CN106384744B - Method for manufacturing organic light emitting display device - Google Patents

Method for manufacturing organic light emitting display device Download PDF

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Publication number
CN106384744B
CN106384744B CN201611010104.6A CN201611010104A CN106384744B CN 106384744 B CN106384744 B CN 106384744B CN 201611010104 A CN201611010104 A CN 201611010104A CN 106384744 B CN106384744 B CN 106384744B
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layer
pixel
organic light
opening
openings
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CN106384744A (en
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刘世奇
刘伟
任思雨
苏君海
李建华
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Truly Huizhou Smart Display Ltd
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Truly Huizhou Smart Display Ltd
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/1201Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/122Pixel-defining structures or layers, e.g. banks

Abstract

The present invention relates to an organic light emitting display device and a method of manufacturing the same, the organic light emitting display device including: a circuit layer; an anode layer disposed on the circuit layer; at least part of the pixel defining layer is attached to the anode layer, the pixel defining layer is provided with a plurality of pixel ports, the pixel ports are aligned to the anode layer, pixel blocks are filled in the pixel ports, and the pixel blocks are arranged on the anode layer; the supporting layer is arranged on the pixel defining layer, a plurality of openings are formed in the supporting layer, the openings are aligned to the pixel openings, and the openings are larger than the pixel openings; and a cathode layer disposed on the support layer. Through directly forming the supporting layer on pixel definition layer for the area of this supporting layer is bigger, effectively supports the apron, can effectively avoid display screen to produce the mar easily under low grey scale, makes display effect better.

Description

Method for manufacturing organic light emitting display device
Technical Field
The present invention relates to the field of organic light emitting technology, and more particularly, to an organic light emitting display device and a method of manufacturing the same.
Background
An AMOLED (Active-matrix organic light emitting diode) display screen has received wide attention from the panel preparation industry due to its advantages of high contrast, high resolution, low power consumption, and fast response speed, and is widely applied to various electronic devices, such as mobile phones, tablets, and computers.
Due to the development of science and technology, people's requirements for display are gradually improved, more favor that the pixels are higher, display more clear display items, therefore, the pixels of the display screen are gradually increased, in the times of pursuing high definition, more complex circuits occupying smaller volumes are needed, and anodes with complex arrangement and high aperture ratio are needed, but the space reserved for the pressure pad is insufficient, the area of the pressure pad is reduced, the metal mask is difficult to achieve a good supporting effect, the metal mask is caused to scratch an anode layer and pixels, and the display screen is caused to scratch easily under a low gray scale.
Disclosure of Invention
In view of this, there is a need for an organic light emitting display device and a method of fabricating the same.
An organic light emitting display device comprising:
a circuit layer;
an anode layer disposed on the circuit layer;
at least part of the pixel defining layer is attached to the anode layer, the pixel defining layer is provided with a plurality of pixel ports, the pixel ports are aligned to the anode layer, pixel blocks are filled in the pixel ports, and the pixel blocks are arranged on the anode layer;
the supporting layer is arranged on the pixel defining layer, provided with a plurality of openings, aligned to the pixel openings and larger than the pixel openings, and used for supporting a cover plate for packaging the organic light-emitting display device and supporting a mask during evaporation of organic light-emitting materials, wherein the supporting layer is coated on the pixel defining layer; and
a cathode layer disposed on the support layer.
In one embodiment, the thickness of the support layer is 1 μm to 2 μm.
In one embodiment, the pixel defining layer has a thickness of 1 μm to 2 μm.
In one embodiment, the distance between the edge of the opening and the edge of the pixel opening is 2-5 μm.
In one embodiment, the width of the pixel defining layer attached to the anode layer is greater than 1 μm.
