CN106486511B - Display device and method for preparing organic light-emitting diode display panel - Google Patents
Display device and method for preparing organic light-emitting diode display panel Download PDFInfo
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- CN106486511B CN106486511B CN201510528307.3A CN201510528307A CN106486511B CN 106486511 B CN106486511 B CN 106486511B CN 201510528307 A CN201510528307 A CN 201510528307A CN 106486511 B CN106486511 B CN 106486511B
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Abstract
The invention relates to the technical field of semiconductor display, in particular to a display device and a method for preparing an organic light-emitting diode display panel.
Description
Technical Field
The invention relates to the technical field of semiconductor display, in particular to a display device and a method for preparing an organic light-emitting diode display panel.
Background
At present, when an FOG (Glass Film) is disposed on an AMOLED display Panel, since a plurality of Bonding pads (Bonding pads) are disposed in a region for Bonding a Flexible Printed Circuit (FPC) on a Panel (Panel), and the Bonding pads are all protruded (i.e., higher) than a surface of the Panel, conductive particles in an Anisotropic Conductive Film (ACF) pressed on the Panel and the Bonding pads are easily gathered between adjacent Bonding pads during a hot pressing process performed on the region, and thus defects such as a short Circuit (short) occur between the adjacent Bonding pads.
FIG. 1 is a schematic sectional view of a conventional FOG structure; as shown in fig. 1, an ACF film 13 is covered on a panel 11 provided with a plurality of pads (pads) 12, and the ACF film 13 contains a plurality of movable conductive particles 131; since the pads 12 are protruded from the surface of the panel, the adjacent pads 12 and the panel therebetween form a groove structure.
When the FPC film 14 is subjected to a hot pressing process by using the hot pressing head 15, that is, the FPC film 14 is pressed on the ACF film 13 along the direction indicated by the arrow in fig. 1, the conductive particles 131 in the ACF film 13 are gathered to the panel 11 between the pads 12 due to the pressure, so that the conductive particles 131 are gathered in the groove structure, and when too many conductive particles 131 are gathered, defects such as Short (Short) between adjacent pads 12 through the gathered conductive particles 131 are generated in the region 16 shown in fig. 1; meanwhile, since the conductive particles 131 on the bonding pad 12 are compressed by the pressure and gathered into the groove, the conductive particles 131 on the bonding pad 12 are not distributed sufficiently (such as the region 17 shown in fig. 1), and the contact performance between the bonding pad 12 and the FPC film 14 is reduced, thereby reducing the performance of the manufactured display device.
Disclosure of Invention
In view of the above, the present application provides a display device including:
the display panel is provided with a front surface, and a display area and a bonding area positioned outside the display area are arranged on the front surface of the display panel;
a plurality of bonding pads disposed in the bonding region on the front surface of the display panel;
the plurality of bumps are respectively arranged on the periphery of the welding pads so as to isolate the adjacent welding pads;
an Anisotropic Conductive Film (ACF) covering the surface of the bump and the surface of the pad, the ACF including a plurality of conductive particles;
a Flexible Printed Circuit (FPC) covering the surface of the anisotropic conductive film and electrically connected to the pads through the conductive particles; and
the top surface of the bump is higher than the upper surface of the welding pad, and the density of the conductive particles distributed above the bump is smaller than that of the conductive particles distributed above the welding pad.
As a preferred embodiment, in the above display device:
the lug is made of an insulating material.
As a preferred embodiment, in the above display device:
the lug is made of photoresist.
As a preferred embodiment, in the above display device:
the top surface of the bump is 1500-2500 nm higher than the upper surface of the welding pad.
As a preferred embodiment, in the above display device:
the display area in the display panel is provided with a light emitting device, and light emitted by the light emitting device is emitted from the front surface of the display panel.
As a preferred embodiment, in the above display device:
the display panel is an organic light emitting diode display panel.
The present application also provides a method for preparing an organic light emitting diode display panel, which can be applied to a display device such as an AMOLED to enhance the contact characteristics of a FOG (Film on Glass) structure, the method comprising:
providing an organic light-emitting diode display panel, wherein the surface of the organic light-emitting diode display panel is provided with a display area and a bonding area positioned on the outer side of the display area, and the surface positioned on the bonding area is provided with a plurality of welding pads;
coating a photoresist layer on the surface of the bonding region to cover the surface of the welding pad and the exposed surface of the display panel positioned in the bonding region; and
forming a plurality of bumps on the periphery of the welding pads by using an exposure and development process, wherein the adjacent welding pads are isolated by the bumps;
the top surface of the bump is higher than the upper surface of the bonding pad adjacent to the bump.
