CN106503289A - The polycrystalline CBN abrasive particles soldering that is split based on Thiessen polygon and the synergistic stress simulation method of grinding - Google Patents
The polycrystalline CBN abrasive particles soldering that is split based on Thiessen polygon and the synergistic stress simulation method of grinding Download PDFInfo
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Abstract
The invention discloses a kind of polycrystalline CBN abrasive particles soldering that is split based on Thiessen polygon and the synergistic stress simulation method of grinding, the Thiessen polygon for applying Matlab Software Creates random first, and pass through program, microcrystal grain in Thiessen polygon is reduced centered on its center of area, shape is similar, and diminution ratio is volume fraction.The data for producing are imported in Ansys, and exports Iges formatted files.Then, the Iges formatted files for generating being imported in Abaqus softwares and being edited, set up the FEM model of single layer soldering polycrystalline CBN abrasive particles, conditions setting is input into its material properties, and stress and strain model is carried out to which, finally carries out simulation analysis.Present invention incorporates Thiessen polygon cutting techniques, polycrystalline CBN abrasive particle soldering tech, high-speed grinding technology and finite element simulation technology, it is achieved that the prediction of the combined stress regularity of distribution of soldering and grinding in soldering polycrystalline CBN abrasive particle grinding process.
Description
Technical field：
The present invention provides a kind of polycrystalline CBN abrasive particles soldering that splits based on Thiessen polygon and the synergistic stress of grinding
Emulation mode, it are related to a kind of soldering that analyzes based on thermal-stress coupling and grinding stress distributed simulation method, belong to finite element
Simulation technical field.
Background technology：
Single layer soldering polycrystal cubic boron nitride (Polycrystalline Cubic boron nitride, PCBN) emery wheel
Intensity, emery wheel sharpness, chip space, abrasive particle are held in abrasive particle there is excellent performance from aspects such as sharp and instrument precision,
It is usually used to the difficult-to-machine materials such as processing high temperature alloy, titanium alloy and titanium matrix composite.But due to soldering and it was ground
Often there is the phenomenon of bulk crushing in stress concentration phenomenon in journey, polycrystalline CBN abrasive particles, reduce the service life of instrument.Cause
This, it is micro- broken that exploration one kind makes polycrystalline CBN abrasive particles produce in grinding process, and the method for improving abrasive particle utilization rate is imperative.
It is to cause abrasive particle that broken one of the main reasons occurs that abrasive particle internal residual stress is excessive, controls the stress on abrasive particle
Distribution is the micro- broken effective ways of control abrasive particle, so that the stress born in soldering and grinding process by abrasive particle point
Cloth is measured.Consider grit size generally less (usual 100 μm -400 μm), it is difficult to (such as aobvious with conventional experimental technique
Micro- infrared spectrum (FTIS), X-ray diffraction (XRD), micro Raman spectra (Raman spectroscopy)) measure answering for abrasive particle
Power is distributed, and finite element (FE) emulation mode has been widely used for the stress distribution law for predicting the materials such as metal, pottery.Therefore
Using finite element simulation method, stress point of the single layer soldering polycrystalline CBN abrasive particles in a vacuum furnace in soldering and grinding process is probed into
Cloth rule, is the key for solving the prediction of soldering polycrystalline grits stress distribution.
Content of the invention：
In order to overcome prior art accurately analyze the defect of stress distribution when soldering abrasive particle is ground, the mesh of the present invention
Be to provide a kind of polycrystalline CBN abrasive particles soldering that splits based on Thiessen polygon and the synergistic stress simulation method of grinding,
Thermal-stress coupling analysis based on finite element can be entered to soldering and the lower polycrystalline CBN abrasive particle internal stress distributions of grinding force effect
Row prediction, can provide theoretical direction for the micro- broken research of polycrystalline CBN abrasive particles.
