CN106493121A - A kind of nanometer cleaning method based on active liquid and laser - Google Patents
A kind of nanometer cleaning method based on active liquid and laser Download PDFInfo
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- CN106493121A CN106493121A CN201610937822.1A CN201610937822A CN106493121A CN 106493121 A CN106493121 A CN 106493121A CN 201610937822 A CN201610937822 A CN 201610937822A CN 106493121 A CN106493121 A CN 106493121A
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- laser
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- granule
- active liquid
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
- B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
Abstract
The invention discloses a kind of nanometer cleaning method based on active liquid and laser, the surface of the material of cleaning required for active liquid film is deposited on, by the interface of LASER HEATING liquid and granule and produce local heating and thermal response liquid, boiling or explosive chemical reaction are produced in a liquid, create higher pressure to clean granule, realize the purpose that granule is cleared material surface.The present invention is by application such as hydrogen peroxide (H2O2) active liquid, enhanced laser-impact is produced with higher pressure, the purpose of Rapid Cleaning body surface dirt particle is reached.The method cleaning dirt particle speed is fast, efficiency high.The application of the also expansible pulse laser technique of the method.
Description
Technical field
The invention belongs to laser cleaning field, and in particular to a kind of nanometer based on high energy laser beam and active liquid is clear
Washing method.
Background technology
Little particle is removed compared with seeming to be easier for removing bulky grain, but the reduction with size, gravity lose its
Affect, now very strong molecular force starts to occupy an leading position.The granule for being smaller in size than one thousandth millimeter can be used more than which
One millionfold power of weight is adhered on surface.
Current micro- cleaning systems are usually used liquid chemical, itself are polluter, and they may infringement treat
The surface of cleaning material.As freon and its chemical relatives are just gradually being eliminated in the whole world, society and industry strive to find
More preferable succedaneum.People both know about currently a popular known cleaning agent by ozone layer depletion and contribute to the product of greenhouse effect
Raw.
There are a kind of new clean technologies to use high energy density laser beam and water as main component at present.In short, just
It is by thin water film（Its thickness is in terms of nanometer to micron）It is deposited on the surface for needing cleaning.Moisture film is by the energy from laser beam
Measure and explode, and dirt particle is raised from surface.May then pass through suction and remove the water with pollutant.The method is
Be proved to be very effective, almost 100% unwanted granule is eliminated after repeating several times to process.But the method needs
Repeatedly dust granule could be removed completely, speed religion is slow, be unsuitable for large-scale promotion use.
Content of the invention
In order to solve the defect existing for above-mentioned technical problem, the invention provides a kind of be based on high energy laser beam and work
The nanometer cleaning method of property liquid hydrogen peroxide.
The technical solution adopted in the present invention is：A kind of nanometer cleaning method based on active liquid and laser, its feature
It is：The surface of the material of cleaning required for active liquid film is deposited on, by the interface of LASER HEATING liquid and granule simultaneously
Local heating and thermal response liquid is produced, boiling or explosive chemical reaction is produced in a liquid, the higher pressure of creation comes clear
Clean granule, realizes the purpose that granule is cleared material surface.
Preferably, the active liquid is water or hydrogen peroxide.
The present invention is by application such as hydrogen peroxide (H2O2) active liquid, enhanced laser punching is produced with higher pressure
Hit, reach the purpose of Rapid Cleaning body surface dirt particle.The method cleaning dirt particle speed is fast, efficiency high.The party
The application of the also expansible pulse laser technique of method.
Description of the drawings
Schematic diagrams of the Fig. 1 for the embodiment of the present invention；Wherein：1 is laser beam；2 is hydrogen peroxide (H2O2)；3 material tables
Face；
Fig. 2 is in hydrogen peroxide (H in the embodiment of the present invention2O2) and water in laser impact intensified（LSP）AA6061's afterwards
Case hardness（VHN）Comparison diagram with plastic deformation depth；Wherein：（a）Comparison diagram for case hardness；（b）For plastic deformation
The comparison diagram of depth；
Fig. 3 is rapid chemical etching-false impulse laser ablation schematic diagram in the embodiment of the present invention；Wherein：（a）Ionization is shown
It is intended to；（b）Plasma etching schematic diagram；
Fig. 4 is the mechanism figure of rapid chemical etching-false impulse laser ablation in the embodiment of the present invention.