As a preferred embodiment, the method for manufacturing an organic light emitting diode display panel further includes:
preparing an anisotropic conductive film to cover the surfaces of the welding pad and the bump, wherein the anisotropic conductive film comprises a plurality of conductive particles; and
and pressing a flexible circuit board on the surface of the anisotropic conductive film by using a hot pressing process so that the flexible circuit board is electrically connected with the welding pads through the conductive particles gathered above the welding pads, and the adjacent welding pads are mutually insulated by the bumps.
As a preferred embodiment, in the method for manufacturing an organic light emitting diode display panel described above:
the top surface of the bump is 1500-2500 nm higher than the upper surface of the welding pad.
As a preferred embodiment, in the method for manufacturing an organic light emitting diode display panel described above:
the organic light emitting diode display panel is provided with a front surface and a back surface opposite to the front surface, and the display area in the organic light emitting diode display panel is provided with an organic light emitting diode device; and
the organic light emitting diode device emits light from a front surface of the display panel.
The technical scheme has the following advantages or beneficial effects:
according to the display device and the method for preparing the organic light-emitting diode display panel, the convex blocks which are protruded (namely higher) than the upper surfaces of the welding pads are arranged between the welding pads on the display panel, so that conductive particles in the ACF film are forced to be gathered towards the ACF film above the welding pads in the subsequent hot-pressing process, the defects of short circuit and the like between the adjacent welding pads caused by gathering of the conductive particles are effectively avoided, and meanwhile, the contact performance between the display panel and the FPC film is effectively improved.
Drawings
Embodiments of the present invention will now be described more fully hereinafter with reference to the accompanying drawings. The drawings are, however, to be regarded as illustrative and explanatory only and are not restrictive of the scope of the invention.
FIG. 1 is a schematic diagram of a conventional FOG structure;
fig. 2 is a schematic view of a display device in an embodiment of the present application;
fig. 3 to 10 are schematic structural flow diagrams of the organic light emitting diode display panel according to the embodiment of the present application.
Detailed Description
The display device and the method for preparing the organic light emitting diode display Panel provided by the embodiment of the invention can be based on the traditional AMOLED display Panel, a plurality of bumps are arranged on the front surface of the display Panel (Panel) for emitting light and close to the position of the bonding Pad (Pad) for bonding, and the upper surfaces of the bumps are higher than the upper surface of the bonding Pad, so that the extrusion force exerted on the ACF film above the bumps is larger than that exerted on the ACF film above the bonding Pad in the subsequent hot pressing process, and the movable conductive particles in the ACF film are converged from the upper part of the bumps to the upper part of the bonding Pad to form an insulation area in the ACF film above the bumps, thereby effectively avoiding the generation of defects such as Short circuit (Short) and the like caused by the convergence of the conductive particles in the ACF film among the bonding pads between the adjacent bonding pads, meanwhile, as the density of the conductive particles converged on the welding pad is increased, the electric contact between the welding pad and the FPC film positioned on the welding pad can be effectively improved.
The following describes a method for manufacturing a pixel array and a display device including the pixel array according to the present invention in detail with reference to the accompanying drawings and specific embodiments.
Example one
FIG. 2 is a schematic diagram of an FOG structure in an embodiment of the present application; as shown in fig. 2, a display device in the embodiment of the present application may include a FOG structure formed after a hot pressing process, for example, and the display device may include:
the display panel 21 may include an AMOLED glass substrate provided with a display module, or may be a panel for preparing other display devices, that is, a light emitting device is prepared in the display panel 21; in addition, for convenience of the following description, the surface of the display panel 21 through which the light emitted by the light emitting device passes is defined as a front surface (i.e., the surface of the display substrate 21 located above in the drawing is referred to as a front surface, and correspondingly, the surface of the display substrate 21 located below is referred to as a back surface), and correspondingly, the display panel 21 further has a back surface opposite to the front surface (the back surface is transparent or opaque, which may be determined according to the actual device requirements); meanwhile, the display panel 21 is provided on the front surface thereof with a display region and a bonding region located outside the display region, and the above-described light emitting device is provided in the display region located on the front surface of the display panel.
Further, the Bonding region disposed on the display Panel 21 is covered by a subsequently prepared FPC film (only a schematic cross-sectional structure of the Bonding region portion of the display substrate 21 is shown in the drawings of the present application, that is, the display substrate 21 further includes other regions, which are not described in detail herein because the arrangement of the structures of the other regions and the corresponding components does not affect the main idea of the present application), and a plurality of Bonding pads (Bonding pads) 22 and a plurality of bumps 23 respectively located at the periphery of the Bonding pads 22 are further disposed on the front surface of the display substrate 21 in the Bonding region (Panel FPC Bonding Pad); wherein the top surface of each bump 23 is raised (i.e., higher) than the upper surface of its neighboring pad 22 to isolate the neighboring pads 22.
