CN106427004A - Shoe sole forming control system for shoe making and shoe sole forming technology - Google Patents
Shoe sole forming control system for shoe making and shoe sole forming technology Download PDFInfo
- Publication number
- CN106427004A CN106427004A CN201611179574.5A CN201611179574A CN106427004A CN 106427004 A CN106427004 A CN 106427004A CN 201611179574 A CN201611179574 A CN 201611179574A CN 106427004 A CN106427004 A CN 106427004A
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- Prior art keywords
- microcontroller
- sole
- assembly
- sensor
- die cavity
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D35/00—Producing footwear
- B29D35/12—Producing parts thereof, e.g. soles, heels, uppers, by a moulding technique
- B29D35/122—Soles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
- B29C45/762—Measuring, controlling or regulating the sequence of operations of an injection cycle
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The invention provides a shoe sole forming control system for shoe making and a shoe sole forming technology, and belongs to the technical field of shoe making. The shoe sole forming control system for shoe making comprises a microcontroller, a temperature control module, a timing module, a weight sensor, a feeding movement mechanism, an upper mold movement mechanism, a heating assembly movement mechanism ad a cooling assembly movement mechanism. The shoe sole forming control system for shoe making controls operation of a shoe sole forming device, enables operation of the whole device to be mechanical and intelligent, is high in control precision in the shoe sole forming process, improves production efficiency and production quality and is suitable for configuration and usage of large-scale mechanical production.
Description
Technical field
The present invention relates to technical field of shoe making, more particularly, to a kind of shoemaking sole moulding device.
Background technology
Shoe-making process refers to the manufacturing of each accessory of footwear and each accessory of footwear is assembled together into footwear
Produce technology and the method for piece.
In prior art, a kind of technique more typically is rubber adhesive shoes technique, also referred to as cold bonding technique, is by footwear using binding agent
The process that side, inner bottom, outer bottom link together.Due to the difference of upper of a shoe and sole bonding facestock material, used binding agent
Type and property also different, such as chloroprene rubber adhesive agent, polyurethane glue stick, SBS adhesive etc..Technique letter due to adhesion process
Single, with short production cycle, production efficiency is high, the change of low cost of manufacture, designs and varieties is fast, be easily enlarged reproduction, so in shoemaking
It is the most assembly technology of application in industry, account for more than the 80% of shoemaking product population.This technique is in leather shoes, motion article of footwear
Application is at most.
The moulding process of general sole first mould is put in heater and is carried out pre-add using injection die pressing, this method
Material for sole of shoe is put into hot briquetting again in mould after reaching suitable temperature by heat, then goes to cooling board normal-temperature water and pours pouring
Mould cools down, and finished product is taken out in die sinking after the completion of cooling, machines.The sole of aftershaping bonded with upper of a shoe.Existing skill
This process machinery low degree in art, the heating of mould and cooling need manually to be changed it is impossible to be met shoe-making industry
The demand of quick, is not suitable for streamlined machining, and the temperature control degree of accuracy of heating and cooling is not, impact molding
The quality of product.
Content of the invention
The problem to be solved in the present invention be moulding process of the prior art control inaccurate, automaticity low it is impossible to
Meet the demand of massive mechanicalization processing.
For solving above-mentioned technical problem, the technical solution used in the present invention is：A kind of shoemaking Sole moulding control is provided
System, provides a kind of shoemaking Sole moulding control system.Described shoemaking Sole moulding control system includes microcontroller, temperature
Control module, timing module, weight sensor, charging motion, upper mould motion, heating component movement mechanism and cooling group
Part motion.
Described temperature control module, timing module, charging motion, upper mould motion, heating component movement mechanism, cooling
Component movement mechanism is all connected with microcontroller.Described temperature control module includes temperature sensor, the heating group being arranged in die cavity
Part and cooling assembly, the temperature in described temperature sensor senses die cavity, the PORT COM phase of temperature sensor and microcontroller
Even；Microcontroller is judged according to the signal that temperature sensor is transmitted, and controls heating assembly, cooling assembly, heating assembly fortune
Motivation structure, the operation of cooling component movement mechanism.
