CN106475862A - A kind of bamboo chip sanding apparatus - Google Patents

A kind of bamboo chip sanding apparatus Download PDF

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Publication number
CN106475862A
CN106475862A CN201611161911.8A CN201611161911A CN106475862A CN 106475862 A CN106475862 A CN 106475862A CN 201611161911 A CN201611161911 A CN 201611161911A CN 106475862 A CN106475862 A CN 106475862A
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CN
China
Prior art keywords
grinding roller
bamboo chip
roller
bamboo
sanding apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201611161911.8A
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Chinese (zh)
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CN106475862B (en
Inventor
郭源水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Si Qing Bilige
Original Assignee
FUZHOU JISHENG BAMBOO INDUSTRY Co Ltd
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Application filed by FUZHOU JISHENG BAMBOO INDUSTRY Co Ltd filed Critical FUZHOU JISHENG BAMBOO INDUSTRY Co Ltd
Priority to CN201611161911.8A priority Critical patent/CN106475862B/en
Publication of CN106475862A publication Critical patent/CN106475862A/en
Application granted granted Critical
Publication of CN106475862B publication Critical patent/CN106475862B/en
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/06Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving conveyor belts, a sequence of travelling work-tables or the like
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00Other grinding machines or devices
    • B24B27/0023Other grinding machines or devices grinding machines with a plurality of working posts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00Other grinding machines or devices
    • B24B27/0069Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00Other grinding machines or devices
    • B24B27/0076Other grinding machines or devices grinding machines comprising two or more grinding tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • B24B41/005Feeding or manipulating devices specially adapted to grinding machines
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00Component parts such as frames, beds, carriages, headstocks
    • B24B41/007Weight compensation; Temperature compensation; Vibration damping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00Drives or gearings; Equipment therefor
    • B24B47/22Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10Single-purpose machines or devices
    • B24B7/16Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/28Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding wood

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Debarking, Splitting, And Disintegration Of Timber (AREA)
  • Chemical And Physical Treatments For Wood And The Like (AREA)

Abstract

The present invention relates to a kind of bamboo chip sanding apparatus, close mill apparatus including the monolithic sanding apparatus setting gradually and biplate;Described monolithic sanding apparatus include the upper and lower end face automatically grinding mechanism setting gradually and left and right end face automatically grinding mechanism;Described upper and lower end face automatically grinding mechanism includes being horizontally disposed with and grinding roller and first time grinding roller on corresponding first up and down;Described left and right end face automatically grinding mechanism includes being vertically arranged and the corresponding first left grinding roller in left and right and the first right grinding roller;Described biplate closes mill apparatus and includes being vertically arranged and the dynamic grinding roller of mutually corresponding second left grinding roller, the second right grinding roller and first;First dynamic grinding roller is horizontally slipped between the second left grinding roller and the second right grinding roller by one first slide rail.

Description

A kind of bamboo chip sanding apparatus
Technical field
The present invention relates to a kind of bamboo chip sanding apparatus, belong to bamboo processing field.
Background technology
The bamboo four seasons are green for a long time, of many uses.In garden, it is the indispensable plant interspersing artificial hillock waterside pavilion.Guilin drenches The other wide plant Folium Bambusae multipliciss in river, become one unique scenery.Anji big bamboo sea, Shu Nanzhuhai and south jiangxi bamboo sea are the famous bamboos of China Seascape is seen;Because bamboo growth is fast, considered for environmental protection in recent years, and had a large amount of furniture and paper to use bamboo manufacture instead.Bamboo also can be made Make artware, musical instrument etc.;By bamboo wood engineering method, the bamboo fibre made through physics and chemical action, it is used as textile, Make towel and medicated clothing etc..Bamboo makes plank light weight, and insect protected is mothproof, is good finishing material, and bamboo is processed into plank Firstly the need of polishing, existing technology is usually bamboo chip is polished into elongated rectangular shape to be adhered by into plank, but bamboo from bottom to Top end diameter is gradually lowered, and thickness is also gradually thinning, and bamboo chip is processed into elongated rectangular shape, certainly will waste bamboo material how, Bamboo utilization rate is low.