A method of manufacturing an organic light emitting display device, comprising:
providing a circuit layer;
forming an anode layer on the circuit layer;
forming a pixel defining layer with a plurality of pixel openings on the anode layer, wherein the pixel openings are aligned with the anode layer, the pixel defining layer is at least partially attached to the anode layer, and the anode layer is at least partially exposed from the pixel openings;
coating a support layer with a plurality of openings on the pixel defining layer, wherein the openings are aligned with the pixel openings and are larger than the pixel openings, the support layer is used for supporting a cover plate for packaging the organic light-emitting display device and is also used for supporting a mask when evaporating organic light-emitting materials;
changing the gradient of the opening of the supporting layer by adopting a UV rinsing mode;
forming a pixel block within the pixel aperture;
a cathode layer is formed on the support layer.
In one embodiment, the thickness of the support layer is 1 μm to 2 μm.
In one embodiment, the pixel defining layer has a thickness of 1 μm to 2 μm.
In one embodiment, the width of the pixel defining layer attached to the anode layer is greater than 1 μm.
In one embodiment, when the edge of the opening is spaced from the edge of the pixel aperture by 2 μm, the slope of the slope portion of the support layer is less than or equal to 20 °; when the edge of the opening is 5 μm away from the edge of the pixel aperture, the slope of the slope portion of the support layer is greater than 20 °.
According to the organic light-emitting display device and the manufacturing method thereof, the supporting layer is directly formed on the pixel defining layer, so that the area of the supporting layer is larger, the cover plate is effectively supported, the display screen can be effectively prevented from being easily scratched under a low gray scale, and the display effect is better.
Drawings
FIG. 1A is a schematic view of a directional structure of an organic light emitting display device according to an embodiment;
FIG. 1B is a schematic diagram of a partial cross-sectional structure of an organic light emitting display device according to an embodiment;
fig. 1C is a schematic partial cross-sectional view of an organic light emitting display device according to an embodiment;
fig. 2 is a flowchart illustrating a method of manufacturing an organic light emitting display device according to an embodiment.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
For example, an organic light emitting display device includes: a circuit layer; an anode layer disposed on the circuit layer; at least part of the pixel defining layer is attached to the anode layer, the pixel defining layer is provided with a plurality of pixel ports, the pixel ports are aligned to the anode layer, pixel blocks are filled in the pixel ports, and the pixel blocks are arranged on the anode layer; the supporting layer is arranged on the pixel defining layer, a plurality of openings are formed in the supporting layer, the openings are aligned to the pixel openings, and the openings are larger than the pixel openings; and a cathode layer disposed on the support layer.
In order to improve the effective supporting effect, for example, each pixel port corresponds to each opening one by one, for example, each opening is correspondingly provided with a pixel block for transmitting light rays of the pixel block; as another example, the opening is similar in shape to the pixel aperture; as another example, the opening is similar to the pixel opening in shape, and the distance between the edge of the opening and the edge of the pixel opening is 2 μm to 5 μm; for example, the distance between the edge of the opening and the edge of the pixel aperture is 3 or 4 μm; as another example, the opening is similar in shape to the pixel block; for example, the pixel block is at a distance of 2 μm to 5 μm, e.g., 3 or 4 μm, from the edge of the opening; for example, the opening, the pixel aperture, and/or the pixel block have a circular, rectangular, or rounded-corner rectangular shape; as another example, the opening, the pixel aperture, and the pixel block have similar circular, rectangular, or rounded-corner rectangular shapes. Therefore, the original point-shaped support can be completely abandoned and replaced by the planar support, a more comprehensive and more effective support effect can be provided, the manufacturing process can be simplified, the application value is high, the cover plate can be effectively supported, and the technical problem that the display screen is easily scratched can be effectively solved.
As shown in fig. 1A and 1B, an organic light emitting display device 10, which is an embodiment, includes: circuit layer 110, anode layer 120, pixel definition layer 130, support layer 150, and cathode layer 160. The anode layer 120 is disposed on the circuit layer 110, the pixel defining layer 130 is provided with a plurality of pixel ports 132, the pixel ports 132 are aligned with the anode layer 120, a portion of the pixel defining layer 130 close to the pixel ports 132 is attached to the anode layer 120, the pixel ports 132 are filled with pixel blocks 140, and the pixel blocks 140 are disposed on the anode layer 120; the support layer 150 is disposed on the pixel defining layer 130, the support layer 150 defines a plurality of openings 152, the openings 152 are aligned with the pixel openings 132, the openings 152 are larger than the pixel openings 132, and the cathode layer 160 is disposed on the cathode layer 160.