Timing module record heats assembly, the run time of cooling assembly, and transmits a signal to microcontroller.
Described weight sensor is arranged in charging mechanism, sensing charging mechanism in material weight, weight sensor with
The PORT COM of microcontroller is connected.
Preferably, described microcontroller is single-chip microcomputer.
Further, also include the density sensor being connected with the PORT COM of microcontroller, described density sensor sets
Put in die cavity, the density of material in sensing die cavity.
Further, also include delivery mechanism, described delivery mechanism is used for taking out the sole after molding from die cavity.Micro-
Controller is judged according to the signal that density sensor transmits, and controls the operation of delivery mechanism.Microcontroller passes according to density
The signal of sensor transmission is judged, controls heating assembly or the operation of cooling assembly.
Preferably, also include imageing sensor, described image sensor is for sensing the shape of the sole after molding.
Further, also include burring machine, it is used for the sole after molding is repaired.Microcontroller is according to image
The signal of sensor transmissions is judged, controls the operation of burring machine.
Further object is that providing molding described in a kind of sole molding process using above-mentioned control system
Technique comprises the steps：
(1) parameter preset in the microcontroller；
(2) component movement will heat to matching with lower mould in microprocessor controls heating component movement mechanism, controls heating
Assembly operating heats to die cavity；
(3) temperature sensor senses to mould-cavity temperature reach default after, microprocessor controls charging motion move into
Row charging, after the material that weight sensor senses in charging mechanism reach default after, microprocessor controls charging mechanism is by thing
To die cavity, in microprocessor controls, mould motion runs afterwards, so that mould is matched with lower mould for material transport；
(4), after upper mould is configured with lower mould, microprocessor controls heat assembly operating, make the material melts in die cavity；
(5) after reaching default heat time heating time, timer transmits a signal to microcontroller, and microprocessor controls heating assembly stops
Only run, control heating component movement mechanism will heat assembly and depart from lower mould, and control cooling component movement mechanism will cool down
Component movement matches as respectively at upper die and lower die, controls cooling assembly respectively upper die and lower die to be cooled down；
(6), in cooling shaping, after reaching default cool time, timer transmits a signal to microcontroller, microcontroller control
Produce mold mechanism to run, make the sole demoulding after molding, get product.
Further, in step (4), (5), during heating assembly or cooling assembly operating, density sensor sense
Answer the density of material in die cavity, the signal that microcontroller transmits according to density sensor, control heating assembly or cool down assembly
Run.If reach default time is heated or cooled after, material density can not reach preset requirement, then microprocessor controls heating group
Part or cooling assembly continue to run with.
Preferably, described moulding process also includes：(7) sole after molding is taken out after die cavity by delivery mechanism, and image passes
Sensor senses the shape of sole, and microcontroller controls burring machine that sole is repaiied according to the signal that imageing sensor transmits
Whole, obtain finished product.
The present invention has the advantages and positive effects that：The shoemaking Sole moulding control system that the application provides, controls
The operation of sole moulding device is so that whole device runs mechanization intellectuality, and controls precision high during Sole moulding,
Improve production efficiency and the quality of production, the configuration being suitable to mass mechanized production uses.
In the control system that the application provides, it is provided with temperature sensor, density sensor, weight sensor and image and passes
Sensor, is monitored to the parameter in Sole moulding respectively, and by corresponding data signal transmission to microcontroller, is easy to micro-control
The judgement of device processed, realizes mechanization, the intellectuality of Sole moulding process.
The moulding process that the application provides, step is clear, and operability is high, is easy to the use of Sole moulding, the product obtaining
Quality is higher, good stability.
Brief description
Fig. 1 is the schematic diagram of control system in the application.
