CN106480406A - Metallized film and preparation method thereof and capacitor - Google Patents
Metallized film and preparation method thereof and capacitor Download PDFInfo
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- CN106480406A CN106480406A CN201610903638.5A CN201610903638A CN106480406A CN 106480406 A CN106480406 A CN 106480406A CN 201610903638 A CN201610903638 A CN 201610903638A CN 106480406 A CN106480406 A CN 106480406A
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- 239000011104 metalized film Substances 0.000 title claims abstract description 53
- 239000003990 capacitor Substances 0.000 title claims abstract description 38
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 239000010408 film Substances 0.000 claims abstract description 114
- 239000000758 substrate Substances 0.000 claims abstract description 39
- 238000009832 plasma treatment Methods 0.000 claims abstract description 37
- 238000001465 metallisation Methods 0.000 claims abstract description 33
- 239000003921 oil Substances 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 17
- 239000007789 gas Substances 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000010409 thin film Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 9
- 238000001883 metal evaporation Methods 0.000 claims description 9
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 8
- 238000002347 injection Methods 0.000 claims description 7
- 239000007924 injection Substances 0.000 claims description 7
- 229920002545 silicone oil Polymers 0.000 claims description 7
- 230000008020 evaporation Effects 0.000 claims description 6
- 238000001704 evaporation Methods 0.000 claims description 6
- 238000005507 spraying Methods 0.000 claims description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 5
- 239000001301 oxygen Substances 0.000 claims description 5
- 229910052760 oxygen Inorganic materials 0.000 claims description 5
- 239000005662 Paraffin oil Substances 0.000 claims description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052786 argon Inorganic materials 0.000 claims description 4
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- 239000011701 zinc Substances 0.000 claims description 4
- WVRXNIBQZAKZTE-UHFFFAOYSA-N 1-methylidene-2h-naphthalene Chemical compound C1=CC=C2C(=C)CC=CC2=C1 WVRXNIBQZAKZTE-UHFFFAOYSA-N 0.000 claims description 3
- 229920002799 BoPET Polymers 0.000 claims description 3
- 239000005041 Mylar™ Substances 0.000 claims description 3
- 229920006269 PPS film Polymers 0.000 claims description 3
- 239000004743 Polypropylene Substances 0.000 claims description 3
- 239000010702 perfluoropolyether Substances 0.000 claims description 3
- 229920006389 polyphenyl polymer Polymers 0.000 claims description 3
- -1 polypropylene Polymers 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- 239000012467 final product Substances 0.000 claims description 2
- 239000012528 membrane Substances 0.000 claims description 2
- 229920006289 polycarbonate film Polymers 0.000 claims description 2
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims description 2
- 238000012545 processing Methods 0.000 claims description 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims 1
- 229910052731 fluorine Inorganic materials 0.000 claims 1
- 239000011737 fluorine Substances 0.000 claims 1
- 238000009736 wetting Methods 0.000 abstract description 6
- 239000007888 film coating Substances 0.000 abstract 1
- 238000009501 film coating Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 9
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 230000005611 electricity Effects 0.000 description 4
- 229910001297 Zn alloy Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- KRQUFUKTQHISJB-YYADALCUSA-N 2-[(E)-N-[2-(4-chlorophenoxy)propoxy]-C-propylcarbonimidoyl]-3-hydroxy-5-(thian-3-yl)cyclohex-2-en-1-one Chemical compound CCC\C(=N/OCC(C)OC1=CC=C(Cl)C=C1)C1=C(O)CC(CC1=O)C1CCCSC1 KRQUFUKTQHISJB-YYADALCUSA-N 0.000 description 1
- 241000416536 Euproctis pseudoconspersa Species 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 235000010446 mineral oil Nutrition 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000009504 vacuum film coating Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/20—Metallic material, boron or silicon on organic substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
- C23C14/5826—Treatment with charged particles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The present invention relates to a kind of metallized film and preparation method thereof and capacitor; described metallized film includes substrate film; in a side surface of described substrate film, there is metal deposition film portion and blank stays edge; described metal deposition film portion surface is coated with layer protecting film layer, and described protection film layer surface has the first plasma treatment layer；In the opposite side of described substrate film, there is the second plasma treatment layer.The surface in the metal deposition film portion of above-mentioned metallized film wetting tension after plasma treatment is less than 42mN/m, the surface of substrate film opposite side wetting tension after plasma treatment is more than 33mN/m, during capacitor is manufactured, film Coating combination is tightr, the air of residual is less, outside moisture invades and is more difficult to, thus improving the moisture resistance of capacitor and the noise reducing capacitor, provides technical support for producing high performance capacitor.
