CN106469856B - Metamaterial - Google Patents
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- CN106469856B CN106469856B CN201510514714.9A CN201510514714A CN106469856B CN 106469856 B CN106469856 B CN 106469856B CN 201510514714 A CN201510514714 A CN 201510514714A CN 106469856 B CN106469856 B CN 106469856B
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- 239000000758 substrate Substances 0.000 claims abstract description 51
- 239000000463 material Substances 0.000 claims abstract description 34
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- 230000008878 coupling Effects 0.000 claims abstract description 4
- 238000010168 coupling process Methods 0.000 claims abstract description 4
- 238000005859 coupling reaction Methods 0.000 claims abstract description 4
- 239000010410 layer Substances 0.000 claims description 68
- 239000002356 single layer Substances 0.000 claims description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- 229910052799 carbon Inorganic materials 0.000 claims description 8
- 238000003475 lamination Methods 0.000 claims description 8
- 229910000859 α-Fe Inorganic materials 0.000 claims description 8
- 238000012545 processing Methods 0.000 abstract description 6
- 238000013461 design Methods 0.000 abstract description 3
- 239000011799 hole material Substances 0.000 description 83
- 238000005516 engineering process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000002059 diagnostic imaging Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 230000002068 genetic effect Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
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Abstract
The invention provides a metamaterial which comprises a single metamaterial layer, wherein the single metamaterial layer comprises a medium substrate, a conductive geometric structure layer attached to the medium substrate and at least one through hole unit penetrating through the conductive geometric structure layer, the through hole unit comprises two pairs of through holes with different sizes which are arranged in parallel in a planar two-dimensional direction, and the centers of the through holes are arranged at equal intervals. The metamaterial provided by the invention adjusts the microstructure parameters through the coupling superposition of different microstructures, so that multi-resonance or wide resonance is realized in the terahertz range; meanwhile, the metamaterial formed by the single metamaterial layer has the advantages of light weight, low price and easiness in processing, and compared with the design of a plurality of layers of materials, the cost can be saved, so that the problems of difficult processing and high cost of the terahertz device in the prior art are effectively solved, and the metamaterial has practical application value.
Description
Technical Field
The invention relates to the field of electromagnetic communication, in particular to a metamaterial.
Background
Terahertz (THz) refers to electromagnetic waves with frequencies in the range of 0.1THz-10THz, whose wavelengths cover 3mm-30 μm, also known as THz radiation, sub-millimeter waves or T-rays. Terahertz is in the electromagnetic spectrum between millimeter wave and infrared, and relative to these two bands, terahertz technology has evolved for only twenty years, with relative hysteresis in theory and application, also known as "terahertz voids" in the electromagnetic spectrum. Terahertz technology can bring important technical innovations to the fields of communication, astronomical observation, radar detection, public safety, medical imaging, genetic inspection and the like, and has received great attention in the scientific and industrial circles in recent years.
Terahertz technology is currently limited by terahertz generation sources, detectors and functional devices, and has not been applied in a large scale. Because the terahertz wavelength is very short, the device size is much smaller than that of a microwave device, which is in the order of a few percent of the microwave device, so the device is difficult to process and has high cost. At present, most terahertz devices are obtained by adopting a photoetching method, the sample size is small, the yield is low, and the research and the application of the terahertz technology are greatly restricted.
For the problems in the related art, no effective solution has been proposed at present.
Disclosure of Invention
Aiming at the problems of difficult processing and high cost of the terahertz device in the prior art, the invention provides a metamaterial comprising a single metamaterial layer.
The metamaterial provided by the invention comprises a single-layer metamaterial layer, wherein the single-layer metamaterial layer comprises a medium substrate, a conductive geometric structure layer attached to the medium substrate and at least one through hole unit penetrating through the conductive geometric structure layer, the through hole unit comprises two pairs of through holes with different sizes which are arranged in parallel in a planar two-dimensional direction, and the centers of the through holes are arranged at equal intervals.
In the above metamaterial, the through holes are two pairs of square holes of different sizes.
In the above-mentioned metamaterial, the long value ranges of the two pairs of square holes are 240 μm to 360 μm and 160 μm to 240 μm respectively, and the wide value ranges of the two pairs of square holes are 40 μm to 60 μm respectively.
In the metamaterial, the through holes are two pairs of round holes with different sizes.
In the above-mentioned metamaterial, the radius of the two pairs of round holes is respectively in the range of 120 μm to 180 μm and 20 μm to 30 μm.
In the above metamaterial, the through hole includes a pair of round holes and a pair of square holes.