Specific embodiment
In order to be better understood from the present invention, with reference to specific embodiments and the drawings, the present invention is further retouched
State.
Embodiment 1
As shown in figure 1, this application discloses a kind of shoemaking Sole moulding control system, including microcontroller, temperature control mould
Block, timing module, weight sensor, density sensor, imageing sensor, charging motion, upper mould motion, heating group
Part motion, cooling component movement mechanism, delivery mechanism and burring machine.
Microcontroller is single-chip microcomputer, and as a kind of embodiment, microcontroller is single-chip microcomputer
Temperature control module, timing module, weight sensor, density sensor, imageing sensor, charging motion, upper mould
Motion, heating component movement mechanism, cooling component movement mechanism, delivery mechanism and burring machine all with microcontroller phase
Even.
Temperature control module includes temperature sensor, heating assembly and the cooling assembly being arranged in die cavity.Temperature sensor sense
Answer the temperature in die cavity, temperature sensor is connected with the PORT COM of microcontroller.
Microcontroller is judged according to the signal that temperature sensor is transmitted, and controls heating assembly, cooling assembly, heating group
Part motion, the operation of cooling component movement mechanism.
Weight sensor is arranged in charging mechanism, weight, weight sensor and the micro-control of material in sensing charging mechanism
The PORT COM of device processed is connected.
Density sensor is arranged in die cavity, the density of material in sensing die cavity, and density sensor is logical with microcontroller
News port is connected.
Delivery mechanism is used for taking out the sole after molding from die cavity.The letter that microcontroller transmits according to density sensor
Number judged, controlled the operation of delivery mechanism.Microcontroller is judged according to the signal that density sensor transmits, and controls and adds
Hot assembly or the operation of cooling assembly.
Imageing sensor, for sensing the shape of the sole after molding, is connected with the PORT COM of microcontroller.
Burring machine is used for the sole after molding is repaired.Microcontroller enters according to the signal that imageing sensor transmits
Row judges, controls the operation of burring machine.
Embodiment 2
This application discloses a kind of sole molding process, using the control system in embodiment 1, comprise the steps：
(1) parameter preset in the microcontroller；Parameter preset includes the melt temperature of Sole moulding required material, after molding
The temperature of product, heat time heating time, cool time, fused materials density, sole density after molding, shape of sole etc. after molding；
(2) component movement will heat to matching with lower mould in microprocessor controls heating component movement mechanism, controls heating
Assembly operating heats to die cavity；
(3) temperature sensor senses to mould-cavity temperature reach default after, microprocessor controls charging motion move into
Row charging, after the material that weight sensor senses in charging mechanism reach default after, microprocessor controls charging mechanism is by thing
To die cavity, in microprocessor controls, mould motion runs afterwards, so that mould is matched with lower mould for material transport；
(4), after upper mould is configured with lower mould, microprocessor controls heat assembly operating, make the material melts in die cavity；
During heating assembly operating, density sensor senses the density of material in die cavity, and microcontroller is according to density
The signal of sensor transmissions, is compared with default parameter, if meeting default parameter, microprocessor controls heat assembly
Out of service, appropriate can not meet parameter preset, then microprocessor controls heating assembly continue to run with；
(5) after reaching default heat time heating time, timer transmits a signal to microcontroller, and microprocessor controls heating assembly stops
Only run, density sensor senses the density of material in die cavity, the signal that microcontroller transmit according to density sensor, and preset
Parameter be compared, if meeting default parameter, microprocessor controls heating assembly out of service, appropriate can not meet default
Parameter, then microprocessor controls heating assembly continue to run with；
After heating assembly is out of service, microprocessor controls heating component movement mechanism will heat assembly and depart from lower mould,
And control cooling component movement mechanism to match cooling down component movement as respectively at upper die and lower die, control cooling assembly to divide
Other upper die and lower die are cooled down；
(6), in cooling shaping, after reaching default cool time, timer transmits a signal to microcontroller, microcontroller control
Cooling body processed is out of service.Density sensor senses the density of material in die cavity, and microcontroller transmits according to density sensor
Signal, be compared with default parameter, if meeting default parameter, microprocessor controls cooling assembly out of service,
Appropriate can not meet parameter preset, then microprocessor controls cooling assembly continue to run with；
After cooling assembly is out of service, microprocessor controls delivery mechanism runs, and makes
The sole demoulding after molding.
