CN106410407A - Antenna device having electromagnetic shielding - Google Patents
Antenna device having electromagnetic shielding Download PDFInfo
- Publication number
- CN106410407A CN106410407A CN201611082156.4A CN201611082156A CN106410407A CN 106410407 A CN106410407 A CN 106410407A CN 201611082156 A CN201611082156 A CN 201611082156A CN 106410407 A CN106410407 A CN 106410407A
- Authority
- CN
- China
- Prior art keywords
- electromagnetic shielding
- groove
- antenna assembly
- radio
- electrically connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
- H01Q1/526—Electromagnetic shields
Abstract
The invention provides an antenna device having electromagnetic shielding. The antenna device includes an intermediary support plate, having an upper surface and a lower surface which are opposite; a groove located on the upper surface; a flip silicon chip located in the groove and having two radio frequency elements; and a grounding layer which is located on the lower surface and is separated into two parts by a lower conductive pattern of the lower surface, the two radio frequency elements being electrically connected to the two parts of the grounding layer. The antenna device having electromagnetic shielding can reduce electromagnetic interference between the two radio frequency elements to the greatest extent by utilization of the separated grounding layer, and utilizes a conductive layer of a side face of the support plate to perform secondary electromagnetic shielding, thereby further weakening electromagnetic interference of the outside world; and the silicon chip is provided with an isolation trench, thereby preventing electromagnetic coupling inside the two radio frequency elements.
Description
Technical field
The present invention relates to a kind of IC apparatus, espespecially it is related to a kind of antenna assembly having and preventing electromagnetic interference.
Background technology
The development of radio communications system leads to receiver and/or transmitter chain to be implemented in integrated circuit form.Known
Example be for portable mobile radio (RF) transceiver circuit, satellite communication microwave receiver, WLAN RF
(WLAN RF) circuit etc..
Typical reception of double polarization chain has radio frequency sending set and receiver circuit.Because two receiver chain needs are same
When operation, so interference between two receiver chains and electromagnetic coupled should minimize in order to avoid unwanted inter-modulated signal reality
Existing optimum operation.
When being provided with integrated circuit form, circuit comprises the agitator with integrated inductor.Because inductance and coil are
Electromagnetic radiating elements, so may have electromagnetic coupled and interference between them.In order to reduce two receivers of integrated circuit
Coupling between chain, it is known to use：
Big distance on silicon chip is to reduce and the coupling of agitator；Two independent circuit；It is used for high frequency with inverted structure
Application, because this can reduce electromagnetic coupled by being avoided wire bonding；It is well known, however, that method typically result in integrated circuit
Circuit area increases and it is thus desirable to bigger encapsulation.
Further, since operating frequency increases, isolation is weakened.As a result, for the insulation request of some frequency applications, for example
Satellite communication is it is impossible to easily be met by known method.For example, for satellite communication, receive for dual-polarized two
Between chain, isolation should be at least in 12GH60dB.However, the typical isolation performance in traditional encapsulated circuit be
12GHz about 45dB.
Content of the invention
Based on solving the problems, such as in above-mentioned encapsulation, the invention provides a kind of antenna assembly with electromagnetic shielding, including：
Intermediary's support plate, has relative upper and lower surface；Groove positioned at described upper surface；Upside-down mounting silicon in described groove
Chip, described silicon has two radio-frequency (RF) component；Positioned at the ground plane of described lower surface, described ground plane is by described following table
The lower conductive pattern in face is divided into two parts, and described two radio-frequency (RF) component are electrically connected respectively to two parts of described ground plane.
According to embodiments of the invention, described silicon has the isolated groove isolating described two radio-frequency (RF) component.
According to embodiments of the invention, described isolated groove is more than the full-size of described two radio-frequency (RF) component.
According to embodiments of the invention, described isolated groove is filled with isolated substance.
According to embodiments of the invention, described groove bottom wall and side wall have conductive pattern, and described two radio-frequency (RF) component are led to
Cross ground plane and the conductive pattern that described conductive pattern is electrically connected to described lower surface.
