CN106469595A - A kind of circuit board heat sink resistance - Google Patents
A kind of circuit board heat sink resistance Download PDFInfo
- Publication number
- CN106469595A CN106469595A CN201610954514.XA CN201610954514A CN106469595A CN 106469595 A CN106469595 A CN 106469595A CN 201610954514 A CN201610954514 A CN 201610954514A CN 106469595 A CN106469595 A CN 106469595A
- Authority
- CN
- China
- Prior art keywords
- carbon fiber
- fiber layer
- porcelain knob
- circuit board
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C10/00—Adjustable resistors
- H01C10/24—Adjustable resistors the contact moving along turns of a helical resistive element, or vica versa
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/08—Cooling, heating or ventilating arrangements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Details Of Resistors (AREA)
- Adjustable Resistors (AREA)
Abstract
The present invention discloses a kind of circuit board heat sink resistance, including porcelain knob, resistance wire, the engineering plastic bed of material, graphite linings and carbon fiber layer, described resistance wire is twist wrapped on porcelain knob, described porcelain knob, the engineering plastic bed of material, graphite linings and carbon fiber layer are arranged successively from the inside to the outside, described porcelain knob one end is provided with the first lead, it is provided with metal block on described carbon fiber layer, described metal block passes through carbon fiber layer, graphite linings and the engineering plastic bed of material are slidably connected with porcelain knob, it is provided with baffle plate on described metal block, described metal block one end is provided with the second lead, described carbon fiber layer bottom is provided with installing rack, this circuit board heat sink resistance good heat dissipation effect, structural strength is high, facilitate adjusting resistance value.
Description
Technical field
The present invention relates to a kind of circuit board heat sink resistance.
Background technology
Resistor is typically directly referred to as resistance in daily life.It is a current limiting element, after resistance is connect in circuit,
The resistance of resistor is fixing usually two pins, and it can limit the size of current by its institute's chord road.Resistance can not
The referred to as fixed resister changing.Resistance variable referred to as potentiometer or rheostat.Preferably resistor is linear, that is,
It is directly proportional to additional instantaneous voltage by the transient current of resistor.Rheostat for partial pressure.In exposed resistive element
On, pressed against one or two removable hard contact.Contact position determines the resistance between resistive element either end and contact.
Terminal voltage and electric current have determination functional relationship, embody the two-terminal device that electric energy is converted into other forms ability, use word
Representing, unit is ohm Ω to female R.Practical devices such as bulb, heating wire, resistor etc. is all represented by resistor element.
The resistance value size of resistive element is general and temperature, material, length, and also cross-sectional area is relevant, and gauge resistor is subject to
The physical quantity that temperature affects size is temperature coefficient, and it is defined as the percent that when temperature often raises 1 DEG C, resistance value changes.
The main physical characteristics of resistance are change electric energy is heat energy, also can say that it is a dissipative cell, electric current just produces interior energy through it.
Resistance generally plays partial pressure, the effect of shunting in circuit.For signal, exchange and direct current signal can pass through resistance.
Existing circuit board is bad with resistance spreading thermal effect at present, structural strength not high it has not been convenient to adjusting resistance value.
Content of the invention
The technical problem to be solved in the present invention is to provide a kind of good heat dissipation effect, and structural strength is high, facilitates adjusting resistance value
Circuit board heat sink resistance.
For solving the above problems, the present invention adopts the following technical scheme that：A kind of circuit board heat sink resistance, including porcelain knob,
Resistance wire, the engineering plastic bed of material, graphite linings and carbon fiber layer, described resistance wire is twist wrapped on porcelain knob, described porcelain knob, work
Engineering plastics layer, graphite linings and carbon fiber layer are arranged successively from the inside to the outside, and described porcelain knob one end is provided with the first lead, and described carbon is fine
It is provided with metal block, described metal block passes through carbon fiber layer, graphite linings and the engineering plastic bed of material and porcelain knob to slide even on dimension layer
Connect, described metal block is provided with baffle plate, described metal block one end is provided with the second lead, described carbon fiber layer bottom sets
It is equipped with installing rack.
Preferably, described first lead is electrically connected with resistance wire.
Preferably, described metal block and the second lead are electrically connected with.
Preferably, the U-shaped setting of described installing rack.
Preferably, described installing rack two ends are provided with installing hole.
Beneficial effects of the present invention are：The carbon fiber layer of setting and graphite linings keep good heat dissipation effect；Setting porcelain knob and
Engineering plastic bed of material holding structure intensity is high；The metal block of setting is slidably connected with porcelain knob, can adjust the length of energising resistance wire
Degree, facilitates adjusting resistance value.