Content of the invention
In order to solve above-mentioned technical problem, the present invention provides a kind of bamboo chip sanding apparatus.This bamboo chip sanding apparatus can be The waste rate of the minimizing bamboo material of littleization, significantly improves the utilization rate of bamboo, cost-effective.
Technical scheme is as follows:
A kind of bamboo chip sanding apparatus, close mill apparatus including the monolithic sanding apparatus setting gradually and biplate;Described monolithic polishing dress Put including the upper and lower end face automatically grinding mechanism setting gradually and left and right end face automatically grinding mechanism;Described upper and lower end face is beaten automatically Grinding machine structure includes being horizontally disposed with and grinding roller and first time grinding roller on corresponding first up and down;Described left and right end face automatically grinding mechanism Including being vertically arranged and the corresponding first left grinding roller in left and right and the first right grinding roller;Described biplate close mill apparatus include being vertically arranged and Mutually corresponding second left grinding roller, the second right grinding roller and first move grinding roller;It is left second that first dynamic grinding roller passes through one first slide rail Horizontally slip between grinding roller and the second right grinding roller.
Wherein, described upper and lower end face automatically grinding mechanism also includes the first controller and is horizontally disposed with and up and down corresponding two Individual first piezoelectricity roller;Two the first piezoelectricity rollers are arranged on the bamboo chip direction of feed side of grinding roller and first time grinding roller on first;Institute State the thickness between the first piezoelectricity roller sensing bamboo chip upper and lower end face and adjusted under grinding roller and first on first by the first controller The spacing of grinding roller;Described left and right end face automatically grinding mechanism also includes second controller and is vertically arranged and corresponding two of left and right Second piezoelectricity roller;Two the second piezoelectricity rollers are arranged on the bamboo chip direction of feed side of the first left grinding roller and the first right grinding roller;Described Second piezoelectricity roller senses about bamboo chip the width between end face and by second controller regulation the first left grinding roller and the first right mill The spacing of roller.
Wherein, the first piezoelectricity roller is identical with the structure of the second piezoelectricity roller, and the first piezoelectricity roller includes roll body and the setting of elasticity Piezoelectric ceramics in roll body annular or tubular;Piezoelectric ceramics is subject to roll body pressure to produce electric current.
Wherein, biplate closes mill apparatus and bamboo chip feeding side is provided with first point moving left and right with the first dynamic grinding roller linkage Guide card;The left and right sides that direction is the first dynamic grinding roller is led in dividing of first point of guide card.
Wherein, described biplate conjunction mill apparatus also include two piece of first bamboo chip limiting plate that left and right be arranged in parallel;Two piece first The spacing of bamboo chip limiting plate is more than the spacing between the second left grinding roller and the second right grinding roller.
Wherein, four conjunction mill apparatus are also included;Described four are closed mill apparatus and include being horizontally disposed with and mutually corresponding second Upper grinding roller, second time grinding roller and second move grinding roller;Second dynamic grinding roller passes through one second slide rail grinding roller and second time mill on second Slide up and down between roller.
Wherein, four conjunction mill apparatus are fed side in bamboo chip and are provided with second point being moved up and down with the second dynamic grinding roller linkage Guide card;The both sides up and down that direction is the second dynamic grinding roller are led in dividing of second point of guide card;Described four are closed mill apparatus and also include putting down up and down Two piece of second bamboo chip limiting plate of row setting;The spacing of two piece of second bamboo chip limiting plate is more than grinding roller and second time grinding roller on second Between spacing.
Wherein, the described second dynamic grinding roller is by a variable-damp vibration damper support;It is provided with pressure sensitive on second point of guide card Device;Pressure inductor is connected with one the 3rd controller signal of telecommunication;3rd controller controls variable-damp vibration damper damping size.
Wherein, the spacing between grinding roller and first time grinding roller is adjusted by the first step motor drive on described first;First Controller controls the first motor start and stop;Spacing between described first left grinding roller and the first right grinding roller is by the second motor Drive and adjust;Second controller controls the second motor start and stop;Described monolithic sanding apparatus, biplate close mill apparatus and four The end closing mill apparatus is respectively arranged with the first bearing material groove, the second bearing material groove and the 3rd bearing material groove.
A kind of bamboo chip group technology, using described bamboo chip sanding apparatus, concrete technology step is as follows:
1. by cutting, bamboo chip into strips passes through monolithic sanding apparatus along the finishing of bamboo chip original-shape.