Description
Technical field
The present invention relates to metallic film capacitor field, more particularly to a kind of metallized film and preparation method thereof and
Comprise the capacitor of this metallized film.
Background technology
Developing rapidly with electronics industry, as a kind of important energy storage electronic devices and components, application is increasingly for capacitor
Extensively.Metallic film capacitor (i.e. the capacitor containing metallized film) is due to having excellent mechanicalness and electrical property
Can, such as flexible, dielectric loss is low, the change of high pressure resistant, dielectric constant with temperature and frequency is little etc., application is more and more extensive,
And progressively replace traditional capacitor.Metallic film capacitor needs it is often necessary to improve the moisture resistance of capacitor because characteristic
And reducing the noise of capacitor, and the metallized film as capacitor main material, to capacitor-side moisture resistance and make an uproar
Sound has significant impact.
Traditional metallized film manufacture method, just completes after being deposited with metal deposition film portion on substrate film, or
In spray last layer oil, part producing business in metal deposition film portion, it has been deposited with metal in above-mentioned metalized film, or spray last layer
After oil, lower powered plasma treatment can be applied to metal coating portion.But the roughness due to substrate film and capacitor add
The reason work technique, capacitor inner membrance Coating combination is not tight, inevitably residual air, thus causing capacitor using
During occur moisture invade lead to capacity fluctuation, and the problem that noise is excessive.
Content of the invention
Based on this, it is an object of the invention to provide a kind of metallized film with excellent humidity resistance.
Specific technical scheme is as follows：
A kind of metallized film, including substrate film, has metal deposition film portion in a side surface of described substrate film
Stay edge with blank, described metal deposition film portion surface is coated with layer protecting film layer, described protection film layer surface has first
Plasma treatment layer；In the opposite side of described substrate film, there is the second plasma treatment layer.
Wherein in some embodiments, the surface tension of described second plasma treatment layer is more than 33mN/m.
Wherein in some embodiments, the surface tension of described first plasma treatment layer is less than 42mN/m.
Wherein in some embodiments, it is 0-5.0mm that described blank stays the width of edge.
Wherein in some embodiments, described metal deposition film portion be on described substrate film by aluminum and zinc at least
The integrative-structure that a kind of metal is formed.
Wherein in some embodiments, described protection film layer is in silicone oil, fluorocarbon oil, paraffin oil and perfluoro polyether oil
Kind.
Wherein in some embodiments, described substrate film is polypropylene film, mylar, PPS films, poly-
Carbonic ester film, polyphenyl methylene naphthalene thin film or polyvinylidene difluoride membrane.
It is a further object of the present invention to provide a kind of capacitor.
Specific technical scheme is as follows：
A kind of capacitor, comprises above-mentioned metallized film.
It is a further object of the present invention to provide the preparation method of listing metallized film.
Specific technical scheme is as follows：
The preparation method of above-mentioned metallized film, comprises the steps：
By evaporation of metal device, the side evaporated metal of basad thin film forms metal deposition film portion；
Protection film layer is become in described metal evaporation film section overlying cap-shaped by fueling injection equipment；
Using plasma apparatus, plasma treatment is carried out to thin film obtained above, form the on described protection film layer surface
One plasma treatment layer, forms the second plasma treatment layer in the opposite side of described substrate film；
Obtain final product described metallic film.