Preferably, the material of the bump 23 may be an insulating material such as photoresist, so that the adjacent pads 22 are isolated on the premise that the bump 23 has a certain hardness.
Further, as shown in fig. 2, the ACF film 24 covers the surface of the bump 23 and the pad 22, and the ACF film 24 contains a plurality of movable conductive particles 241; the FPC film 25 may be pressed on the ACF film 24 by a process such as hot pressing to cover the upper surface of the ACF film 24, and the FPC film 25 is electrically connected to the pads 22 through the conductive particles 241.
Because the heights of the bonding pad 22 and the bump 23 under the ACF film 24 are different, that is, the upper surface of the film structure formed by the bonding pad 22 and the bump 23 has an uneven structure, during the above-mentioned pressing operation, the movable conductive particles 241 in the ACF film 24 can be gathered from the protrusion to the depression, and further the conductive particles 241 in the ACF film 24 at the protrusion (i.e., above the bump 23) can be gathered to the depression (i.e., above the bonding pad 22), that is, the conductive particles 241 in the region 28 as shown in fig. 2 are gathered to the region 27, and further many conductive particles 241 are gathered in the ACF film 24 of the region 27, so that the electrical contact performance between the FPC film 25 and the bonding pad 22 can be enhanced; meanwhile, as the conductive particles 241 in the ACF film 24 at the protrusion are spread, the conductive particles 241 in the region 28 of fig. 2 are sparsely distributed, that is, an insulating region (i.e., the region 28) is formed in the ACF film 24 above the bump 23, so that the occurrence of defects such as short circuit between adjacent pads 241 caused by the convergence of the conductive particles 241 in the ACF film 24 can be effectively avoided.
Preferably, in order to effectively improve the electrical contact performance between the FPC film 25 and the bonding pad 22 on the premise of ensuring the insulation between the adjacent bonding pads 241, the upper surface of the protrusion 23 may be protruded from (i.e., higher than) the upper surface of the bonding pad by 1500 to 2500nm, preferably 1500nm, 2000nm, 2500nm, or the like.
In addition, the display panel can be an organic light emitting diode (AMOLED) display panel board and the like, so that the defects of short circuit and the like caused by aggregation of conductive particles between welding pads (Pad) can be effectively avoided, meanwhile, the contact performance of the FPC film and the display panel can be greatly improved, and the yield of products is further improved.
Example two
FIGS. 3 to 10 are schematic structural flow diagrams of a method for fabricating an OLED display panel according to an embodiment of the present disclosure; as shown in fig. 3 to 10, the present application further provides an organic light emitting diode display panel, which can be used for manufacturing a display device in an embodiment one based on a conventional FOG structure (such as an AMOLED FOG structure) manufacturing process, so as to effectively avoid short circuit and other defects caused by convergence of conductive particles between adjacent pads, and further improve the contact performance of the FOG structure in the display device, where the method specifically includes:
first, as shown in fig. 3, a display panel 31 having a bonding region disposed on a surface thereof is provided, and a plurality of pads 32 are disposed on the surface of the display panel 31 at the bonding region. The display panel 31 may be prepared with elements such as a display device based on a conventional process, and the display panel 31 has a front surface (i.e., an upper surface as shown in fig. 3) for emitting light so that light emitted from the light emitting device is emitted; accordingly, the back surface (i.e. the lower surface shown in fig. 3) opposite to the front surface may be a light-transmitting or light-transmitting surface, and may be set according to the actual device structure; in addition, a display region in which the above-described light emitting devices are disposed and a bonding region located outside the display region are disposed on the front surface of the display panel 31.
It should be noted that, since the display panel located outside the bonding region is not relevant to the technical solution in the present application, the structures of other regions are not shown in the drawings of the present embodiment, but those skilled in the art can know based on the currently disclosed documents and the known knowledge, so that the description is not repeated here, but the present application is not limited thereto.
Next, based on the structure shown in fig. 3, a coating process of a photoresist 331 is performed on the bonding region to form the structure shown in fig. 4, and after the spin coating process is continued, a vacuum drying and pre-baking process (i.e., a curing process) is continued, a photoresist layer 332 having a flat surface and covering the exposed surfaces of the bonding pad 32 and the display panel 31 as shown in fig. 5 can be formed.