2. about two bamboo chips after 1. polishing through step side by side, the wherein narrow portion of a bamboo chip and another bamboo chip Wide portion corresponds to;Two bamboo chips are inserted biplate together and closes mill apparatus;Two bamboo chips are made to be individually directed first by first point of guide card The dynamic grinding roller left and right sides.
3. select after 2. polishing through step two bamboo chips matching and be one group, two groups of bamboo chips are side by side up and down, by two groups Bamboo chip inserts four conjunction mill apparatus together;Two groups of bamboo chips are made to be individually directed the second dynamic upper and lower both sides of grinding roller by second point of guide card.
The present invention has the advantages that:
The waste rate of the minimizing bamboo material that the 1st, a kind of bamboo chip of present invention sanding apparatus can minimize, significantly improves the utilization of bamboo Rate, cost-effective.
2nd, a kind of monolithic sanding apparatus of bamboo chip of present invention sanding apparatus can be real along the thickness of bamboo chip and change width Now polish, reduce the waste rate of bamboo.
3rd, two panels bamboo chip can be processed into level and cut by a kind of biplate conjunction mill apparatus of bamboo chip of present invention sanding apparatus setting Face is the bamboo chip split body of rectangle.
4th, four bamboo chips can be processed strip square by a kind of four conjunction mill apparatus of bamboo chip of present invention sanding apparatus setting The bamboo chip split body of shape.
5th, a kind of the first piezoelectricity roller of bamboo chip of present invention sanding apparatus setting and the second piezoelectricity roller can realize monolithic bamboo chip The automatization of polishing is adjusted.
6th, a kind of variable-damp vibration damper of bamboo chip of present invention sanding apparatus setting can be closed at four with balancing gravity factor Adverse effect in mill apparatus.
7th, a kind of first point of guide card of bamboo chip of present invention sanding apparatus and second point of guide card can ensure the feeding of bamboo chip.
8th, a kind of the first bamboo chip limiting plate of bamboo chip of present invention sanding apparatus and the second bamboo chip limiting plate can be spelled for bamboo chip Close deckle shape.
Brief description
Fig. 1 is a kind of overall structure schematic top plan view of present invention bamboo chip sanding apparatus;
Fig. 2 is the signal of grinding roller, first time grinding roller and the first motor on the first of the present invention a kind of bamboo chip sanding apparatus Figure;
Fig. 3 is a kind of local main view cross-sectional schematic of the biplate conjunction mill apparatus of present invention bamboo chip sanding apparatus;
Fig. 4 is that a kind of biplate of present invention bamboo chip sanding apparatus closes the schematic diagram that mill apparatus process two panels bamboo chip;
Fig. 5 is a kind of schematic side view of the biplate conjunction mill apparatus of present invention bamboo chip sanding apparatus;
Fig. 6 is a kind of local schematic front view of four conjunction mill apparatus of present invention bamboo chip sanding apparatus;
Fig. 7 is a kind of schematic diagram of two groups of bamboo chips of processing of four conjunction mill apparatus of present invention bamboo chip sanding apparatus;
Fig. 8 is a kind of schematic side view of four conjunction mill apparatus of present invention bamboo chip sanding apparatus;
Fig. 9 is a kind of structural representation of the first piezoelectricity roller of present invention bamboo chip sanding apparatus.
In figure reference is expressed as:
1- monolithic sanding apparatus, 11- upper and lower end face automatically grinding mechanism, 111- first controller, 112- the first piezoelectricity roller, 113- Grinding roller on first, first time grinding roller of 114-, 115- first motor, 116- roll body, 117- piezoelectric ceramics, 12- about end face Automatically grinding mechanism, 121- second controller, 122- the second piezoelectricity roller, the left grinding roller of 123- first, the right grinding roller of 124- first, 125- Second motor, 13- the first bearing material groove, 2- biplate close mill apparatus, the left grinding roller of 21- second, the right grinding roller of 22- second, 23- first Slide rail, 24- first moves grinding roller, first point of guide card of 25-, 26- the first bamboo chip limiting plate, 27- the second bearing material groove, tetra- conjunction mill dresses of 3- Put, grinding roller, second time grinding roller of 32-, 33- second slide rail, 34- second move grinding roller, 35- on 30- the 3rd bearing material groove, 31- second Two points of guide cards, 36- variable-damp vibration damper, 37- pressure inductor, 38- the 3rd controller, 39- the second bamboo chip limiting plates.