Wherein in some embodiments, the technological parameter of described plasma treatment is：The gas being passed through be argon, nitrogen,
At least one in oxygen；The gas flow being passed through is 100sccm～1000sccm；The power of glow discharge be 500W～
10000W.
Wherein in some embodiments, the technological parameter of described plasma treatment is：The gas flow being passed through is 300sccm
～600sccm；The power of glow discharge is 2500W-6000W.
Wherein in some embodiments, the technological parameter of described fueling injection equipment is：Control the described protection film layer of spraying
Material temperature is at 80 DEG C～200 DEG C.
Wherein in some embodiments, the technological parameter of described fueling injection equipment is：Control the described protection film layer of spraying
Material temperature is at 110 DEG C～140 DEG C.
The surface in the metal deposition film portion of above-mentioned metallized film wetting tension after plasma treatment is less than 42mN/m,
The surface of substrate film opposite side wetting tension after the plasma treatment is more than 33mN/m so that during capacitor manufactures, film layer
Between combine tightr, the air of residual is less, and outside moisture invades and is more difficult to, thus improving the moisture resistance of capacitor and reducing electric capacity
The noise of device, provides technical support for producing high performance capacitor.
Brief description
Fig. 1 is the structural representation of metallized film of the present invention；
Fig. 2 is the manufacture method schematic flow sheet of the metallized film of an embodiment of the present invention；
(a is metal deposition film to the detects schematic diagram of the surface wettability tension force of metallized film that Fig. 3 manufactures for embodiment 1
Portion side, b is the opposite side of substrate film)；
(c is metal deposition film to the detects schematic diagram of the surface wettability tension force of metallized film that Fig. 4 manufactures for comparative example 1
Portion side, d is the opposite side of substrate film).
In figure parts numbers are described as follows：
000- metallized film, 001- substrate film, 002- metal deposition film portion, 003- the first plasma treatment layer,
004- blank stays edge, 005- the second plasma treatment layer；
The manufacture device of 100- metallized film, 110- unwinding device, 120- transfer roller, 130- transfer roller, 140- metal
Evaporative component, 160- oil spout assembly, 180- plasma treatment assembly, 200- wrap-up, 210- vacuum film coating chamber position adjustments
Device, 170- substrate film.
Specific embodiment
For the ease of understanding the present invention, below with reference to relevant drawings, the present invention is described more fully.In accompanying drawing
Give presently preferred embodiments of the present invention.But, the present invention can realize in many different forms however it is not limited to this paper institute
The embodiment of description.On the contrary, providing the purpose of these embodiments to be to make the understanding to the disclosure more thorough
Comprehensively.
It should be noted that when element is referred to as " being installed on " another element, it can be directly on another element
Or can also there is element placed in the middle.When an element is considered as " connection " another element, it can be direct connection
To another element or may be simultaneously present centering elements.When an element is considered as " connection " another element, it can
To be directly to another element or to may be simultaneously present centering elements.
Unless otherwise defined, all of technology used herein and scientific terminology and the technical field belonging to the present invention
The implication that technical staff is generally understood that is identical.The term being used in the description of the invention herein is intended merely to description tool
The purpose of the embodiment of body is it is not intended that in limiting the present invention.Term as used herein "and/or" includes one or more phases
The arbitrary and all of combination of the Listed Items closing.
As shown in figure 1, the metallized film 000 of an embodiment of the present invention is to set in a side surface of substrate film 001
Metal deposition film portion 002, blank is had to stay edge 004, described metal deposition film portion 002 surface is coated with layer protecting film layer (figure
Not shown in), described protection film layer surface has the first plasma treatment layer 003；Have in the opposite side of described substrate film
Second plasma treatment layer 005.