According to embodiments of the invention, described intermediary support plate has conductive through hole.
According to embodiments of the invention, the conductive pattern of the diapire of described groove is electrically connected with described conductive through hole, described
Conductive through hole is electrically connected with the conductive pattern of described lower surface.
According to embodiments of the invention, the side of described intermediary support plate has conductive layer, is electrically connected to described ground plane.
Technical scheme, the electromagnetism that can farthest be reduced using the ground plane separating between two radio-frequency (RF) component is done
Disturb, and carry out secondary electromagnetic shielding using the conductive layer of the side of support plate, weaken the electromagnetic interference in the external world further；In silicon core
Piece arranges isolated groove, prevents the electromagnetic coupled within two radio-frequency (RF) component.
Brief description
Fig. 1 is the profile of inventive antenna device；
Fig. 2 is the top view of inventive antenna device.
Specific embodiment
Referring to Fig. 1, the invention provides a kind of antenna assembly with electromagnetic shielding, including：Intermediary's support plate 1, has phase
To upper and lower surface；Groove 2 positioned at described upper surface；Upside-down mounting silicon 3 in described groove 2, described silicon
Chip 3 has two radio-frequency (RF) component 4,5；Positioned at the ground plane of described lower surface, described ground plane is by under described lower surface
Conductive pattern 10 is divided into two parts, and described two radio-frequency (RF) component 4,5 are electrically connected respectively to two parts of described ground plane.
Referring to Fig. 2, described silicon 1 has the isolated groove 8 isolating described two radio-frequency (RF) component 4,5, described isolating trenches
Groove 8 is more than the full-size of described two radio-frequency (RF) component, and described isolated groove 8 is filled with isolated substance.
Described groove 2 diapire and side wall have conductive pattern 6, and described two radio-frequency (RF) component 4,5 pass through conducting sphere 7 and described
Conductive pattern 6 is electrically connected to ground plane and the conductive pattern 10 of described lower surface.
Described intermediary support plate 1 has conductive through hole 11.Conductive pattern 6 and the described conductive through hole of the diapire of described groove 2
11 electrical connections, described conductive through hole 11 is electrically connected with the conductive pattern 10 of described lower surface.Described upper surface has upper conductive layer
Described in 12, the side of intermediary's support plate 1 has conductive layer 9, is electrically connected to described ground plane.
Finally it should be noted that：Obviously, above-described embodiment is only intended to clearly illustrate example of the present invention, and simultaneously
The non-restriction to embodiment.For those of ordinary skill in the field, can also do on the basis of the above description
Go out change or the variation of other multi-forms.There is no need to be exhaustive to all of embodiment.And thus drawn
Obvious change that Shen goes out or change among still in protection scope of the present invention.
Claims (8)
1. a kind of antenna assembly with electromagnetic shielding, including：Intermediary's support plate, has relative upper and lower surface；It is located at
The groove of described upper surface；Upside-down mounting silicon in described groove, described silicon has two radio-frequency (RF) component；Positioned at institute
State the ground plane of lower surface, described ground plane is divided into two parts by the lower conductive pattern in described lower surface, described two radio frequencies
Element is electrically connected respectively to two parts of described ground plane.
2. the antenna assembly with electromagnetic shielding according to claim 1 is it is characterised in that described silicon has isolation
The isolated groove of described two radio-frequency (RF) component.
3. the antenna assembly with electromagnetic shielding according to claim 2 is it is characterised in that described isolated groove is more than institute
State the full-size of two radio-frequency (RF) component.
4. the antenna assembly with electromagnetic shielding according to claim 2 is it is characterised in that described isolated groove is filled with
Isolated substance.
5. the antenna assembly with electromagnetic shielding according to claim 1 is it is characterised in that described groove bottom wall and side wall
There is conductive pattern, described two radio-frequency (RF) component are electrically connected to ground plane and the conduction of described lower surface by described conductive pattern
Pattern.
