CN106486592A - Electrothermal module and thermoelectricity switch - Google Patents
Electrothermal module and thermoelectricity switch Download PDFInfo
- Publication number
- CN106486592A CN106486592A CN201510541801.3A CN201510541801A CN106486592A CN 106486592 A CN106486592 A CN 106486592A CN 201510541801 A CN201510541801 A CN 201510541801A CN 106486592 A CN106486592 A CN 106486592A
- Authority
- CN
- China
- Prior art keywords
- electrothermal module
- thermoelement
- upper substrate
- infrabasal plate
- support column
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The embodiment of the present invention provides a kind of electrothermal module and thermoelectricity switch.The electrothermal module that the present invention provides includes upper substrate, infrabasal plate, thermoelectric structure, at least two support columns；Thermoelectric structure includes least one set thermoelement, and every group of thermoelement includes a p-type thermoelement and a N-type thermoelement；This upper substrate is be arranged in parallel with this infrabasal plate, this at least two support column is supported on the marginal position between this upper substrate and infrabasal plate, the p-type thermoelement of each group thermoelement and N-type thermoelement pass through the electrode of this upper substrate and the electrode alternately connection of this infrabasal plate, and the material of this support column is toughness material.The embodiment of the present invention can improve the service life of electrothermal module.
Description
Technical field
The present embodiments relate to pyroelectric technology, more particularly, to a kind of electrothermal module and thermoelectricity switch.
Background technology
Electrothermal module is as the electron-like device that can be directly realized by electric energy and heat energy mutually conversion, its volume
The advantages of little, lightweight, noiselessness, high reliability, makes the range of application of electrothermal module more and more wider.
Fig. 1 is a kind of structural representation of common electrothermal module.As shown in figure 1, electrothermal module may include
Upper substrate 101, infrabasal plate 102 and the thermoelectric structure being located between upper substrate 101 and infrabasal plate 102, should
Thermoelectric structure can include least one set thermoelement 103.Every group of heat in least one set thermoelement 103
Electric device may include a p-type thermoelement and a N-type thermoelement.This least one set thermoelement
In 103, each thermoelement is connected with the electrode of upper substrate 101 and the electrode of infrabasal plate 102, each group thermoelectricity
In element, p-type thermoelement and N-type thermoelement replace connection.Electrothermal module in the heat energy of running,
I.e. there is temperature difference, therefore upper substrate 101 and infrabasal plate 102 and have in upper substrate 101 and infrabasal plate 102
The linear thermal expansion being produced due to thermal stress.Electrothermal module runs in hot environment, then in running
Also there is residual thermal stress, that is, this each thermoelement also has Temperature Distribution in each thermoelement, therefore,
Also there is linear thermal expansion in thermoelement in the presence of this residual thermal stress.Substrate and thermoelement are not
The synteny coefficient of expansion is so that substrate is different from the linear thermal expansion of thermoelement, so that thermoelectricity mould
Block is integrally deformed.The bulk deformation of electrothermal module makes thermoelement produce mechanical torsion, and position
The mechanical torsion that the farthest thermoelement of distance center is subject between upper substrate 101 and infrabasal plate 102 is maximum.
In prior art, the thermoelement deformation that electrothermal module substrate edges often is serious, is also easy to produce
The problem of slight crack, thus affect the service life of whole electrothermal module.
Content of the invention
The embodiment of the present invention provides a kind of electrothermal module and thermoelectricity switch, to improve making of electrothermal module
Use the life-span.
In a first aspect, the embodiment of the present invention provides a kind of electrothermal module, including：Upper substrate, infrabasal plate,
Thermoelectric structure and at least two support columns；Described thermoelectric structure includes least one set thermoelement, every group
Thermoelement includes a p-type thermoelement and a N-type thermoelement；
Wherein, described upper substrate and described infrabasal plate be arranged in parallel, and described at least two support columns are supported on
Marginal position between described upper substrate and described infrabasal plate, the p-type thermoelement of each group thermoelement and
The electrode of electrode and described infrabasal plate that N-type thermoelement passes through described upper substrate replaces connection, described
The material of support column is toughness material.
According in a first aspect, in the first mode in the cards, described at least two support columns are respectively
It is arranged on the farthest position in the center of the described thermoelectric structure of the distance between described upper substrate and described infrabasal plate
Put.
