CN106501637B - The method for determining antiskid brake control device high temperature weak link - Google Patents
The method for determining antiskid brake control device high temperature weak link Download PDFInfo
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- CN106501637B CN106501637B CN201610876515.7A CN201610876515A CN106501637B CN 106501637 B CN106501637 B CN 106501637B CN 201610876515 A CN201610876515 A CN 201610876515A CN 106501637 B CN106501637 B CN 106501637B
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- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/003—Environmental or reliability tests
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Abstract
A kind of method of determining antiskid brake control device high temperature weak link, using 3-D graphic software, make antiskid brake control device shell, the circuit board of antiskid brake control device, antiskid brake control device component 3-D graphic；The 3-D graphic for simplifying antiskid brake control device, the three-dimensional high temperature computation model of antiskid brake control device is established using hydrodynamics software；The computation model is used to substitute the products in kind of antiskid brake control device；Using the temperature of the method actual measurement antiskid brake control device shell of room temperature Thermal test, heating device.Using computer technology and conventional software, the high temperature weak link of antiskid brake control device is determined, do not generate test pollution and testing equipment consumption, energy consumption, save the tests exemplar of antiskid brake control device.
Description
Technical field
The present invention relates to the high Temperature Fault Analysis fields of civilian airplane in transportation category electronic product, specifically use computer skill
The method that art determines antiskid brake control device high temperature weak link.
Background technique
Antiskid brake control device is changed electric signal, is carried out landing antiskid brake by aviation power supply, receiver wheel speed
Brake pressure control in journey.The antiskid brake control device can be completed normally to land antiskid brake control, take-off line brake
Control, the control of vehicle protection among wheels, ground protection control, the control functions such as wheel rotation stop brake after undercarriage stowage.
The high temperature of antiskid brake control device calculates temperature and refers to the shape that works under the high temperature conditions with antiskid brake control device
Under state, the high-temperature temperature that is calculated.
Foreign current situation:
In order to reduce failure caused by high temperature, foreign countries determine the high temperature weak link of electronic product using following technology:
1) screening of electric components is carried out according to MIL-STD-2164 " electronic device environment stress screening " standard；
2) according to MIL-STD-781 " product development, identification and production in reliability test " carry out reliability test, will
Occurs the component of high temperature failure in test as high temperature weak link；
3) high accelerated aging is used according to Unite States Standard GMW8287 " high accelerated aging, highly accelerated stress screen and sampling observation "
The method of test, using the component for occurring high temperature failure in test as high temperature weak link；
4) the high temperature weak link of electronic product is determined using the method calculated；
5) weak link is determined using MIL-STD-217F " electronic product reliability is estimated ", it is contemplated that use index in the process
Distribution.
Although above-mentioned technology can determine the high temperature weak link of a part of electronic product；But there are following deficiencies:
1) complete machine carries out Highly Accelerated Life Test and determines that the waste of high temperature weak link fund is too big；
2) component for occurring high temperature failure in environmental stress screening may be failure caused by manufacture reason, aging,
With uncertain factor；
3) component for occurring high temperature failure in reliability test may be manufacture reason, it is also possible to being really high temperature weakness
Link has uncertain factor；
4) determine that high temperature weak link does not complete the transition used by theoretical research to engineering also using the method calculated, it is right
The amendment of computation model is insufficient, and computational accuracy is poor；
5) weak link is determined using MIL-STD-217F " electronic product reliability is estimated ", it is contemplated that use index in the process
Distribution, Xi'an Aviation Brake Technology Co., Ltd. propose a kind of true in the innovation and creation application No. is 201610373996.X
Determine the method for antiskid brake control device high temperature failure distribution, this method proves that the high temperature failure of component disobeys index point
Cloth can be generated according to exponential distribution intended result greater than 103Error.
Present status in China:
Domestic electronic product determines the high temperature weak link of electronic product using following technology:
1, high accelerated aging is used according to Unite States Standard GMW8287 " high accelerated aging, highly accelerated stress screen and sampling observation "
The method of test, using the component for occurring high temperature failure in test as high temperature weak link；
2, screening of electric components is carried out according to GJB1032 " electronic device environment stress screening " standard；
3, it is tested according to GJB899 " reliability test and acceptance test ", will occur first device of high temperature failure in test
Part is as high temperature weak link；
4, the high temperature weak link of electronic product is determined using the method for calculating；
5, weak link is determined using GJB299C " electronic product reliability is estimated ", model is exponential distribution.
6, a kind of determining airplane antiskid braking control box hot operation stress pole is disclosed in ZL201110310885.1
The method of limit.This method has determined the hot operation pole of analog circuit antiskid braking control box using reliability intensifying experimental facilities
Limit；
7, a kind of method of antiskid braking control box high temperature limit is disclosed in ZL 201310169039.1.It should
Method has determined the high temperature limit of digital circuit antiskid braking control box using three synthetic experiment equipments.