Specific embodiment
It is next with specific embodiment below in conjunction with the accompanying drawings that the present invention will be described in detail.
As shown in figure 1, a kind of bamboo chip sanding apparatus, including monolithic sanding apparatus 1;Described monolithic sanding apparatus 1 include according to The upper and lower end face automatically grinding mechanism 11 of secondary setting and left and right end face automatically grinding mechanism 12;Upper and lower end face automatically grinding mechanism 11 For the upper and lower end face of bamboo chip of polishing, left and right end face automatically grinding mechanism 12 is used for the left and right end face of bamboo chip of polishing.
As shown in Figure 1, 2, described upper and lower end face automatically grinding mechanism 11 include the first controller 111, level between the upper and lower away from Two the first piezoelectricity rollers 112 of setting and level is setting up and down and mutual spacing adjustable first under grinding roller 113 and first Grinding roller 114;On first, grinding roller 113 is relative with first time grinding roller 114 position, and structure is identical, and rotation direction is contrary, and outer circumference surface is arranged Row are provided with blade, cutter tooth or mill layer;Described first piezoelectricity roller 112 senses the thickness between bamboo chip upper and lower end face and passes through first Controller 111 adjusts the spacing of grinding roller 113 and first time grinding roller 114 on first;Grinding roller 113 and first time grinding roller on described first Spacing between 114 drives regulation by the first motor 115;On first, grinding roller 113 and first time grinding roller 114 are respectively by independence The first motor 115 drive and adjust, two the first motor 115 models are identical, and running parameter is identical, connects electric both positive and negative polarity On the contrary;Described first piezoelectricity roller 112 is electrically connected with the first controller 111;The curent change of the first piezoelectricity roller 112 conducts to first Controller 111, after Electric signal processing, the first controller 111 controls the first motor 115 start and stop with this.
As shown in Figure 1, 2, described left and right end face automatically grinding mechanism 12 include second controller 121, vertically between left and right away from Two the second piezoelectricity rollers 122 of setting and the setting of vertical left and right and the adjustable first left grinding roller 123 of mutual spacing and first right side Grinding roller 124;First left grinding roller 123 is relative with the first right grinding roller 124 position, and structure is identical, and rotation direction is contrary, and outer circumference surface is arranged Row are provided with blade, cutter tooth or mill layer;Described second piezoelectricity roller 122 senses about bamboo chip the width between end face and by second Controller 121 adjusts the spacing of the first left grinding roller 123 and the first right grinding roller 124;Described first left grinding roller 123 and the first right grinding roller Spacing between 124 drives regulation by the second motor 125;First left grinding roller 123 and the first right grinding roller 124 are respectively by independence The second motor 125 drive and adjust, two the second motor 125 models are identical, and running parameter is identical, connects electric both positive and negative polarity On the contrary;Described second piezoelectricity roller 122 is electrically connected with second controller 121;The curent change of the second piezoelectricity roller 122 conducts to second Controller 121, after Electric signal processing, second controller 121 controls the second motor 125 start and stop with this.
As shown in figure 9, the first piezoelectricity roller 112 is identical with the structure of the second piezoelectricity roller 122, the first piezoelectricity roller 112 includes bullet Property roll body 116 and the piezoelectric ceramics 117 being arranged on roll body 116 annular or tubular;Piezoelectric ceramics 117 is subject to roll body 116 pressure Produce electric current.
Further, as shown in Fig. 1, Fig. 3 to Fig. 5, described bamboo chip sanding apparatus also include biplate and close mill apparatus 2;Described Biplate closes the second left grinding roller 21, the second right grinding roller 22 and the first dynamic grinding roller 24 that mill apparatus 2 include vertically and are parallel to each other;First Dynamic grinding roller 24 is horizontally slipped between the second left grinding roller 21 and the second right grinding roller 24 by one first slide rail 23;First slide rail 23 Quantity is two, is symmetricly set on the second left grinding roller 21 and the second right grinding roller about 22, the two ends of the first slide rail 23 rotate respectively It is set in the rotating shaft two ends of the second left grinding roller 21 and the second right grinding roller 22, do not affect axis of rotation and bamboo chip feeds;First Dynamic grinding roller 24 is slidably located between two first slide rails 23, and it is set side by side with the second left grinding roller 21 and the second right grinding roller 22 about Put.