According to the first mode in the cards of first aspect, in second mode in the cards,
Described support column is two, described two support columns be separately positioned on described upper substrate and described infrabasal plate it
Between diagonal vertex position.
According to the first mode in the cards of first aspect, in the third mode in the cards,
Described support column is four, described four support columns be separately positioned on described upper substrate and described infrabasal plate it
Between edge vertices position.
According in the third mode in the cards of first aspect to first aspect any one, the 4th
Plant in mode in the cards, described support column is little along the area perpendicular to the cross section of cylinder axial direction
The area of the cross section along described direction for the thermoelement in described thermoelectric structure.
According in the 4th kind of mode in the cards of first aspect to first aspect any one, the 5th
Plant in mode in the cards, the material of described support column is kovar alloy or aluminium oxide.
According in the 5th kind of mode in the cards of first aspect to first aspect any one, the 6th
Plant in mode in the cards, the two ends of described support column are welded with described upper substrate and described infrabasal plate respectively
Connect.
According in the 6th kind of mode in the cards of first aspect to first aspect any one, the 7th
In kind of mode in the cards, described upper substrate and the opposite surface of described infrabasal plate are additionally provided with metal level.
According in the 7th kind of mode in the cards of first aspect to first aspect any one, the 8th
Plant in mode in the cards, the material of described thermoelement is Tellurobismuthite., antimony telluride, SiGe or tellurium lead.
Second aspect, the embodiment of the present invention also provides a kind of thermoelectric conversion device, including：Power module and
Electrothermal module；
Described power module is connected with described electrothermal module, to provide electric energy for described electrothermal module；Described
Electrothermal module is any of the above-described described electrothermal module.
The third aspect, the embodiment of the present invention also provides a kind of thermoelectric conversion device, including：Heat source module and
Electrothermal module；
Described heat source module is connected with described electrothermal module, to provide heat energy for described electrothermal module；Described
Electrothermal module is any of the above-described described electrothermal module.
Electrothermal module provided in an embodiment of the present invention and thermoelectricity switch, electrothermal module may include upper substrate,
Infrabasal plate, thermoelectric structure, at least two support columns, and this at least two support column be supported on upper substrate and
Marginal position between infrabasal plate, and, the material of this support column is toughness material, and therefore support column then may be used
By deformation, the heat energy of thermoelectric structure in electrothermal module running is consumed, thermoelectric structure can be reduced
Thermal stress, reduce support column position mechanical torsion size, thus reducing support column due to it
The slight crack that the machine maintenance torsion of position brings, improves the service life of electrothermal module.
Brief description
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to reality
Apply required use in example or description of the prior art accompanying drawing do one simply introduce it should be apparent that, under
Accompanying drawing in the description of face is some embodiments of the present invention, for those of ordinary skill in the art,
On the premise of not paying creative labor, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is a kind of structural representation of common electrothermal module；
A kind of structural representation of electrothermal module that Fig. 2 provides for the embodiment of the present invention one；
A kind of schematic cross-section of electrothermal module that Fig. 3 provides for the embodiment of the present invention two；
The structural representation of another kind of electrothermal module that Fig. 4 provides for the embodiment of the present invention two；
The structural representation of another electrothermal module that Fig. 5 provides for the embodiment of the present invention two；
The structural representation of the electrothermal module that Fig. 6 provides for the embodiment of the present invention three；
The schematic cross-section of the electrothermal module that Fig. 7 provides for the embodiment of the present invention three；
Each support column corresponding thermograde figure that Fig. 8 provides for the embodiment of the present invention three；
A kind of structural representation of thermoelectric conversion device that Fig. 9 provides for the embodiment of the present invention four；
A kind of structural representation of thermoelectric conversion device that Figure 10 provides for the embodiment of the present invention five.
Specific embodiment
Purpose, technical scheme and advantage for making the embodiment of the present invention are clearer, below in conjunction with this
Accompanying drawing in bright embodiment, is clearly and completely described to the technical scheme in the embodiment of the present invention,
Obviously, described embodiment is a part of embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained under the premise of not making creative work
The every other embodiment obtaining, broadly falls into the scope of protection of the invention.
