60 support force, and avoid lower coating glued membrane 50 from producing disrepair phenomenon in winding because excessively thin.
In addition, the present invention also provides a kind of method of packaging electronic building brick, which is with the electronics group of the present invention
Part winding belt package structure, the mode for drawing the brilliant back of the body is taken and can not need in advance with turning device
Under the situation of upset electronic building brick, reach it is brilliant dorsad under (i.e. electronic building brick face up) packaging effect
Really.Fig. 3 A-1 to Fig. 3 D-2 are the flow processs of the method for the packaging electronic building brick of one embodiment of the invention
Figure, each figure represent this side all with 2 view of electronic building brick winding belt package structure with profile
Each step of method.First, refer to shown in Fig. 3 A-1 to Fig. 3 A-2, providing such as Fig. 2A and figure
Electronic building brick winding belt package structure 2 shown in 2B, and by this electronic building brick winding belt package structure below 2
After the mode upward of coating glued membrane 50 is placed, lower coating glued membrane 50 is rolled and is exposed second and is opened
Mouth 410 and accommodation space.Then, refer to shown in Fig. 3 B-1 to Fig. 3 B-2, with suction nozzle or other
Pick device draws the 60 brilliant back of the body of (or pickup) electronic building brick, and electronic building brick 60 is picked up and mobile,
And by second opening 410 and electronic building brick is inserted into accommodation space, now the front of electronic building brick from
But so can be in the face of the overlying strata glued membrane 30 (i.e. top) of electronic building brick winding belt package structure 2.
Then, refer to shown in Fig. 3 C-1 to Fig. 3 C-2, treat electronic building brick 60 insert accommodation space it
Afterwards, the lower coating glued membrane 50 that will wind up is layed in the bottom of side wall 408 again, and to lower coating glued membrane
50 heating and pressure so that lower coating glued membrane 50 sticks in the bottom of side wall 408 again, and seals again
The second opening 410 is closed, electronic building brick 60 is closed in accommodation space, now electronic building brick is being just
Face remains in that the appearance of the overlying strata glued membrane 30 (i.e. top) in the face of electronic building brick winding belt package structure 2
State.Finally, 2 turn-over of electronic building brick winding belt package structure of electronic building brick will be equipped with, will
Form of the electronic building brick winding belt package structure 2 from bottom (descending coating glued membrane 50) upward is turned into bottom
(i.e. overlying strata glued membrane 30) form upward, now the front of electronic building brick remain in that and face electronics
The attitude of the overlying strata glued membrane 30 (i.e. top) of component winding belt package structure 2, and reach electronic building brick
Face up the packaging effect and demand of (i.e. towards overlying strata glued membrane 30).In this electronic building brick winding bag
In 2 overturning step of assembling structure, electronic building brick winding belt package is fixed on as electronic building brick is all packaged
In structure 2, so electronic building brick 60 can't be caused because overturning electronic building brick winding belt package structure 2
Collide with electronic building brick winding belt package structure 2, on 60 front of electronic building brick, circuit or micro structure more will not
It is damaged because electronic building brick 60 and electronic building brick winding belt package structure 2 are collided, and staff can be with
Directly electronic building brick winding belt package structure 2 is overturn with handss easily, so packaging stream can't be increased
The step of journey, time and cost.
Secondly, refer to shown in Fig. 3 D-1 to Fig. 3 D-2, if after the packaging for completing electronic building brick,
Take out in needing the accommodation space by electronic building brick by electronic building brick winding belt package structure 2, and after carrying out
Continuous technique or flow process, then first roll overlying strata glued membrane 30, and expose the first opening 404, house
Electronic building brick 60 in space and accommodation space.Then, drawn with suction nozzle or other pick devices (or
Pickup) electronic building brick 60 front, and electronic building brick 60 is picked up, and is moved by the first opening 406
Accommodation space is moved out of, so that subsequent technique is used.Certainly, in other embodiments of the present invention, also may be used
By being packaged with electronic building brick winding belt package structure side upward of coating glued membrane 50 below 2 of electronic building brick
Formula place after, by lower coating glued membrane 50 roll and expose the second opening 410, accommodation space and
Electronic building brick 60 in accommodation space.Then, then with suction nozzle or other pick devices draw (or pickup)
The brilliant back of the body of electronic building brick 60, and electronic building brick 60 is picked up, and moved out by the second opening 410
Accommodation space, so that subsequent technique is used, and because drawing electronic building brick when further can avoid taking out
Front and infringement that the circuit on the front of electronic building brick or micro structure are caused.Thus, it is possible to
The method for knowing the electronic building brick winding belt package structure and packaging electronic building brick of the present invention, can be in response to follow-up
The demand of different process, neatly changes the method for taking out electronic building brick, allows subsequent technique to be able to smoothness
Carrying out.