Brief description
Fig. 1 is a kind of structure chart of present invention circuit board heat sink resistance.
Specific embodiment
As shown in figure 1, a kind of circuit board heat sink resistance, including porcelain knob 1, resistance wire 2, the engineering plastic bed of material 3, graphite linings 4
With carbon fiber layer 5, described resistance wire 2 is twist wrapped on porcelain knob 1, described porcelain knob 1, the engineering plastic bed of material 3, graphite linings 4 and
Carbon fiber layer 5 is arranged successively from the inside to the outside, and described porcelain knob 1 one end is provided with the first lead 6, and described carbon fiber layer 5 is provided with
Metal block 11, described metal block 11 passes through carbon fiber layer 5, graphite linings 4 and the engineering plastic bed of material 3 to be slidably connected with porcelain knob 1, institute
State and baffle plate 7 is provided with metal block 11, described metal block 11 one end is provided with the second lead 8, described carbon fiber layer 5 bottom
It is provided with installing rack 9.
Described first lead 6 is electrically connected with resistance wire 2.
Described metal block 11 is electrically connected with the second lead 8.
The U-shaped setting of described installing rack 9.
Described installing rack 9 two ends are provided with installing hole 10.
Beneficial effects of the present invention are：The carbon fiber layer of setting and graphite linings keep good heat dissipation effect；Setting porcelain knob and
Engineering plastic bed of material holding structure intensity is high；The metal block of setting is slidably connected with porcelain knob, can adjust the length of energising resistance wire
Degree, facilitates adjusting resistance value.
The above, the only specific embodiment of the present invention, but protection scope of the present invention is not limited thereto, and any
The change or replacement expected without creative work, all should be included within the scope of the present invention.
Claims (5)
1. a kind of circuit board heat sink resistance it is characterised in that：Fine including porcelain knob, resistance wire, the engineering plastic bed of material, graphite linings and carbon
Dimension layer, described resistance wire is twist wrapped on porcelain knob, and described porcelain knob, the engineering plastic bed of material, graphite linings and carbon fiber layer are successively
Arrange from the inside to the outside, described porcelain knob one end is provided with the first lead, and described carbon fiber layer is provided with metal block, described metal
Slide block passes through carbon fiber layer, graphite linings and the engineering plastic bed of material and porcelain knob to be slidably connected, and described metal block is provided with baffle plate, institute
State metal block one end and the second lead is installed, described carbon fiber layer bottom is provided with installing rack.
2. circuit board heat sink resistance according to claim 1 it is characterised in that：Described first lead is electrical with resistance wire
Connect.
3. circuit board heat sink resistance according to claim 1 it is characterised in that：Described metal block and the second lead electricity
Property connect.
4. circuit board heat sink resistance according to claim 1 it is characterised in that：The U-shaped setting of described installing rack.
5. circuit board heat sink resistance according to claim 1 it is characterised in that：Described installing rack two ends are provided with installation
Hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610954514.XA CN106469595A (en) | 2016-10-27 | 2016-10-27 | A kind of circuit board heat sink resistance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610954514.XA CN106469595A (en) | 2016-10-27 | 2016-10-27 | A kind of circuit board heat sink resistance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106469595A true CN106469595A (en) | 2017-03-01 |
Family
ID=58230933
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610954514.XA Pending CN106469595A (en) | 2016-10-27 | 2016-10-27 | A kind of circuit board heat sink resistance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106469595A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0473902A (en) * | 1990-07-16 | 1992-03-09 | Seidensha:Kk | Surface packaging type winding resistor and manufacture thereof |
| CN201600975U (en) * | 2010-02-26 | 2010-10-06 | 高华军 | Improved slide rheostat |
| CN204792273U (en) * | 2015-07-21 | 2015-11-18 | 深圳市格瑞特电子有限公司 | Special type pastes dress resistor |
-
2016
- 2016-10-27 CN CN201610954514.XA patent/CN106469595A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0473902A (en) * | 1990-07-16 | 1992-03-09 | Seidensha:Kk | Surface packaging type winding resistor and manufacture thereof |
| CN201600975U (en) * | 2010-02-26 | 2010-10-06 | 高华军 | Improved slide rheostat |
| CN204792273U (en) * | 2015-07-21 | 2015-11-18 | 深圳市格瑞特电子有限公司 | Special type pastes dress resistor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170301 |