The electrothermal module that various embodiments of the present invention provide, can be applicable to refrigeration, heating, generating electricity is passed with temperature
Sense etc. is in each field, therefore this electrothermal module can be arranged at refrigeration plant, heater, electromotor or
In temperature sensing device.
A kind of structural representation of electrothermal module that Fig. 2 provides for the embodiment of the present invention one.As shown in Fig. 2
Electrothermal module includes：Upper substrate 201, infrabasal plate 202, thermoelectric structure 203, at least two support columns 204.
Wherein, the material of support column 204 is toughness material.
Wherein, upper substrate 201 and infrabasal plate 202 can be insulated substrate, upper substrate 201 and infrabasal plate
202 material can be for example pottery.Thermoelectric structure 203 may include thermoelement.Thermoelement can claim
For thermoelectricity sub-prime.Thermoelement can be thermoelectric semiconductor.This toughness material can be for example ductile metal material
Material.
Upper substrate 201 is be arranged in parallel with infrabasal plate 202.At least two support columns 204 are supported on upper substrate
Marginal position between 201 and infrabasal plate 202.Thermoelectric structure 203 includes least one set thermoelement,
Every group of thermoelement includes a p-type thermoelement and a N-type thermoelement；Each group thermoelement
P-type thermoelement and N-type thermoelement pass through the electrode of upper substrate 201 and the electrode of infrabasal plate 202
Alternately connect.
Wherein, electrode can be for example metal electrode.
Optionally, the electrode of the electrode of upper substrate 201 and/or infrabasal plate 202 also can connect power supply and make
Produce potential between the electrode of the electrode of substrate 201 and infrabasal plate 202, that is, there is voltage difference.Upper substrate 201
Produce potential between the electrode of electrode and infrabasal plate 202, the thermoelectric element module being connected with each electrode can be made
Middle formation current loop, due to peltier effect so that the electrode of upper substrate 201 and infrabasal plate 202
In electrode, an electrode heat absorption, another electrode heat release, realize the conversion of electric energy and heat energy, are freezed
Or heating.Wherein, an electrode can be the substrate heat absorption being located by this electrode, another electricity
It can be extremely the substrate heat release being located by this another electrode.Therefore, this upper substrate 201 and infrabasal plate
In 202, a substrate can be cold substrate, and another substrate can be hot substrate.Specifically upper substrate 201
Or infrabasal plate 202 is as hot substrate, can be by the sense of current in thermoelectric structure, if the sense of current
Change, then former cold substrate can be hot substrate, former hot substrate also can be changed into cold substrate.
Alternately, the exportable voltage of the electrode of the electrode of upper substrate 201 and infrabasal plate 202, by warm
The electric energy output obtaining can be converted.There is temperature difference with the electrode of infrabasal plate 202 in the electrode of upper substrate 201,
I.e. wherein, the temperature of an electrode and the temperature of another electrode are different.This electrode temperature can be
Temperature after this electrode place substrate neither endothermic nor exothermic.The electrode of upper substrate 201 and infrabasal plate 202
Interelectrode temperature difference so that forming current loop in the electrothermal module that is connected with electrode, due to matching shellfish
Gram effect so that producing voltage difference between the electrode of the electrode of upper substrate 201 and infrabasal plate 202, i.e. potential,
Realize heat energy to the conversion of electric energy, generated electricity.Electrothermal module carry out generating can be described as thermo-electric generation or
Heat energy power-generating.
Thermoelectric structure 203 can be semiconductor structure, and such as the thermoelement of thermoelectric structure 203 is thermoelectricity half
Conductor, therefore electrothermal module carry out refrigeration and can be described as semiconductor refrigerating, and electrothermal module carries out heating and can be described as
Quasiconductor heats, and electrothermal module carries out generating and is also referred to as quasiconductor generating.The p-type of each group thermoelement
Thermoelement and N-type thermoelement are replaced by the electrode of upper substrate 201 and the electrode of infrabasal plate 202
Connect, refer to：Two neighboring thermoelement is different, and this two neighboring thermoelement may include a P
Type thermal element and a N-type thermoelement.Wherein, each group the torrid zone element in adjacent thermoelement spacing
Can be identical.