In the above metamaterial, the value range of the radius of the through hole of the round hole is 20-30 μm, the value range of the length of the square hole is 240-360 μm, and the value range of the width of the square hole is 60-240 μm.
In the metamaterial, each through hole unit and a part of the conductive geometric structure layer where the through hole unit is located are defined as one conductive geometric structure unit, the structural period of the conductive geometric structure unit is lx=ly, and the value ranges of Lx and Ly are 640-960 mu m.
In the metamaterial, the area of the conductive geometric structure layer accounts for 5% -30% of the area of the medium substrate.
In the above metamaterials, the area of the conductive geometry layer accounts for 22.69% of the area of the dielectric substrate.
In the above metamaterial, the thickness of the conductive geometry layer is 6 μm to 25 μm.
In the above metamaterials, the thickness of the conductive geometry layer is 18 μm.
In the above metamaterial, the thickness of the dielectric substrate is 6 μm to 75 μm.
In the above metamaterial, the thickness of the dielectric substrate is 40 μm.
In the above metamaterials, the conductive geometry layer is attached to the dielectric substrate by vacuum lamination.
In the above metamaterials, the conductive geometry layer is made of electromagnetically lossy material.
In the above metamaterial, the electromagnetically lossy material includes ferrite.
In the above metamaterial, the material of the dielectric substrate is made of carbon.
In the above metamaterials, the dielectric substrate is a dielectric substrate of flame retardant material grade FR 4.
In the above metamaterial, the dielectric constant of the dielectric substrate is in the range of 3.2 to 5.2, and the loss tangent is in the range of 0.0032 to 0.0048.
The metamaterial provided by the invention utilizes microstructures with electromagnetic loss materials with different sizes on the same layer of electromagnetic loss material, and adjusts the structural parameters of the microstructures through coupling superposition of different microstructures, so that multi-resonance or wide resonance is realized in the terahertz range. Meanwhile, the metamaterial formed by the single metamaterial layer has the advantages of light weight, low price and easiness in processing, and compared with the design of a plurality of layers of materials, the cost can be saved, so that the problems of difficult processing and high cost of the terahertz device in the prior art are effectively solved, and the metamaterial has practical application value.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1A is a schematic structural view of a metamaterial according to embodiment 1 of the present invention as a single-layer hybrid electromagnetic-loss material square-hole material;
fig. 1B is a cross-sectional view of the metamaterial of fig. 1A taken along a straight line through a square hole.
Fig. 2A is a schematic structural view of a metamaterial according to embodiment 2 of the present invention as a single layer of a hybrid electromagnetic lossy material circular hole material;
fig. 2B is a cross-sectional view of the metamaterial of fig. 2A taken along a straight line through a circular hole.
Fig. 3A is a schematic structural diagram of a metamaterial according to embodiment 2 of the present invention as a single-layer hybrid electromagnetic-loss material round-hole square-hole bonding material;
fig. 3B is a cross-sectional view of the metamaterial of fig. 3A taken along a straight line through a square hole.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which are derived by a person skilled in the art based on the embodiments of the invention, fall within the scope of protection of the invention.
The invention provides a metamaterial which comprises a single metamaterial layer, wherein the single metamaterial layer comprises a medium substrate, a conductive geometric structure layer and at least one through hole unit, wherein the conductive geometric structure layer is attached to the medium substrate, the through hole unit penetrates through the conductive geometric structure layer, the through hole unit comprises two pairs of through holes with different sizes, the through holes are arranged in parallel in a planar two-dimensional direction, the centers of the through holes are arranged at equal intervals, namely, four through holes are positioned on four vertexes of the same square. The metamaterial provided by the invention is a single-layer mixed-structure electromagnetic loss type terahertz material, and multiple resonance frequencies are realized by utilizing the combination of conductive geometric structures with different sizes and adjusting parameters of the conductive geometric structures.
In a preferred embodiment, the centers of the through holes of the two pairs of through holes are respectively located at the four vertexes of the same square. In a preferred embodiment, the two pairs of through holes are two pairs of square holes of different sizes arranged side by side, the length of the two pairs of square holes ranges from 240 μm to 360 μm and from 160 μm to 240 μm, respectively, and the width of the two pairs of square holes ranges from 40 μm to 60 μm, preferably the sizes of the two pairs of square holes are 300 μm×50 μm and 200 μm×50 μm, respectively. In some preferred embodiments, the two pairs of through holes are two pairs of circular holes of different sizes arranged side by side, the radii of the two pairs of circular holes range from 120 μm to 180 μm and from 20 μm to 30 μm, respectively, preferably the radii of the two pairs of circular holes are 150 μm and 25 μm, respectively. In other preferred embodiments, the two pairs of through holes are a pair of square holes and a pair of round holes arranged side by side, wherein the radius of the through holes of the round holes ranges from 20 μm to 30 μm, the length of the square holes ranges from 240 μm to 360 μm and the width of the square holes ranges from 60 μm to 240 μm, preferably the radius of the through holes of the round holes ranges from 25 μm, and the radius of the square holes ranges from 300 μm×50 μm. Wherein, in each of the above embodiments, both of the through holes in each pair of through holes have the same size.