6. the antenna assembly with electromagnetic shielding according to claim 1 is it is characterised in that described intermediary support plate has leads
Electric through-hole.
7. the antenna assembly with electromagnetic shielding according to claim 6 is it is characterised in that the leading of the diapire of described groove
Electrical pattern is electrically connected with described conductive through hole, and described conductive through hole is electrically connected with the conductive pattern of described lower surface.
8. the antenna assembly with electromagnetic shielding according to claim 5 is it is characterised in that the side of described intermediary support plate
There is conductive layer, be electrically connected to described ground plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611082156.4A CN106410407A (en) | 2016-11-30 | 2016-11-30 | Antenna device having electromagnetic shielding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611082156.4A CN106410407A (en) | 2016-11-30 | 2016-11-30 | Antenna device having electromagnetic shielding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106410407A true CN106410407A (en) | 2017-02-15 |
Family
ID=58084941
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611082156.4A Pending CN106410407A (en) | 2016-11-30 | 2016-11-30 | Antenna device having electromagnetic shielding |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106410407A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019117692A1 (en) | 2017-12-15 | 2019-06-20 | Samsung Electronics Co., Ltd. | Electronic device having interference shielding structure |
| CN115020971A (en) * | 2022-05-31 | 2022-09-06 | 复旦大学 | Integrated antenna for wireless interconnection between chips and manufacturing method thereof |
| CN115020970A (en) * | 2022-05-31 | 2022-09-06 | 复旦大学 | Antenna system for wireless interconnection between chips and manufacturing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1265225A (en) * | 1997-05-23 | 2000-08-30 | 艾利森电话股份有限公司 | Integrated circuit, components thereof and mfg. method |
| CN102275861A (en) * | 2010-06-01 | 2011-12-14 | 欧姆龙株式会社 | Semiconductor device and microphone |
| CN104425460A (en) * | 2013-09-11 | 2015-03-18 | 恩智浦有限公司 | Integrated circuit |
-
2016
- 2016-11-30 CN CN201611082156.4A patent/CN106410407A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1265225A (en) * | 1997-05-23 | 2000-08-30 | 艾利森电话股份有限公司 | Integrated circuit, components thereof and mfg. method |
| CN102275861A (en) * | 2010-06-01 | 2011-12-14 | 欧姆龙株式会社 | Semiconductor device and microphone |
| CN104425460A (en) * | 2013-09-11 | 2015-03-18 | 恩智浦有限公司 | Integrated circuit |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019117692A1 (en) | 2017-12-15 | 2019-06-20 | Samsung Electronics Co., Ltd. | Electronic device having interference shielding structure |
| KR20190072024A (en) * | 2017-12-15 | 2019-06-25 | 삼성전자주식회사 | Electronic device having electromagnetic interference shielding structure |
| CN111480399A (en) * | 2017-12-15 | 2020-07-31 | 三星电子株式会社 | Electronic device with interference shielding structure |
| EP3666048A4 (en) * | 2017-12-15 | 2020-11-04 | Samsung Electronics Co., Ltd. | Electronic device having interference shielding structure |
| US10905037B2 (en) | 2017-12-15 | 2021-01-26 | Samsung Electronics Co., Ltd. | Electronic device having interference shielding structure |
| KR102435019B1 (en) * | 2017-12-15 | 2022-08-22 | 삼성전자주식회사 | Electronic device having electromagnetic interference shielding structure |
| CN111480399B (en) * | 2017-12-15 | 2023-07-04 | 三星电子株式会社 | Electronic device with interference shielding structure |
| CN115020971A (en) * | 2022-05-31 | 2022-09-06 | 复旦大学 | Integrated antenna for wireless interconnection between chips and manufacturing method thereof |
| CN115020970A (en) * | 2022-05-31 | 2022-09-06 | 复旦大学 | Antenna system for wireless interconnection between chips and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170215 |
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| RJ01 | Rejection of invention patent application after publication |