This at least two support column 204 is supported on the marginal position between upper substrate 201 and infrabasal plate 202,
The material of support column is toughness material, and support column then can be warm in running by electrothermal module by deformation
The heat energy of electric structure is consumed, and therefore can reduce the thermal stress of thermoelectric structure 203, reduces thermoelectric structure
203 thermal expansion, reduce support column position mechanical torsion size, thus reduce support column by
The slight crack bringing in the mechanical torsion of its position.Wherein, the heat energy of this thermoelectric structure 203 can be
Electrothermal module running external environment temperature is so as to there is residual thermal stress in thermoelectric structure 203 carried
The heat energy coming.
The electrothermal module that the embodiment of the present invention one provides, including upper substrate, infrabasal plate, thermoelectric structure, extremely
Few two support columns, and this at least two support column is supported on the marginal position between upper substrate and infrabasal plate,
And, the material of this support column is toughness material, and therefore electrothermal module then can be run by support column by deformation
During the heat energy of thermoelectric structure consumed, the thermal stress of thermoelectric structure can be reduced, reduce support column institute
In the size of the mechanical torsion of position, thus reduce support column being brought due to the machine maintenance torsion of its position
Slight crack, improve electrothermal module service life.
Optionally, this at least two support column 204 be separately positioned on upper substrate 201 and infrabasal plate 202 it
Between the farthest position in the center apart from thermoelectric structure 203.
A kind of schematic cross-section of electrothermal module that Fig. 3 provides for the embodiment of the present invention two.As shown in figure 3,
Support column 204 can be two, and two support columns 204 are separately positioned on upper substrate 201 and infrabasal plate 202
Between diagonal vertex position.
The schematic cross-section of another kind of electrothermal module that Fig. 4 provides for the embodiment of the present invention two.As Fig. 4 institute
Show, support column 204 can be four, and four support columns 204 are separately positioned on upper substrate 201 and lower base
Edge vertices position between plate 202.
Optionally, support column 204 can be equal to heat along the area of the cross section perpendicular to cylinder axial direction
The area of thermoelement cross section in the direction in electric structure 203.
Optionally, support column 204, along the area of the cross section perpendicular to cylinder axial direction, is less than, heat
The area of thermoelement cross section in the direction in electric structure 203.
If support column 204 is less than electrothermal module 203 along the area of the cross section perpendicular to cylinder axial direction
The area of middle thermoelement cross section in the direction, can reduce due to support column and upper substrate 201 and
The heat flux in opposite direction of the unidirectional Heat transmission between infrabasal plate 202 it is ensured that the performance of electrothermal module, that is,
Ensure the upper substrate 201 of electrothermal module and the temperature difference of infrabasal plate 202.
Meanwhile, support column 204 is less along the area of the cross section perpendicular to cylinder axial direction, can make
The mechanical stiffness of support column 204 is less, and its deformation is bigger, thus the heat energy being consumed by deformation is more,
Make the residual thermal stress of thermoelectric structure 203 less, reduce the damage of the electrothermal module that residual thermal stress brings
Bad, better ensure that the service life of electrothermal module.
Optionally, the material of support column 204 is kovar alloy (KOVAR) or aluminium oxide (Alumina
oxide).This aluminium oxide is represented by aluminium sesquioxide (Al2O3).
Optionally, the two ends of support column 204 are welded with upper substrate 201 and infrabasal plate 202 respectively.
Optionally, the embodiment of the present invention two also provides another electrothermal module.Fig. 5 is the embodiment of the present invention
The structural representation of another electrothermal module of two offers.As shown in figure 5, optional, the heat of this Fig. 5
On the basis of electrothermal module described in above-described embodiment one or embodiment two for the electric module, upper substrate 201 He
The opposite surface of infrabasal plate 202 is additionally provided with metal level 501.
Wherein, this metal level 501 can be cupro-nickel gold plate.The electrode of upper substrate 201 and infrabasal plate 202
Electrode can also be cupro-nickel gold plate.
The metal level of upper substrate 201 can be easy to upper substrate 201 other elements and be welded to connect, infrabasal plate 202
Metal level 501 can be easy to infrabasal plate 202 other elements and be welded to connect.
Optionally, the material of thermoelement is Tellurobismuthite. (Bismuth Telluride), antimony telluride (antimony
Telluride), SiGe (SiGr) or tellurium lead (PbTe).Tellurobismuthite. is represented by Bi2Te3.Antimony telluride
It is represented by Sb2Te3.