By the method packaging electronic building brick of the above-mentioned packaging electronic building brick of the present invention, can be not required in bag
Electronic building brick is turned into by brilliant form back up by brilliant shape back up with turning device in advance before dress
State, it is also possible to take the mode for drawing the brilliant back of the body to carry out the pickup of electronic building brick, transport and insert, so
Step needed for upset electronic building brick, time and cost is not only eliminated, and is simplified electronic building brick and is gone out
The cost of the flow process and reduction electronic building brick shipment packaging of package dress, more because avoiding suction nozzle and upset
Device is positive with electronic building brick to be contacted and collision, and reduces the circuit or micro- on electronic building brick front
The risk that structure suffers damage.
In view of above-described embodiment, the invention provides a kind of electronic building brick winding belt package structure and electronics
Pack method, can be in response to a variety of packaging demands, without with any turning device pair
Electronic building brick is overturn, and can reach different packing instructions in the way of drawing the brilliant back of the body of electronic building brick,
And then simplify the flow process that electronic building brick shipment is packed, the cost of electronic building brick shipment packaging is reduced, and
Reduce the risk that the circuit on electronic building brick front or micro structure suffer damage.
The above, is only presently preferred embodiments of the present invention, not makees any form to the present invention
On restriction, although the present invention is disclosed above with preferred embodiment, but is not limited to this
It is bright, any those skilled in the art, in the range of without departing from technical solution of the present invention, when can profit
A little change is made with the method and technology contents of the disclosure above or the equivalent reality of equivalent variations is modified to
Apply example, as long as being the content without departing from technical solution of the present invention, according to the present invention technical spirit to
Any simple modification, equivalent variations and modification that upper embodiment is made, still fall within the technology of the present invention side
In the range of case.
Claims (11)
1. a kind of electronic building brick winding belt package structure, it is characterised in which includes：
Carrier band, is open along the carrier band with the first of lower surface through the carrier band upper surface with multiple
Long side direction is spaced, and leaves the lower surface direction by lower surface court around each first opening
Extend the side wall formed around the first opening surrounding, and second is formed in each sidewall bottom and be open；
Overlying strata glued membrane, sticks on the upper surface of the carrier band, and closes the first opening of the carrier band；With
And
Lower coating glued membrane, sticks in the bottom of these side walls and closes these the second openings, and cover under this
Layer glued membrane is collectively forming the accommodation space of multiple holding electronic components with these side walls.
2. electronic building brick winding belt package structure according to claim 1, it is characterised in that wherein every
The one side wall is also comprising the protuberance for stretching out, glutinous with the lower coating glued membrane to increase the side wall
Veneer is accumulated.
3. electronic building brick winding belt package structure according to claim 1, it is characterised in that wherein should
There is perforate in the region of the corresponding each accommodation space of lower coating glued membrane, to avoid each this from housing
Electronic building brick in space is completely closely sealed with lower coating glued membrane.
4. electronic building brick winding belt package structure according to claim 1, it is characterised in that wherein should
The bore of the first opening is all more than the size of the electronic building brick with second bore being open, and makes the electricity
Sub-component can be entered with the second opening via the first opening or remove the accommodation space.
5. electronic building brick winding belt package structure according to claim 1, it is characterised in that wherein should
The thickness of lower coating glued membrane is more than the overlying strata glued membrane, to provide the support force for carrying the electronic building brick,
And avoid the lower coating glued membrane from producing disrepair phenomenon in winding.
6. it is a kind of packaging electronic building brick method, it is characterised in which comprises the steps of：
Step one, there is provided electronic building brick winding belt package structure, the electronic building brick winding belt package structure bag
Contain：
Carrier band, is open along the load with the first of lower surface through the carrier band upper surface with multiple
The long side direction of band is spaced, and leaves the lower surface by lower surface court around each first opening
Direction extends the side wall to be formed around the first opening surrounding, and forms second in each sidewall bottom
Opening；
Overlying strata glued membrane, sticks on the upper surface of the carrier band, and close the carrier band first opens
Mouthful；And
Lower coating glued membrane, sticks in the bottom of those side walls and closes those the second openings, and should
Lower coating glued membrane is collectively forming the accommodation space of multiple holding electronic components with those side walls；
Step 2, the electronic building brick winding belt package structure is put in the way of upward by the lower coating glued membrane
Put, and the lower coating glued membrane is rolled and second opening and the accommodation space is exposed；
Step 3, electronic building brick is inserted in the accommodation space via second opening；And
The lower coating glued membrane is sticked in the bottom of the side wall and closes this and second open by step 4 again
Mouthful, and the electronic building brick is closed in the accommodation space.