The present invention is achieved through the following technical solutions：
The Thiessen polygon for applying Matlab Software Creates random first, and by program, will be micro- in Thiessen polygon
Brilliant particle is reduced centered on its center of area, and shape is similar, and diminution ratio is volume fraction.The data for producing are imported in Ansys,
And export Iges formatted files.Then, the Iges formatted files for generating are imported in Abaqus softwares and is edited, set up single layer soldering
The FEM model of polycrystalline CBN abrasive particles, conditions setting are input into its material properties, and carry out stress and strain model to which, most laggard
Row simulation analysis.
, by loading the optimal brazing temperature curve that previous experiments are obtained to model, true simulation single layer soldering is more for the present invention
The process that brilliant CBN abrasive particles are cooled down in vacuum resistance furnace brazing, so that obtain effect on cutlage；By loading what emulation was obtained
The grinding force of single abrasive particle high-speed grinding GH4169, is born during simulation single layer soldering polycrystalline CBN abrasive particle high-speed grinding GH4169
Combined stress, it is achieved that the soldering and the synergistic stress simulation of grinding based on the single layer soldering polycrystalline CBN abrasive particles of finite element
Method, its operating process and step as shown in Figure 1.
The polycrystalline CBN abrasive particles soldering that is split based on Thiessen polygon and the synergistic stress simulation method of grinding, step
As follows：
Step one：Thiessen polygon is split
First, numerical computations software Matlab is applied, and random distribution n point in the area of l is in long and width；
Thiessen polygon segmentation is carried out to this n point using the Thiessen polygon dividing function of Matlab softwares, forms n crystallite
Grain；Matlab programs are write, this n microcrystal grain is reduced with respect to the center of area of itself, shape invariance, reduced scale are referred to as
Volume fraction, is adhesive tape between microcrystal grain；The data for generating are generated physical model by finite element emulation software Ansys
Output format Iges file.
Step 2：Soldering polycrystalline CBN abrasive particles are modeled
The Iges formatted files generated described in step one are imported in finite element emulation software, modeling tool is applied, is set up
Polycrystalline CBN abrasive particles, solder layer and base layer, and apply to constrain, set up the two dimensional model of single layer soldering CBN emery wheels.
Step 3：Single layer soldering polycrystalline CBN Abrasive model material properties assignment
Abaqus software requirements are pressed, single layer soldering polycrystalline CBN emery wheel material attributes are input into, the material properties are heat-stress
Density, specific heat, thermal conductivity, elastic modelling quantity, Poisson's ratio and thermal coefficient of expansion needed for coupling analysis.
Step 4：Single layer soldering polycrystalline CBN Abrasive models finite element grid is modeled
The modeling of single layer soldering polycrystalline CBN emery wheels finite element grid includes that cell type is chosen and stress and strain model；The grid list
Element type chooses CPS8R；The stress and strain model will take into account the requirement of amount of calculation and computational accuracy, rationally control stress and strain model density,
Mesh refinement is carried out to key position, the precision distribution of single layer soldering polycrystalline CBN emery wheel stress and strain models is rationally realized.
Step 5：Effect on cutlage is analyzed
Effect on cutlage analysis be on the basis of single layer soldering polycrystalline CBN abrasive particle FEM meshes, abrasive particle,
The brazing temperature and cooldown rate used in actual soldering is loaded on solder and grinding wheel base body, and carries out thermal-stress coupling emulation,
The effect on cutlage that emulation single layer soldering CBN abrasive particles are produced during soldering cools.
Wherein, the brazing mode is vacuum resistance furnace soldering.Described brazing temperature and cool time are respectively：Soldering
900 DEG C of temperature, 10 DEG C/min of cooldown rate.Final chilling temperature is 20 DEG C.
Step 6：Soldering/grinding synergy combined stress analysis
Soldering/grinding synergy combined stress analysis is on the basis of effect on cutlage model, adds grinding force, enters
Combined stress emulation under soldering during row single layer soldering polycrystalline CBN abrasive particle high-speed grindings/grinding synergy, tries to achieve individual layer
Combined stress distribution of the soldering polycrystalline CBN abrasive particles in grinding process.