Specific embodiment
Understand for the ease of those of ordinary skill in the art and implement the present invention, below in conjunction with the accompanying drawings and embodiment is to this
Bright it is described in further detail, it will be appreciated that enforcement example described herein is merely to illustrate and explains the present invention, not
For limiting the present invention.
A kind of nanometer cleaning side based on high energy laser beam and active liquid that the present invention is provided, using high-energy-density
Laser beam 1 and active liquid (such as hydrogen peroxide H2O2) 2 as key component, thin active liquid film is deposited on institute
The material surface 3 of cleaning is needed, when active liquid film is by the energy from laser beam 1, laser can heat liquid and granule
Interface simultaneously produces local heating and thermal response liquid, produces boiling in a liquid（Such as water H2O）Or explosive chemical reaction（Example
Such as hydrogen peroxide H2O2）, producing much higher pressure to clean granule, dust granule will leave material surface 3.Carry pollutant
Active liquid 1 by draw method be removed.
Application active liquid limits such as hydrogen peroxide (H2O2) 2 strengthening laser-impact.Which is derived from laser-impact and relies primarily on
In the high density of laser induced plasma, which is determined by the ablating rate of the target material interacted by laser material.Cause
This, is limited by using active liquid and can effectively strengthen laser-impact, caused by rapid chemical etching reaction due to more
Effective ablation simultaneously occur in laser ablation process.Test result indicate that：By using hydrogen peroxide (H2O2)（Rather than
Water H2O）As restriction by laser impact intensified（LSP）Aluminium alloy 6061 afterwards（AA6061）（As an example）Hardness and
Plastic deformation depth is effectively increased.Application hydrogen peroxide (H2O2) 2, laser impact intensified（LSP）Efficiency improves 150%.Peroxidating
Hydrogen (H2O2) enhanced laser-impact mainly mutually promote in laser ablation and chemical etching caused by higher ablation factor.
Additionally, the experiment show by the pulse laser ablation (PLA) of zinc shows hydrogen peroxide (H2O2) 2 can dramatically increase and disappear
Melt rate almost 300%.For laser impact intensified（LSP）AA6061 experiment, aluminium foil be used as absorb laser energy ablation
Coating produces laser induced plasma, and for pulse laser ablation（PLA）Zinc, the zinc of top surface is straight by laser pulse
Connect ablation.
Limit to strengthen laser-impact for being verified activity, the laser-impact of AA6061 is executed and hydrogen peroxide (H2O2)
As constraint with aluminium foil as ablation device and compared with underwater laser impact.Using operation under 1064 nano wave lengths
Surelite III series Q adjusts Nd-YAG laser instrument（One kind of neodymium-doped yttrium-aluminum garnet solid state laser）（Continuum
Inc.）, its pulse width（Full width at half maximum）For 5ns, for delivering laser pulse.After hammering, the microhardness of sample is led to
Cross a Leco microhardness tester and measure in 25g loads and under the 10s retention times.The feature of the surface profile after process is led to
Cross Wyko NT3300HD surface profilers from VeecoInc to characterize.
Measurement is by hydrogen peroxide (H2O2) and water limit laser-impact after case hardness and surface plastic deformation depth,
And the pressure effect that comparative assessment is caused by enhanced laser-impact, because direct measurement laser-impact pressure relative difficulty.?