In a preferred embodiment, each via unit and the portion of the conductive geometry layer where the via unit is located are defined as one conductive geometry unit, the structural period of the conductive geometry unit preferably being lx=ly=800 μm. In a preferred embodiment, the duty cycle of the conductive geometry layer is 5% -30%, i.e. the area of the conductive geometry layer occupies 5% -30% of the area of the medium substrate, preferably the duty cycle of the conductive geometry layer is 22.69%, so that the metamaterial can better realize the adjustment of the resonance peak. In a preferred embodiment, the thickness of the conductive geometry layer is 6 μm to 25 μm, preferably 18 μm, so that the metamaterial enables better tuning of the resonance peak. In a preferred embodiment, the thickness of the dielectric substrate is 6 μm to 25 μm, preferably the thickness of the dielectric substrate is 20 μm, so that the metamaterial can realize an electromagnetic modulation function in the terahertz range.
In a preferred embodiment, the conductive geometry layer is attached to the dielectric substrate by vacuum lamination. In a preferred embodiment, the conductive geometry layer is made of an electromagnetically lossy material comprising ferrite. In a preferred embodiment, the material of the dielectric substrate is made of carbon. The dielectric substrate is an FR4 dielectric substrate of flame resistant material grade, and in a preferred embodiment, the dielectric substrate has a dielectric constant in the range of 3.2 to 5.2 and a loss tangent in the range of 0.0032 to 0.0048.
The metamaterial provided by the invention has the beneficial effects of at least the following (1) to (3):
(1) The metamaterial provided by the invention is a terahertz wave band single-layer mixed structure material, and can realize superposition of resonance peaks generated by different structures and expand bandwidth.
(2) The metamaterial provided by the invention is an impedance material, and can be used for adjusting a resonance peak through the type and the duty ratio of an electromagnetic loss material structure.
(3) The metamaterial provided by the invention has an electromagnetic modulation function within 0.1-10 THz.
Example 1
Fig. 1A is a schematic structural view of a metamaterial, which is a single-layer mixed-type electromagnetic-loss material square hole material, and fig. 1B is a cross-sectional view of the metamaterial taken along a straight line passing through the square hole, according to an embodiment of the present invention. As shown in fig. 1 and 1B, the metamaterial comprises a single metamaterial layer comprising: an FR4 dielectric substrate 3 having a dielectric substrate thickness d of 20 μm and comprising carbon; the conductive geometry layer 4 attached to the dielectric substrate 3 by vacuum lamination, the conductive geometry layer thickness h being 6 μm, the duty cycle being 5%; and at least one via unit disposed through the conductive geometry layer 4, the via unit including two pairs of square holes of different sizes arranged in parallel, namely, a pair of first square holes 1 and a pair of second square holes 2, and centers of the two pairs of square holes being on four apexes of the same square, namely, centers of each via hole being arranged at equal intervals, the dimensions of the first square holes 1 and the second square holes 2 being 300 μm×50 μm and 200 μm×50 μm, respectively, wherein each of the via units and a portion of the conductive geometry layer where the via unit is located are defined as one conductive geometry unit, a structural period of the conductive geometry unit is lx=ly=800 μm, while the conductive geometry layer is made of an electromagnetic loss material including ferrite, and a dielectric constant of the dielectric substrate is 4.3, and a loss tangent of the dielectric substrate is 0.004.
Example 2
As shown in fig. 2A and 2B, the metamaterial comprises a single metamaterial layer comprising: a dielectric substrate 3 having a thickness d of 75 μm and containing carbon; a conductive geometry layer 4 attached to the dielectric substrate 3 by vacuum lamination; a conductive geometry layer 4 having a thickness h of 25 μm and a duty cycle of 30%; and at least one through hole unit penetrating the conductive geometry layer 4, the through hole unit comprising two pairs of circular holes of different sizes arranged side by side, namely, a pair of first circular holes 5 and a pair of second circular holes 6, and the through hole centers of the two pairs of circular holes being respectively located on four apexes of the same square, while the radii of the two pairs of circular holes are respectively 150 μm and 25 μm, wherein the structural period of the conductive geometry unit is lx=ly=800 mm, while the conductive geometry layer is made of an electromagnetic loss material including ferrite, the dielectric constant of the dielectric substrate is 4.3, and the loss tangent is 0.004.