Multiple electrothermal modules that the embodiment of the present invention two provides, by subtracting the area of the cross section of support column
Little so that the cross section of support column area be less than thermoelectric structure the cross section of thermoelement area,
Reduce the reverse heat flux in support column, it is to avoid the heat transfer of hot substrate to cold substrate is it is ensured that thermoelectricity mould
The performance of block, and reduce the area of the cross section of support column, the mechanical stiffness of a support column can be made to subtract
Little, deformation is bigger, thus the heat energy that consumed by deformation more so that thermoelement in thermoelectric structure
Residual thermal stress is less, reduces the damage of the electrothermal module that residual thermal stress brings, better ensures that thermoelectricity
The service life of module.
It should be noted that support column and thermoelement can for rectangular cylinder or cylinder,
Cylinder or the cylinder of other shapes.Although, each heat providing in the embodiment of the present invention one or embodiment two
In electric module accompanying drawing, the cross section of each support column and each thermoelement is rectangle, so, this each support
The cross section of post and this each thermoelement can also be other shapes, such as the other shapes such as circle, rhombus,
The embodiment of the present invention is not in this, as restriction.
The embodiment of the present invention three also provides a kind of electrothermal module.The heat that Fig. 6 provides for the embodiment of the present invention three
The structural representation of electric module.The schematic cross-section of the electrothermal module that Fig. 7 provides for the embodiment of the present invention three.
As shown in fig. 6, electrothermal module may include upper substrate 601, infrabasal plate 602, least one set thermoelement
603 and at least two support columns 604.Wherein, every group of thermoelement in least one set thermoelement 603
603 include a p-type thermoelement and a N-type thermoelement.Every at least two support columns 604
The material of individual support column 604 is ductile metal, such as kovar alloy or aluminium alloy.Upper substrate 601 and lower base
The material of plate 602 can be for example pottery.Also set on upper substrate 601 and the opposite surface of infrabasal plate 602
There is electrode 605；It is additionally provided with metal level 606 on upper substrate 601 and the opposite surface of infrabasal plate 602.
Upper substrate 601 is be arranged in parallel with infrabasal plate 602.At least two support columns 604 are supported on upper substrate
Marginal position between 601 and infrabasal plate 602.
The p-type thermoelement of each group thermoelement and N-type thermoelement pass through upper substrate 201 electrode and
The electrode of infrabasal plate 202 replaces connection.
The surface of upper substrate 601 and infrabasal plate 602 can be rectangle, and support column 604 is four.This four
Individual support column 604 is separately positioned on the edge fixed position between upper substrate 601 and infrabasal plate 602.
Support column 604 is smaller than each thermoelement along the area of the cross section perpendicular to cylinder axial direction
The area of 603 cross sections in the direction.
Support column 604 can be the cylinder of rectangle for cross section.For example, this thermoelement 603
Cross section is the square that the length of side is 0.47 millimeter, and therefore, the area of the cross section of thermoelement 603 can
Think 0.22 square millimeter.The cross section of support column 604 is the square that the length of side is 0.2 millimeter, therefore,
The area of the cross section of support column 604 can be 0.04 square millimeter.
When thermoelement 603 has electric current, in this electrothermal module, upper substrate 601 and infrabasal plate 602 just produce
The raw temperature difference, that is, generate thermograde.This thermograde is represented by △ T.
Each support column corresponding thermograde figure that Fig. 8 provides for the embodiment of the present invention three.Common thermoelectricity
Module, if including the thermoelement of 42 Tellurobismuthite. materials, the area of the cross section of each thermoelement is
0.22 square millimeter, then in electrothermal module, the temperature between two substrates can be the support column institute of Fig. 8 acquiescence
Such as 35.7 degree of corresponding thermograde.The heat conductivity of kovar alloy is 30W/mK, the heat conductivity of aluminium oxide
For 17W/mK.If as shown in figure 8, the support column of the electrothermal module in the embodiment of the present invention three is transversal
Face be 0.47mm × 0.47mm, material be kovar alloy support column, then the upper substrate of electrothermal module and under
The thermograde of substrate can be as shown in Figure 8 19 degree.If as shown in figure 8, the embodiment of the present invention three
In electrothermal module support column for cross section be 0.47mm × 0.47mm, material be aluminium oxide support
Post, then the thermograde of the upper substrate 601 of electrothermal module and infrabasal plate 602 can be as shown in Figure 8
16 degree.