The present invention has advantages below：
1. two-dimensional simulation model simplification calculating process is used；
2. complicated microstructure inside polycrystalline CBN abrasive particles is fitted with Thiessen polygon；
3. the stress for producing in pair soldering and grinding process has carried out simulation and prediction, is to explore the micro- Cracking Mechanism of CBN abrasive particles
Theoretical direction is provided.
In a word, present invention incorporates Thiessen polygon cutting techniques, polycrystalline CBN abrasive particle soldering tech, high-speed grinding technology
With finite element simulation technology, it is achieved that the soldering in soldering polycrystalline CBN abrasive particle grinding process and the combined stress regularity of distribution being ground
Prediction.Simulation model is two-dimensional simulation model；The abrasive particle for adopting for vacuum resistance furnace in realized by soldering tech and solder
Chemical bond after polycrystalline CBN abrasive particles；The solder for adopting is Ag-Cu-Ti solder alloys or Cu-Sn-Ti solder alloys；Using
Matrix material be 45 steel or 40Cr steel；The grinding force is the grinding nickel-base high-temperature alloy material obtained by finite element simulation
Grinding force.Using the method, combined stress distribution of the soldering polycrystalline CBN abrasive particles in grinding process can be obtained, is further
The micro- Cracking Mechanism of research control soldering abrasive particle provides foundation.
Description of the drawings
Fig. 1 is the inventive method flow chart；
Fig. 2 is the Thiessen polygon cutting procedure figure of embodiment 1；
Fig. 3 is soldering polycrystalline CBN abrasive particle FEM model figures；
Fig. 4 is soldering polycrystalline CBN abrasive particle FEM model grid charts；
Fig. 5 is single layer soldering polycrystalline CBN abrasive particle effect on cutlage cloud atlas；
Fig. 6 is grinding force applying figure；
Fig. 7 is soldering and grinding combined stress cloud atlas；
Fig. 8 is the crystallite polygon after Thiessen polygon segmentation；
Fig. 9 is polycrystalline CBN abrasive particle soldering Stress Map of the material homogeneous without crystal boundary；
Figure 10 is the polycrystalline CBN abrasive particle soldering Stress Maps of crystallite regular shape.
Specific embodiment
Below in conjunction with drawings and Examples, the present invention is described in further detail.
Implementing procedure according to Fig. 1, from Thiessen polygon segmentation, the modeling of soldering polycrystalline CBN abrasive particles, single layer soldering polycrystalline
CBN Abrasive model material properties assignment, the modeling of single layer soldering polycrystalline CBN Abrasive models finite element grid, effect on cutlage point
Six aspects are analyzed in analysis, soldering/grinding synergy combined stress, and the present invention will be described in detail.
Embodiment 1
The polycrystalline CBN abrasive particles soldering that is split based on Thiessen polygon and the synergistic stress simulation method of grinding, which walks
Rapid as follows：
Step one：Thiessen polygon is split
Application numerical computations software (Matlab) first, is random distribution n in the area of l in long and width
Point；Thiessen polygon segmentation, shape are carried out to this n point using the Thiessen polygon dividing function (Voronoi) of Matlab softwares
Into n microcrystal grain.L takes 0.5mm here, and n takes 625 here.
As polycrystalline CBN abrasive particles are made up of crystallite CBN particles and AlN binding agents, it is therefore desirable to add AlN in a model and glue
Knot agent band.The crystallite polygon being illustrated in figure 8 after Thiessen polygon segmentation, its drift angle coordinate are (xi, yi), center of area coordinate is
(xc, yc), the polygonal area is A.Then polygon vertex coordinate (xi, yi), center of area coordinate (xc, yc) and area A it
Between there is relation as shown in formula (I)：
Wherein n is polygonal number of vertex, and by the center of area and polygon, each summit couples together, then the polygon can enter one
Step is divided into n triangle.If have the polygon similar to itself in the polygon, and each edge all with former polygonal parallel, then
Introduce volume fraction VfDefinition is such as formula (II)：
The introducing of the parameter causes polygon scaled down, reduced scale to be equal to volume fraction Vf.Polygon in Tyson
Adhesive tape can be formed between the microcrystal grain for generating then in shape, for arranging the bonding between the crystallite CBN particles in emulation
Agent.
