CN106500612B - The non-contact measurement system and method for material members high temperature deformation - Google Patents
The non-contact measurement system and method for material members high temperature deformation Download PDFInfo
- Publication number
- CN106500612B CN106500612B CN201610891894.7A CN201610891894A CN106500612B CN 106500612 B CN106500612 B CN 106500612B CN 201610891894 A CN201610891894 A CN 201610891894A CN 106500612 B CN106500612 B CN 106500612B
- Authority
- CN
- China
- Prior art keywords
- laser
- deformation
- test specimen
- material members
- high temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/16—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge
Abstract
A kind of non-contact measurement system the invention discloses material members high temperature deformation includes: laser, spatial filter, industrial CCD camera and image processor;Wherein, the laser beam of laser sending is radiated to the center surface of the test specimen under initial temperature by spatial filter, to obtain initial laser speckle;Reference picture and deformation pattern are obtained respectively by industrial charge-coupled device CCD camera;Described image processor calculates deformation displacement field of the deformation pattern relative to the reference picture using the relevant method of digital picture.The non-contact measurement method of material members high temperature deformation according to an embodiment of the present invention, effectively improve the precision of the contactless deformation measurement of material members under hot environment, and temperature applicable range is wider, the mechanical property for measuring material members for hot environment provides new thinking.
Description
Technical field
The present invention relates to optical measurement mechanics technical field, in particular to a kind of non-cpntact measurement system of material members high temperature deformation
System and method.
Background technique
In the numerous areas such as metallurgy, electric power, aerospace, the strain measurement technique under hot environment is to high-temperature material
One of the key technology of structure progress thermodynamic property evaluation.Strain measurement is divided into two kinds of " contact " and " contactless ".
Traditional " contact type measurement " method based on foil gauge, when carrying out high temperature strain measurement, there are strain gauge element sieves
Choosing and connected, error compensation etc. are difficult, and based on the measurement method of high-temperature extensometer, there are the large and small test specimens of compressive deformation measurement error
The limitations such as fixture design is difficult, service wear is big under high temperature.Therefore, contactless high temperature strain measurement technology increasingly obtains weight
Depending on.But under hot environment, contactless deformation measurement method faces many difficulties, as prepared by high-temperature speckle.It is well known that speckle
It is the important carrier of Digital Image Correlation Method measurement body surface deformation, the quality of surface of test piece speckle pattern directly affects material
The precision of deformation measurement.Currently used speckle preparation method is that spray paint, spraying inorganic adhesive etc. manually prepare speckle
Method, but common paint is unable to high temperature resistant, different degrees of oxidation, discoloration will occur after temperature is higher than 200 DEG C, very
To phenomena such as falling off.Even special heat resistance paint, phenomena such as also aoxidizing, fall off as the temperature rises,
And in order to form the speckle of high-quality high contrast, heat resistance paint is only applicable to and the biggish test specimen of its color difference.Spraying
The method of inorganic adhesive is that high-temperature resistant particle is bonded in surface of test piece using high temperature inorganic bonding agent to form speckle, but in height
Under warm environment, when the thermal expansion coefficient difference of the thermal expansion coefficient of high temperature resistant adhesive and test specimen itself is larger, binding force becomes
Difference causes speckle that phenomena such as different degrees of deformation even falls off occurs.
Summary of the invention
The present invention is directed to solve one of the technical problem in above-mentioned technology at least to a certain extent.For this purpose, of the invention
One purpose is to propose a kind of non-contact measurement system of material members high temperature deformation, effectively improves material under hot environment
Expect the precision of the contactless deformation measurement of component, and temperature applicable range is wider, the mechanics of material members is measured for hot environment
Performance provides new thinking, is with a wide range of applications.
It is another object of the present invention to the non-contact measurement methods for proposing a kind of material members high temperature deformation.
In order to achieve the above objectives, first aspect present invention embodiment proposes a kind of the non-contact of material members high temperature deformation
Measuring system, comprising: laser, spatial filter, industrial CCD (Charge-coupled Device, charge-coupled device) phase
Machine and image processor;Wherein, the test specimen laser beam of laser sending being radiated at by spatial filter under initial temperature
Center surface, to obtain initial laser speckle;The initial laser speckle is acquired by industrial charge-coupled device CCD camera
Image to obtain reference picture;After being heated to preset temperature by the test specimen and keeping preset time, to the test specimen into
Row power carries, and acquires the image of the deformation laser speckle of the test specimen during power carries by the industrial CCD camera to obtain
Take deformation pattern;Described image processor calculates the deformation pattern relative to the reference using the relevant method of digital picture
The deformation displacement field of image.