Although the country use above-mentioned technology it can be found that electronic product high temperature weak link, but still there are it is following not
Foot:
1, complete machine carries out Highly Accelerated Life Test and determines that the waste of high temperature weak link fund is too big；
2, the component for occurring high temperature failure in environmental stress screening can not rule out event caused by manufacture reason, aging
Barrier has uncertain factor；
3, the component for occurring high temperature failure in reliability test can not rule out manufacture reason, have uncertain factor；
4, determine that high temperature weak link does not complete the mistake promoted the use of by theoretical research to engineering also using the method for calculating
It crosses, calculation method is immature, and insufficient to the amendment of computation model, computational accuracy is poor；
5, high temperature weak link is determined using GJB299C, it is contemplated that in the process use exponential distribution, application No. is
A kind of side of determining antiskid brake control device high temperature failure distribution function is disclosed in the innovation and creation of 201610373996.X
Method, this method prove that the high temperature failure of component disobeys exponential distribution, can produce when high temperature failure estimated using exponential distribution
Raw thousands of times of error, this is the deficiency of existing standard.GJB299C writes referring to MIL-STD-217F, external foundation
217F, it is expected that it is domestic according to 299C, it is expected that making to be the same mistake.
6, the purpose in ZL201110310885.1 is that drift occurs for determining analog circuit antiskid braking control box performance
The hot operation limit is a kind of with the test for destroying property, can replace damage component after the test and repair product.Though
So can be according to test data analyzer high temperature weak link, but primary test puts into 2 sets of antiskid braking control box economic losses
It is exactly 500,000 yuan, 300,000 yuan of testing expenses.And 2 sets of quantity are few, determine that the precision of high temperature weak link is low.
7, in ZL201310169039.1 purpose be determining digital circuit antiskid braking control box the high temperature limit.This
It is a kind of destructive testing, repairs product after the test without economic value.Although can be according to test data analyzer
High temperature weak link, but 2 sets of antiskid braking control box economic losses of primary test investment are exactly 2,000,000 yuan.And 2 sets of quantity
It is few, determine that the precision of high temperature weak link is low.
Summary of the invention
Hot test time of the existing technology is long, testing expenses are high to overcome, and computational accuracy is low, cannot accurately determine
Electronic product high temperature weak link generates the big status of error using the failure rate method for predicting in standard, and the present invention proposes one
The method that kind determines antiskid brake control device high temperature weak link.
Of the invention comprises the concrete steps that:
Step 1, the preparation that high temperature calculates:
The preparation that the high temperature calculates includes the structural information for acquiring the antiskid brake control device, all kinds of members of acquisition
The information of device, and draw the three-dimensional geometric shapes of the antiskid brake control device.
Specifically process is:
The first step prepares the structural information of the antiskid brake control device
The structural information includes the composition and connection type of the antiskid brake control device.
Second step prepares the information of all kinds of components
2 pieces of circuit boards include 12 integration modules altogether, model, weight, the size, encapsulation of component on integration module
The information such as form, as the information for calculating high temperature weak link.
Third step draws the three-dimensional geometric shapes of the antiskid brake control device
Using the three-dimensional geometric shapes of the CITIA Software on Drawing antiskid brake control device, it is divided into following 3 partial content:
1) three-dimensional geometric shapes of the antiskid brake control device finished product state；
2) three-dimensional geometric shapes of the antiskid brake control device circuit board；
3) three-dimensional geometric shapes of the integration module of the antiskid brake control device, component.
So far, the preparation of antiskid brake control device high temperature calculating is completed.
Step 2, the high temperature computation model of antiskid brake control device is established:
The modeling procedure that antiskid brake control device high temperature calculates are as follows:
The first step is revised according to the three-dimensional geometric shapes of the antiskid brake control device；
The revision that the three-dimensional geometric shapes to antiskid brake control device carry out includes: to remove diameter less than 0.65mm
Hole；Remove the boss that size is less than 0.65mm；Delete the connectors such as screw, connector, the cable unrelated with heat analysis.
Second step, according to the packing forms of the location information of all components and each type component, temperature model
It encloses, voltage and current, plugging mode, weight and outer dimension, carries out circuit board modeling.The above-mentioned letter of the various types of component
Breath is obtained by purchasing handbook.
Third step inputs relevant parameter
Input the work of the power consumption, case material, antiskid brake control device of component of the power consumption more than or equal to 0.05W
Environmental condition.
By the gravity direction of antiskid brake control device according to level installation direction setting.
4th step, grid dividing: region of the power consumption more than or equal to 0.05W is set as domain grid and is controlled.The region with
Outer position is automatically generated by software.
So far, the high temperature modeling work of antiskid brake control device is completed.
Step 3, the temperature of each heating element is calculated under normal temperature conditions
According to high temperature computation model, the component by power consumption more than or equal to 0.05W is determined as heating element
The temperature condition of calculating: environment temperature is set as 25 DEG C.The function of each heating element is inputted into computer
Consumption, and the maximum power dissipation of the heating element and the common power consumption of the low-power consumption component respectively account for 50%.