Substrate film 001 selects macromolecule polymer material to make, and is molded into film shape.Wherein, high molecular polymerization
Thing material selection such as polypropylene film, mylar or PPS films, polycarbonate film, polyphenyl methylene naphthalene thin film or poly-
Fluoride film etc. synthesizes macromolecular material.This kind of material has excellent physicochemical property, such as thermostability height, mechanical performance
By force, electrical characteristic is excellent etc..In other embodiments it is appreciated that substrate film 001 is not limited to above-mentioned material.
Metal deposition film portion 002 is located at a side surface or the both side surface of substrate film 001, can design metal as needed
Pattern, such as strip, latticed etc..Metal deposition film portion 002 selects the less metal or metal alloy of corona deterioration to make, such as
Aluminum, zinc or alumin(i)um zinc alloy etc..Alumin(i)um zinc alloy has excellent weatherability, can adapt to multiple environment, and range of application is wider.At present
For improving the weather resisteant of metalized film 000, generally apply last layer oil (protection film layer) on the surface in metal deposition film portion 002, but
More and more harsh moisture resistance still can not be met.
The part as blank not having evaporation metal evaporation film portion 002 on the surface of substrate film 001 stays edge 004.Empty
Stay edge 004 longitudinally disposed on substrate film 001 in vain, for longitudinally staying side.Blank stays edge 004 to be not limited to be located at substrate film
The both sides on 001 surface are it is also possible in the optional position at middle part, blank stays the quantity of edge 004 can be more than 1.
Metal deposition film portion 002 and blank stay the surface of edge 004 to scribble one layer of oil (protection film layer), oil and substrate film
001 after implementing plasma treatment, and surface wettability tension force changes.Scribble the table of metal evaporation thin film 002 side of oil
Face wetting tension is decreased to below 42mN/m, and the surface wettability tension force of substrate film opposite side increases to more than 32mN/m, relatively
Traditional metallized film, it is manufactured into the moisture resistance of capacitor and significantly improves, and noise substantially reduces.
The surface wettability tension force of metal deposition film portion 002 side of present embodiment between 38mN/m～40mN/m, base
The surface wettability tension force of bottom thin film opposite side is between 34mN/m～36mN/m.Further, in the present embodiment, metal evaporation
One layer of oil is scribbled on film portion 002 side and forms protection film layer, the oil of oil reservoir is silicone oil, fluorocarbon oil, paraffin oil (mineral oil) and perfluor
At least one in polyether oil.It is preferably silicone oil and fluorocarbon oil etc..The effect of oil reservoir is to reduce gold after follow-up plasma treatment
Belong to the surface wettability tension force of evaporation film 002.
This metallized film 000 can be widely used in capacitor area.By reducing the surface of metal deposition film portion side
Wetting tension, such as less than 42mN/m, and increase the surface wettability tension force of substrate film side, such as larger than 33mN/m, electricity can be made
The film layer of container combines tightr, thus reducing air residual and reducing extraneous air intrusion, thus improving the protection against the tide of capacitor
Property and reduce noise, the pressure of capacitor and stability can also be increased, provide technical support for producing high performance capacitor.
Further, present embodiment additionally provides a kind of manufacture method of metallized film, as shown in figure 3, this manufacturer
Method at least comprises the steps：
Step 300, by evaporation of metal assembly, basad thin film carries out metal evaporation process, the substrate film after process
Upper formation metal deposition film portion.
The metal of vapor deposition treatment is at least one in aluminum or zinc or allumen.
In present embodiment, from allumen.
Step 310, by fueling injection equipment, the metal deposition film portion after processing to metal evaporation, spraying last layer oil is formed
Protection film layer.Oil can be at least one in silicone oil, fluorocarbon oil, paraffin oil and perfluoro polyether oil.It is preferably silicone oil and fluorocarbon oil etc..
In the present embodiment, the Oil-temperature control during oiling is at 80 DEG C～200 DEG C, preferably 110 DEG C～140 DEG C.
Step S320, the metallized film after oiling, by plasma treatment appts, and in plasma treatment appts
It is passed through gas, gas can be argon, at least one of oxygen.It is preferably oxygen and argon.