Further, biplate conjunction mill apparatus 2 are provided with bamboo chip feeding side and are moved left and right with the first dynamic grinding roller 24 linkage First point of guide card 25;The left and right sides that direction is the first dynamic grinding roller 24 is led in dividing of first point of guide card 25, along bamboo chip direction of feed, The width of first point of guide card 25 is gradually increased, and realizes dividing and leads effect.
Further, described biplate conjunction mill apparatus 2 also include two piece of first bamboo chip limiting plate 26 that left and right be arranged in parallel;Two Block the first bamboo chip limiting plate 26 is correspondingly arranged with the second left grinding roller 21 and the second right grinding roller 22 respectively, two piece of first bamboo chip limiting plate 26 spacing is more than the spacing between the second left grinding roller 21 and the second right grinding roller 22;First bamboo chip limiting plate 26 is used for limiting two panels Bamboo chip to the left and right both sides away from ensureing that about two panels bamboo chip, the structure against composition is rectangle in the horizontal plane, and ensure first Dynamic grinding roller 24 is subject to the extruding force of two panels bamboo chip.
Further, as shown in Fig. 1, Fig. 6 to Fig. 8, described bamboo chip sanding apparatus also include four conjunction mill apparatus 3;Described Four close mill apparatus 3 include level and be parallel to each other second on grinding roller 31, second time grinding roller 32 and second move grinding roller 34;Second Dynamic grinding roller 34 is slided up and down between grinding roller 31 and second time grinding roller 32 on second by one second slide rail 33;Second slide rail 33 Quantity is two, is symmetricly set on grinding roller 31 and second time grinding roller 32 about on second, the two ends of the second slide rail 33 rotate respectively It is set in the rotating shaft two ends of grinding roller 31 and second time grinding roller 32 on second, do not affect axis of rotation and bamboo chip feeds;Second Dynamic grinding roller 34 is slidably located between two second slide rails 33, its with second on grinding roller 31 and second time grinding roller 32 is side by side up and down sets Put.
Further, four conjunction mill apparatus 3 are provided with bamboo chip feeding side and are moved up and down with the second dynamic grinding roller 34 linkage Second point of guide card 35;The both sides up and down that direction is the second dynamic grinding roller 34 are led in dividing of second point of guide card 35;Along bamboo chip direction of feed, The width up and down of second point of guide card 35 is gradually increased, and realizes dividing and leads effect.
Further, described four are closed two piece of second bamboo chip limiting plate 39 that mill apparatus 3 also include be arrangeding in parallel up and down;Two Block the second bamboo chip limiting plate 39 respectively with second on grinding roller 31 and second time grinding roller 32 be correspondingly arranged, two piece of second bamboo chip limiting plate 39 spacing is more than the spacing on second between grinding roller 31 and second time grinding roller 32;Second bamboo chip limiting plate 39 is used for limiting two Piece bamboo chip and lower two panels bamboo chip to upper and lower both sides away from.
Further, the second dynamic grinding roller 34 is by a variable-damp vibration damper 36 support;It is provided with pressure on second point of guide card 35 Power induction apparatuss 37;Pressure inductor 37 is connected with the 3rd controller 38 signal of telecommunication;3rd controller 38 controls adaptive damping to subtract Shake device 36 damps size and ensures that the supporting force of variable-damp vibration damper 36 is equal to the gravity of the second dynamic grinding roller 34 and bamboo chip thereon Sum.
Further, as shown in figure 1, described monolithic sanding apparatus 1, biplate conjunction mill apparatus 2 and four close mill apparatus 3 End is respectively arranged with the first bearing material groove 13, the second bearing material groove 27 and the 3rd bearing material groove 30.