7. it is according to claim 6 packaging electronic building brick method, it is characterised in that wherein also wrap
Containing the electronic building brick winding belt package structure is overturn, to this after step 4, electronics has been packaged with
The electronic building brick winding belt package structure of component is placed in the way of upward by the overlying strata glued membrane, and makes this
Electronic building brick faces up.
8. it is according to claim 7 packaging electronic building brick method, it is characterised in that wherein also wrap
Glued membrane containing overlying strata rolls step, expose the overlying strata glued membrane to be rolled this first opening with
The accommodation space, and then expose the electronic building brick in the accommodation space.
9. it is according to claim 8 packaging electronic building brick method, it is characterised in that wherein also wrap
Step is taken out containing electronic building brick, the electronic building brick in the accommodation space is taken out via first opening,
For follow-up use.
10. the method for packaging electronic building brick according to claim 7, it is characterised in that wherein also
Step is rolled comprising lower coating glued membrane, second opening is exposed the lower coating glued membrane to be rolled
With the accommodation space, and then the electronic building brick in the accommodation space is exposed.
The method of 11. packaging electronic building bricks according to claim 10, it is characterised in that wherein also
Step is taken out comprising electronic building brick, the electronics group in the accommodation space is taken out via second opening
Part, for follow-up use.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510570018.XA CN106516422B (en) | 2015-09-09 | 2015-09-09 | Electronic building brick winding belt package structure and method to pack electronic building brick |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510570018.XA CN106516422B (en) | 2015-09-09 | 2015-09-09 | Electronic building brick winding belt package structure and method to pack electronic building brick |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106516422A true CN106516422A (en) | 2017-03-22 |
| CN106516422B CN106516422B (en) | 2018-10-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510570018.XA Active CN106516422B (en) | 2015-09-09 | 2015-09-09 | Electronic building brick winding belt package structure and method to pack electronic building brick |
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| Country | Link |
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| CN (1) | CN106516422B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114420821A (en) * | 2020-10-23 | 2022-04-29 | 厦门三安光电有限公司 | Packaging method of LED core particles and LED core particle packaging structure |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1458044A (en) * | 2002-05-16 | 2003-11-26 | 罗姆股份有限公司 | Belt type packaging body |
| CN1521095A (en) * | 2003-02-13 | 2004-08-18 | 王子制纸株式会社 | Package container paper plate for containing electronic chips |
| CN1762766A (en) * | 2004-10-22 | 2006-04-26 | 日本力特株式会社 | Coiling device |
| CN1951768A (en) * | 2005-10-20 | 2007-04-25 | 京元电子股份有限公司 | Coil specification regulation positioning device and method |
| CN101400581A (en) * | 2006-03-17 | 2009-04-01 | 3M创新有限公司 | Carrier tape with excellent impact strength and release property |
| CN104071452A (en) * | 2013-04-22 | 2014-10-01 | 深圳市长盈精密技术股份有限公司 | Package for thin type products and packing method thereof |
-
2015
- 2015-09-09 CN CN201510570018.XA patent/CN106516422B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1458044A (en) * | 2002-05-16 | 2003-11-26 | 罗姆股份有限公司 | Belt type packaging body |
| CN1521095A (en) * | 2003-02-13 | 2004-08-18 | 王子制纸株式会社 | Package container paper plate for containing electronic chips |
| CN1762766A (en) * | 2004-10-22 | 2006-04-26 | 日本力特株式会社 | Coiling device |
| CN1951768A (en) * | 2005-10-20 | 2007-04-25 | 京元电子股份有限公司 | Coil specification regulation positioning device and method |
| CN101400581A (en) * | 2006-03-17 | 2009-04-01 | 3M创新有限公司 | Carrier tape with excellent impact strength and release property |
| CN104071452A (en) * | 2013-04-22 | 2014-10-01 | 深圳市长盈精密技术股份有限公司 | Package for thin type products and packing method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114420821A (en) * | 2020-10-23 | 2022-04-29 | 厦门三安光电有限公司 | Packaging method of LED core particles and LED core particle packaging structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106516422B (en) | 2018-10-12 |
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