Compared with the thermograde of existing common electrothermal module, material is kovar alloy or aluminium oxide, horizontal
Section is that the thermograde of the electrothermal module of support column of 0.47mm × 0.47mm is less, for ensureing the present invention
The thermograde implementing electrothermal module in three is it is ensured that the suitability of electrothermal module.Support column can be reduced
The area of cross section.
If as shown in figure 8, the support column of the electrothermal module in the embodiment of the present invention three for cross section is
0.2mm × 0.2mm, material is the support column of kovar alloy, then the upper substrate of electrothermal module and infrabasal plate
Thermograde can be as shown in Figure 8 28.5 degree.If as shown in figure 8, in the embodiment of the present invention three
The support column of electrothermal module is 0.2mm × 0.2mm for cross section, and material is the support column of aluminium oxide, then heat
The thermograde of the upper substrate of electric module and infrabasal plate can be as shown in Figure 8 26.7 degree.
Common electrothermal module in hot environment the displacement vector of running and for example can be 1.346
Micron, if then the material of support column is kovar alloy in the electrothermal module of the embodiment of the present invention three, this
Unique vector in electrothermal module running in hot environment of bright embodiment three can be 1.311
Micron, displacement vector and the faint reduction of acquirement.This common electrothermal module thermoelement in hot environment
Maximum von mises stress can be for example 34616gf/mm2If, then the thermoelectricity of the embodiment of the present invention three
In module, the material of support column is kovar alloy, then the electrothermal module of the embodiment of the present invention three is in hot environment
In middle running thermoelement maximum von mises stress can be 31433gf/mm2.Therefore may be used
Know, the support column of toughness material can make support column pass through deformation and consume residual thermal stress, so that this
In the electrothermal module of inventive embodiments three, the von mises stress of thermoelement is effectively reduced.
The electrothermal module that the embodiment of the present invention three provides, because at least two support columns are also separately positioned on this
Edge fixed position between upper substrate and infrabasal plate, the material of this support column is toughness material, therefore props up
The heat energy of thermoelement each in electrothermal module running then can be consumed by dagger by deformation, can subtract
The thermal stress of little thermoelement, reduces the size of the mechanical torsion of support column position, thus reduce propping up
The slight crack that dagger is brought due to the machine maintenance torsion of support column position, improves the service life of electrothermal module.
The embodiment of the present invention four also provides a kind of thermoelectric conversion device.Fig. 9 provides for the embodiment of the present invention four
A kind of thermoelectric conversion device structural representation.As shown in figure 9, this thermoelectric conversion device 900 can wrap
Include power module 901 and electrothermal module 902.Power module 901 is connected with electrothermal module 902, thinks
Electrothermal module 902 provides electric energy；Electrothermal module 902 can be for described in any of the above-described embodiment of the present invention
Electrothermal module.
This thermoelectric conversion device 900 can be thermoelectric refrigerator, the friendship of the heat energy such as thermoelectricity warmer and electric energy
Changing device.In electrothermal module 902, electrode also has power input, and this power input can be with power supply mould
Block 901 connects, thus providing electric energy for electrothermal module, the as thermoelement of electrothermal module provides and drives
Electric current.This electrothermal module 902 is used for refrigeration and the difference of heating is that the thermoelectricity of this electrothermal module 902 is first
The sense of current of part is different.
The thermoelectric conversion device that the embodiment of the present invention four provides, including the thermoelectricity described in any of the above-described embodiment
Module, beneficial effect is similar to the above embodiments, will not be described here.
The embodiment of the present invention five also provides a kind of thermoelectric conversion device.Figure 10 provides for the embodiment of the present invention five
A kind of thermoelectric conversion device structural representation.As shown in Figure 10, this thermoelectric conversion device 1000 can
Including heat source module 1001 and electrothermal module 1002.Heat source module 1001 is connected with electrothermal module 1002,
To provide electric energy for electrothermal module 1002；Electrothermal module 1002 can be any of the above-described embodiment of the present invention
Described in electrothermal module.
This thermoelectric conversion device 1000 can be thermoelectric generator, then this electrothermal module 1002 can be used for sending out
Electricity, in electrothermal module 1002, substrate also has thermal source input, and this thermal source input can be with heat source module
1001 connections, thus provide heat energy for the electrode of the thermoelement connection of electrothermal module.