Then, on the basis of the structure shown in fig. 5, a mask 34 having a pattern of pads 32 distributed on the surface of the display panel 31 is prepared; as shown in fig. 6, after the photoresist layer 332 is exposed by the mask 34, a portion of the photoresist layer 332 is removed after a developing process, so as to form a plurality of bumps 33 near the periphery of each pad 32, i.e., the photoresist layer 332 above the pads 32 is removed, and a portion of the photoresist layer 332 covering the front surface of the display panel 31 between the pads 32 is remained, so as to form the plurality of bumps 33, i.e., the structure shown in fig. 7.
In addition, the top surface of the bump 33 is protruded (i.e. higher) than the upper surface of the pad 32 adjacent to the bump, that is, the bump located on the peripheral side of the pad 32 and the pad 32 form a groove structure, and the upper surface of the pad 32 is a concave part of the groove structure, so that the conductive particles are gathered on the pad 32 during the subsequent pressing process of the FPC film, thereby effectively avoiding the generation of defects such as short circuit of the pad 32 caused by the gathering of the conductive particles, and further improving the electrical contact characteristics between the FPC film and the pad 32.
Preferably, the method further comprises:
as shown in fig. 8, based on the structure shown in fig. 7, the ACF film 35 is further prepared to cover the surfaces of the pad 32 and the bump 33, and the ACF film 35 has a thickness greater than the height of the top surface of the bump 33 protruding above (i.e., higher than) the upper surface of the pad 32, so that the ACF film 35 can fill the groove structure; meanwhile, the ACF film 35 includes a plurality of conductive particles 351 capable of freely moving in the ACF film 35, and at this time, as shown in fig. 8, the plurality of conductive particles 351 may be uniformly distributed in the ACF film 35.
Then, as shown in fig. 9, based on the structure shown in fig. 8, the FPC film 36 may be pressed on the upper surface of the ACF film 35 by a hot pressing process, that is, the upper surface of the FPC film 36 may be pressed by the hot pressing head 37 to cover the upper surface of the ACF film 35; since the conductive particles 351 of the ACF film 35 converge from above the bumps 33 to above the bonding pads 32 during the above-mentioned pressure-bonding process, the structure shown in fig. 10 is formed, i.e., the FPC film 36 can be electrically connected to the bonding pads 32 through the conductive particles 351 converging above the bonding pads 32, and the adjacent bonding pads 32 can be insulated from each other by the bumps 33.
In the method for manufacturing the FOG structure of the embodiment, referring to fig. 10, when the conductive particles 351 in the region 39 (i.e., the ACF film located above the bump 33) are subjected to the above-mentioned pressing process, the pressing force applied to the conductive particles 351 in the region 38 (i.e., the ACF film located above the pad 32) is greater than the pressing force applied to the conductive particles 351 in the region 38, so that the conductive particles 351 in the region 39 (i.e., the protrusions) are diffused to the depressions (i.e., the region 38), and more conductive particles 351 are gathered in the region 38, and the more conductive particles 351 are gathered, the stronger the electrical contact between the FPC film 36 and the pad 32 through the region 38 is, i.e., the electrical contact performance between the FPC film 36 and the pad 32 can be effectively enhanced; meanwhile, since the conductive particles 351 in the ACF film 35 at the protrusions are all spread, the conductive particles 351 in the region 39 of fig. 10 are sparsely distributed, that is, an insulating region (i.e., the region 39) is formed in the ACF film 35 above the bumps 33, so that the occurrence of defects such as short circuit between adjacent pads 32 caused by the convergence of the conductive particles 351 in the ACF film 35 can be effectively avoided.
Preferably, in order to improve the electrical contact performance between the FPC film 36 and the bonding pad 32 while ensuring effective insulation between the adjacent bonding pads 32, the upper surface of the protrusion 33 may be protruded (i.e., higher) than the upper surface of the bonding pad by 1500 to 2500nm, preferably 1500nm, 1800nm, 2200nm, or 2500 nm.
In summary, in the embodiments of the present invention, the insulating bump is disposed between the pads on the display panel, and the bump is higher than the upper surface of the pad, that is, the pad and the adjacent bump form a groove structure, and the upper surface of the pad is located in the bottom region of the groove; when the ACF film containing the conductive particles is covered on the groove structures, the conductive particles can move in the ACF film, so that in the process of pressing and covering the FPC film by a subsequent hot pressing process, the conductive particles distributed above the convex blocks are driven to be gathered towards the bottoms of the groove structures at two sides (namely above the welding pads), namely after the hot pressing process is carried out, the density of the conductive particles distributed in the ACF film above the convex blocks is far smaller than that of the conductive particles distributed in the ACF film above the welding pads, the contact performance between the welding pads and the FPC film is effectively improved while the defects of short circuit and the like of adjacent welding pads caused by gathering of the conductive particles are effectively avoided, and the conductivity between the FPC and the display panel is improved.