In particular, the circuit layer 110 is a circuit portion of the organic light emitting display device 10 for supplying power to the anode layer 120 and the cathode layer 160, for example, the anode layer 120 includes an indium tin oxide layer, for example, the anode layer 120 includes a silver layer, for example, the anode layer 120 includes a first indium tin oxide layer, a silver layer, and a second indium tin oxide layer connected in sequence, for example, the cathode layer 160 includes a magnesium silver alloy layer, and for example, the cathode layer 160 includes a lithium aluminum alloy layer. For example, the anode layer 120 includes a plurality of anodes disposed on the circuit layer 110, for example, the plurality of anodes are disposed at intervals, for example, each anode corresponds to a pixel block 140, for example, each pixel port 132 corresponds to an anode.
The pixel definition layer 130 is used to define or define the position or size of the pixel block 140, the pixel block 140 is located in the blank of the pixel definition layer 130, i.e. the pixel aperture 132, and the position and size of the pixel aperture 132 define the position and size of the pixel block 140. The pixel openings 132 expose corresponding anodes, so that pixel blocks 140 can be formed on the anode layer 120, for example, the area of the pixel openings 132 is smaller than that of the corresponding anodes, for example, the width of the pixel openings 132 is smaller than that of the corresponding anodes, and each pixel opening 132 is aligned with an anode, so that the position of the pixel definition layer 130 close to the pixel opening 132 is covered on the edge of the anode layer 120.
The pixel block 140 is, for example, a light emitting pixel block, the pixel block 140 emits light under the voltage, the pixel block 140 is made of an organic material, for example, the pixel block 140 includes an electron transporting material, a hole transporting material, and a light emitting layer, for example, the pixel block 140 includes a fluorescent dye compound, for example, the pixel block 140 includes an aromatic amine compound, for example, the pixel block 140 includes a fluorescent host material and a fluorescent dopant. The pixel blocks 140 include green, red and blue pixel blocks 140, and the pixel blocks 140 are spaced apart from each other, for example, the pixel defining layer 130 is disposed between the pixel blocks 140, and the organic light emitting display device 10 displays various colors by a combination of the pixel blocks 140 of different colors. For example, the pixel defining layer 130 is a polyimide layer, and the material of the pixel defining layer 130 is Polyimide (PI), for example.
Specifically, the supporting layer 150 is used for supporting a cover plate for encapsulating the organic light emitting display device 10 and also used for supporting a MASK (MASK) during evaporation of an organic light emitting material, the supporting layer 150 is a PS (Photo Spacer, also called Spacer or gap control material) layer, for example, the supporting layer 150 is a polyimide layer, for example, the material of the supporting layer 150 is polyimide.
For example, the area of the opening 152 is larger than the area of the pixel opening 132, for example, the aperture of the opening 152 is larger than the aperture of the pixel opening 132, and for another example, the area of the cross section of the opening 152 is larger than the area of the cross section of the pixel opening 132, and the pixel opening 132 is entirely located in the projection area of the corresponding opening 152, so that the support layer 150 does not cover the pixel block 140 because the opening 152 of the support layer 150 is larger than the pixel opening 132, and the support layer 150 does not affect the light emission of the pixel block 140.
By directly forming the supporting layer 150 on the pixel defining layer 130, since the supporting layer 150 completely covers the pixel defining layer 130 and only exposes the pixel opening 132 at the opening 152, the area of the supporting layer 150 is larger, the cover plate is effectively supported, scratches can be effectively avoided, and the display effect of the organic light emitting display device 10 is better.