Step 4, heating element heat distribution parameter and complete machine geo-thermal response test parameter are obtained
The heating element heat distribution parameter and complete machine geo-thermal response test parameter are obtained by way of test.Work as test
When the calculating data of obtained heating element heat distribution are greater than measured data, need to correct high temperature calculating mould according to measured data
Type；When there is the big heating element of temperature rise under working condition in complete machine geo-thermal response test, need to change to high temperature computation model
Generation amendment.
Test temperature is room temperature.
The first step carries out heating element heat distribution test: circuit board measured surface is applied to dumb light paint, in each integrated mould
Thermal test point is arranged on the heating element of block, antiskid brake control device is respectively according under maximum power dissipation and common power consumption state
Operation, heat balance time 1h are tested after equalized temperature with thermal imaging system, and each module hair on each circuit board is finally obtained
The temperature data of thermal device.
Second step, complete machine geo-thermal response test: respectively according to maximum power dissipation and common power consumption under the conditions of 25 DEG C of environment temperature
State is powered to the antiskid brake control device；Conduction time is to terminate to test.Start to test after energization 1h, in table 2
Listed instrument acquires the contact point and anti-skidding brake of module and antiskid brake control device shell in the antiskid brake control device
The temperature at truck control device housing outer surface center.
1) according to the difference between measured data and calculating data, each fever is modified within the scope of each component rated disspation
The power consumption number of component, to reduce Thermal test data and calculate the difference between data.When the difference of measured value and calculated value is big
When 5%, the power consumption number of the former hair member thermal device determined need to be modified, the precision of high temperature computation model is improved.When modification, if real
Thermometric angle value, which is higher than, calculates temperature value, then improve the power consumption number of the heating element；Conversely, if observed temperature value is lower than calculating
Temperature value, then reduce the power consumption number of the heating element.The increase rate of the heating element power consumption number reduces amplitude and is
0.01~0.02W.
2) according to GJB299C " the estimated handbook of reliability of electronic equipment ", heating element encapsulating material is modified；It is basic herein
On, high temperature computation model is adjusted, amendment work for the first time is completed.
Step 5, iterated revision high temperature computation model
The environment temperature of the iterated revision is 40~60 DEG C.In iterated revision, each fever is increased gradually with 5 DEG C of step-length
The temperature of component.By the temperature data of actual measurement heating element under the Current Temperatures of setting, and by high temperature described in step 4
The makeover process of computation model is iterated amendment to high temperature computation model, and by the data after each iterated revision and surveys number
According to being compared, if the worst error between the two is greater than 5%, continue the amendment work of high temperature computation model；If between the two most
Less than 5%, amendment can terminate big error.
Step 6, the high temperature weak link of antiskid brake control device is determined according to iterated revision result
The analysis of high temperature weak link is carried out using the revised high temperature computation model of antiskid brake control device.Using environment
Temperature is set and high-temperature control temperature is the high temperature weak link of the determining antiskid brake control device after amendment
So far, determine that the process of the high temperature weak link of the antiskid brake control device terminates.
The present invention uses computer technology and conventional software, determines the high temperature weak link of antiskid brake control device, no
Test pollution and testing equipment consumption, energy consumption are generated, the tests exemplar of antiskid brake control device is saved.
In the present invention:
1) use 3-D graphic software, make antiskid brake control device shell, antiskid brake control device circuit board,
The 3-D graphic of the component of antiskid brake control device；
2) 3-D graphic for simplifying antiskid brake control device, establishes antiskid brake control device using hydrodynamics software
Three-dimensional high temperature computation model；The computation model is used to substitute the products in kind of antiskid brake control device；
3) using the temperature of the method actual measurement antiskid brake control device shell of room temperature Thermal test, heating device, the test
For the data of a room temperature point；
Xi'an Aviation Brake Technology Co., Ltd. proposes one in the innovation and creation application No. is 201610584291.2
The method that kind test antiskid brake control device high temperature calculates model data, according to each high temperature test tested in this method
Point data, it is point-by-point to correct low temperature computation model., guarantee the precision of high temperature calculated result.
Component at 70 DEG C of environment temperature and under working condition higher than 100 DEG C is determined as high temperature weak link.
Implementation result of the invention:
The high temperature weak link and existing actual loading test technology phase of antiskid brake control device are determined using computer technology
Than having the effect of saving test period, saving expenditures, reduction energy consumption.Specific implementation result has:
1) time-saving effect determines that high temperature weak link needs 7 day time using Highly Accelerated Life Test, using this
Inventive technique only needs 1 day time just to can determine the high temperature weak link of antiskid brake control device；
2) the problem of effect of saving tests exemplar expense, there is no consumption test exemplars using computer technology；
3) effect of reduction of expenditure, Highly Accelerated Life Test expense hourly are 1500 yuan, testing expenses in 7 days are as follows: 7
It × 8h/ daily × 1500 yuan/h=84000 member, using computer, there is no need to pay this expense；
4) have the effect of reducing energy consumption, the high temperature step test power in Highly Accelerated Life Test is 130kw, energy
Source consumption is big；
5) temperature value of present invention actual measurement high temperature each point, does not damage antiskid brake control device, does not generate high temperature step
Into the spending of test, the purpose for the arrangement is that improving the computational accuracy of high temperature computation model.