The non-contact measurement system of material members high temperature deformation according to an embodiment of the present invention, using laser speckle as material
Expect the information carrier of the deformation of member, the speckle image of record deformation front and back, and uses Digital Image Correlation Method analysis of material structure
The deformation field information of part, the laser speckle of system preparation has high temperature resistant under high temperature environment, takes off without discoloration, nothing through the invention
It falls, easily prepare, the advantages that applicability is extensive, therefore the quality of the image based on the laser speckle also correspondinglys increase, thus effectively
Ground improves the precision of the contactless deformation measurement of material members under hot environment, and temperature applicable range is wider, is high temperature ring
The mechanical property of border measurement material members provides new thinking, is with a wide range of applications.
In addition, the non-contact measurement method of the material members high temperature deformation proposed according to that above embodiment of the present invention can be with
With following additional technical characteristic:
Specifically, the spatial filter includes narrow band filter slice, and the type of the narrow band filter slice is according to the laser
Device is selected.
According to one embodiment of present invention, the laser need to include solid-state single longitudinal mode laser, wherein the solid-state
The coherence length for the laser beam that single longitudinal mode laser issues is greater than the industrial CCD camera to the distance of the test specimen.
According to one embodiment of present invention, the maximum laser power for the laser beam that the laser issues is according to described pre-
If temperature is selected.
According to one embodiment of present invention, the roughness of the center surface of the test specimen is greater than the wavelength of the laser beam
Half.
According to one embodiment of present invention, the rate that the frame per second of the industrial CCD camera is carried according to the power of the test specimen
It is selected.
According to one embodiment of present invention, the analysis sub-district parameter of the relevant method of the digital picture is according to the examination
The roughness of the center surface of part is selected.
In order to achieve the above objectives, second aspect of the present invention embodiment proposes a kind of the non-contact of material members high temperature deformation
Measurement method, comprising: by the center surface for the test specimen being radiated at after laser beam filtering under initial temperature, to obtain initial laser
Speckle;The image of the initial laser speckle is acquired to obtain reference picture;The test specimen is being heated to preset temperature and is being protected
After holding preset time, power load is carried out to the test specimen, and acquires the figure for deforming laser speckle of the test specimen during power carries
As to obtain deformation pattern;Change of the deformation pattern relative to the reference picture is calculated by the relevant method of digital picture
Shape displacement field.
The non-contact measurement method of material members high temperature deformation according to an embodiment of the present invention, using laser speckle as material
Expect the information carrier of the deformation of member, the speckle image of record deformation front and back, and uses Digital Image Correlation Method analysis of material structure
The deformation field information of part, the laser speckle prepared by the method for the invention have high temperature resistant under high temperature environment, take off without discoloration, nothing
It falls, easily prepare, the advantages that applicability is extensive, therefore the quality of the image based on the laser speckle also correspondinglys increase, thus effectively
Ground improves the precision of the contactless deformation measurement of material members under hot environment, and temperature applicable range is wider, is high temperature ring
The mechanical property of border measurement material members provides new thinking, is with a wide range of applications.
Detailed description of the invention
Figure 1A is to be shown according to the material object of the non-contact measurement system of the material members high temperature deformation of one embodiment of the invention
It is intended to;
Figure 1B is to be closed according to the connection of the non-contact measurement system of the material members high temperature deformation of one embodiment of the invention
It is schematic diagram;
Fig. 2 is the flow chart according to the non-contact measurement method of the material members high temperature deformation of one embodiment of the invention;
Fig. 3 is the schematic diagram in kind according to the carbon carbon braided material test specimen of one embodiment of the invention;
Fig. 4 is to carry curve according to the power to test specimen of one embodiment of the invention;
The schematic diagram of deformation laser speckle under Fig. 5 2300 DEG C of hot environments according to an embodiment of the invention;
Fig. 6 is the test specimen strain curve according to one embodiment of the invention;
Fig. 7 is the test specimen load-deformation curve according to one embodiment of the invention.