As two polygons are similar, therefore volume fraction can represent an accepted way of doing sth (III) again：
Therefore：
Thus summit (x is obtainedi, yi) in volume fraction VfUnder corresponding apex coordinate (xi', yi'), so can determine interior
The size and shape in portion.
Therefore, Matlab programs are write, this n microcrystal grain is reduced with respect to the center of area of itself, shape is similar, reduces
Ratio be referred to as volume fraction；
Program is as follows：
The data generated by said procedure are generated physical model output format by finite element emulation software (Ansys)
(Iges) file, as shown in Figure 2.
Step 2：Soldering polycrystalline CBN abrasive particles are modeled
It is in Abaqus softwares that the Iges formatted files generated described in step one are imported finite element emulation software, utilizes
Modeling tool in Abaqus softwares is Part modules, sets up polycrystalline CBN abrasive particles, solder layer and base layer.The following institute of process
Show：
1) regular hexagon polycrystalline CBN abrasive particles are drawn, and the monolateral length of abrasive particle is 200 μm, the equal rounding of six corner angle, fillet half
Footpath is 2 μm.
2) solder layer is drawn so that solder layer is most thick to spend the 20%-50% for accounting for abrasive grain diameter, while making abrasive particle bottom
Solder layer thickness range between baseline top is 5-20 μm.
3) 45 steel matrix are drawn, matrix is long 2mm, the rectangle of wide 5mm, matrix area are about 400 times of abrasive particle area,
The size of grinding wheel base body is avoided to produce impact to abrasive particle stress.
4) abrasive particle, solder, matrix are from top to bottom sequentially fitted together successively, and passes through finite element emulation software
(ABAQUS) the Tie functions in, at the top of abrasive particle bottom and solder layer and solder layer bottom is bound together with baseline top.
5) boundary condition is set, the base bottom free degree is disposed as 0；By the x-axis of matrix both sides and solder both sides and
The free degree rotated around y-axis and around z-axis is disposed as 0.As shown in Figure 3.
Step 3：Single layer soldering polycrystalline CBN emery wheel material attribute assignments
In Abaqus softwares, it is desirable to be input into single layer soldering polycrystalline CBN emery wheel material attributes, the material properties are heat-stress
Density, specific heat, thermal conductivity, elastic modelling quantity, Poisson's ratio and thermal coefficient of expansion needed for coupling analysis, as shown in table 1.
Table 1 is single layer soldering CBN emery wheel material attributes
Step 4：Single layer soldering polycrystalline CBN emery wheels finite element grid is modeled
The modeling of single layer soldering polycrystalline CBN emery wheels finite element grid includes that cell type is chosen and stress and strain model；The grid list
Element type chooses CPS8R, and the courses of action being chosen in Abaqus of cell type are：Mesh | Element Type, are ejecting
Dialog box in select Family types be Plane stress (plane stress), by Geometric Order (geometry order)
Quadratic (two sub-cells) is set to, then cell type is CPS8R.
The stress and strain model will take into account the requirement of amount of calculation and computational accuracy, rationally control stress and strain model density, to crucial portion
Position carries out mesh refinement, rationally realizes the precision distribution of single layer soldering polycrystalline CBN emery wheel stress and strain models.Operation in Abaqus
Path is：Mesh | control, in the Mesh Control dialog boxes for ejecting, Techniques is set to Free and (is appointed
Meaning), Algorithm (algorithm) is chosen as Medial axis (axis).
Finite element grid modeling is carried out to single layer soldering polycrystalline CBN Abrasive models according to above method, model is obtained limited
First grid model has node 45065, unit 12737.The single layer soldering polycrystalline CBN abrasive particle finite element grid moulds of foundation
Type, as shown in Figure 4.