(7) sole after molding is taken out after die cavity by delivery mechanism, the shape of image sensor senses sole, microcontroller
Judged with default parameter according to the signal of imageing sensor transmission, control burring machine that sole is repaired, must become
Product.
Above embodiments of the invention have been described in detail, but content be only presently preferred embodiments of the present invention it is impossible to
It is considered the practical range for limiting the present invention.All impartial changes made according to the scope of the invention and improvement etc., all should still return
Belong within this patent covering scope.
Claims (9)
1. a kind of shoemaking with Sole moulding control system it is characterised in that：Including microcontroller, temperature control module, timing module, weight
Quantity sensor, charging motion, upper mould motion, heating component movement mechanism and cooling component movement mechanism；
Described temperature control module, timing module, charging motion, upper mould motion, heating component movement mechanism, cooling assembly
Motion is all connected with microcontroller；
Described temperature control module includes temperature sensor, heating assembly and the cooling assembly being arranged in die cavity, described temperature sensing
Device senses the temperature in die cavity, and temperature sensor is connected with the PORT COM of microcontroller；Microcontroller is according to temperature sensor
The signal transmitting is judged, controls heating assembly, cooling assembly, heating component movement mechanism, cools down component movement mechanism
Run；
Timing module record heats assembly, the run time of cooling assembly, and transmits a signal to microcontroller；
Described weight sensor is arranged in charging mechanism, weight, weight sensor and the micro-control of material in sensing charging mechanism
The PORT COM of device processed is connected.
2. shoemaking sole moulding device according to claim 1 it is characterised in that：Described microcontroller is single-chip microcomputer.
3. shoemaking sole moulding device according to claim 1 and 2 it is characterised in that：Also include and microcontroller
The density sensor that PORT COM is connected, described density sensor is arranged in die cavity, the density of material in sensing die cavity.
4. shoemaking sole moulding device according to claim 3 it is characterised in that：Also include delivery mechanism, described take
Mold mechanism is used for taking out the sole after molding from die cavity；
Microcontroller is judged according to the signal that density sensor transmits, and controls the operation of delivery mechanism；
Microcontroller is judged according to the signal that density sensor transmits, and controls heating assembly or the operation of cooling assembly.
5. shoemaking sole moulding device according to claim 1 and 2 it is characterised in that：Also include imageing sensor, institute
State imageing sensor for sensing the shape of the sole after molding.
6. shoemaking sole moulding device according to claim 5 it is characterised in that：Also include burring machine, it is used for
Sole after molding is repaired；
Microcontroller is judged according to the signal that imageing sensor transmits, and controls the operation of burring machine.
7. a kind of sole molding process using control system as claimed in claim it is characterised in that：Comprise the steps：
(1) parameter preset in the microcontroller；
(2) component movement will heat to matching with lower mould in microprocessor controls heating component movement mechanism, controls heating assembly
Run and die cavity is heated；
(3), after temperature sensor senses reach to mould-cavity temperature and preset, microprocessor controls charging motion motion carries out adding
Material, after the material that weight sensor senses in charging mechanism reaches and presets, material is transported by microprocessor controls charging mechanism
Transport in die cavity, in microprocessor controls, mould motion runs afterwards, so that mould is matched with lower mould；
(4), after upper mould is configured with lower mould, microprocessor controls heat assembly operating, make the material melts in die cavity；
(5) after reaching default heat time heating time, timer transmits a signal to microcontroller, and microprocessor controls heating assembly stops fortune
OK, control heating component movement mechanism will heat assembly to depart from lower mould, and control cooling component movement mechanism will cool down assembly
Motion matches as respectively at upper die and lower die, controls cooling assembly respectively upper die and lower die to be cooled down；
(6) in cooling shaping, after reaching default cool time, timer transmits a signal to microcontroller, and microprocessor controls take
Mold mechanism runs, and makes the sole demoulding after molding, gets product.