Laser impact intensified（LSP）In technique, surface plasticity strain stress p, depending on the surge pressure of laser-impact, can use formula
（1）, wherein P is surge pressure, and HEL is Yu Gongniu elastic limits, σY dynIt is dynamic yield strength, λ and μ is according to Young's moduluss
E and the Lame＆1＆ constants of Poisson's ratio υ.The higher surface strain caused by enhanced laser-impact pressure brings and higher should be hardened
Change effect, and cause bigger superficial hardness number.On the other hand, the plastic strain for being caused by laser-impact pressure is surface depth
The decreasing function of degree.Plastic deformation occurs to be no longer than Yu Gongniu elastic limits in peak stress（HEL）Depth with ε p=0.Cause
This, enhanced laser-impact pressure can be characterized as laser impact intensified（LSP）Case hardness afterwards and plastic deformation depth.
Fig. 2 is laser impact intensified under liquid（LSP）Experimental result, each data point be five times measurement meansigma methodss.See
Observe in hydrogen peroxide (H2O2) under laser impact intensified（LSP）Cause than underwater laser shock peening（LSP）Bigger surface
Hardness（Fig. 2（a））.For example, using identical laser intensity 8GW/cm2, by applying hydrogen peroxide (H2O2), hardness from
113VHN（Vickers hardness number）Increase to 123VHN.Consider AA6061 laser impact intensified（LSP）Front hardness is about
94VHN, hydrogen peroxide (H2O2) by underwater laser shock peening（LSP）Efficiency improve 153%.Even if moreover, it has been found that water
The laser intensity of lower LSP is from 4GW/cm2Increase to 12GW/cm2, hardness only increases by 9% from 108VHN to 118VHN.This is because
When laser intensity is more than 10GW/cm2When, produce the saturation for puncturing plasma and causing surge pressure.On the other hand, peroxide is used
Change hydrogen (H2O2) replace water (H2O this major limitation) can be destroyed and improves hardness and be up to about 132VHN, this is close to by straining
The saturation hardness number of the AA6061 that hardening causes.Meanwhile, hydrogen peroxide (H2O2) also bring relatively large areal deformation depth
（Fig. 2（b））.For example, using identical laser intensity 10GW/cm2, hydrogen peroxide (H2O2) deforming depth is increased from 0.73l μm
To 1.12l μm of increasing Fuda 153.4%.Additionally, for underwater laser shock peening（LSP）Observe identical laser-impact saturation
Phenomenon, and think hydrogen peroxide (H2O2) this restriction is effectively destroyed by forming deeper surface pitting.Therefore, laser
Shock peening（LSP）Case hardness and deforming depth afterwards shows, by applying hydrogen peroxide (H2O2) produce as restriction medium
There is the enhanced laser-impact of bigger pressure, so as to improve cleaning efficiency.
The intensity of generally laser-impact is introduced and controlled by the expansion of laser induced plasma, and including density, pressure
With the plasma parameter of temperature by ablation factor control.Therefore, the bigger ablation factor for being promoted by activity constraint is in this process
Pivotal role is played, to strengthen the laser-impact with higher pressure.
In order to understand this process, it is proposed that rapid chemical etching-false impulse laser ablation（PLA）, as shown in figure 3,
The flow chart of this mechanism is as shown in Figure 4.Formula（a）-（e）The ionization occurred for during and chemical etching reaction, wherein hv
Represent photon energy, Δ ETIt is the heat energy of etching reaction release.When the target of metal surface focal point is by anterior incident laser
Pulse evaporation ionizing, produce a laser-induced plasma plume at goal constraint interface（Fig. 4（a））.This electricity
From being main by trans- bremsstrahlung mechanism control（Equation（a）Fig. 4）, with free electron e-Fast-growth relevant.Once produce
Raw, due to the effect of restraint that liquid is limited, plasma is forced into thermodynamic state immediately.Meanwhile, plasma pressure
Dramatically increase and by rear portion shunt excitation light energy being absorbed come inducing temperature, subsequently formed on surface and there is ultrasonic shock wave.