Step 5：Effect on cutlage is analyzed
Effect on cutlage analysis be on the basis of single layer soldering polycrystalline CBN abrasive particle FEM meshes, abrasive particle,
The brazing temperature and cooldown rate used in actual soldering is loaded on solder and grinding wheel base body, and carries out thermal-stress coupling emulation,
The effect on cutlage that emulation single layer soldering polycrystalline CBN abrasive particles are produced during soldering cools.
Wherein, the brazing mode is vacuum resistance furnace soldering.Described brazing temperature and cool time are respectively：Soldering
900 DEG C of temperature, 10 DEG C/min of cooldown rate.Final chilling temperature is 20 DEG C.
Cooling analysis step is set up first in Abaqus softwares, and the courses of action in Abaqus are：Step|Create
Step, opens Create Step dialog boxes, and Procedure type (analysis step type) are Static, and General is (typically quiet
State), Continue is then clicked on, after initial analysis step is initial step, adds temperature down analysis steps,
The analysis step time is 4800.Brazing temperature and emulation end temp is set, the courses of action in Abaqus are：Load|
Predefined Field | Manager, opens Predefined Field Manager dialog boxes, clicks on create, select
Initial analysis steps, Category (species) are chosen as other, and Types for Selected Step are selected
Temperature, sets Magnitude (amplitude) as 800 DEG C, in initial step analysis steps by temperature
Down analysis steps are set to Modified (modification), and Magnitude (amplitude) is set as 20 DEG C, remaining parameter constant, thus
Complete cooling to arrange.Thermal-stress coupling analysis is carried out to model, single layer soldering polycrystalline CBN abrasive particles is obtained and is cooled in soldering
During produce effect on cutlage, as shown in Figure 5.
Step 6：Soldering/grinding synergy combined stress analysis
Soldering/grinding synergy combined stress analysis is on the basis of effect on cutlage model, adds grinding force (such as
Shown in Fig. 6), the soldering/lower combined stress of grinding synergy carried out during single layer soldering polycrystalline CBN abrasive particle high-speed grindings is imitative
Very, combined stress distribution of the single layer soldering polycrystalline CBN abrasive particles in grinding process is tried to achieve.
Add the analysis step of grinding force, the courses of action in Abaqus on the basis of former first effect on cutlage model
For Step | Create Step, open Create Step dialog boxes, click on create, in Temperature down analysis steps
Add Force analysis steps afterwards, the analysis step time is 10-5s.Secondly, add grinding force, the courses of action in Abaqus are：
Load | Manager, opens Manager dialog boxes, adds grinding force, wherein Types in Force analysis steps
Selected step (select Surface traction (surface external force), grinding force is 2.6N in the x-direction, is ground in the y-direction
Power is 1.4N.Complete grinding force loading after simulation analysis are carried out to model, obtain single layer soldering polycrystalline CBN abrasive particles soldering/
The lower combined stress distribution of grinding synergy.So far the distributional analysis of single layer soldering polycrystalline CBN abrasive particle effect on cutlage is completed, such as
Shown in Fig. 7.
Therefore embodiment 1 obtains effect on cutlage and soldering and grinding combined stress point on soldering polycrystalline CBN abrasive particles
Cloth cloud atlas is respectively as shown in Fig. 5,7.
If there is the following two kinds form in the method for not adopting Thiessen polygon to split, simulation model：(1) simulation model
Middle polycrystalline CBN abrasive particles are set as a kind of homogeneous material, there is no crystal boundary in the material, then the soldering stress distribution cloud of two-dimensional simulation
Figure is as shown in Figure 9.In Fig. 9, soldering stress mainly presents symmetrical, and STRESS VARIATION is steady, it is impossible to true reflection polycrystalline CBN mills
The acute variation of grain internal stress and abrasive particle are distributed for the impact of stress distribution, thus the method is not suitable for polycrystalline CBN
The stress simulation of abrasive particle.(2) the crystallite CBN grain shapes inside polycrystalline CBN abrasive particles are consistent, and arranging rule.Soldering stress is imitated
True cloud atlas is as shown in Figure 10.Now, abrasive particle size is similar, and shape is similar, and inside abrasive particle, soldering stress distribution assumes rule change,
But the randomness of STRESS VARIATION in true abrasive particle cannot be embodied, is therefore had some limitations.In sum, many using Tyson
The polycrystalline CBN Abrasive models of side shape segmentation can truly react polycrystalline CBN abrasive particles internal stress in soldering and grinding process
In STRESS VARIATION, for optimize brazed abrasive wheel make theoretical direction is provided.