Specific embodiment
The embodiment of the present invention is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached
The embodiment of figure description is exemplary, it is intended to is used to explain the present invention, and is not considered as limiting the invention.
With reference to the accompanying drawing come describe the embodiment of the present invention material members high temperature deformation non-contact measurement method.
Description the embodiment of the present invention method before, first briefing material component high-temperature deformation non-contact measurement system
100, which includes laser 11, spatial filter 12, industrial CCD camera 13 and image processor 14.The material object of system
As shown in figure 1, connection relationship diagram is as shown in fig. 1b for schematic diagram.
Specifically, laser beam that laser 11 issues to be radiated at by the spatial filter 12 to the examination under initial temperature
The center surface of part, to obtain initial laser speckle.By industrial CCD camera 13 acquire the image of the initial laser speckle with
Obtain reference picture.Then, after being heated to preset temperature by the test specimen and keeping preset time, power is carried out to the test specimen
It carries, and the image of the deformation laser speckle by the test specimen during the industrial CCD camera 13 further acquisition power load
To obtain deformation pattern.Finally, described image processor 14 calculates the deformation pattern phase using the relevant method of digital picture
For the deformation displacement field of the reference picture.
The laser 11 can be solid-state single longitudinal mode laser.Meanwhile the center surface of the test specimen must be optics
Rough surface, roughness should be greater than the half of the wavelength of the laser beam.
Preferably, the maximum laser power for the laser beam that the laser 11 issues is selected according to the preset temperature
It selects.Specifically, background radiation is increasingly severe with the raising of test specimen temperature, therefore, test specimen temperature is higher, the laser of selection
Power is bigger, to guarantee that laser intensity is greater than background radiation light intensity.
Wherein, the spatial filter 12 may include narrow band filter slice, and the type of the narrow band filter slice is according to
Laser is selected.Specifically, the narrow band filter slice needs are selected according to the wavelength of the laser, narrow-band filtering
The central wavelength of piece should be the wavelength of laser beam, and the narrower ability for eliminating high temperature background radiation of bandwidth of narrow band filter slice is more
It is good.
The frame per second of the industrial CCD camera 13 can carry rate according to the power of the test specimen and be selected.Specifically, test specimen
Power carry that rate is bigger, and the frame per second of industrial CCD camera requires higher.Wherein, the relevant length for the laser beam that the laser issues
Degree can be greater than the industrial CCD camera to the distance of the test specimen.Meanwhile the power stability of the laser 11 requires ratio
It is higher.
The non-contact measurement system of material members high temperature deformation according to an embodiment of the present invention, using laser speckle as material
Expect the information carrier of the deformation of member, the speckle image of record deformation front and back, and uses Digital Image Correlation Method analysis of material structure
The deformation field information of part, the laser speckle of system preparation has high temperature resistant under high temperature environment, takes off without discoloration, nothing through the invention
It falls, easily prepare, the advantages that applicability is extensive, therefore the quality of the image based on the laser speckle also correspondinglys increase, thus effectively
Ground improves the precision of the contactless deformation measurement of material members under hot environment, and temperature applicable range is wider, is high temperature ring
The mechanical property of border measurement material members provides new thinking, is with a wide range of applications.
Fig. 2 be according to the flow chart of the non-contact measurement method of the material members high temperature deformation of one embodiment of the invention,
Include:
S1: the center surface for the test specimen being radiated under initial temperature after laser beam filtering is dissipated with obtaining initial laser
Spot.
For example, 532nm green (light) laser, power 1200mw can be used;As shown in figure 3, test specimen can be
Carbon carbon braided material, size 10*10*30mm3.In this step, adjusting the green (light) laser first makes it issue laser
Beam carries out space filtering to the laser beam by spatial filter, to obtain uniform shoot laser.Then, the shoot laser
It is irradiated to the center rough surface of the carbon carbon braided material and scatters countless relevant wavelets, these wavelets are empty around object
Between interfere the bright blackening point to form a large amount of random distributions with grain structure, this spot is initial laser speckle.
S2: the image of the initial laser speckle is acquired to obtain reference picture.
