CN106385652A - Earphone minisize loudspeaker assembly - Google Patents
Earphone minisize loudspeaker assembly Download PDFInfo
- Publication number
- CN106385652A CN106385652A CN201611099917.7A CN201611099917A CN106385652A CN 106385652 A CN106385652 A CN 106385652A CN 201611099917 A CN201611099917 A CN 201611099917A CN 106385652 A CN106385652 A CN 106385652A
- Authority
- CN
- China
- Prior art keywords
- voice coil
- hole
- diaphragm
- earphone
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000000712 assembly Effects 0.000 claims description 11
- 238000000429 assembly Methods 0.000 claims description 11
- 239000003292 glue Substances 0.000 abstract description 7
- 230000001681 protective effect Effects 0.000 abstract 1
- FPWNLURCHDRMHC-UHFFFAOYSA-N 4-chlorobiphenyl Chemical compound C1=CC(Cl)=CC=C1C1=CC=CC=C1 FPWNLURCHDRMHC-UHFFFAOYSA-N 0.000 description 6
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 230000003090 exacerbative effect Effects 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/1091—Details not provided for in groups H04R1/1008 - H04R1/1083
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/02—Details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/06—Loudspeakers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/10—Details of earpieces, attachments therefor, earphones or monophonic headphones covered by H04R1/10 but not provided for in any of its subgroups
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2400/00—Loudspeakers
- H04R2400/11—Aspects regarding the frame of loudspeaker transducers
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
- Headphones And Earphones (AREA)
Abstract
The invention discloses an earphone minisize loudspeaker assembly. The earphone minisize loudspeaker assembly comprises a basin frame, a diaphragm, a voice coil and a lead. The bottom of the basin frame is provided with a first through hole; a magnet is fixed inside the basin frame; a PCB is fixed on the outer side of the basin frame; the diaphragm is fixed on the rim of the basin frame; a voice coil extending toward the bottom of the basin frame is arranged on the diaphragm; the first terminal of the voice coil lead is electrically connected to the side wall of the voice coil; and the second terminal of the voice coil lead is electrically connected to the PCB after going through a first through hole in a suspending mode. During wire running of the coil, the lead of the voice coil is led out and is not in contact with the diaphragm, coil wire running protective glue does not need to be dispensed, the balance of the diaphragm can be improved and distortion caused by imbalance vibration can be reduced. Meanwhile, the earphone minisize loudspeaker assembly does not increases weight of the diaphragm and greatly improves a tone quality reduction degree.
Description
Technical field
The present invention relates to speaker, more particularly, to a kind of earphone micro-speaker assemblies.
Background technology
In prior art, as shown in figure 1, the voice coil loudspeaker voice coil cabling mode of the Microspeaker used by earphone, typically by lead
After 10 are connected with voice coil loudspeaker voice coil 20, directly pass by from diaphragm 30, and can on diaphragm 30 point protection glue, for anchor leg 10.By
Mode in earphone voice coil leads is passed by from diaphragm 30, and requires point protection glue on diaphragm 30, therefore there is a problem of following：
, increased the imbalance of diaphragm 30 at first point, the vibration exacerbating earphone micro loudspeaker unit is uneven, leads to distortion inclined
Greatly；Second point, increases the quality of vibrational system, leads to the sound radiation pressure of earphone micro loudspeaker unit to reduce, and affects tonequality.
Content of the invention
The technical problem to be solved is：A kind of earphone micro-speaker assemblies are provided, diaphragm can be lifted
Degree of balance, reduce the vibration distortion that leads to of imbalance；The weight of diaphragm vibration system will not be increased simultaneously, improve the sound of earphone
Matter reduction degree.
For solving above-mentioned technical problem, the present invention proposes a kind of earphone micro-speaker assemblies, including：
Frame, the bottom of described frame is provided with first through hole, and the inner side of described frame is fixed with Magnetitum, the outside of described frame
It is fixed with PCB；
Diaphragm, described diaphragm is fixedly installed on the edge of frame, and described diaphragm is provided with the sound extending towards frame bottom direction
Circle；
Voice coil leads, the first end of described voice coil leads is electrically connected with the side wall of described voice coil loudspeaker voice coil, and the second of described voice coil leads
End is electrically connected with PCB after vacantly passing through described first through hole.
Further, described Magnetitum is cylinder, and Magnetitum is provided with second through hole corresponding with described first through hole, institute
The second end stating voice coil leads is vacantly electrically connected with PCB successively through after described second through hole, first through hole.