A kind of bamboo chip group technology, using above-mentioned bamboo chip sanding apparatus, concrete technology step is as follows:
1. by cutting, bamboo chip into strips is repaired by monolithic sanding apparatus 1, wherein, during bamboo chip feeding, the first piezoelectricity Roller 112 is subject to bamboo chip thickness change crimp to produce curent change, and the first controller 111 receives and passes through after processing current signal First motor 115 adjusts the spacing on first between grinding roller 113 and first time grinding roller 114;Second piezoelectricity roller 122 is subject to bamboo chip Change width crimp produces curent change, and second controller 121 receives and passes through the second stepping electricity after processing current signal Machine 125 adjusts the spacing between the first left grinding roller 123 and the first right grinding roller 124;Make grinding roller 113 on first, first time grinding roller 114th, the first left grinding roller 123 and the first right grinding roller 124 are polished along bamboo chip original-shape.
2. about two bamboo chips after 1. polishing through step side by side, the wherein narrow portion of a bamboo chip and another bamboo chip Wide portion corresponds to;Two bamboo chips are inserted biplate together and closes mill apparatus 2;Make two bamboo chips pass through first point of guide card 25 and be individually directed the One dynamic grinding roller 24 left and right sides, polishes through the second left grinding roller 21, the second right grinding roller 22 and the first dynamic grinding roller 24;Wherein, first move Grinding roller 24 moves left and right with the change of shape of opposite side about two bamboo chips, ensures that two bamboo chips have and cooperates Left and right end face.
3. two bamboo chips matching after 2. polishing through step are one group, and two groups of bamboo chips are side by side up and down, by two groups of bamboo chips Four conjunction mill apparatus 3 of insertion together;About 34 both sides to make two groups of bamboo chips be individually directed the second dynamic grinding roller by second point of guide card 35, Polish through grinding roller 31, second time grinding roller 32 and the second dynamic grinding roller 34 on second;Wherein variable-damp vibration damper 36 compensates second and moves The weight of the deadweight of grinding roller 34 and above one group of bamboo chip;Second dynamic grinding roller 34 becomes with the shape of the upper and lower opposite side of two groups of bamboo chips Change and move up and down, make two groups of bamboo chips have the upper and lower end face cooperating.
The foregoing is only embodiments of the invention, not thereby limit the present invention the scope of the claims, every using this Equivalent structure or equivalent flow conversion that bright description and accompanying drawing content are made, or directly or indirectly it is used in other related skills Art field, is included within the scope of the present invention.

Claims (10)

1. a kind of bamboo chip sanding apparatus it is characterised in that:Close mill apparatus including the monolithic sanding apparatus (1) setting gradually and biplate (2);Described monolithic sanding apparatus (1) include the upper and lower end face automatically grinding mechanism (11) setting gradually and left and right end face is beaten automatically Grinding machine structure (12);Described upper and lower end face automatically grinding mechanism (11) includes being horizontally disposed with and grinding roller on corresponding first up and down (113) and the first time grinding roller (114);Described left and right end face automatically grinding mechanism (12) includes being vertically arranged and left and right corresponding the One left grinding roller (123) and the first right grinding roller (124);Described biplate closes mill apparatus (2) and includes being vertically arranged and mutually corresponding the Two left grinding rollers (21), the second right grinding roller (22) and first move grinding roller (24);First dynamic grinding roller (24) passes through one first slide rail (23) Horizontally slip between the second left grinding roller (21) and the second right grinding roller (24).
2. as claimed in claim 1 a kind of bamboo chip sanding apparatus it is characterised in that:Described upper and lower end face automatically grinding mechanism (11) also include the first controller (111) and be horizontally disposed with and corresponding two the first piezoelectricity rollers (112) up and down;Two first pressures Electric roller (112) is arranged on the bamboo chip direction of feed side of grinding roller on first (113) and first time grinding roller (114);Described first pressure Electric roller (112) sense the thickness between bamboo chip upper and lower end face and pass through in the first controller (111) regulation first grinding roller (113) and The spacing of first time grinding roller (114);Described left and right end face automatically grinding mechanism (12) also includes second controller (121) and vertically Setting and corresponding two the second piezoelectricity rollers (122) in left and right;Two the second piezoelectricity rollers (122) are arranged on the first left grinding roller (123) Bamboo chip direction of feed side with the first right grinding roller (124);About described second piezoelectricity roller (122) sensing bamboo chip between end face Width the spacing by second controller (121) regulation the first left grinding roller (123) and the first right grinding roller (124).