It is realized as this step 1 by industrial CCD camera.In general, light can be become charge and by charge by CCD
Storage and transfer, can also take out the charge of storage makes voltage change, therefore is ideal CCD camera element, with its structure
At CCD camera with it is small in size, light-weight, be unaffected by the magnetic field, the characteristic with anti-vibration and shock and be widely used.
The selection of suitable industrial CCD camera not only directly determines institute's acquired image resolution ratio, picture quality etc., at the same also with it is whole
The operational mode of a system is directly related.
S3: after being heated to preset temperature by the test specimen and keeping preset time, power load is carried out to the test specimen, and adopt
Collect the image of the deformation laser speckle of the test specimen during power carries to obtain deformation pattern.
In this step, for example, test specimen can be heated to 2300 DEG C, power load is carried out to test specimen after keeping the temperature 10min,
It is as shown in Figure 4 that power carries curve.
S4: deformation displacement of the deformation pattern relative to the reference picture is calculated by the relevant method of digital picture
?.
It, can be during the test piece deformation described in industrial CCD camera continuous acquisition during the test specimen power carries
The image of laser speckle is deformed, image is as shown in Figure 5.
The analysis sub-district parameter of the relevant method of the digital picture can be according to the coarse of the center surface of the test specimen
Degree is selected.Swash specifically, the object of the relevant method analysis of digital picture is that material members deformation is preceding with deformed
Light speckle pattern, and analyzing sub-district parameter (e.g., sub-district size etc.) should be selected according to information such as the surface roughnesses of practical test specimen
It selects.
Specifically, the deformation in deformation process is swashed using the image of the initial laser speckle before deformation as reference picture
The image of light speckle calculates separately every deformation pattern relative to corresponding as deformation pattern, with the relevant method of digital picture
The deformation displacement field of reference picture.Then, corresponding strain curve is calculated with least square method, as shown in Figure 6.Finally, being based on
The strain curve obtains the test specimen loaded load-deformation curve under high temperature environment, as shown in Figure 7.
The non-contact measurement method of material members high temperature deformation according to an embodiment of the present invention, using laser speckle as material
Expect the information carrier of the deformation of member, the speckle image of record deformation front and back, and uses Digital Image Correlation Method analysis of material structure
The deformation field information of part, due to the laser speckle of the method for the present invention preparation have under high temperature environment high temperature resistant, without discoloration, without de-
It falls, easily prepare, the advantages that applicability is extensive, therefore the quality of the image based on the laser speckle also correspondinglys increase, thus effectively
Ground improves the precision of the contactless deformation measurement of material members under hot environment, and temperature applicable range is wider, is high temperature ring
The mechanical property of border measurement material members provides new thinking, is with a wide range of applications.
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up time
The orientation or positional relationship of the instructions such as needle ", " counterclockwise ", " axial direction ", " radial direction ", " circumferential direction " be orientation based on the figure or
Positional relationship is merely for convenience of description of the present invention and simplification of the description, rather than the device or element of indication or suggestion meaning must
There must be specific orientation, be constructed and operated in a specific orientation, therefore be not considered as limiting the invention.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include one or more of the features.In the description of the present invention, the meaning of " plurality " is two or more,
Unless otherwise specifically defined.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " fixation " etc.
Term shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral;It can be mechanical connect
It connects, is also possible to be electrically connected;It can be directly connected, can also can be in two elements indirectly connected through an intermediary
The interaction relationship of the connection in portion or two elements.It for the ordinary skill in the art, can be according to specific feelings
Condition understands the concrete meaning of above-mentioned term in the present invention.
In the present invention unless specifically defined or limited otherwise, fisrt feature in the second feature " on " or " down " can be with
It is that the first and second features directly contact or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists
Second feature " on ", " top " and " above " but fisrt feature be directly above or diagonally above the second feature, or be merely representative of
First feature horizontal height is higher than second feature.Fisrt feature can be under the second feature " below ", " below " and " below "
One feature is directly under or diagonally below the second feature, or is merely representative of first feature horizontal height less than second feature.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is included at least one embodiment or example of the invention.In the present specification, schematic expression of the above terms are not
It must be directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be in office
It can be combined in any suitable manner in one or more embodiment or examples.In addition, without conflicting with each other, the skill of this field
Art personnel can tie the feature of different embodiments or examples described in this specification and different embodiments or examples
It closes and combines.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is not considered as limiting the invention, those skilled in the art within the scope of the invention can be to above-mentioned
Embodiment is changed, modifies, replacement and variant.