Claims (5)
1. a kind of soldering of polycrystalline CBN abrasive particles and the synergistic stress simulation method of grinding based on Thiessen polygon segmentation, its
It is characterised by：Step is as follows：
Step one：Thiessen polygon is split
First, Matlab softwares are applied, and random distribution n point in the area of l are in long and width；Soft using Matlab
The Voronoi dividing functions of part carry out Thiessen polygon segmentation to this n point, form n microcrystal grain；Write Matlab journeys
Sequence, makes this n microcrystal grain reduce with respect to the center of area of itself, and shape invariance, reduced scale are referred to as volume fraction Vf；Will be raw
Into data be Iges formatted files by finite element emulation software Ansys Software Create physical model output format；
Step 2：Soldering polycrystalline CBN abrasive particles are modeled
The Iges formatted files generated described in step one are imported in finite element emulation software Abaqus software, soft using Abaqus
Modeling tool in part, sets up polycrystalline CBN abrasive particles, solder layer and base layer, and applies to constrain, and sets up single layer soldering CBN sand
The two dimensional model of wheel；
Step 3：Single layer soldering polycrystalline CBN Abrasive model material properties assignment：By requirement input single layer soldering in Abaqus softwares
CBN emery wheel material attributes；
Step 4：Single layer soldering polycrystalline CBN Abrasive models finite element grid is modeled
The modeling of single layer soldering polycrystalline CBN emery wheels finite element grid includes that cell type is chosen and stress and strain model；The grid cell class
CPS8R chosen by type；
Step 5：Effect on cutlage is analyzed
Effect on cutlage analysis is on the basis of single layer soldering polycrystalline CBN abrasive particle FEM meshes, in abrasive particle, solder
And the brazing temperature and cooldown rate on grinding wheel base body used in the actual soldering of loading, and thermal-stress coupling emulation is carried out, emulate
The effect on cutlage that single layer soldering CBN abrasive particles are produced during soldering cools；
Step 6：Soldering/grinding synergy combined stress analysis
Soldering/grinding synergy combined stress analysis is on the basis of effect on cutlage model, adds grinding force, carries out list
Combined stress emulation under soldering during layer soldering polycrystalline CBN abrasive particle high-speed grindings/grinding synergy, tries to achieve single layer soldering
Combined stress distribution of the polycrystalline CBN abrasive particles in grinding process.
2. a kind of collaboration with grinding based on the polycrystalline CBN abrasive particles soldering that Thiessen polygon is split according to claim 1 is made
Stress simulation method, it is characterised in that：In step one, crystallite polygon after Thiessen polygon segmentation, its drift angle are sat
It is designated as (xi, yi), center of area coordinate is (xc, yc), the polygonal area is A；Then polygon vertex coordinate (xi, yi), the center of area
Coordinate (xc, yc) and area A between there is relation as shown in formula (I)：
Then, volume fraction VfDefinition is such as formula (II)：
In Thiessen polygon, adhesive tape is formed between the microcrystal grain for generating, for arranging CBN, crystallite in emulation
Binding agent between grain.
As two polygons are similar, therefore volume fraction can represent an accepted way of doing sth (III) again：
Therefore：
Thus summit (x is obtainedi, yi) in volume fraction VfUnder corresponding apex coordinate (x 'i, y 'i), so can determine inside
Size and shape.
3. a kind of the collaboration with grinding based on the polycrystalline CBN abrasive particles soldering that Thiessen polygon is split according to claim 1 is made
Stress simulation method, it is characterised in that：Brazing mode described in step 5 is vacuum resistance furnace soldering.Described soldering temperature
Degree and cool time are respectively：900 DEG C of brazing temperature, 10 DEG C/min of cooldown rate.Final chilling temperature is 20 DEG C.