Further, described PCB is provided with the third through-hole corresponding with described first through hole, and described voice coil loudspeaker voice coil draws
Second end of line is electrically connected with PCB after vacantly passing through described second through hole, first through hole, third through-hole successively.
Technique scheme at least has the advantages that：The present invention adopts the first end of voice coil leads and voice coil loudspeaker voice coil
Side wall is electrically connected with, and the second end of voice coil leads is vacantly passed through and is electrically connected with PCB after first through hole.Voice coil loudspeaker voice coil cabling
When, the extraction of voice coil leads no longer with film contact, voice coil loudspeaker voice coil cabling Protection glue need not be put, the degree of balance of diaphragm can be lifted, fall
The distortion that low vibration imbalance leads to；The weight of diaphragm vibration system will not be increased simultaneously, improve the tonequality reduction degree of earphone.
Brief description
Fig. 1 is the cabling schematic diagram of the voice coil leads of earphone micro-speaker assemblies in prior art.
Fig. 2 is the structure sectional view of embodiment of the present invention earphone micro-speaker assemblies.
Fig. 3 is the Structure explosion diagram of embodiment of the present invention earphone micro-speaker assemblies.
Specific embodiment
It should be noted that in the case of not conflicting, the embodiment in the application and the feature in embodiment can phases
Mutually combine.Below in conjunction with the accompanying drawings the present invention is described further.
As shown in Figure 2 and Figure 3, earphone micro-speaker assemblies of the present invention include frame 1, diaphragm 4, voice coil leads 6, wherein,
The bottom of frame 1 is provided with first through hole 11, is fixed with Magnetitum 2 in the inner side of frame 1, is fixed with PCB in the outside of frame 1
Wiring board 3, specifically, PCB 3 is attached in earphone frame 1 using glue, and Magnetitum 2 is equally bonded in frame 1 using glue
Internal；Diaphragm 4 is fixedly installed on the edge of frame 1, is provided with the voice coil loudspeaker voice coil 5 extending towards frame 1 bottom direction, tool on diaphragm 4
Body ground, earphone voice coil loudspeaker voice coil 5 is pasted onto diaphragm 4, forms sound membrane module, and last sound film resistor is assembled in frame 1 further, forms ear
Machine micro loudspeaker unit body；The first end of voice coil leads 6 is electrically connected with the side wall of voice coil loudspeaker voice coil 5, the second end of voice coil leads 6
It is electrically connected with PCB 3 after vacantly passing through first through hole 11.It is preferred that Magnetitum 2 is designed as cylinder, Magnetitum 2 is provided with
Second through hole 21 corresponding with first through hole 11, the second end of voice coil leads 6 vacantly passes through the second through hole 21, first through hole 11
It is electrically connected with PCB 3 afterwards.Preferably, PCB 3 is provided with the third through-hole 31 corresponding with first through hole 11,
Second end of voice coil leads 6 is electrically connected with PCB 3 after vacantly passing through the second through hole 21, first through hole 11, third through-hole 31
Connect.
To sum up, all have through hole in the centre of frame 1, Magnetitum 2, PCB 3, voice coil leads 6 are directly switched to film
On piece 4.Cabling due to voice coil leads 6 is no longer contacted with diaphragm 4, need not put cabling Protection glue, can lift the balance of diaphragm 4
Degree, reduces the distortion that vibration imbalance leads to, will not increase the weight of diaphragm 4 vibrational system simultaneously, substantially increase earphone
Tonequality reduction degree.
The above is the specific embodiment of the present invention it is noted that for those skilled in the art
For, under the premise without departing from the principles of the invention, some modifications can also be made, these modifications are also considered as the protection of the present invention
Scope.
Claims (3)
1. a kind of earphone micro-speaker assemblies are it is characterised in that include：
Frame, the bottom of described frame is provided with first through hole, and the inner side of described frame is fixed with Magnetitum, the outside of described frame
It is fixed with PCB；
Diaphragm, described diaphragm is fixedly installed on the edge of frame, and described diaphragm is provided with the sound extending towards frame bottom direction
Circle；
Voice coil leads, the first end of described voice coil leads is electrically connected with the side wall of described voice coil loudspeaker voice coil, and the second of described voice coil leads
End is electrically connected with PCB after vacantly passing through described first through hole.
2. the earphone micro-speaker assemblies described in claim 1, it is characterised in that described Magnetitum is cylinder, Magnetitum set
There is second through hole corresponding with described first through hole, the second end of described voice coil leads vacantly passes through described second to lead to successively
It is electrically connected with PCB behind hole, first through hole.
