CN106451171B - A kind of power system buried substation - Google Patents
A kind of power system buried substation Download PDFInfo
- Publication number
- CN106451171B CN106451171B CN201611102951.5A CN201611102951A CN106451171B CN 106451171 B CN106451171 B CN 106451171B CN 201611102951 A CN201611102951 A CN 201611102951A CN 106451171 B CN106451171 B CN 106451171B
- Authority
- CN
- China
- Prior art keywords
- casing
- electromagnetic relay
- additionally provided
- microcontroller
- power system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000010438 heat treatment Methods 0.000 claims abstract description 18
- 238000010521 absorption reaction Methods 0.000 claims abstract description 11
- 238000005057 refrigeration Methods 0.000 claims abstract description 8
- 239000004065 semiconductor Substances 0.000 claims abstract description 8
- 235000008733 Citrus aurantifolia Nutrition 0.000 claims abstract description 4
- 235000011941 Tilia x europaea Nutrition 0.000 claims abstract description 4
- 239000012530 fluid Substances 0.000 claims abstract description 4
- 239000004571 lime Substances 0.000 claims abstract description 4
- 239000000843 powder Substances 0.000 claims abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 22
- 238000009423 ventilation Methods 0.000 claims description 15
- 239000007788 liquid Substances 0.000 claims description 6
- 230000005611 electricity Effects 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims 1
- 238000010276 construction Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001727 in vivo Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
- H02B7/00—Enclosed substations, e.g. compact substations
- H02B7/06—Distribution substations, e.g. for urban network
- H02B7/08—Underground substations
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
- H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
- H02B1/26—Casings; Parts thereof or accessories therefor
- H02B1/28—Casings; Parts thereof or accessories therefor dustproof, splashproof, drip-proof, waterproof or flameproof
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
- H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
- H02B1/56—Cooling; Ventilation
- H02B1/565—Cooling; Ventilation for cabinets
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Road Paving Structures (AREA)
- Drying Of Solid Materials (AREA)
Abstract
The present invention relates to a kind of power system buried substation, and it includes being arranged at the casing of below ground, and cover sheet is provided with above the casing;Intermediate course is provided with the tank wall of casing, semiconductor refrigeration chip is provided with described intermediate course, and it is filled with refrigerating fluid, fin is provided with the side wall of casing, the inside of fin connects with the intermediate course in tank wall, described semiconductor refrigeration chip is connected to power supply by the first electromagnetic relay, and temperature sensor is additionally provided with described casing;Drainage blower fan is additionally provided with casing, the air outlet of drainage blower fan is connected with baker by pipeline, moisture absorption layer and zone of heating are provided with the baker, lime powder is filled with described moisture absorption layer, electrical heating wire is provided with described zone of heating, described drainage blower fan and electrical heating wire are connected to power supply by the second electromagnetic relay, and humidity sensor is additionally provided with described casing.
Description
Technical field
The invention belongs to power system device technical field, and in particular to a kind of power system buried substation.
Background technology
With the continuous development of economic construction, increasing outdoor substation arises at the historic moment, with more easily for economy
Build and material conditions are provided.
But the construction of ground transformer station needs land occupation area;Therefore, buried substation turns into outdoor substation
The importance of construction;But in the prior art there is following technical problem in buried substation:
First:Buried substation causes what the power equipments such as the transformer in it distributed because its sealing is relatively restricted
Heat can not discharge in time;Second:Buried substation easily makes moist, and influences the power equipment normal work in it;3rd:Ground
Buried type substation is caused the damage of power equipment by earthquake effect;4th:Easily cause ponding;5th:Can not be timely
Alarmed to remote control center.This is the deficiencies in the prior art part.
Therefore, for drawbacks described above of the prior art, there is provided a kind of power system buried substation is designed, with solution
Certainly above-mentioned technical problem, it is necessary.
The content of the invention
It is an object of the present invention to design a kind of power system land used in view of the above-mentioned drawbacks of the prior art, providing
Buried type substation, to solve above-mentioned technical problem.