The thermoelectric conversion device that the embodiment of the present invention five provides, including the thermoelectricity described in any of the above-described embodiment
Module, beneficial effect is similar to the above embodiments, will not be described here.
One of ordinary skill in the art will appreciate that：Realize all or part step of above-mentioned each method embodiment
Suddenly can be completed by the related hardware of programmed instruction.Aforesaid program can be stored in a computer can
Read in storage medium.This program upon execution, executes the step including above-mentioned each method embodiment；And
Aforesaid storage medium includes：ROM, RAM, magnetic disc or CD etc. are various can be with store program codes
Medium.Finally it should be noted that：Various embodiments above only in order to technical scheme to be described, and
Non- it is limited；Although being described in detail to the present invention with reference to foregoing embodiments, this area
Those of ordinary skill should be understood：It still can be carried out to the technical scheme described in foregoing embodiments
Modification, or equivalent is carried out to wherein some or all of technical characteristic；And these are changed or replace
Change, do not make the essence of appropriate technical solution depart from the scope of various embodiments of the present invention technical scheme.
Claims (11)
1. a kind of electrothermal module is it is characterised in that include：Upper substrate, infrabasal plate, thermoelectric structure and
At least two support columns；Described thermoelectric structure includes least one set thermoelement, and every group of thermoelement includes
One p-type thermoelement and a N-type thermoelement；
Wherein, described upper substrate and described infrabasal plate be arranged in parallel, and described at least two support columns are supported on
Marginal position between described upper substrate and described infrabasal plate, the p-type thermoelement of each group thermoelement and
The electrode of electrode and described infrabasal plate that N-type thermoelement passes through described upper substrate replaces connection, described
The material of support column is toughness material.
2. electrothermal module according to claim 1 is it is characterised in that described at least two support columns
The center being separately positioned on the described thermoelectric structure of the distance between described upper substrate and described infrabasal plate is farthest
Position.
3. electrothermal module according to claim 2 it is characterised in that described support column be two,
Described two support columns are separately positioned on the diagonal vertex position between described upper substrate and described infrabasal plate.
4. electrothermal module according to claim 2 it is characterised in that described support column be four,
Described four support columns are separately positioned on the edge vertices position between described upper substrate and described infrabasal plate.
5. the electrothermal module according to any one of Claims 1 to 4 is it is characterised in that described support
The area perpendicular to the cross section of cylinder axial direction for the post edge is less than thermoelement in described thermoelectric structure along institute
State the area of the cross section in direction.
6. the electrothermal module according to any one of Claims 1 to 5 is it is characterised in that described support
The material of post is kovar alloy or aluminium oxide.
7. the electrothermal module according to any one of claim 1～6 is it is characterised in that described support
The two ends of post are welded with described upper substrate and described infrabasal plate respectively.
8. the electrothermal module according to any one of claim 1～7 is it is characterised in that described upper base
It is additionally provided with metal level on plate and the opposite surface of described infrabasal plate.
9. the electrothermal module according to any one of claim 1～8 is it is characterised in that described thermoelectricity
The material of element is Tellurobismuthite., antimony telluride, SiGe or tellurium lead.
10. a kind of thermoelectric conversion device is it is characterised in that include：Power module and electrothermal module；
Described power module is connected with described electrothermal module, to provide electric energy for described electrothermal module；Described
Electrothermal module is the electrothermal module any one of claim 1～9.