The comprehensive comparison of the present invention and prior art implementation result:
1) compare with the effect of environmental stress screening: environmental stress screening is a kind of subsequent 100% method examined, screening
In it is without failure can dispatch from the factory, that breaks down cannot dispatch from the factory；It can be found in development process using the method for calculating
With exclusion high temperature weak link, product development quality is improved；
2) every set control box high temperature calculates and the time of environmental stress screening, expense compare: environmental stress screening expense 80h
× 500 yuan/h=40000 member；The calculating expense of computer: 15h × 100/h=1500 member；
3) compare with the time of reliability test, expense；According to GJB899A high-risk test scheme in short-term, when control box
MTBF when being 3000h, test period 3300h, testing expenses are as follows: 3300h × 500 yuan/h=1650000 member；Computer into
Row high temperature weak link calculates expense: 15h × 100/h=1500 member；
4) compare with the effect of existing computing technique, computation model of the invention uses HB5830.8 " airborne equipment environment
Condition and test method high temperature " as defined in high temperature range, with the data correction high temperature computation model of 8 high-temperature temperature test points,
And the prior art is 1 measured data amendment, prior art electronic product high temperature, which calculates error range, can reach ± 10%, this hair
Bright calculating error is less than ± 5%.
Detailed description of the invention
Attached drawing 1 is the schematic diagram of each panel of antiskid brake control device shell.In figure:
1. first side plate；2. second side plate；3. installing plug panel；4. rear panel；5. top panel；6. lower panel；
7. plug.
Attached drawing 2 is flow chart of the invention.
Specific embodiment
The present embodiment provides power supply, receiver rotation by taking certain civil transport antiskid brake control device as an example, by aircraft
Fast variable quantity electric signal carries out the control of antiskid brake pressure.The antiskid brake control device can be completed normally to land anti-skidding brake
Vehicle control, protection among wheels, ground protection, the various functions of wheel rotation stop brake after taking off.
The detailed process of the present embodiment is:
Step 1, the preparation that high temperature calculates
The preparation that the high temperature calculates includes the structural information for acquiring the antiskid brake control device, all kinds of members of acquisition
The information of device, and draw the three-dimensional geometric shapes of the antiskid brake control device.Specifically:
The first step prepares the structural information of the antiskid brake control device
The structural information includes the composition and connection type of the antiskid brake control device.
The antiskid brake control device is made of shell and 2 pieces of circuit boards, and 2 fast-circuit plates are respectively as follows: control panel, record
Plate；It is connected using slot mode with shell.
The information of shell collected includes the shape and size, material, seal form of the shell.
Second step prepares the information of all kinds of components
2 pieces of circuit boards include 12 integration modules altogether, model, weight, the size, encapsulation of component on integration module
The information such as form, as the information for calculating high temperature weak link.
Third step draws the three-dimensional geometric shapes of the antiskid brake control device
Using the three-dimensional geometric shapes of the CITIA Software on Drawing antiskid brake control device, it is divided into following 3 partial content:
4) three-dimensional geometric shapes of the antiskid brake control device finished product state；
5) three-dimensional geometric shapes of the antiskid brake control device circuit board；
6) three-dimensional geometric shapes of the integration module of the antiskid brake control device, component.
So far, the preparation of antiskid brake control device high temperature calculating is completed.
Step 2, the high temperature computation model of antiskid brake control device is established
Following equipment, software are used from this step.
Testing equipment: HPZ800 computer workstation.
Software used is shown in Table 1, and used test instrument is shown in Table 2.
Table 1 determines software register used in high temperature weak link
| Sequence | Title | Manufacturer | Version | Purposes |
| 1 | CITIA | America DS Inc | V5R18 | Drawing 3 D graphics |
| 2 | FLOTHERM | MENTORGRAPHICS company, the U.S. | 8.1 | Carry out high temperature calculating |
2 Thermal test instrument summary sheet of table
| Sequence | Title | Model | Manufacturer | Purposes |
| 1 | Thermal imaging system | TI55 | FLUX company, the U.S. | Acquire thermal signal |
| 2 | Data collecting instrument | ANGILENT34970A | ANGILENT company, the U.S. | Acquire dsc data |
| 3 | Thermocouple | T-type | ANGILENT company, the U.S. | Acquire the temperature of high-temperature device |
The modeling procedure that antiskid brake control device high temperature calculates are as follows:
The first step carries out following revision according to the three-dimensional geometric shapes of the antiskid brake control device:
1) remove the hole that diameter is less than 0.65mm；
2) remove the boss that size is less than 0.65mm；
3) connectors such as screw, connector, the cable unrelated with heat analysis are deleted.