To achieve the above object, the present invention provides following technical scheme:
A kind of power system buried substation, it includes being arranged at the casing of below ground, set above the casing
It is equipped with cover sheet;It is characterized in that:
Intermediate course is provided with the tank wall of casing, semiconductor refrigeration chip is provided with described intermediate course, and fill out
Filled with refrigerating fluid, fin is provided with the madial wall of casing, the inside of fin connects with the intermediate course in tank wall, described
Semiconductor refrigeration chip power supply is connected to by the first electromagnetic relay, be additionally provided with TEMP in described casing
Device;
Drainage blower fan is additionally provided with casing, the air outlet for draining blower fan is connected with baker, the drying by pipeline
Moisture absorption layer and zone of heating are provided with device, lime powder is filled with described moisture absorption layer, is provided with described zone of heating
Electrical heating wire, described drainage blower fan and electrical heating wire are connected to power supply, described case by the second electromagnetic relay
It is additionally provided with humidity sensor in vivo;
The outside surrounding of the casing is provided with water collection sheet, and the bottom of casing is provided with arc collect cavity, and described catchments
Plate connects with arc collect cavity, and the bottom of arc collect cavity is provided with header tank, and level sensing is provided with described header tank
Device, described header tank are connected with water pump by water pipe, and described water pump is communicated to ground by water pipe, and described water pump passes through
3rd electromagnetic relay is connected to power supply;
It is provided with some ventilation ducts on described casing to be communicated to more than ground, height of the ventilation duct more than ground is mutual not
It is identical, inverted V-shaped top cover is provided with the ventilation duct, the end of inverted V-shaped top cover is less than the ventilation duct mouth of pipe;
It is additionally provided with microcontroller in described casing, it is the described temperature sensor of the input connection of microcontroller, wet
Sensor and liquid level sensor are spent, the first electromagnetic relay, the second electromagnetism relay described in the output end connection of microcontroller
Device and the 3rd electromagnetic relay, microcontroller are also associated with wireless transmitter module, and described wireless transmitter module passes through wireless
Network communicates with mster-control centre;
Buffer structure is additionally provided with casing, described buffer structure includes the fixed plate and branch being arranged in bottom half
Fagging, spacing hole is provided with described fixed plate, described supporting plate bottom is provided with gag lever post, described gag lever post and limit
Position hole is engaged, and the end of gag lever post is also associated with stage clip, and anti-slip rubber layer is additionally provided with the inwall of spacing hole.
Preferably, described microcontroller is singlechip controller;It is easy to develop, cost is low.
Preferably, the thickness of described anti-slip rubber layer is 2-4mm.
Preferably, the thickness of described anti-slip rubber layer is 3mm.
The beneficial effects of the present invention are the technical scheme provided by the present invention, can solve the problem that buried substation dissipates
The technical problem of hot, moistureproof, shockproof, anti-ponding, ventilation and remote alarms, use in the technical program ventilation duct ground with
Upper highly different design, it can fully improve the ventilation effect in casing.
Meanwhile by the temperature and humidity in microprocessor control adjusting tank body, and in time arrange the ponding in header tank
To more than ground;
Baker uses moisture absorption layer and zone of heating double-layer structure, and moisture absorption processing is first carried out to the humid air in casing, and
After heat, improve the drying effect to humid air.In addition, design principle of the present invention is reliable, and it is simple in construction, have very extensive
Application prospect.
As can be seen here, the present invention compared with prior art, has prominent substantive distinguishing features and significantly improved, it is implemented
Beneficial effect be also obvious.
Brief description of the drawings
Fig. 1 is a kind of structural representation of power system buried substation provided by the invention.
Fig. 2 is the electrical connection diagram of microcontroller.
Fig. 3 is the schematic diagram of buffer structure in Fig. 1.
Fig. 4 is the structural representation of baker in Fig. 1.
Wherein, 1- casings, 2- cover sheets, 3- intermediate courses, 4- semiconductor refrigeration chips, 5- fin, the electricity of 6- first
Magnetic relay, 7- power supplies, 8- temperature sensors, 9- drainage blower fans, 10- bakers, 11- moisture absorption layers, 12- zones of heating, 13-
Electrical heating wire, the electromagnetic relays of 14- second, 15- humidity sensors, 16- water collection sheets, 17- arc collect cavities, 18- header tanks,
19- liquid level sensors, 20- water pumps, the electromagnetic relays of 21- the 3rd, 22- ventilation ducts, 23- inverted V-shaped top covers, 24- microcontrollers,
25- wireless transmitter modules, 26- mster-control centres, 27- buffer structures, 271- fixed plates, 272- supporting plates, 273- spacing holes,
274- gag lever posts, 275- stage clips, 276- anti-slip rubber layers.
