CN106486321B - Kick type temperature controller bimetal leaf - Google Patents

Kick type temperature controller bimetal leaf Download PDF

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Publication number
CN106486321B
CN106486321B CN201611262142.0A CN201611262142A CN106486321B CN 106486321 B CN106486321 B CN 106486321B CN 201611262142 A CN201611262142 A CN 201611262142A CN 106486321 B CN106486321 B CN 106486321B
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CN
China
Prior art keywords
sensitive piece
thermal sensitive
metal thermal
central part
bimetal leaf
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201611262142.0A
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Chinese (zh)
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CN106486321A (en
Inventor
黄浩
汪泽维
郭伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hefei Comfort Industry & Trade Co Ltd
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Hefei Comfort Industry & Trade Co Ltd
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Publication date
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Priority to CN201611262142.0A priority Critical patent/CN106486321B/en
Publication of CN106486321A publication Critical patent/CN106486321A/en
Application granted granted Critical
Publication of CN106486321B publication Critical patent/CN106486321B/en
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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00Thermally-actuated switches
    • H01H37/02Details
    • H01H37/32Thermally-sensitive members
    • H01H37/52Thermally-sensitive members actuated due to deflection of bimetallic element
    • H01H37/54Thermally-sensitive members actuated due to deflection of bimetallic element wherein the bimetallic element is inherently snap acting
    • H01H37/5427Thermally-sensitive members actuated due to deflection of bimetallic element wherein the bimetallic element is inherently snap acting encapsulated in sealed miniaturised housing

Abstract

The present invention provides a kind of Kick type temperature controller bimetal leafs, wherein, the bimetal leaf includes upper and lower two panels metal thermal sensitive piece, the upper metal thermal sensitive piece is rounded, the lower metal thermal sensitive piece has a central part, and the periphery of the central part is provided at least two symmetrically arranged abutting feet.The central part that bimetal leaf of the invention uses adds the structure of periphery abutting foot, upper layer metal thermal sensitive piece area of the invention and thickness are all larger than lower metal thermal sensitive piece, so that the thermal response time greatly shortens, and since the thermal deformation of upper layer metal thermal sensitive piece is larger, the action accuracy of entire bimetallic sheet structure ensure that.

Description

Kick type temperature controller bimetal leaf
Technical field
The present invention relates to a kind of temperature controller accessory, specifically a kind of Kick type temperature controller bimetal leaf.
Background technique
Currently, the capping that traditional bimetal leaf Kick type temperature controller is sealed by one encapsulates, main action component is One discoidal bimetallic thermal sensitive piece, the reversed kick of meeting, passes through the ceramic bar inside temperature controller after bimetallic thermal sensitive piece is heated Movable contact spring is pushed, to realize the on-off of moving contact and fixed contact.Since temperature controller is controlled by temperature sensing part, temperature sensing part It absorbs heat and needs certain heat transfer time, thus there are temperature-sensitive movement speeds for this traditional bimetal leaf Kick type temperature controller Slowly, the disadvantages of poor sensitivity, when cannot cut off in time circuit within the first time of overtemperature, but need to wait longer heat absorption Between, after allowing the heat of temperature-sensitive action component to reach the critical-temperature of setting, temperature controller could kick movement.
Summary of the invention
The object of the present invention is to provide a kind of Kick type temperature controller bimetal leafs, to solve existing bimetal leaf sensitivity Low problem.
The present invention is implemented as follows: a kind of Kick type temperature controller bimetal leaf, wherein the bimetal leaf include it is upper, Lower two panels metal thermal sensitive piece, the upper metal thermal sensitive piece is rounded, and the lower metal thermal sensitive piece has a central part, described The periphery of central part is provided at least two symmetrically arranged abutting feet.The quantity for abutting foot is at least three, the abutting foot It is evenly arranged on the central part periphery.The upper metal thermal sensitive piece with a thickness of 0.05-0.1 ㎜.The thickness of the lower metal thermal sensitive piece Degree is 0.05-0.08 ㎜.
The central part that bimetal leaf of the invention uses adds the structure of periphery abutting foot, and upper metal temperature-sensitive of the invention is unilateral Long-pending and thickness is all larger than lower metal thermal sensitive piece, so that the thermal response time greatly shortens, and due to the thermal deformation of upper metal thermal sensitive piece It is larger, it ensure that the action accuracy of entire bimetallic sheet structure.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with It obtains other drawings based on these drawings.
Fig. 1 is the structural schematic diagram of Kick type temperature controller.
Fig. 2 is the structural schematic diagram of lower metal thermal sensitive piece.
Fig. 3 is the structural schematic diagram of lower metal thermal sensitive piece.
In figure: 1-Kick type temperature controller, 2-bimetal leafs, 3-lower metal thermal sensitive pieces, central part-3.1 abut foot- 3.2。
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other Embodiment shall fall within the protection scope of the present invention.
As shown in Figure 1, bimetal leaf 2 of the present invention is set in Kick type temperature controller.
As shown in Fig. 2, lower layer's temperature sensing scissel 3 of the invention includes a central part 3.1, central part 3.1 can be circle Shape.The area of central part 3.1 is less than the area of upper metal thermal sensitive piece.It is symmetrical that the periphery of central part 3.1 is provided at least two The abutting foot 3.2 of setting.As shown in figure 3, the quantity for abutting foot in the present embodiment is 3, it is evenly arranged on the periphery of central part 3.1, Wherein, the quantity for abutting foot may also be configured to multiple, be evenly arranged on the periphery of central part.
Upper metal thermal sensitive piece with a thickness of 0.05-0.1 ㎜.
Lower metal thermal sensitive piece with a thickness of 0.05-0.08 ㎜.