Example 3
As shown in fig. 3A and 3B, a metamaterial comprises a single metamaterial layer comprising: a dielectric substrate 3 having a thickness d of 50um and containing carbon; the conductive geometry layer 4 attached to the dielectric substrate 3 by vacuum lamination, the conductive geometry layer thickness h being 20 μm, the duty cycle being 20%; and at least one via unit provided penetrating the conductive geometry layer 4, the via unit including a pair of third party holes 7 and a pair of third round holes 8 arranged in parallel with centers of the two pairs of via holes being respectively located on four apexes of the same square, the third party holes 7 having a size of 300 μm×50 μm and the third round holes 8 having a radius of 25 μm, wherein the conductive geometry unit has a structural period lx=ly=800 mm, while the conductive geometry layer is made of an electromagnetic loss material including ferrite, the dielectric substrate has a dielectric constant of 4.3 and a loss tangent of 0.004.
Example 4
A metamaterial comprising a single-layer metamaterial layer comprising a dielectric substrate having a thickness of 40um and comprising carbon, a conductive geometry layer attached to the dielectric substrate by vacuum lamination, and at least one via unit disposed through the conductive geometry layer having a thickness of 18 um and a duty cycle of 22.69%, the via unit comprising two pairs of square holes of different sizes arranged side by side with the centers of the vias of the two pairs of vias on four vertices of the same square, respectively, while the sizes of the two pairs of square holes are 300 um x 50um and 200 um x 50um, respectively, wherein the structural period of the conductive geometry unit is lx=ly=800 mm, while the conductive geometry layer is made of an electromagnetically lossy material comprising ferrite, the dielectric substrate having a dielectric constant of 4.3 and a loss tangent of 0.004.
Example 5
A metamaterial comprising a single-layer metamaterial layer comprising a dielectric substrate having a thickness of 6um and containing carbon, a conductive geometry layer attached to the dielectric substrate by vacuum lamination, and at least one via unit provided through the conductive geometry layer having a thickness of 20 um and a duty cycle of 22.69%, the via unit comprising two pairs of square holes of different sizes arranged side by side with the centers of the vias of the two pairs of vias on four vertices of the same square, respectively, while the sizes of the two pairs of square holes are 300 um x 50um and 200 um x 50um, respectively, wherein the structural period of the conductive geometry unit is lx=ly=800 mm, while the conductive geometry layer is made of an electromagnetic lossy material comprising ferrite, the dielectric substrate having a dielectric constant of 4.3 and a loss tangent of 0.004.
It will be appreciated by those skilled in the art that embodiments of the via unit provided by the present invention are not limited to the combinations and sizes of vias listed in the embodiments.
The metamaterial disclosed by the invention utilizes microstructures with electromagnetic loss materials with different sizes on the same layer of electromagnetic loss material, and adjusts the structural parameters of the microstructures through coupling superposition of different microstructures, so that multi-resonance or wide resonance is realized in a terahertz range. Meanwhile, the metamaterial formed by the single metamaterial layer has the advantages of light weight, low price and easiness in processing, and compared with the design of a plurality of layers of materials, the cost can be saved, so that the problems of small sample size and low yield of the terahertz device in the prior art are effectively solved, and the method has practical application value.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the invention.
Claims (14)
1. The metamaterial is characterized by comprising a single metamaterial layer, wherein the single metamaterial layer comprises a medium substrate, a conductive geometric structure layer attached to the medium substrate and at least one through hole unit penetrating through the conductive geometric structure layer, the through hole unit comprises two pairs of through holes with different sizes which are arranged in parallel in a planar two-dimensional direction, the center of each through hole is arranged at equal intervals,
wherein the dielectric substrate and the conductive geometry layer are both single layers, and the conductive geometry layer is made of an electromagnetically lossy material,
wherein the conductive geometry layer has a thickness of 6 μm to 25 μm, the dielectric substrate has a thickness of 6 μm to 25 μm,
wherein each through hole unit and the part of the conductive geometric structure layer where the through hole unit is positioned are defined as a conductive geometric structure unit, the structural period of the conductive geometric structure unit is lx=ly, the value ranges of Lx and Ly are 640-960 mu m, the area of the conductive geometric structure layer accounts for 5-30% of the area of the medium substrate,
the metamaterial is formed by utilizing microstructures with the electromagnetic loss materials, which are arranged on the same layer and have different sizes, on the same layer of the electromagnetic loss material, and the microstructure parameters are adjusted through coupling superposition of different microstructures, so that multi-resonance or wide resonance is realized in the terahertz range.