In order to better support the cover plate, in an embodiment, the thickness of the support layer 150 is 1 μm to 2 μm, for example, the thickness of the support layer 150 is 1 μm, for example, the thickness of the support layer 150 is 2 μm, for example, the thickness of the support layer 150 is 1.5 μm, it is worth mentioning that the thickness of the support layer 150 is not too large, and the thickness of the support layer 150 is too large, so that the evaporated cathode is easily broken at a large drop height to cause the breaking of the cathode layer 160, and the thickness of the support layer 150 is not too small, and the thickness of the support layer 150 is too small, so that the cover plate cannot be well supported, and therefore, in this embodiment, the thickness of the support layer 150 is preferably 1 μm to 2 μm, so that the breaking of the cathode layer 160 can be effectively avoided, and the cover plate can be well supported.
In order to further improve the yield of the organic light emitting display device 10, in one embodiment, the thickness of the pixel defining layer 130 is 1 μm to 2 μm. For example, the thickness of the pixel defining layer 130 is 1 μm, for example, the thickness of the pixel defining layer 130 is 2 μm, preferably, the thickness of the pixel defining layer 130 is 1.5 μm, it should be mentioned that the thickness of the pixel defining layer 130 is not too large, the thickness of the pixel defining layer 130 is too large, the cathode layer 160 is easily broken due to the large drop, the thickness of the pixel defining layer 130 is not too small, the thickness of the pixel defining layer 130 is too small, the limiting effect on the pixel block 140 is easily poor, the pixel block 140 is formed outside the pixel hole 132, the evaporation effect of the cathode layer 160 is poor, and the display effect of the organic light emitting display device 10 is poor, therefore, in this embodiment, the thickness of the pixel defining layer 130 is preferably 1 μm to 2 μm, on one hand, the cathode layer 160 can be effectively prevented from being broken, on the other hand, the evaporation effect of the cathode layer 160 is better, thereby increasing the yield of the organic light emitting display device 10.
For example, the thickness of the pixel block 140 is smaller than the thickness of the pixel defining layer 130, for example, the thickness of the pixel block 140 is 1 μm, the thickness of the pixel block 140 is not preferably larger than the thickness of the pixel defining layer 130, and if the thickness of the pixel block 140 is larger than the thickness of the pixel defining layer 130, the pixel block 140 is made to overflow the pixel opening 132 during the vapor deposition, which affects the vapor deposition of the cathode layer 160, and the light emitting display effect of the pixel block 140 is poor.
In order to further improve the yield of the organic light emitting display device 10, in one embodiment, as shown in fig. 1C, the distance D between the edge of the opening 152 and the edge of the pixel opening 132 is 2 μm to 5 μm. It should be noted that if the opening 152 is too large, the area of the supporting layer 150 will be reduced, which will result in poor supporting effect of the supporting layer 150, and if the opening 152 is too small, the edge of the opening 152 is too close to the edge of the pixel opening 132, and the supporting layer 150 will easily affect the light emitting effect of the pixel block 140, therefore, in this embodiment, the distance between the edge of the opening 152 and the edge of the pixel opening 132 is 2 μm to 5 μm, which makes the supporting effect of the supporting layer 150 better on one hand, and avoids affecting the light emitting effect of the pixel block 140 on the other hand.