3. as claimed in claim 2 a kind of bamboo chip sanding apparatus it is characterised in that:First piezoelectricity roller (112) and the second piezoelectricity The structure of roller (122) is identical, first piezoelectricity roller (112) include elasticity roll body (116) and be arranged on roll body (116) annular or The piezoelectric ceramics (117) of tubular;Piezoelectric ceramics (117) is subject to roll body (116) pressure to produce electric current.
4. as claimed in claim 1 a kind of bamboo chip sanding apparatus it is characterised in that:Biplate closes mill apparatus (2) and feeds in bamboo chip Side is provided with the first point of guide card (25) moving left and right with the first dynamic grinding roller (24) linkage;Point side of leading of first point of guide card (25) To the left and right sides for the first dynamic grinding roller (24).
5. as claimed in claim 4 a kind of bamboo chip sanding apparatus it is characterised in that:Described biplate closes mill apparatus (2) and also includes Two piece of first bamboo chip limiting plate (26) that left and right be arranged in parallel;The spacing of two piece of first bamboo chip limiting plate (26) is more than the second left mill Spacing between roller (21) and the second right grinding roller (22).
6. as claimed in claim 1 a kind of bamboo chip sanding apparatus it is characterised in that:Also include four and close mill apparatus (3);Described Four close mill apparatus (3) include be horizontally disposed with and mutually corresponding second on grinding roller (31), second time grinding roller (32) and second move Grinding roller (34);Second dynamic grinding roller (34) passes through one second slide rail (33) on second between grinding roller (31) and second time grinding roller (32) Slide up and down.
7. as claimed in claim 6 a kind of bamboo chip sanding apparatus it is characterised in that:Four are closed mill apparatus (3) and feed in bamboo chip Side is provided with the second point of guide card (35) moving up and down with the second dynamic grinding roller (34) linkage;Point side of leading of second point of guide card (35) To the both sides up and down for the second dynamic grinding roller (34);Described four are closed two piece second that mill apparatus (3) also include be arrangeding in parallel up and down Bamboo chip limiting plate (39);The spacing of two piece of second bamboo chip limiting plate (39) is more than grinding roller (31) and second time grinding roller (32) on second Between spacing.
8. as claimed in claim 7 a kind of bamboo chip sanding apparatus it is characterised in that:Described second dynamic grinding roller (34) is variable by one Damping shock absorber (36) support;It is provided with pressure inductor (37) on second point of guide card (35);Pressure inductor (37) and one the Three controllers (38) signal of telecommunication connects;3rd controller (38) controls variable-damp vibration damper (36) damping size.
9. a kind of bamboo chip sanding apparatus as described in any claim in claim 2 to 8 it is characterised in that:Described first Spacing between upper grinding roller (113) and first time grinding roller (114) is driven by the first motor (115) and adjusts;First controller (111) the first motor (115) start and stop are controlled;Spacing between described first left grinding roller (123) and the first right grinding roller (124) Driven by the second motor (125) and adjust;Second controller (121) controls the second motor (125) start and stop;Described monolithic Sanding apparatus (1), biplate close mill apparatus (2) and four close mill apparatus (3) end be respectively arranged with the first bearing material groove (13), Second bearing material groove (27) and the 3rd bearing material groove (30).
10. a kind of bamboo chip group technology it is characterised in that:Using bamboo chip sanding apparatus as claimed in claim 9, concrete technology Step is as follows:
1. by cutting, bamboo chip into strips passes through monolithic sanding apparatus (1) along the finishing of bamboo chip original-shape;
2. about two bamboo chips after 1. polishing through step side by side, the wide portion of the wherein narrow portion of a bamboo chip and another bamboo chip Corresponding;Two bamboo chips are inserted biplate together and closes mill apparatus (2);Make two bamboo chips pass through first point of guide card (25) and be individually directed the One dynamic grinding roller (24) left and right sides;
3. select after 2. polishing through step two bamboo chips matching and be one group, two groups of bamboo chips are side by side up and down, by two groups of bamboo chips Mill apparatus (3) are closed in insertion four together;Make two groups of bamboo chips pass through second point of guide card (35) to be individually directed on the second dynamic grinding roller (34) Lower both sides.
CN201611161911.8A 2016-12-15 2016-12-15 A kind of bamboo chip grinding device Active CN106475862B (en)

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