In the present embodiment, the flow that gas is passed through is 100sccm～1000sccm, preferably 300sccm～
600sccm.
Step S330, the plasma apparatus of the metallized film after being connected with oiling and the gas being passed through carry out aura and put
Electricity, by the process to metallized film for the plasma, the surface wettability tension force in metal deposition film portion is decreased to below 42mN/m, base
The surface wettability tension force of bottom film side increases to more than 33mN/m.
In the present embodiment, the Power Control of glow discharge is in 500W～10000W, preferably 2500W-6000W.
Present embodiment, by 4 above-mentioned implementation steps, changes the surface wettability tension force of metallized film both sides, makes electricity
During vessel fabrication, the combination between film layer is even closer, and the air residual in capacitor element is less, outside another capacitor element
Air is more difficult to invade, and advantageously reduces the noise of capacitor, improves the moisture resistance of capacitor, reduces the fluctuation of condenser capacity.
Embodiment 1
Using the manufacture method of above-mentioned metallized film, after metal evaporation, first in the spraying of metal deposition film portion side
Silicone oil, then through plasma treatment, form the metallized film of moisture resistance and low noise.
Wherein, the relevant parameter control in plasma treatment process is as follows：
Being passed through gas is oxygen, and gas flow is 400sccm～600sccm, and glow discharge power is 4000w～6000w.
As shown in figure 3, through detection, the surface wettability tension force of the metal deposition film portion side of this metallized film is
39mN/m, the surface wettability tension force of substrate film opposite side is 35mN/m.
Comparative example 1
Using traditional metallized film manufacture method as described in the background section.
Wherein, the relevant parameter control in plasma treatment process is as follows：
Being passed through gas is nitrogen, and gas flow is 50sccm～100sccm, and glow discharge power is 100w～2000w.
As shown in figure 4, through detection, the surface wettability tension force of the metal deposition film portion side of this metallized film is
44mN/m, the surface wettability tension force of substrate film opposite side is 31mN/m.
Table 1 below is to be respectively adopted embodiment 1 and the metal deposition film portion of comparative example 1 and the surface wettability in substrate film portion
Tension force contrast test data：
Table 1
Table 2 below is that the metallized film manufacture method being respectively adopted embodiment 1 and comparative example 1 makes metallized film electricity
Container (runs the Capacitance Shift Rate of 500 hours, hereinafter referred to as " double 85 Δ C/ with regard to moisture resistance under Un*85 DEG C of * 85%RH
C ") and exchange status under noise (abbreviation level of noise) contrast test data：
Table 2
By contrast as can be seen that adopting the manufacture method of embodiment 1, first oil is coated in after metal evaporation is processed
Metal deposition film side, then pass through plasma treatment, carry out glow discharge process, the surface wettability of metal deposition film side
Tension force reduces, and the surface wettability tension force of substrate film side is increased, and is so conducive to improving the anti-of metallic film capacitor
Tide and the noise reducing capacitor, improve quality and the stability of capacitor product.
Each technical characteristic of embodiment described above can arbitrarily be combined, for making description succinct, not to above-mentioned reality
The all possible combination of each technical characteristic applied in example is all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all it is considered to be the scope of this specification record.
Embodiment described above only have expressed the several embodiments of the present invention, and its description is more concrete and detailed, but simultaneously
Can not therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
Say, without departing from the inventive concept of the premise, some deformation can also be made and improve, these broadly fall into the protection of the present invention
Scope.Therefore, the protection domain of patent of the present invention should be defined by claims.
Claims (13)
1. a kind of metallized film, it is characterised in that including substrate film, has metal in a side surface of described substrate film
Evaporation film portion and blank stay edge, and described metal deposition film portion surface is coated with layer protecting film layer, described protection film layer surface
There is the first plasma treatment layer；In the opposite side of described substrate film, there is the second plasma treatment layer.