8. sole molding process according to claim 7 it is characterised in that：In step (4), (5), heat assembly or cold
But during assembly operating, density sensor senses the density of material in die cavity, and microcontroller transmits according to density sensor
Signal, control heating assembly or cooling assembly operation；
If reach default time is heated or cooled after, material density can not reach preset requirement, then microprocessor controls heating group
Part or cooling assembly continue to run with.
9. the sole molding process according to claim 7 or 8 it is characterised in that：Also include：
(7) delivery mechanism by after molding sole take out die cavity after, the shape of image sensor senses sole, microcontroller according to
The signal of imageing sensor transmission controls burring machine that sole is repaired, and obtains finished product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611179574.5A CN106427004A (en) | 2016-12-19 | 2016-12-19 | Shoe sole forming control system for shoe making and shoe sole forming technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611179574.5A CN106427004A (en) | 2016-12-19 | 2016-12-19 | Shoe sole forming control system for shoe making and shoe sole forming technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106427004A true CN106427004A (en) | 2017-02-22 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611179574.5A Pending CN106427004A (en) | 2016-12-19 | 2016-12-19 | Shoe sole forming control system for shoe making and shoe sole forming technology |
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| CN (1) | CN106427004A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109648902A (en) * | 2018-12-03 | 2019-04-19 | 泉州市晋科技术检测有限公司 | A kind of preparation method of the double-colored playshoes in interior |
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| US6555034B2 (en) * | 2000-03-27 | 2003-04-29 | Sumitomo Heavy Industries, Ltd. | Method for controlling an injection molding machine capable of reducing variations in weight of molded products |
| CN103358497A (en) * | 2012-03-26 | 2013-10-23 | 住友重机械工业株式会社 | Injection moulding machine |
| CN104626492A (en) * | 2015-01-08 | 2015-05-20 | 中国计量学院 | Injection molding monitoring detection system based on machine vision and operation method |
| CN104626449A (en) * | 2014-12-11 | 2015-05-20 | 深圳前海安南国际供应链管理服务有限公司 | Injection molding method and system |
| CN106003575A (en) * | 2016-06-29 | 2016-10-12 | 苏州天朋精密元器件有限公司 | Automatic loading device for injection mold |
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2016
- 2016-12-19 CN CN201611179574.5A patent/CN106427004A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6555034B2 (en) * | 2000-03-27 | 2003-04-29 | Sumitomo Heavy Industries, Ltd. | Method for controlling an injection molding machine capable of reducing variations in weight of molded products |
| CN103358497A (en) * | 2012-03-26 | 2013-10-23 | 住友重机械工业株式会社 | Injection moulding machine |
| CN104626449A (en) * | 2014-12-11 | 2015-05-20 | 深圳前海安南国际供应链管理服务有限公司 | Injection molding method and system |
| CN104626492A (en) * | 2015-01-08 | 2015-05-20 | 中国计量学院 | Injection molding monitoring detection system based on machine vision and operation method |
| CN106003575A (en) * | 2016-06-29 | 2016-10-12 | 苏州天朋精密元器件有限公司 | Automatic loading device for injection mold |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109648902A (en) * | 2018-12-03 | 2019-04-19 | 泉州市晋科技术检测有限公司 | A kind of preparation method of the double-colored playshoes in interior |
| CN109648902B (en) * | 2018-12-03 | 2021-05-18 | 泉州市晋科技术检测有限公司 | Preparation method of indoor double-color leisure shoes |
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Application publication date: 20170222 |
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