Claims (2)
1. a kind of non-contact measurement system of material members high temperature deformation characterized by comprising laser, spatial filter,
Industrial charge-coupled device CCD camera and image processor;Wherein,
The laser beam that laser issues is radiated at by spatial filter to the center surface of the test specimen under initial temperature, with acquisition
Initial laser speckle;
The image of the initial laser speckle is acquired by industrial charge-coupled device CCD camera to obtain reference picture;
After being heated to preset temperature by the test specimen and keeping preset time, power load is carried out to the test specimen, and by described
Industrial CCD camera acquires the image of the deformation laser speckle of the test specimen during power carries to obtain deformation pattern;
Described image processor calculates the deformation pattern relative to the reference picture using the relevant method of digital picture
Deformation displacement field;
Wherein, the spatial filter includes narrow band filter slice, and the type of the narrow band filter slice is carried out according to the laser
Selection, wherein the central wavelength of narrow band filter slice should be the wavelength of laser beam;
Wherein, the laser need to include solid-state single longitudinal mode laser, wherein the laser that the solid-state single longitudinal mode laser issues
The coherence length of beam is greater than the industrial CCD camera to the distance of the test specimen;
Wherein, the maximum laser power for the laser beam that the laser issues is selected according to the preset temperature;
Wherein, the roughness of the center surface of the test specimen is greater than the half of the wavelength of the laser beam;
Wherein, the analysis sub-district parameter of the relevant method of the digital picture according to the roughness of the center surface of the test specimen into
Row selection.
2. the non-contact measurement system of material members high temperature deformation as described in claim 1, which is characterized in that the industry
The frame per second of CCD camera is selected according to the rate that the power of the test specimen carries.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610891894.7A CN106500612B (en) | 2016-10-12 | 2016-10-12 | The non-contact measurement system and method for material members high temperature deformation |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610891894.7A CN106500612B (en) | 2016-10-12 | 2016-10-12 | The non-contact measurement system and method for material members high temperature deformation |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106500612A CN106500612A (en) | 2017-03-15 |
CN106500612B true CN106500612B (en) | 2019-08-06 |
Family
ID=58294903
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610891894.7A Active CN106500612B (en) | 2016-10-12 | 2016-10-12 | The non-contact measurement system and method for material members high temperature deformation |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106500612B (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107643213B (en) * | 2017-07-31 | 2018-07-20 | 东南大学 | A kind of high temperature strain measurement method for eliminating off face Influence of Displacement |
CN111033171A (en) * | 2017-08-24 | 2020-04-17 | C&B技术公司 | Apparatus and method for warpage measurement |
CN108195297A (en) * | 2017-12-13 | 2018-06-22 | 太原航空仪表有限公司 | A kind of micro component high/low temperature deformation measuring device |
CN112055871A (en) * | 2018-02-28 | 2020-12-08 | 国家科研中心 | Computer-implemented method for identifying mechanical properties by coupled image correlation and mechanical modeling |
CN108955555B (en) * | 2018-08-09 | 2020-04-21 | 合肥工业大学 | High-precision high-temperature deformation measuring method |
CN109253703B (en) * | 2018-10-16 | 2019-09-10 | 北京科技大学 | The suppressing method of flow perturbation error in high temperature deformation non-cpntact measurement |
CN110207606B (en) * | 2019-06-27 | 2021-04-20 | 航天神舟飞行器有限公司 | Out-of-plane strain measurement method based on digital image correlation |
CN111829896A (en) * | 2020-06-30 | 2020-10-27 | 北京航空航天大学 | Ultra-high temperature strain field-temperature field synchronous measurement system and measurement method based on ultraviolet imaging |
CN112200788B (en) * | 2020-10-16 | 2021-03-26 | 清华大学 | High-temperature deformation measuring device and method |
CN112630260A (en) * | 2020-11-30 | 2021-04-09 | 中国电力科学研究院有限公司 | Method and system for determining vitrification of epoxy resin material for external insulation of power transmission equipment |
CN113552125B (en) * | 2021-07-19 | 2023-05-16 | 清华大学 | Ablation rate testing device and method for materials in high-temperature wind tunnel environment |