Embodiment
Below in conjunction with the accompanying drawings and the present invention will be described in detail by specific embodiment, and following examples are to the present invention
Explanation, and the invention is not limited in implementation below.
As shown in Figures 1 to 4, a kind of power system buried substation provided by the invention, it includes being arranged at ground
Following casing 1, the top of casing 1 are provided with cover sheet 2;
Intermediate course 3 is provided with the tank wall of casing 1, semiconductor refrigeration chip 4 is provided with described intermediate course 3,
And refrigerating fluid is filled with, it is provided with fin 5 on the madial wall of casing, the intermediate course in the inside and tank wall of fin connects
Logical, described semiconductor refrigeration chip 4 is connected to power supply 7 by the first electromagnetic relay 6, is also set up in described casing
There is temperature sensor 8;
Drainage blower fan 9 is additionally provided with casing, the air outlet for draining blower fan is connected with baker 10, the baking by pipeline
It is provided with moisture absorption layer 11 and zone of heating 12 in dry device, is filled with lime powder in described moisture absorption layer, in described zone of heating
Electrical heating wire 13 is provided with, described drainage blower fan and electrical heating wire are connected to power supply electricity by the second electromagnetic relay 14
Source, humidity sensor 15 is additionally provided with described casing;
The outside surrounding of the casing is provided with water collection sheet 16, and the bottom of casing is provided with arc collect cavity 17, described
Water collection sheet connects with arc collect cavity, and the bottom of arc collect cavity is provided with header tank 18, and liquid is provided with described header tank
Level sensor 19, described header tank are connected with water pump 20 by water pipe, and described water pump is communicated to ground by water pipe, described
Water pump power supply is connected to by the 3rd electromagnetic relay 21;
It is provided with some ventilation ducts 22 on described casing to be communicated to more than ground, height of the ventilation duct more than ground is mutual
Differ, inverted V-shaped top cover 23 is provided with the ventilation duct, the end of inverted V-shaped top cover is less than the ventilation duct mouth of pipe;
It is additionally provided with microcontroller 24 in described casing, the described temperature sensor of the input connection of microcontroller,
Humidity sensor and liquid level sensor, the first described electromagnetic relay of the output end connection of microcontroller, the second electromagnetism after
Electrical equipment and the 3rd electromagnetic relay, microcontroller are also associated with wireless transmitter module 25, and described wireless transmitter module passes through
Wireless network communicates with mster-control centre 26;
Buffer structure 27 is additionally provided with casing, described buffer structure 27 includes the fixed plate being arranged in bottom half
271 and supporting plate 272, spacing hole 273 is provided with described fixed plate, described supporting plate bottom is provided with gag lever post 274,
Described gag lever post is engaged with spacing hole, and the end of gag lever post is also associated with stage clip 275, is additionally provided with the inwall of spacing hole
Anti-slip rubber layer 276.
In the present embodiment, described microcontroller is singlechip controller;It is easy to develop, cost is low.
The thickness of described anti-slip rubber layer is 3mm.
In embodiment in fact, the thickness of described anti-slip rubber layer can also be 2mm or 4mm.
Disclosed above is only the preferred embodiment of the present invention, but the present invention is not limited to this, any this area
What technical staff can think does not have creative change, and some improvement made without departing from the principles of the present invention and
Retouching, should all be within the scope of the present invention.