Second step, according to the packing forms of the location information of all components and each type component, temperature model
It encloses, voltage and current, plugging mode, weight and outer dimension, carries out circuit board modeling.The above-mentioned letter of the various types of component
Breath is obtained by purchasing handbook.
Third step inputs relevant parameter
Input the power consumption of component of the power consumption more than or equal to 0.05W, case material, antiskid brake control device building ring
Border condition.In the present embodiment, it is:
1) case material: aluminum alloy materials；
2) component power consumption: the component to all power consumptions more than or equal to 0.05W carries out power consumption setting, and power consumption is less than
The component and whole plate power consumption of 0.05W is additional on circuit boards；
3) environmental condition: GJB150 is up to 70 DEG C；Present invention determine that when calculating error less than ± 5%, before 70 DEG C
Terminate to calculate；When error is greater than ± 5%, environmental condition is higher than 70 DEG C, be less than up to reaching calculating error and measurement error ±
5%.
By the gravity direction of antiskid brake control device according to level installation direction setting.
4th step, grid dividing: region of the power consumption greater than 0.05W is set as domain grid and is controlled.Other than the region
Position is automatically generated by software.
So far, the high temperature modeling work of antiskid brake control device is completed.
Step 3, the temperature of each heating element is calculated under normal temperature conditions
According to high temperature computation model, the component by power consumption more than or equal to 0.05W is determined as heating element.Fever member
Device said module is shown in Table 3.
The temperature condition of calculating: environment temperature is set as 25 DEG C.The function of each heating element is inputted into computer
Consumption, and the maximum power dissipation of the low-power consumption component and the common power consumption of the low-power consumption component respectively account for 50%.Data are calculated to see
Table 3.
The heating element temperature that table 3 is calculated using model, environment temperature: 25 DEG C
Step 4, heating element heat distribution parameter and complete machine geo-thermal response test parameter are obtained
The heating element heat distribution parameter and complete machine geo-thermal response test parameter are obtained by way of test.
Test temperature is room temperature.In the present embodiment, test temperature is 25 DEG C.
The first step carries out heating element heat distribution test: circuit board measured surface is applied to dumb light paint, in each integrated mould
Arrange that Thermal test point, heating module, component are shown in Table 4 on the heating element of block, antiskid brake control device is respectively according to most
It is run under big power consumption and common power consumption state, heat balance time 1h is tested after equalized temperature with thermal imaging system, finally
The temperature data of each module heating device on each circuit board is obtained, is shown in Table 4.
Each heating device data summary table that the actual measurement of table 4 obtains, 25 DEG C of environment temperature
The calculating of table 3 data are generally bigger than 4 measured data measured data of table, the mistake of 16 fixed point DSPs of high temperature
Difference are as follows: (86-73)/73=17.3, it is impossible to be used in engineering corrects high temperature computation model according to 4 measured data of table.
Second step, complete machine geo-thermal response test: complete machine geo-thermal response test: respectively according to maximum under the conditions of 25 DEG C of environment temperature
Power consumption and common power consumption state are powered to the antiskid brake control device；Conduction time is to terminate to test.It is opened after energization 1h
Begin test, acquires connecing for module and antiskid brake control device shell in the antiskid brake control device with instrument listed in table 2
The temperature of contact and antiskid brake control device housing outer surface center, is shown in Table 5.
5 antiskid brake control device complete machine geo-thermal response test data of table, 25 DEG C of environment temperature
Antiskid brake control dress when first side plate 1 described in table 5 and second side plate 2 are located at towards plug 7
Set the left and right side of shell；When the rear panel 4 is towards plug behind antiskid brake control device shell.
According to measured data obtained in table 4 and table 5, boundary condition, the parameter of high temperature computation model are corrected.
1) difference between data is calculated according to the measured data of table 4 and table 3, is repaired within the scope of each component rated disspation
Change the power consumption number of each heating element, to reduce Thermal test data and calculate the difference between data.When measured value and calculated value
Difference when being greater than 5%, the power consumption number of the former fever member device determined need to be modified, improve the precision of high temperature computation model.Modification
When, if observed temperature value, which is higher than, calculates temperature value, improve the power consumption number of the heating element；Conversely, if observed temperature value is low
In calculating temperature value, then the power consumption number of the heating element is reduced.The increase rate of the heating element power consumption number or reduction
Amplitude is 0.01~0.02W.
2) according to the estimated handbook of GJB299C reliability of electronic equipment, this part heating element encapsulating material is modified；Herein
On the basis of, high temperature computation model is adjusted, amendment work for the first time is completed.
Step 5, iterated revision high temperature computation model
When iterated revision high temperature computation model, when once correcting obtained result and not being able to satisfy required precision, carry out down
Primary amendment, until computational accuracy is met the requirements.