2. The metamaterial according to claim 1, wherein the through holes are two pairs of square holes of different sizes.
3. The metamaterial according to claim 2, wherein the two pairs of square holes have a long range of 240 μm to 360 μm and 160 μm to 240 μm, respectively, and the two pairs of square holes have a wide range of 40 μm to 60 μm, respectively.
4. The metamaterial according to claim 1, wherein the through holes are two pairs of circular holes of different sizes.
5. The metamaterial according to claim 4, wherein the radii of the two pairs of circular holes are respectively in the range of 120 μm to 180 μm and 20 μm to 30 μm.
6. The metamaterial according to claim 1, wherein the through hole comprises a pair of square holes and a pair of round holes arranged side by side.
7. The metamaterial according to claim 6, wherein the radius of the through hole of the round hole is in a range of 20 μm to 30 μm, the length of the square hole is in a range of 240 μm to 360 μm, and the width of the square hole is in a range of 60 μm to 240 μm.
8. The metamaterial according to claim 1, wherein the area of the conductive geometry layer is 22.69% of the area of the dielectric substrate.
9. The metamaterial according to claim 1, wherein the conductive geometry layer has a thickness of 18 μιη.
10. The metamaterial according to claim 1, wherein the conductive geometry layer is attached to the dielectric substrate by vacuum lamination.
11. The metamaterial according to claim 1, wherein the electromagnetically lossy material comprises ferrite.
12. The metamaterial according to claim 1, wherein the material of the dielectric substrate is made of carbon.
13. The metamaterial according to claim 1, wherein the dielectric substrate is a flame resistant material grade FR4 dielectric substrate.
14. The metamaterial according to claim 13, wherein the dielectric substrate has a dielectric constant in the range of 3.2 to 5.2 and a loss tangent in the range of 0.0032 to 0.0048.
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| CN201510514714.9A CN106469856B (en) | 2015-08-20 | 2015-08-20 | Metamaterial |
| PCT/CN2016/095806 WO2017028795A1 (en) | 2015-08-20 | 2016-08-18 | Metamaterial |
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| CN201510514714.9A CN106469856B (en) | 2015-08-20 | 2015-08-20 | Metamaterial |
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| CN108897087B (en) * | 2018-06-13 | 2019-08-23 | 电子科技大学中山学院 | Nano structure capable of improving asymmetric transmission and preparation method thereof |
| CN109888480B (en) * | 2018-10-11 | 2020-12-25 | 南京理工大学 | Broadband multi-resonance super-surface antenna based on non-periodic square ring structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103268985A (en) * | 2013-04-24 | 2013-08-28 | 同济大学 | Electromagnetic wave beam regulating and controlling device |
| CN104638376A (en) * | 2015-02-03 | 2015-05-20 | 北京邮电大学 | Metamaterial structural body for realizing magnetic field adjustment of dielectric constant and structural body design method thereof |
| CN204885448U (en) * | 2015-08-20 | 2015-12-16 | 深圳光启高等理工研究院 | Super material |
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| CN202496171U (en) * | 2012-01-10 | 2012-10-17 | 3M创新有限公司 | Drilled sintered ferrite sheet, antenna isolation body and antenna module |
| CN102593596B (en) * | 2012-02-29 | 2015-04-22 | 深圳光启高等理工研究院 | Negative magnetic permeability metamaterial |
| US20140266967A1 (en) * | 2013-03-15 | 2014-09-18 | Omar Ramahi | Metamaterial Particles for Electromagnetic Energy Harvesting |
| CN104764711B (en) * | 2015-04-17 | 2018-02-06 | 中国科学院重庆绿色智能技术研究院 | Terahertz Meta Materials bio-sensing chip and its method of testing |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103268985A (en) * | 2013-04-24 | 2013-08-28 | 同济大学 | Electromagnetic wave beam regulating and controlling device |
| CN104638376A (en) * | 2015-02-03 | 2015-05-20 | 北京邮电大学 | Metamaterial structural body for realizing magnetic field adjustment of dielectric constant and structural body design method thereof |
| CN204885448U (en) * | 2015-08-20 | 2015-12-16 | 深圳光启高等理工研究院 | Super material |
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