2. metallized film according to claim 1 is it is characterised in that the surface tension of described second plasma treatment layer
More than 33mN/m.
3. metallized film according to claim 1 is it is characterised in that the surface tension of described first plasma treatment layer
Less than 42mN/m.
4. the metallized film according to any one of claim 1-3 is it is characterised in that described blank stays the width of edge to be
0-5.0mm.
5. the metallized film according to any one of claim 1-3 is it is characterised in that described metal deposition film portion is in institute
The integrative-structure being formed by least one metal in aluminum and zinc is stated on substrate film.
6. the metallized film according to any one of claim 1-3 is it is characterised in that described protection film layer is silicone oil, fluorine
One of oil, paraffin oil and perfluoro polyether oil.
7. the metallized film according to any one of claim 1-3 is it is characterised in that described substrate film is that polypropylene is thin
Film, mylar, PPS films, polycarbonate film, polyphenyl methylene naphthalene thin film or polyvinylidene difluoride membrane.
8. a kind of capacitor is it is characterised in that comprise the metallized film described in any one of claim 1-7.
9. the preparation method of the metallized film described in any one of claim 1-7 is it is characterised in that comprise the steps：
By evaporation of metal device, the side evaporated metal of basad thin film forms metal deposition film portion；
Protection film layer is become in described metal evaporation film section overlying cap-shaped by fueling injection equipment；
Using plasma apparatus, plasma treatment is carried out to thin film obtained above, form first etc. on described protection film layer surface
Ion processing layer, forms the second plasma treatment layer in the opposite side of described substrate film；
Obtain final product described metallized film.
10. the preparation method of metallized film according to claim 9 is it is characterised in that the work of described plasma treatment
Skill parameter is：The gas being passed through is argon, at least one in oxygen；The gas flow being passed through is 100sccm～1000sccm；
The power of glow discharge is 500W～10000W.
The preparation method of 11. metallized films according to claim 10 is it is characterised in that the work of described plasma treatment
Skill parameter is：The gas flow being passed through is 300sccm～600sccm；The power of glow discharge is 2500W-6000W.
The preparation method of 12. metallized films according to claim 9 is it is characterised in that the technique of described fueling injection equipment
Parameter is：The material temperature of described protection film layer controlling spraying is at 80 DEG C～200 DEG C.
The preparation method of 13. metallized films according to claim 12 is it is characterised in that the technique of described fueling injection equipment
Parameter is：The material temperature of described protection film layer controlling spraying is at 110 DEG C～140 DEG C.
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| CN107301917A (en) * | 2017-08-03 | 2017-10-27 | 安徽省宁国市海伟电子有限公司 | A kind of low-loss metal film |
| WO2019206058A1 (en) * | 2018-04-27 | 2019-10-31 | 东丽先端材料研究开发（中国）有限公司 | Metalized film |
| CN112323021A (en) * | 2019-08-05 | 2021-02-05 | 河南华佳新材料技术有限公司 | Production process for reducing capacity loss of metalized film capacitor after charging and discharging |
| CN113470974A (en) * | 2021-06-09 | 2021-10-01 | 东丽薄膜加工（中山）有限公司 | Film, preparation method thereof and capacitor |
| WO2022100377A1 (en) * | 2020-11-13 | 2022-05-19 | 厦门法拉电子股份有限公司 | Thin-film capacitor core |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107301917A (en) * | 2017-08-03 | 2017-10-27 | 安徽省宁国市海伟电子有限公司 | A kind of low-loss metal film |
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| CN112323021A (en) * | 2019-08-05 | 2021-02-05 | 河南华佳新材料技术有限公司 | Production process for reducing capacity loss of metalized film capacitor after charging and discharging |
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| CN113470974A (en) * | 2021-06-09 | 2021-10-01 | 东丽薄膜加工（中山）有限公司 | Film, preparation method thereof and capacitor |
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| CN106480406B (en) | 2018-11-13 |
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