CN113628136B (en) * | 2021-07-29 | 2023-07-25 | 北京科技大学 | High dynamic range laser speckle digital image correlation deformation measurement method |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103363919A (en) * | 2013-07-15 | 2013-10-23 | 国家电网公司 | Device and method for measuring strain of high-temperature pipeline of power plant based on white light speckle technology |
CN104457603A (en) * | 2014-08-18 | 2015-03-25 | 清华大学 | Object deformation measurement method under high-temperature environment |
CN104535412A (en) * | 2014-12-29 | 2015-04-22 | 合肥工业大学 | Ultraviolet illumination DIC (digital image correction)-based mechanical property loading measuring system and method for high-temperature material |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4189925B2 (en) * | 2003-09-05 | 2008-12-03 | 福岡県 | Surface displacement measuring method and surface displacement measuring apparatus |
CN105371778A (en) * | 2015-10-29 | 2016-03-02 | 北京交通大学 | Real-time measurement method and system for digital cutting speckle interference |
-
2016
- 2016-10-12 CN CN201610891894.7A patent/CN106500612B/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103363919A (en) * | 2013-07-15 | 2013-10-23 | 国家电网公司 | Device and method for measuring strain of high-temperature pipeline of power plant based on white light speckle technology |
CN104457603A (en) * | 2014-08-18 | 2015-03-25 | 清华大学 | Object deformation measurement method under high-temperature environment |
CN104535412A (en) * | 2014-12-29 | 2015-04-22 | 合肥工业大学 | Ultraviolet illumination DIC (digital image correction)-based mechanical property loading measuring system and method for high-temperature material |
Also Published As
Publication number | Publication date |
---|---|
CN106500612A (en) | 2017-03-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN106500612B (en) | The non-contact measurement system and method for material members high temperature deformation | |
Mireles et al. | Analysis and correction of defects within parts fabricated using powder bed fusion technology | |
Cholewa et al. | A technique for coupled thermomechanical response measurement using infrared thermography and digital image correlation (TDIC) | |
CN105606222B (en) | A kind of measuring device and measuring method of flame three-dimensional temperature field | |
Wang et al. | Measurement of high temperature full-field strain up to 2000 C using digital image correlation | |
JP5771632B2 (en) | Method and apparatus for measuring the contour shape of a cylindrical body | |
CN104655051B (en) | A kind of high-speed structures light 3 d shape vertical measurement method | |
Bodelot et al. | Experimental study of heterogeneities in strain and temperature fields at the microstructural level of polycrystalline metals through fully-coupled full-field measurements by digital image correlation and infrared thermography | |
CN110239091A (en) | Device and method for manufacturing three-dimension object | |
CN106053247A (en) | Material high temperature mechanical property test system and method based on laser irradiation heating | |
Cheng et al. | Investigation of Portevin-Le Chatelier effect in 5456 Al-based alloy using digital image correlation | |
Berny et al. | On the analysis of heat haze effects with spacetime DIC | |
Spera et al. | Application of Stereo‐Digital Image Correlation to Full‐Field 3‐D Deformation Measurement of Intervertebral Disc | |
Pan | Thermal error analysis and compensation for digital image/volume correlation | |
CN105953749B (en) | A kind of optical 3-dimensional topography measurement method | |
Cocco et al. | Advances in X-ray optics: From metrology characterization to wavefront sensing-based optimization of active optics | |
JP6340034B2 (en) | Non-contact type shape measuring machine calibration ceramic reference material | |
Yu et al. | Time-gated active imaging digital image correlation for deformation measurement at high temperatures | |
CN106019235A (en) | Satellite-borne/foundation InSAR dual-purpose manual corner reflection device | |
Hansen et al. | A high magnification UV lens for high temperature optical strain measurements | |
Zhu et al. | High-temperature DIC based on aluminium dihydrogen phosphate speckle | |
Zhu et al. | Rapid and repeatable fluorescent speckle pattern fabrication using a handheld inkjet printer | |
Jones et al. | Advances in phosphor two-color ratio method thermography for full-field surface temperature measurements | |
Soni et al. | Non-intrusive temperature measurement of NSOM probes with thermoreflectance imaging | |
CN106772977A (en) | One kind is infrared to merge microlens and assembly method with the double light of visible ray |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |