CN106424995A - Heat dissipating film formation method - Google Patents
Heat dissipating film formation method Download PDFInfo
- Publication number
- CN106424995A CN106424995A CN201610556642.9A CN201610556642A CN106424995A CN 106424995 A CN106424995 A CN 106424995A CN 201610556642 A CN201610556642 A CN 201610556642A CN 106424995 A CN106424995 A CN 106424995A
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- dissipation film
- brazed
- radiating
- solder plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/203—Fluxing, i.e. applying flux onto surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Exhaust Gas After Treatment (AREA)
- Exhaust Silencers (AREA)
Abstract
The present invention provides a heat dissipating film forming method capable of efficiently forming a heat radiating layer only at a desired portion of a member. There is provided a heat dissipating film forming method for forming a heat radiating film (5), the heat radiating film forming method comprising the steps of: The heat-resistant coating agent containing silica as a main component is fired on the solder plate (6) having a melting point higher than the firing temperature of the heat-radiating agent to form a heat radiating film (5)on the solder plate (6); and the solder plate (6) on which the heat radiating film (5) is formed is arranged on the brazed portion (20) of the exhaust manifold (2) to be brazed to form heat radiating film (5)on the exhaust manifold (2).
Description
Technical field
The present invention relates to heat dissipation film forming method.
Background technology
In the past, the exhaust system component of the internal combustion engine such as turbocharger, discharge manifold or catalyst be exposed to from
Its thermostability is worried in the high temperature exhaust gas that internal combustion engine is discharged.On the other hand, carrying out by improving gas extraction system portion
The thermal diffusivity of part, the grinding of the effectively utilizes exhaust heat that the heat distributing from this exhaust system component carried out absorb heat using insulator etc.
Study carefully.
Therefore, it is known to the outer surface in the exhaustor of such as internal combustion engine and form the heat dissipating layer with excellent thermal diffusivity
The technology (referring for example to patent documentation 1) of (heat dissipation film).According to this technology, the radiating of exhaustor can be improved using heat dissipating layer
Property.
Patent documentation 1：Japanese Unexamined Patent Publication 2009-133213 publication
Content of the invention
But, when forming heat dissipating layer in the outer surface of exhaust system component, radiating Liniment is being applied directly to row
After the outer surface of gas system unit, need to be fired.Accordingly, it is difficult to only apply radiating Liniment at desired position, exist
Have and define the problem of heat dissipating layer at unwanted position originally.
In addition, the coating of radiating Liniment is fired due to needing complicated operation with it, therefore generally entered by specialized vendor
OK.Therefore, in the conventional method of the outer surface that radiating Liniment is applied directly to exhaust system component, part is to and from
Between above-mentioned specialized vendor and the manufacturer of exhaust system component, also there is a problem of that production efficiency is poor.
The present invention is exactly to complete in view of the foregoing, and its object is to offer can be efficiently only in the expectation of part
Position formed heat dissipating layer heat dissipation film forming method.
To achieve these goals, the present invention provides formation heat dissipation film to dissipate hotting mask forming method, this heat dissipation film side of being formed
Method has following operation：Make with silicon dioxide as main component radiating Liniment with fusing point firing than this radiating Liniment
It is fired after the high solder plate of temperature (solder plate 6 for example described later) contact, thus heat dissipation film is formed on described solder plate
(heat dissipation film 5 for example described later) (the 1st operation for example described later)；And the solder plate being formed with described heat dissipation film is configured at portion
Being brazed of part (discharge manifold 2 for example described later) carries out soldering in portion's (for example described later be brazed portion 20), thus described
Heat dissipation film (the 2nd operation for example described later) is formed on part.
In the present invention, first, the radiating Liniment with silicon dioxide as main component is coated to fusing point than this radiating
It is fired after on the high solder plate of the firing temperature of Liniment.Thereby, it is possible to heat dissipation film is formed on solder plate.Then, will
The solder plate being formed with heat dissipation film is configured to the portion of being brazed of part and carries out soldering.Thereby, it is possible to being brazed in portion in part
Form heat dissipation film.Thus, according to the present invention, seek help from specialized vendor unlike the past and only just can only be existed by component vendors
The desired position of part is efficiently formed heat dissipating layer.
The described portion of being brazed is preferably configured as the rib of drippage comprising curved surface and being formed about preventing solder in this curved surface
(rib 7 for example described later).
In the present invention, the solder plate being formed with heat dissipation film is soldered in the portion of being brazed.In addition, it is attached in the portion that is brazed
Nearly formation rib.Thus, in the case that the portion that is for example brazed is made up of curved surface, when can be reliably prevented soldering, solder is from by pricker
Weldering portion is dripped.In addition, in the case that the portion that is for example brazed is made up of plane, the extension of solder during soldering can be limited in
In desired scope.Therefore, it is possible to more reliably only form heat dissipation film in the portion of being brazed.
Described part is preferably the exhaust system component (aerofluxuss for example described later of internal combustion engine (electromotor 1 for example described later)
Menifold 2).
In the present invention, the heat dissipation film forming method of foregoing invention is applied in the exhaust system component of internal combustion engine.By
This, only can be efficiently formed heat dissipation film at the desired position of exhaust system component.
In accordance with the invention it is possible to provide efficiently only be formed in the heat dissipation film of the desired site formation heat dissipating layer of part
Method.
Brief description
Fig. 1 is to illustrate by the heat dissipation film forming method of an embodiment of the invention to be formed with the internal combustion of heat dissipation film
The figure of the exhaust system component of machine.
Fig. 2 is the axonometric chart of the solder plate illustrating to be formed with the heat dissipation film of above-mentioned embodiment.
Label declaration
1：Electromotor (internal combustion engine)；
2：Discharge manifold (part, exhaust system component)；
3：Exhaustor；
4：Catalyst；
5：Heat dissipation film；
6：Solder plate；
7：Rib；
10：Insulator；
20：It is brazed portion；
40：Exhaust gas purification catalytic portions.
Specific embodiment
Referring to the drawings an embodiment of the invention is illustrated.
Fig. 1 is to illustrate by the heat dissipation film forming method of an embodiment of the invention to be formed with the internal combustion of heat dissipation film
The figure of the exhaust system component of machine.
In the heat dissipation film forming method of present embodiment, as internal combustion engine, (hereinafter referred to as " electromotor " (is illustrated as
ENG).) 1 the outer surface of exhaust manifold 2 of exhaust system component on formed heat dissipation film 5.
As shown in figure 1, discharge manifold 2 is configured at the underface of electromotor 1, its hull-skin temperature reaches e.g., from about 900 DEG C.
Therefore, it is configured with insulator 10 near the outside of this discharge manifold 2.The quilt shedding from the discharge manifold 2 being formed with heat dissipation film 5
This insulator 10 is heated, and is used effectively by this exhaust heat.
In addition, being connected with exhaustor 3 in the downstream of discharge manifold 2.It is provided with net with aerofluxuss in the midway of exhaustor 3
Change the catalyst 4 of catalytic portions 40.By being supported to HC (hydrocarbon), the CO in aerofluxuss by honeycomb support2(titanium dioxide
Carbon), NOxExhaust emission control catalyst that (oxynitride) etc. is purified and form exhaust gas purification catalytic portions 40.
The heat dissipation film forming method of present embodiment has：The operation of heat dissipation film 5 is formed on solder plate 6 (hereinafter referred to as
" the 1st operation ".) and on the discharge manifold 2 as exhaust system component formed heat dissipation film 5 operation the (the hereinafter referred to as the " the 2nd
Operation ".).Hereinafter each operation is described in detail.
In the 1st operation, radiating Liniment is made to contact the fusing point solder higher than the firing temperature of this radiating Liniment first
Plate 6.
Here, the known heat-radiation coating with silicon dioxide as main component for example can be used as radiating Liniment
Application.Radiating Liniment with silicon dioxide as main component is by firing and vitreous under its firing temperature, thus formed dissipating
Hotting mask 5.
Use the material that fusing point is higher than the firing temperature of above-mentioned radiating Liniment as solder.Thus, scattered when firing
During hot Liniment, solder plate 6 will not melt.For instance, it is possible to using by the Ni (nickel) of highly corrosion resistant is the pricker that amorphism is constituted
Material.More specifically, it is used and comprise Ni as main component and pass through to add B (boron) in addition to Cr (chromium) or Si* (silicon)
Or P (phosphorus) and become the solder of low melting point.By these solders are shaped to tabular and form solder plate 6.
The specific method that radiating Liniment contacts solder plate 6 is made to be not specifically limited.For example, aerosol apparatus can both have been utilized
It is coated on solder plate 6 it is also possible to make solder plate 6 impregnated in the bath of radiating Liniment Deng by radiating Liniment.
In addition, in the 1st operation, fire the radiating coating being configured on solder plate 6 with the firing temperature of this radiating Liniment
Agent.For example pass through be fired at 900 DEG C about, radiating Liniment vitreous and be close to the surface of solder plate 6, thus formed dissipate
Hotting mask 5.
Then in the 2nd operation, the solder plate 6 being formed with heat dissipation film 5 by the 1st above-mentioned operation is placed on aerofluxuss
Being brazed in portion 20 of menifold 2.It is brazed portion 20 to be set properly in the desired position needing formation heat dissipation film 5.
In addition after the solder plate 6 being formed with heat dissipation film 5 being placed in the portion of being brazed 20 in the 2nd operation, 1000
DEG C～1200 DEG C in they are fired.Thus, solder plate 6 melts and carries out soldering.Soldering and other subassemblies etc.
Soldering is carried out together.
Here, being configured to comprise curved surface as shown in figure 1, being brazed portion 20, it has been formed about rib 7 in the portion that is brazed 20.
Rib 7 is for example prominent from the outwardly side of discharge manifold 2, and the all-round extension along this discharge manifold 2 is formed.By using this
Rib 7 accepts solder during soldering, thus preventing the drippage of solder.
Heat dissipation film 5 is configured with being brazed in portion 20 of discharge manifold 2 by above-mentioned soldering.Now, constituting row
Cr in the SUS (rustless steel) of the gas menifold 2 or Cr in solder and vitreous and shape between the silicon dioxide in the heat dissipation film 5 that formed
Become combination firmly.Thus, in being brazed of discharge manifold 2, the heat dissipation film 5 being close to securely is formed with portion 20.
Based on the heat dissipation film forming method of present embodiment described above, it is capable of following effect.
In the present embodiment, first, make radiating Liniment with silicon dioxide as main component with fusing point than this radiating
It is fired after high solder plate 6 contact of the firing temperature of Liniment.Thereby, it is possible to heat dissipation film 5 is formed on solder plate 6.Connect
, the solder plate 6 being formed with heat dissipation film 5 is configured to being brazed in portion 20 of discharge manifold 2 and carries out soldering.Thereby, it is possible to only
Form heat dissipation film 5 in being brazed in portion 20 of discharge manifold 2.Thus, according to present embodiment, seek help from unlike the past specially
Industry manufacturer and only just only can be efficiently formed heat dissipation film 5 at the desired position of discharge manifold 2 by component vendors.
In addition, in the present embodiment, the solder plate 6 being formed with heat dissipation film 5 is soldered in the portion of being brazed 20.In addition,
It has been formed about rib 7 in the portion that is brazed 20.Thus, it is being brazed the situation that portion 20 is made up of curved surface as in the present embodiment
Under, solder during soldering can be reliably prevented using rib 7 and drip from the portion that is brazed 20.In addition, for example in the portion that is brazed 20 by putting down
In the case that face is constituted, using rib 7, the extension of solder during soldering can be limited in desired scope.Therefore, it is possible to more
Reliably only form heat dissipation film 5 in the portion that is brazed 20.
Additionally, this invention is not limited to above-mentioned embodiment, be capable of deformation in the range of the purpose of the present invention, improvement
Also it is contained in the present invention.
In the above-described embodiment, the heat dissipation film forming method of the present invention is applied to the aerofluxuss as exhaust system component
In menifold 2, but it is not limited to this.For example, the radiating of the present invention can both be applied in the part beyond exhaust system component
Film forming method is it is also possible to as the turbocharger of exhaust system component or the catalyst application present invention.
Claims (3)
1. a kind of heat dissipation film forming method forming heat dissipation film, it has following operation：
Make the pricker higher than the firing temperature of this radiating Liniment with fusing point of the radiating Liniment with silicon dioxide as main component
It is fired after flitch contact, thus forming heat dissipation film on described solder plate, and
The solder plate being formed with described heat dissipation film is configured to being brazed in portion of part and carries out soldering, thus on the part
Form heat dissipation film.
2. heat dissipation film forming method according to claim 1, wherein,
Described be brazed portion be formed about rib.
3. heat dissipation film forming method according to claim 1 and 2, wherein,
Described part is the exhaust system component of internal combustion engine.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-154464 | 2015-08-04 | ||
| JP2015154464A JP2017031921A (en) | 2015-08-04 | 2015-08-04 | Heat radiation film formation method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106424995A true CN106424995A (en) | 2017-02-22 |
| CN106424995B CN106424995B (en) | 2018-11-06 |
Family
ID=57987046
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610556642.9A Active CN106424995B (en) | 2015-08-04 | 2016-07-14 | Heat dissipation film forming method |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2017031921A (en) |
| CN (1) | CN106424995B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58163820A (en) * | 1982-03-19 | 1983-09-28 | Daido Steel Co Ltd | Slide member |
| CN1201241A (en) * | 1997-03-12 | 1998-12-09 | 同和矿业株式会社 | Metal-ceramic composition chip, production method therefor, and soldering material for said method |
| CN1257554A (en) * | 1997-05-24 | 2000-06-21 | 奥迪股份公司 | Motor vehicle component for exhaust gas routing |
| CN1308181A (en) * | 1999-10-20 | 2001-08-15 | 德古萨－于尔斯股份公司 | Muffler with catalytic device for two-stroke engine and its catalytic device |
| US20100269939A1 (en) * | 2007-11-28 | 2010-10-28 | Ibiden Co., Ltd. | Exhaust pipe |
-
2015
- 2015-08-04 JP JP2015154464A patent/JP2017031921A/en active Pending
-
2016
- 2016-07-14 CN CN201610556642.9A patent/CN106424995B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58163820A (en) * | 1982-03-19 | 1983-09-28 | Daido Steel Co Ltd | Slide member |
| CN1201241A (en) * | 1997-03-12 | 1998-12-09 | 同和矿业株式会社 | Metal-ceramic composition chip, production method therefor, and soldering material for said method |
| CN1257554A (en) * | 1997-05-24 | 2000-06-21 | 奥迪股份公司 | Motor vehicle component for exhaust gas routing |
| CN1308181A (en) * | 1999-10-20 | 2001-08-15 | 德古萨－于尔斯股份公司 | Muffler with catalytic device for two-stroke engine and its catalytic device |
| US20100269939A1 (en) * | 2007-11-28 | 2010-10-28 | Ibiden Co., Ltd. | Exhaust pipe |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2017031921A (en) | 2017-02-09 |
| CN106424995B (en) | 2018-11-06 |
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