Various alterations and modifications will no doubt become apparent to those skilled in the art after having read the above description. Therefore, the appended claims should be construed to cover all such variations and modifications as fall within the true spirit and scope of the invention. Any and all equivalent ranges and contents within the scope of the claims should be considered to be within the intent and scope of the present invention.
Claims (10)
1. A display device, comprising:
the display panel is provided with a front surface, and a display area and a bonding area positioned outside the display area are arranged on the front surface of the display panel;
a plurality of bonding pads disposed in the bonding region on the front surface of the display panel;
the plurality of bumps are respectively arranged on the periphery of the welding pads so as to isolate the adjacent welding pads;
the anisotropic conductive film covers the surfaces of the bumps and the surfaces of the welding pads, and contains a plurality of conductive particles;
the flexible circuit board covers the surface of the anisotropic conductive film and is electrically connected with the welding pad through the conductive particles; and
the surface of the top of the lug is higher than the upper surface of the welding pad, the density of the conductive particles distributed above the lug is smaller than that of the conductive particles distributed above the welding pad, and the top of the lug is in an arc shape with a high center and two low sides.
2. The display device according to claim 1, wherein the bump is made of an insulating material.
3. The display device according to claim 2, wherein the bump is made of a photoresist.
4. The display device of claim 1, wherein the top surface of the bump is 1500-2500 nm higher than the upper surface of the pad.
5. The display device according to claim 1, wherein the display region in the display panel is provided with a light emitting device, and light emitted from the light emitting device is emitted from a front surface of the display panel.
6. The display device according to claim 5, wherein the display panel is an organic light emitting diode display panel.
7. A method of making an organic light emitting diode display panel, the method comprising:
providing an organic light-emitting diode display panel, wherein the surface of the organic light-emitting diode display panel is provided with a display area and a bonding area positioned on the outer side of the display area, and the surface positioned on the bonding area is provided with a plurality of welding pads;
coating a photoresist layer on the surface of the bonding region to cover the surface of the welding pad and the exposed surface of the display panel positioned in the bonding region; and
forming a plurality of bumps on the periphery of the welding pads by using an exposure and development process, wherein the adjacent welding pads are isolated by the bumps;
the top surface of the bump is higher than the upper surface of the welding pad adjacent to the bump, and the top of the bump is in an arc shape with a high center and two low sides.
8. The method of manufacturing an organic light emitting diode display panel according to claim 7, further comprising:
preparing an anisotropic conductive film to cover the surfaces of the welding pad and the bump, wherein the anisotropic conductive film comprises a plurality of conductive particles; and
and pressing a flexible circuit board on the surface of the anisotropic conductive film by using a hot pressing process so that the flexible circuit board is electrically connected with the welding pads through the conductive particles gathered above the welding pads, and the adjacent welding pads are mutually insulated through the bumps.
9. The method of claim 7 or 8, wherein the top surface of the bump is 1500-2500 nm higher than the top surface of the pad.
10. The method of producing an organic light-emitting diode display panel according to claim 7 or 8, wherein the organic light-emitting diode display panel has a front surface and a back surface opposite to the front surface, and the display region in the organic light-emitting diode display panel is provided with an organic light-emitting diode device; and
the organic light emitting diode device emits light from a front surface of the display panel.
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| CN201510528307.3A CN106486511B (en) | 2015-08-25 | 2015-08-25 | Display device and method for preparing organic light-emitting diode display panel |
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| CN107784952A (en) * | 2017-11-17 | 2018-03-09 | 京东方科技集团股份有限公司 | A kind of display panel and preparation method thereof, display device |
| CN112820843B (en) * | 2021-01-20 | 2022-08-16 | 合肥维信诺科技有限公司 | Flexible display panel and display device |
| WO2023210953A1 (en) * | 2022-04-27 | 2023-11-02 | 삼성전자주식회사 | Display module |
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| CN1505455A (en) * | 2002-12-05 | 2004-06-16 | �ձ������ȷ湫˾ | Interconnection structure of electric conductive wirings |
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| JP3826605B2 (en) * | 1999-03-08 | 2006-09-27 | セイコーエプソン株式会社 | Method for manufacturing semiconductor device mounting structure, liquid crystal device, and electronic apparatus |
| US7361027B2 (en) * | 2002-12-25 | 2008-04-22 | Semiconductor Energy Laboratory Co., Ltd. | Contact structure, display device and electronic device |
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