The pressure of the verified laser induced plasma in the case where liquid is limited of many reports is at gigapascal (gigapascal)
Level, temperature can reach thousand of Kelvins.This extreme environment is hydrogen peroxide (H2O2) decomposition reaction provide pole
Big benefit, its discharge elemental oxygen O as a strong oxidizer chemical etching process（Equation in Fig. 4（b））.Notice here
High temperature can substantially speed up chemolysis speed.As the report such as Hong, hydrogen peroxide in hot environment
(H2O2) decomposition rate（It is higher than 103K）The order of magnitude 10 can be reached7cm3·mol-1·s-1.Additionally, it is contemplated that powerful liquid limit
The impact of system, it is reasonable to illustrate that decomposition reaction occurs mainly in the atom of the plasma plume of surface region and most of release
Oxygen is limited and is present in interface, such as Fig. 3（b）Shown.Additionally, the elemental oxygen of some releases can pass through, and absorption is later to swash
Light energy is further ionized to form the oxygen O of ionization+There is even higher oxidisability, due to inverse bremsstrahlung process（In Fig. 4
Equation（c））.Therefore, rapid chemical product decomposition rate and little restricted volume may result in the tool of atom and ionized oxygen
There is the plasma thin layer of strong oxidisability and high concentration, cause a rapid chemical etch process to remove more target materials
（In Fig. 4（d）With（e））.
Mutually promote bigger ablation factor and enhanced plasma causes the further increase of ablation factor, sharp so as to change
Light surge.Higher plasma pressure may result in higher ablation factor.More than discussion, with higher interior energy and pressure
The enhancing plasma of power is expected to obtain, due to the fact that.First, chemical etching process can increase plasma
Density and thickness cause plasma pressure to increase by removing more target materials.Gross pressure P of plasma is electronics point
The sum of pressure Pe and particle fraction pressure Pp, such as shown in equation (2).Wherein kBIt is Boltzmann constant, neAnd npBe respectively electronics and
The amount of granule.Therefore, electronics and grain density n are increased respectivelyeAnd np, plasma pressure can be strengthened by chemical etching reaction
Power.Additionally, the model based on well-known Fabbro, time-evolution pressure P (t) of plasma and thickness L (t) such as equation
(3), shown in, wherein Z1 and Z2 is target and the impact impedance for limiting medium.It theoretically prove plasma pressure with wait from
Daughter thickness is proportional.The bigger plasma thickness of energy acquisition expection may cause deeper because of bigger ablation factor
Depth of ablation.Second, the heat energy that plasma parameter further may be discharged by chemically etching process is affected (Fig. 4
Middle equation (d) and (e)).This heat energy will be applied in increase plasma internal heat energy and open liquid/target interface.Process phase
Between the energy balance can be described by equation (4), wherein I, ETLaser intensity with α, by plasma absorption heat energy and
Constant fraction.Equation (4) shows the increase energy Δ E of the heat of releaseT, higher plasma pressure can be caused.Therefore,
Ablation factor and plasma pressure are mutually promoted and cause enhanced laser-impact.
P=Pe+Pp=kBTene+kBTpnp（2）
By application such as hydrogen peroxide (H2O2) active liquid limit, enhanced laser punching is produced with higher pressure
Hit.Propose the mechanism of rapid chemical etching-auxiliary laser ablation.Induced by mutually promoting between ablation and etching process
Larger ablation factor be considered as strengthen laser-impact key factor.Therefore, the method has been broken current due to puncturing
The major limitation of the underwater pulse laser processing for causing, and effectively by underwater laser shock peening（LSP）Burn with pulse laser
Erosion（PLA）Efficiency be respectively increased 150% and 300%.It is therefore contemplated that can be with by the enhanced laser-impact of active constraint
The application of pulse laser technique is extended significantly, such as laser impact intensified（LSP）, laser assisted micro Process and pulse swash
Light ablation（PLA）.