The environment temperature of the iterated revision is 40~60 DEG C.In iterated revision, each fever is increased gradually with 5 DEG C of step-length
The temperature of component.By the temperature data of actual measurement heating element under the Current Temperatures of setting, and by high temperature described in step 4
The makeover process of computation model is iterated amendment to high temperature computation model, and by the data after each iterated revision and surveys number
According to being compared, if the worst error between the two is greater than 5%, continue the amendment work of high temperature computation model；If between the two most
Less than 5%, amendment can terminate big error.
First time iterated revision is carried out to high temperature computation model.
It is obtained by table 5, the Thermal test temperature of second side plate is 57 DEG C, is higher by 32 DEG C of environment temperature, in the operating condition
Temperature rise it is big.When amendment, the difference between data is calculated according to the measured data of table 4 and table 3, the power consumption number of each component is mentioned
High 0.01~0.02W, to reduce Thermal test data and calculate the difference between data.It simultaneously can according to GJB299C electronic equipment
By the estimated handbook of property, the encapsulating material information of heating element described in model is modified, and be adjusted to high temperature computation model,
Complete amendment work for the first time.
Calculating data after correcting high temperature computation model according to 4 measured data of table are shown in Table 6.
Table 6 corrects 25 DEG C of the temperature computation data environment temperature of heating element after high temperature computation model for the first time
In table 6, the worst error for calculating data and measured data revised for the first time are as follows: (80-73)/73=9.5%,
It need to continue the amendment work of high temperature computation model.
Amendment target of the invention is to calculate error to be less than ± 5%.In order to reach requirement, continue using Xi'an aviation
The test antiskid brake control dress that braking Science and Technology Ltd. proposes in the innovation and creation application No. is 201610584291.2
It sets high temperature and calculates the progress high temperature computation model adjustment of test data obtained in the method for model data.
Second of iterated revision is carried out to high temperature computation model.
The environment temperature of second of iterated revision surveys the temperature of each heating element when being 40 DEG C.
The method of the actual measurement heating element temperature is the same as heating element heat distribution test method in step 4.Using hair
Temperature data of the bright 201610584291.2 actual measurement antiskid brake control device at 40 DEG C of environment temperature is shown in Table 7.
Test data of the table 7 under 40 DEG C of environment temperature and antiskid brake control device working condition
40 DEG C are set by the environment temperature in computation model, obtains the temperature of each heating element at 40 DEG C.
According to the temperature data for surveying heating element in table 7, and by the amendment of high temperature computation model described in step 4
Journey carries out second to high temperature computation model and corrects.Revised data are shown in Table 8.
40 DEG C of the calculating data environment temperature of heating element after second of table 8 amendment high temperature computation model
In table 8, second of revised worst error for calculating data and measured data are as follows: (96-88)/88=9% is needed
Continue the amendment work of high temperature computation model.
Third time iterated revision is carried out to high temperature computation model.
The environment temperature of third time iterated revision surveys the temperature of each heating element when being 45 DEG C
The method of each heating element temperature of actual measurement is the same as the heating element heat distribution test method in step 4.It adopts
Temperature data of the antiskid brake control device at 45 DEG C of environment temperature, which is surveyed, with invention 201610584291.2 is shown in Table 9.
Test data of the table 9 under 45 DEG C of environment temperature and antiskid brake control device working condition
45 DEG C are set by the environment temperature in computation model, obtains the temperature of each heating element at 45 DEG C.
The temperature data for surveying heating element in table 9 is compared with the data in computation model at 45 DEG C, and is pressed
The makeover process of high temperature computation model described in step 4 carries out third time amendment to high temperature computation model.Revised data are shown in
Table 10.
The calculating data environment temperature 45 C of each heating element after table 10 is corrected for the third time
In table 10, the revised worst error for calculating data and measured data of third time are as follows: (100-93)/93=
7.5%, the amendment work of high temperature computation model need to be continued.
4th iterated revision is carried out to low temperature computation model.
The environment temperature of 4th iterated revision surveys the temperature of each heating element when being 50 DEG C
The method of each heating element temperature of actual measurement is the same as the heating element heat distribution test method in step 4.It adopts
Temperature data of the antiskid brake control device at 50 DEG C of environment temperature, which is surveyed, with invention 201610584291.2 is shown in Table 11.
Test data of the table 11 under 50 DEG C of environment temperature and antiskid brake control device working condition
50 DEG C are set by the environment temperature in computation model, obtains the temperature of each heating element at 50 DEG C.
The temperature data for surveying heating element in table 11 is compared with the data in computation model at 50 DEG C, and is pressed
The makeover process of high temperature computation model described in step 4 carries out the 4th amendment to high temperature computation model.Revised data are shown in
Table 12.
The temperature computation data environment temperature 50 C of the 4th revised each heating element of table 12
In table 12, the 4th revised worst error for calculating data and measured data are as follows: (104-98)/98=
6.1%, the amendment work of high temperature computation model need to be continued.
5th iterated revision is carried out to high temperature computation model.
The environment temperature of 5th iterated revision surveys the temperature of each heating element when being 55 DEG C
The method of each heating element temperature of actual measurement is the same as the heating element heat distribution test method in step 4.It adopts
Temperature data of the antiskid brake control device at 55 DEG C of environment temperature, which is surveyed, with invention 201610584291.2 is shown in Table 13.
Test data of the table 13 under 55 DEG C of environment temperature and antiskid brake control device working condition
55 DEG C are set by the environment temperature in computation model, obtains the temperature of each heating element at 55 DEG C.
The temperature data for surveying heating element in table 13 is compared with the data in computation model at 55 DEG C, and is pressed
The makeover process of high temperature computation model described in step 4 carries out the 5th amendment to high temperature computation model.Revised data are shown in
Table 14.
55 DEG C of the temperature computation data environment temperature of the 5th revised each heating element of table 14
In table 14, the 5th revised worst error for calculating data and measured data are as follows: (108-103)/103=
4.9%, on the boundary line of 5% error, continue the amendment work of high temperature computation model.
Sixth iteration amendment is carried out to high temperature computation model.
Sixth iteration modified environment temperature surveys the temperature of each heating element when being 60 DEG C
The method of each heating element temperature of actual measurement is the same as the heating element heat distribution test method in step 4.It adopts
Temperature data of the antiskid brake control device at 60 DEG C of environment temperature, which is surveyed, with invention 201610584291.2 is shown in Table 15.
Test data of the table 15 under 60 DEG C of environment temperature and antiskid brake control device working condition
60 DEG C are set by the environment temperature in computation model, obtains the temperature of each heating element at 60 DEG C.
The temperature data for surveying heating element in table 15 is compared with the data in computation model at 60 DEG C, and is pressed
The makeover process of high temperature computation model described in step 4 carries out the 6th amendment to high temperature computation model.Revised data are shown in
Table 16.
The temperature computation data environment temperature 60 C of the 6th revised each heating element of table 16
6th revised calculating data and measured data worst error in table 16 are as follows: (112-108)/108=
3.7%, less than the error of regulation 5%, the amendment work of high temperature computation model terminates.
Step 6, the high temperature weak link of antiskid brake control device is determined according to iterated revision result
The analysis of high temperature weak link is carried out using the revised high temperature computation model of antiskid brake control device.The height of use
Temperature setting temperature and high-temperature control temperature are shown in Table 17, and 70 in table DEG C derive from HB5830.8 hot test, go out described in table
Mouth temperature is the high-temperature gas outlet temperature of three combined test chambers of computer simulation.The environment temperature and high-temperature gas export
Temperature is 70 DEG C.
The high temperature weak link of antiskid brake control device refers under 70 DEG C of environmental conditions and temperature is higher than under working condition
100 DEG C of module, component.
Table 17 determines the setting condition that antiskid brake control device high temperature calculates
Antiskid brake control device shell temperature rise calculated result is shown in Table 18, and each module, the calculated result of component are shown in Table 19.
The shell high-temperature analysis result of 18 antiskid brake control device of table,
| Shell mean temperature DEG C | Environment temperature DEG C | Shell average temperature rising DEG C |
| 89 | 70 | 19 |
Each module temperature calculated result under 70 DEG C of environment temperature and antiskid brake control device working condition of table 19
It is calculated using revised high temperature computation model, in 70 DEG C of environment temperature and antiskid brake control device working condition
Under, high temperature microcontroller chip, 16 fixed point DSPs of high temperature, data board high temperature storage, high temperature integrated device, high temperature
Programmable logic circuit, the temperature of high temperature bus transceiver have reached 100 DEG C, are the high temperature weakness rings of antiskid brake control device
Section.
So far, determine that the process of the high temperature weak link of the antiskid brake control device terminates.