A kind of 11. thermoelectric conversion devices are it is characterised in that include：Heat source module and electrothermal module；
Described heat source module is connected with described electrothermal module, to provide heat energy for described electrothermal module；Described
Electrothermal module is the electrothermal module any one of claim 1～9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510541801.3A CN106486592A (en) | 2015-08-28 | 2015-08-28 | Electrothermal module and thermoelectricity switch |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510541801.3A CN106486592A (en) | 2015-08-28 | 2015-08-28 | Electrothermal module and thermoelectricity switch |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106486592A true CN106486592A (en) | 2017-03-08 |
Family
ID=58234997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510541801.3A Pending CN106486592A (en) | 2015-08-28 | 2015-08-28 | Electrothermal module and thermoelectricity switch |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106486592A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111615754A (en) * | 2018-01-19 | 2020-09-01 | Lg 伊诺特有限公司 | Thermoelectric element |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6560167B1 (en) * | 1997-12-25 | 2003-05-06 | Seiko Instruments Inc. | Thermoelectric generation unit and portable electronic device using the unit |
| CN101740717A (en) * | 2008-11-14 | 2010-06-16 | 复旦大学 | CuxO-based resistor type storage and preparation method thereof |
| CN102044630A (en) * | 2009-10-15 | 2011-05-04 | 复旦大学 | CuSiO resistive memory prepared based on sputtering copper and producing method thereof |
| JP2012079803A (en) * | 2010-09-30 | 2012-04-19 | Kyocera Corp | Thermoelectric module |
-
2015
- 2015-08-28 CN CN201510541801.3A patent/CN106486592A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6560167B1 (en) * | 1997-12-25 | 2003-05-06 | Seiko Instruments Inc. | Thermoelectric generation unit and portable electronic device using the unit |
| CN101740717A (en) * | 2008-11-14 | 2010-06-16 | 复旦大学 | CuxO-based resistor type storage and preparation method thereof |
| CN102044630A (en) * | 2009-10-15 | 2011-05-04 | 复旦大学 | CuSiO resistive memory prepared based on sputtering copper and producing method thereof |
| JP2012079803A (en) * | 2010-09-30 | 2012-04-19 | Kyocera Corp | Thermoelectric module |
Non-Patent Citations (1)
| Title |
|---|
| 张斌: "《过程原理与设备》", 1 December 2010 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111615754A (en) * | 2018-01-19 | 2020-09-01 | Lg 伊诺特有限公司 | Thermoelectric element |
| CN111615754B (en) * | 2018-01-19 | 2024-04-16 | Lg伊诺特有限公司 | Thermoelectric element |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Shittu et al. | High performance and thermal stress analysis of a segmented annular thermoelectric generator | |
| Fan et al. | Numerical simulation on thermoelectric and mechanical performance of annular thermoelectric generator | |
| Sahin et al. | Thermodynamic irreversibility and performance characteristics of thermoelectric power generator | |
| Hashim et al. | Model for geometry optimisation of thermoelectric devices in a hybrid PV/TE system | |
| Kuroki et al. | Thermoelectric generation using waste heat in steel works | |
| Sahin et al. | The thermoelement as thermoelectric power generator: Effect of leg geometry on the efficiency and power generation | |
| Gong et al. | Thermo-mechanical analysis on a compact thermoelectric cooler | |
| EP1780807B1 (en) | Thermoelectric conversion module | |
| Hodes | Optimal pellet geometries for thermoelectric power generation | |
| Zhu et al. | Thin-film solar thermoelectric generator with enhanced power output: Integrated optimization design to obtain directional heat flow | |
| TW201041195A (en) | Split-thermo-electric structures | |
| JPWO2006043514A1 (en) | Structure of Peltier element or Seebeck element and manufacturing method thereof | |
| CN102201530B (en) | Thermoelectric conversion device | |
| Al‐Merbati et al. | A model study for cyclic thermal loading and thermal performance of a thermoelectric generator | |
| Admasu et al. | Effects of temperature non-uniformity over the heat spreader on the outputs of thermoelectric power generation system | |
| Rabari et al. | Effect of convection heat transfer on performance of waste heat thermoelectric generator | |
| Wang et al. | A comprehensive study on X-type thermoelectric generator modules | |
| Liu et al. | Investigation of the impact of the thermoelectric geometry on the cooling performance and thermal—mechanic characteristics in a thermoelectric cooler | |
| CN104779340A (en) | Temperature-difference power generating device based on high-conductivity graphene connection material | |
| Liu et al. | Investigation of a novel separately-configured micro-thermoelectric cooler to enabling extend application scope | |
| Meng et al. | Thermoelectric analysis for helical power generation systems | |
| CN105378955A (en) | Carrier element and module | |
| CN105099275A (en) | Planar thermoelectric power generation structure with miniature boss array hot end | |
| Wang et al. | U-type unileg thermoelectric module: A novel structure for high-temperature application with long lifespan | |
| US20120145210A1 (en) | Next Generation Thermoelectric Device Designs and Methods of Using Same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170308 |