4. a kind of the collaboration with grinding based on the polycrystalline CBN abrasive particles soldering that Thiessen polygon is split according to claim 1 is made
Stress simulation method, it is characterised in that in step 3, described material properties are close needed for thermal-stress coupling analysis
Degree, specific heat, thermal conductivity, elastic modelling quantity, Poisson's ratio and thermal coefficient of expansion.
5. a kind of the collaboration with grinding based on the polycrystalline CBN abrasive particles soldering that Thiessen polygon is split according to claim 1 is made
Stress simulation method, it is characterised in that in step 4, stress and strain model will take into account the requirement of amount of calculation and computational accuracy, rationally
Control stress and strain model density, carries out mesh refinement to key position, rationally realizes single layer soldering polycrystalline CBN emery wheel stress and strain models
Precision is distributed.
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108089457A (en) * | 2017-11-29 | 2018-05-29 | 北京航空航天大学 | A kind of process quality control method based on online finite element simulation |
| CN108595887A (en) * | 2018-05-10 | 2018-09-28 | 南京航空航天大学 | A kind of simulation calculation and prediction technique that glomerocryst CBN abrasive wears develop |
| CN108629147A (en) * | 2018-05-02 | 2018-10-09 | 西安电子科技大学 | A kind of polycrystal Geometric Modeling Method |
| CN109214038A (en) * | 2018-07-09 | 2019-01-15 | 上海交通大学 | A kind of emery stick surface topography emulation mode |
| CN109858168A (en) * | 2019-02-14 | 2019-06-07 | 湘潭大学 | A kind of wheel face abrasive grain placement optimized calculation method based on discrete element emulation |
| CN111881604A (en) * | 2020-07-24 | 2020-11-03 | 西安建筑科技大学 | Three-dimensional finite element model modeling method for Thiessen polygon subdivision |
| CN112100888A (en) * | 2020-09-07 | 2020-12-18 | 南京航空航天大学 | Blade tenon tooth slow-advancing deep-cutting forming grinding residual stress prediction method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040161639A1 (en) * | 2003-02-17 | 2004-08-19 | Kyocera Corporation | Surface-coated member |
| CN101859337A (en) * | 2010-06-04 | 2010-10-13 | 中国地质大学（北京） | Method for evaluating cracking of brazing diamond abrasive grain alloy layer |
| CN104057404A (en) * | 2014-06-19 | 2014-09-24 | 南京航空航天大学 | Three-dimensional cooperative distribution method for various grinding materials for preparing superhard tool |
| CN108595887A (en) * | 2018-05-10 | 2018-09-28 | 南京航空航天大学 | A kind of simulation calculation and prediction technique that glomerocryst CBN abrasive wears develop |
-
2016
- 2016-09-18 CN CN201610828742.2A patent/CN106503289B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040161639A1 (en) * | 2003-02-17 | 2004-08-19 | Kyocera Corporation | Surface-coated member |
| CN101859337A (en) * | 2010-06-04 | 2010-10-13 | 中国地质大学（北京） | Method for evaluating cracking of brazing diamond abrasive grain alloy layer |
| CN104057404A (en) * | 2014-06-19 | 2014-09-24 | 南京航空航天大学 | Three-dimensional cooperative distribution method for various grinding materials for preparing superhard tool |
| CN108595887A (en) * | 2018-05-10 | 2018-09-28 | 南京航空航天大学 | A kind of simulation calculation and prediction technique that glomerocryst CBN abrasive wears develop |
Non-Patent Citations (2)
| Title |
|---|
| TINGTING ZHOU 等: "Microscopic cracking simulation of nanocomposite ceramic tool materials under the consideration of residual stress", 《INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY》 * |
| 丁文锋 等: "立方氮化硼超硬磨料与45钢钎焊接头残余应力有限元分析", 《机械工程学报》 * |
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