Claims (2)
1. a kind of method of determining antiskid brake control device high temperature weak link, which is characterized in that comprise the concrete steps that:
Step 1, the preparation that high temperature calculates:
The preparation that the high temperature calculates includes the structural information for acquiring the antiskid brake control device, all kinds of components of acquisition
Information, and draw the three-dimensional geometric shapes of the antiskid brake control device；
Step 2, the high temperature computation model of antiskid brake control device is established:
The modeling procedure that antiskid brake control device high temperature calculates are as follows:
The first step includes: to remove diameter to be less than according to the revision that the three-dimensional geometric shapes of the antiskid brake control device carry out
The hole of 0.65mm；Remove the boss that size is less than 0.65mm；Delete the screw unrelated with heat analysis, connector, cable connectors；
Second step, according to the location information of all components and packing forms, temperature range, the electricity of each type component
Current voltage, plugging mode, weight and outer dimension carry out circuit board modeling；The above- mentioned information of the various types of component are equal
It is obtained by purchasing handbook；
Third step inputs relevant parameter
Input the power consumption of component of the power consumption more than or equal to 0.05W, case material, antiskid brake control device working environment item
Part；
By the gravity direction of antiskid brake control device according to level installation direction setting；
4th step, grid dividing: region of the power consumption more than or equal to 0.05W is set as domain grid and is controlled；Other than the region
Position is automatically generated by software；
So far, the high temperature modeling work of antiskid brake control device is completed；
Step 3, the temperature of each heating element is calculated under normal temperature conditions
According to high temperature computation model, the component by power consumption more than or equal to 0.05W is determined as heating element
The temperature condition of calculating: environment temperature is set as 25 DEG C；The power consumption of each heating element is inputted into computer, and
And the maximum power dissipation of the heating element and the common power consumption of the heating element respectively account for 50%；
Step 4, heating element heat distribution parameter and complete machine geo-thermal response test parameter are obtained
The test temperature for testing heating element heat distribution parameter and complete machine geo-thermal response test parameter is room temperature；Specifically:
The first step carries out heating element heat distribution test: circuit board measured surface is applied to dumb light paint, in each integration module
Thermal test point is arranged on heating element, antiskid brake control device under maximum power dissipation and common power consumption state respectively according to transporting
Row, heat balance time 1h are tested after equalized temperature with thermal imaging system, and each integration module on each circuit board is finally obtained
The temperature data of heating element；
Complete machine geo-thermal response test: second step is powered to the antiskid brake control device under the conditions of 25 DEG C of environment temperature, presses respectively
Carried out according to maximum power dissipation and common power consumption state, after waiting thermal balance, acquire in the antiskid brake control device integration module with
At shell contact point and the temperature at housing outer surface center；
According to measured data, boundary condition, the parameter of high temperature computation model are corrected, specifically:
I, according to the difference between measured data and calculating data, modifies the first device of each fever within the scope of each component rated disspation
The power consumption number of part, to reduce Thermal test data and calculate the difference between data；When the difference of measured value and calculated value is greater than 5%
When, the power consumption number of the former heating element determined need to be modified, the precision of high temperature computation model is improved；
When modification, if observed temperature value, which is greater than, calculates temperature value, the power consumption number of the heating element is improved；Conversely, if actual measurement
Temperature value, which is less than, calculates temperature value, then reduces the power consumption number of the heating element；
II, according to GJB299C " the estimated handbook of reliability of electronic equipment ", modifies heating element encapsulating material；On this basis,
High temperature computation model is adjusted, amendment work for the first time is completed；
Step 5, iterated revision high temperature computation model
The environment temperature of the iterated revision is 40~60 DEG C；In iterated revision, the first device of each fever is increased gradually with 5 DEG C of step-length
The temperature of part；By the temperature data of actual measurement heating element under the Current Temperatures of setting, and calculated by high temperature described in step 4
The makeover process of model is iterated amendment to high temperature computation model, and by after each iterated revision data and measured data into
Row compares, if the worst error between the two is greater than 5%, continues the amendment work of high temperature computation model；If the maximum between the two is accidentally
Less than 5%, amendment terminates difference；
Step 6, the high temperature weak link of antiskid brake control device is determined according to iterated revision result
The analysis of high temperature weak link is carried out using the revised high temperature computation model of antiskid brake control device；It is arranged using environment
Temperature and high-temperature control temperature are the high temperature weak link that revised temperature determines the antiskid brake control device；
So far, determine that the process of the high temperature weak link of the antiskid brake control device terminates.
2. a kind of method of determining antiskid brake control device high temperature weak link as described in claim 1, which is characterized in that institute
The detailed process for stating the preparation of high temperature calculating is:
The first step prepares the structural information of the antiskid brake control device
The structural information includes the composition and connection type of the antiskid brake control device；
The antiskid brake control device is made of shell and 2 pieces of circuit boards, and 2 pieces of circuit boards are respectively as follows: control panel, data board；It adopts
It is connected with slot mode with shell；
The information of shell collected includes the shape and size, material, seal form of the shell；
Second step prepares the information of all kinds of components
2 pieces of circuit boards include 12 integration modules altogether, model, weight, the size, packing forms of component on integration module
Information, as the information for calculating high temperature weak link；
Third step draws the three-dimensional geometric shapes of the antiskid brake control device
Using the three-dimensional geometric shapes of the CITIA Software on Drawing antiskid brake control device, it is divided into following 3 partial content:
The three-dimensional geometric shapes of the I antiskid brake control device finished product state；
The three-dimensional geometric shapes of the II antiskid brake control device circuit board；
The three-dimensional geometric shapes of the integration module of the III antiskid brake control device, component；
So far, the preparation of antiskid brake control device high temperature calculating is completed.
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| CN107390668B (en) * | 2017-06-26 | 2019-07-16 | 西安航空制动科技有限公司 | Determine that antiskid brake control device adds the method for tight reliability test sectional plane |
| CN115308978B (en) * | 2022-08-05 | 2024-05-28 | 郑州森鹏电子技术股份有限公司 | Design method for heating and defrosting functions of vehicle-mounted camera |
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