Claims (4)
1. a kind of power system buried substation, it includes being arranged at the casing of below ground, set above the casing
There is cover sheet;It is characterized in that:
Intermediate course is provided with the tank wall of casing, semiconductor refrigeration chip is provided with described intermediate course, and be filled with
Refrigerating fluid, fin is provided with the madial wall of casing, the inside of fin connects with the intermediate course in tank wall, and described half
Conductor refrigerating chip is connected to power supply by the first electromagnetic relay, and temperature sensor is additionally provided with described casing;
Drainage blower fan is additionally provided with casing, the air outlet of blower fan is drained and baker is connected with by pipeline, in the baker
Moisture absorption layer and zone of heating are provided with, lime powder is filled with described moisture absorption layer, electricity is provided with described zone of heating and is added
Heated filament, described drainage blower fan and electrical heating wire are connected to power supply by the second electromagnetic relay, in described casing
It is additionally provided with humidity sensor;
The outside surrounding of the casing is provided with water collection sheet, and the bottom of casing is provided with arc collect cavity, described water collection sheet with
Arc collect cavity connects, and the bottom of arc collect cavity is provided with header tank, liquid level sensor, institute are provided with described header tank
The header tank stated is connected with water pump by water pipe, and described water pump is communicated to ground by water pipe, and described water pump passes through the 3rd
Electromagnetic relay is connected to power supply;
It is provided with some ventilation ducts on described casing to be communicated to more than ground, the mutual not phase of height of the ventilation duct more than ground
Together, inverted V-shaped top cover is provided with the ventilation duct, the end of inverted V-shaped top cover is less than the ventilation duct mouth of pipe;
Microcontroller is additionally provided with described casing, the temperature sensor, humidity described in the input connection of microcontroller pass
Sensor and liquid level sensor, the first described electromagnetic relay of the output end connection of microcontroller, the second electromagnetic relay with
And the 3rd electromagnetic relay, microcontroller are also associated with wireless transmitter module, described wireless transmitter module passes through wireless network
Communicated with mster-control centre;
Buffer structure is additionally provided with casing, described buffer structure includes fixed plate and the support being arranged in bottom half
Plate, is provided with spacing hole in described fixed plate, and described supporting plate bottom is provided with gag lever post, described gag lever post with it is spacing
Hole is engaged, and the end of gag lever post is also associated with stage clip, and anti-slip rubber layer is additionally provided with the inwall of spacing hole.
A kind of 2. power system buried substation according to claim 1, it is characterised in that:Described microcontroller
For singlechip controller.
A kind of 3. power system buried substation according to claim 2, it is characterised in that:Described anti-slip rubber
The thickness of layer is 2-4mm.
A kind of 4. power system buried substation according to claim 3, it is characterised in that:Described anti-slip rubber
The thickness of layer is 3mm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201611102951.5A CN106451171B (en) | 2016-12-05 | 2016-12-05 | A kind of power system buried substation |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201611102951.5A CN106451171B (en) | 2016-12-05 | 2016-12-05 | A kind of power system buried substation |
Publications (2)
Publication Number | Publication Date |
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CN106451171A CN106451171A (en) | 2017-02-22 |
CN106451171B true CN106451171B (en) | 2018-03-16 |
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CN201611102951.5A Active CN106451171B (en) | 2016-12-05 | 2016-12-05 | A kind of power system buried substation |
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Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN112578832B (en) * | 2018-03-20 | 2021-11-30 | 国网浙江桐庐县供电有限公司 | Heat dissipation and humidity control device for substation equipment |
CN111064080B (en) * | 2019-11-12 | 2021-05-11 | 广东电网有限责任公司 | Moisture-proof semi-buried transformer substation and moisture-proof method thereof |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4403142A1 (en) * | 1993-04-14 | 1994-10-20 | Bsa Ingenieurs Conseils | Electrical substation (transformer substation) |
CN202333559U (en) * | 2011-12-13 | 2012-07-11 | 北京市电力公司 | Box-type transformer substation with underground transformer |
CN105977852A (en) * | 2016-06-17 | 2016-09-28 | 凯地(广东)电业设备有限公司 | Landscape buried box-type substation with ventilation cooling system |
CN106159770A (en) * | 2016-08-25 | 2016-11-23 | 国网山东省电力公司阳信县供电公司 | A kind of buried substation of band emergency alarm device |
-
2016
- 2016-12-05 CN CN201611102951.5A patent/CN106451171B/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4403142A1 (en) * | 1993-04-14 | 1994-10-20 | Bsa Ingenieurs Conseils | Electrical substation (transformer substation) |
CN202333559U (en) * | 2011-12-13 | 2012-07-11 | 北京市电力公司 | Box-type transformer substation with underground transformer |
CN105977852A (en) * | 2016-06-17 | 2016-09-28 | 凯地(广东)电业设备有限公司 | Landscape buried box-type substation with ventilation cooling system |
CN106159770A (en) * | 2016-08-25 | 2016-11-23 | 国网山东省电力公司阳信县供电公司 | A kind of buried substation of band emergency alarm device |
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CN106451171A (en) | 2017-02-22 |
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