Claims (2)

1. a kind of Kick type temperature controller bimetal leaf, characterized in that the bimetal leaf includes upper and lower two panels metal thermal sensitive piece, The upper metal thermal sensitive piece is rounded, and the lower metal thermal sensitive piece has a central part, in the periphery setting of the central part There are at least two symmetrically arranged abutting feet, the area and thickness of the upper metal thermal sensitive piece are all larger than the lower metal thermal sensitive piece Area and thickness, the upper metal thermal sensitive piece with a thickness of 0.05-0.1 ㎜, the lower metal thermal sensitive piece with a thickness of 0.05- 0.08㎜。
2. Kick type temperature controller bimetal leaf according to claim 1, characterized in that the quantity for abutting foot is at least three A, the abutting foot is evenly arranged on the central part periphery.
CN201611262142.0A 2016-12-30 2016-12-30 Kick type temperature controller bimetal leaf Active CN106486321B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201611262142.0A CN106486321B (en) 2016-12-30 2016-12-30 Kick type temperature controller bimetal leaf

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201611262142.0A CN106486321B (en) 2016-12-30 2016-12-30 Kick type temperature controller bimetal leaf

Publications (2)

Publication Number Publication Date
CN106486321A CN106486321A (en) 2017-03-08
CN106486321B true CN106486321B (en) 2019-03-05

Family

ID=58286087

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201611262142.0A Active CN106486321B (en) 2016-12-30 2016-12-30 Kick type temperature controller bimetal leaf

Country Status (1)

Country Link
CN (1) CN106486321B (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN86106649A (en) * 1986-10-09 1988-04-20 中山大学 Manual restore, single and rapid reaction, durable bimetallic element
CN2135193Y (en) * 1992-04-30 1993-06-02 王志安 Heat-sensitive bimetallic element
CN203398013U (en) * 2013-06-18 2014-01-15 苏州皇冠涂料科技发展有限公司 Bimetallic four-point-shaped sheet improving thermal response time of temperature control switch

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070188293A1 (en) * 2006-02-16 2007-08-16 Yu-Kang Yang Temperature switch

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN86106649A (en) * 1986-10-09 1988-04-20 中山大学 Manual restore, single and rapid reaction, durable bimetallic element
CN2135193Y (en) * 1992-04-30 1993-06-02 王志安 Heat-sensitive bimetallic element
CN203398013U (en) * 2013-06-18 2014-01-15 苏州皇冠涂料科技发展有限公司 Bimetallic four-point-shaped sheet improving thermal response time of temperature control switch

Also Published As

Publication number Publication date
CN106486321A (en) 2017-03-08

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PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of invention: Snap action thermostat bimetallic sheet

Effective date of registration: 20220531

Granted publication date: 20190305

Pledgee: Hefei SME financing Company limited by guarantee

Pledgor: HEFEI SHUSHI INDUSTRY AND TRADE Co.,Ltd.

Registration number: Y2022980006786

PE01 Entry into force of the registration of the contract for pledge of patent right
PC01 Cancellation of the registration of the contract for pledge of patent right

Date of cancellation: 20230816

Granted publication date: 20190305

Pledgee: Hefei SME financing Company limited by guarantee

Pledgor: HEFEI SHUSHI INDUSTRY AND TRADE Co.,Ltd.

Registration number: Y2022980006786

PC01 Cancellation of the registration of the contract for pledge of patent right