The reason for active liquid of the present invention can effectively strengthen laser-impact is more by rapid chemical etching reaction
Caused is effectively etched in laser ablation process while occurring.It is compared with water H2O is compared as constraint, with hydrogen peroxide
(H2O2) active liquid limit aluminium alloy 6061 laser-impact intensity（LSP）Efficiency improves 150%, and the pulse laser of zinc
Ablation（PLA）Ablation factor increased 300%.The present invention have produce higher ablation factor and punching under same laser intensity
The additional mechanism of pressure is hit, the purpose of quick, efficient, thoroughly cleaning is reached, has huge application potential.The invention is not restricted to water
With hydrogen peroxide H2O2As long as laser can heat the interface of liquid and granule and produce local heating and thermal response liquid, in liquid
Boiling or explosive chemical reaction, the pressure cleaning granule for making generation higher, then liquid and material will have more is produced in body
Extensive combination.
It should be appreciated that the part that this specification is not elaborated belongs to prior art.
It should be appreciated that the above-mentioned description for preferred embodiment is more detailed, therefore can not be considered to this
The restriction of invention patent protection scope, one of ordinary skill in the art are being weighed without departing from the present invention under the enlightenment of the present invention
Under the protected ambit of profit requirement, replacement can also be made or deformed, be each fallen within protection scope of the present invention, this
Bright scope is claimed should be defined by claims.
Claims (2)
1. a kind of nanometer cleaning method based on active liquid and laser, it is characterised in that：Needed for active liquid film is deposited on
The surface of material to be cleared up, by the interface of LASER HEATING liquid and granule and produces local heating and thermal response liquid,
Boiling or explosive chemical reaction is produced in liquid, creates higher pressure to clean granule, realize for granule clearing material table
The purpose in face.
2. the nanometer cleaning method based on active liquid and laser according to claim 1, it is characterised in that：The activity
Liquid is water or hydrogen peroxide.
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Cited By (6)
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| CN107321720A (en) * | 2017-08-22 | 2017-11-07 | 成都新柯力化工科技有限公司 | A kind of high efficiency laser cleaning technique |
| CN108406090A (en) * | 2018-02-05 | 2018-08-17 | 中国航发北京航空材料研究院 | A kind of high-energy short-pulse laser processing of removal metal surface camouflage coating |
| CN108971141A (en) * | 2018-06-29 | 2018-12-11 | 江苏大学 | A kind of method and apparatus of small energy laser high-efficiency washing steel surface rusty scale |
| CN109226101A (en) * | 2018-09-18 | 2019-01-18 | 江苏大学 | A kind of laser cleaning method using the water-soluble coating containing energy |
| CN113058935A (en) * | 2021-04-30 | 2021-07-02 | 浙江工业大学 | Method for cleaning micro-nano particles by underwater double-beam pulse laser induced shock waves |
| CN113305106A (en) * | 2021-06-03 | 2021-08-27 | 四川大学 | Method for cleaning micro-nano particle pollutants by laser and application |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107321720A (en) * | 2017-08-22 | 2017-11-07 | 成都新柯力化工科技有限公司 | A kind of high efficiency laser cleaning technique |
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| CN108406090A (en) * | 2018-02-05 | 2018-08-17 | 中国航发北京航空材料研究院 | A kind of high-energy short-pulse laser processing of removal metal surface camouflage coating |
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| CN109226101A (en) * | 2018-09-18 | 2019-01-18 | 江苏大学 | A kind of laser cleaning method using the water-soluble coating containing energy |
| CN113058935A (en) * | 2021-04-30 | 2021-07-02 | 浙江工业大学 | Method for cleaning micro-nano particles by underwater double-beam pulse laser induced shock waves |
| CN113305106A (en) * | 2021-06-03 | 2021-08-27 | 四川大学 | Method for cleaning micro-nano particle pollutants by laser and application |
| CN113305106B (en) * | 2021-06-03 | 2022-08-02 | 四川大学 | Method for cleaning micro-nano particle pollutants by laser and application |
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