3. the earphone micro-speaker assemblies described in claim 2 it is characterised in that described PCB be provided with described
The corresponding third through-hole of first through hole, the second end of described voice coil leads vacantly passes through described second through hole successively, first leads to
It is electrically connected with PCB behind hole, third through-hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611099917.7A CN106385652A (en) | 2016-12-05 | 2016-12-05 | Earphone minisize loudspeaker assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611099917.7A CN106385652A (en) | 2016-12-05 | 2016-12-05 | Earphone minisize loudspeaker assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106385652A true CN106385652A (en) | 2017-02-08 |
Family
ID=57960025
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611099917.7A Pending CN106385652A (en) | 2016-12-05 | 2016-12-05 | Earphone minisize loudspeaker assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106385652A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107401574A (en) * | 2017-07-12 | 2017-11-28 | 深圳熙斯特新能源技术有限公司 | A kind of mounting structure of electric vehicle controller beam and beam |
| CN108737914A (en) * | 2018-08-15 | 2018-11-02 | 斯贝克电子（嘉善）有限公司 | A kind of loudspeaker and the speaker with the loudspeaker |
| CN109348339A (en) * | 2018-11-02 | 2019-02-15 | 歌尔股份有限公司 | Sounding device and earphone |
| WO2020087754A1 (en) * | 2018-11-02 | 2020-05-07 | 歌尔股份有限公司 | Sound emission device and headset |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201608871U (en) * | 2009-10-30 | 2010-10-13 | 歌尔声学股份有限公司 | Miniature moving coil type electro-acoustic converter |
| CN204014050U (en) * | 2014-07-23 | 2014-12-10 | 音品电子（深圳）有限公司 | A kind of high power Microspeaker |
| CN204948336U (en) * | 2015-07-24 | 2016-01-06 | 歌尔声学股份有限公司 | Microspeaker |
| CN204948337U (en) * | 2015-07-24 | 2016-01-06 | 歌尔声学股份有限公司 | Microspeaker |
| WO2016086756A1 (en) * | 2014-12-02 | 2016-06-09 | 歌尔声学股份有限公司 | Miniature loudspeaker |
-
2016
- 2016-12-05 CN CN201611099917.7A patent/CN106385652A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201608871U (en) * | 2009-10-30 | 2010-10-13 | 歌尔声学股份有限公司 | Miniature moving coil type electro-acoustic converter |
| CN204014050U (en) * | 2014-07-23 | 2014-12-10 | 音品电子（深圳）有限公司 | A kind of high power Microspeaker |
| WO2016086756A1 (en) * | 2014-12-02 | 2016-06-09 | 歌尔声学股份有限公司 | Miniature loudspeaker |
| CN204948336U (en) * | 2015-07-24 | 2016-01-06 | 歌尔声学股份有限公司 | Microspeaker |
| CN204948337U (en) * | 2015-07-24 | 2016-01-06 | 歌尔声学股份有限公司 | Microspeaker |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107401574A (en) * | 2017-07-12 | 2017-11-28 | 深圳熙斯特新能源技术有限公司 | A kind of mounting structure of electric vehicle controller beam and beam |
| CN108737914A (en) * | 2018-08-15 | 2018-11-02 | 斯贝克电子（嘉善）有限公司 | A kind of loudspeaker and the speaker with the loudspeaker |
| CN108737914B (en) * | 2018-08-15 | 2023-11-03 | 斯贝克电子（嘉善）有限公司 | Horn and sound box with same |
| CN109348339A (en) * | 2018-11-02 | 2019-02-15 | 歌尔股份有限公司 | Sounding device and earphone |
| WO2020087754A1 (en) * | 2018-11-02 | 2020-05-07 | 歌尔股份有限公司 | Sound emission device and headset |
| CN109348339B (en) * | 2018-11-02 | 2024-03-08 | 歌尔股份有限公司 | Sound generating device and earphone |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20200828 Address after: No.18 Dayuan Road, No.14 Jiujing team, Nanfeng Town, Fengkai County, Zhaoqing City, Guangdong Province 526500 Applicant after: FENGKAI RUIGUAN TECHNOLOGY Co.,Ltd. Address before: 518000 Guangdong city in Shenzhen Province, Baoan District Whampoa manhole Street Taipa Zi Dong Industrial Zone B Applicant before: SHENZHEN REGWIN TECHNOLOGY Co.,Ltd. |
|
| TA01 | Transfer of patent application right | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170208 |
|
| RJ01 | Rejection of invention patent application after publication |