For example, as shown in fig. 1C, the supporting layer 150 is provided with an inclined portion 154 at a position close to the opening 152, for example, the opening 152 of the supporting layer 150 is provided with an inclined portion 154, the inclined portion 154 has a certain slope, which is an included angle between the surface of the inclined portion 154 and the surface of the pixel defining layer 130, the inclined portion 154 can provide a transition for the cathode layer 160, and prevent the cathode layer 160 from being broken due to an excessively large drop during evaporation, in one embodiment, when the slope of the inclined portion 154 of the supporting layer 150 is less than or equal to 20 °, a distance D between an edge of the opening 152 and an edge of the pixel opening 132 is 2 μm, in this embodiment, since the slope of the inclined portion 154 is relatively gentle, the position of the supporting layer 150 close to the opening 152 has a small drop, so that a small drop is formed by the opening 152 and the pixel opening 132, and the cathode layer 160 is not, therefore, the distance D between the edge of the opening 152 and the edge of the pixel aperture 132 is 2 μm; in one embodiment, when the slope 154 of the supporting layer 150 is greater than 20 °, the distance D between the edge of the opening 152 and the edge of the pixel aperture 132 is 5 μm, in this embodiment, since the slope 154 is greater, the distance between the supporting layer 150 and the pixel defining layer 130 is greater, and the distance between the edge of the opening 152 and the edge of the pixel aperture 132 needs to be increased, so that the distance between the edge of the supporting layer 150 and the pixel defining layer 130 and the distance between the edge of the pixel defining layer 130 and the pixel block 140 are separated, and the distance between the edge of the opening 152 and the edge of the pixel aperture 132 is 5 μm, so that the step-by-step difference of the cathode layer 160 is transited, and the cathode layer 160 is prevented from being broken due to the excessively large difference, thereby further improving the yield of the organic light emitting display device 10.
In order to improve the display effect of the organic light emitting display device 10, in an embodiment, as shown in fig. 1C, the width L of the pixel defining layer 130 attached to the anode layer 120 is greater than 1 μm, for example, the width L of the portion of the pixel defining layer 130 attached to the anode layer 120 is greater than 1 μm. Specifically, the pixel definition layer 130 needs to cover the anode of the anode layer 120, so that the pixel block 140 can be completely defined and aligned with the anode, and the abnormal brightness phenomenon of the pixel block 140 can be prevented, preferably, the width of the pixel definition layer 130 attached to the anode layer 120 is 1 μm to 2 μm, it should be understood that the width of the portion of the pixel definition layer 130 attached to the anode is not too large, and too large, which results in a smaller area of the anode leakage, and the area of the pixel opening 132 is also smaller, which results in a smaller area of the pixel block 140, and affects the display effect, therefore, the width of the portion of the pixel definition layer 130 attached to the anode layer 120 is preferably 1 μm to 2 μm, which can effectively prevent the abnormal brightness of the pixel block 140, and can make the area of the pixel block 140 larger, and the display effect better.
As shown in fig. 2, a method for manufacturing an organic light emitting display device according to an embodiment includes:
step 202, a circuit layer is provided.
In particular, the circuit layer is a circuit portion of the organic light emitting display device for supplying power to the anode layer and the cathode layer.
An anode layer is formed over the circuit layer, step 204.
For example, the anode layer is formed on the circuit layer by evaporation, for example, indium tin oxide is evaporated on the circuit layer to form the anode layer, and for example, silver is evaporated on the circuit layer to form the anode layer, for example, indium tin oxide, silver and indium tin oxide are sequentially evaporated on the circuit layer to form the anode layer, and for example, a first indium tin oxide layer, a silver layer and a second indium tin oxide layer are sequentially evaporated on the circuit layer to form the anode layer. For example, an anode layer including a plurality of anodes is formed on the circuit layer by vapor deposition, and the plurality of anodes are provided at intervals.
Step 206, forming a pixel definition layer having a plurality of pixel openings on the anode layer, wherein the pixel openings are aligned with the anode layer, the pixel definition layer is at least partially attached to the anode layer, and the anode layer is at least partially exposed from the pixel openings.
For example, a polyimide layer is coated on the anode layer to form a pixel defining layer, and an exposure and development method is adopted to form pixel openings on the pixel defining layer, where each pixel opening is aligned with an anode of the anode layer, and the pixel defining layer is partially attached to the anode of the anode layer, i.e., the width of the pixel opening is smaller than the width of the anode, and the anode of the anode layer is exposed out of the pixel opening.
In order to accelerate the formation of the pixel defining layer, for example, after the pixel defining layer is formed by coating polyimide on the anode layer, the pixel defining layer is cured by heating, so that the curing and molding of the pixel defining layer can be accelerated.
Step 208, a support layer having a plurality of openings is formed on the pixel defining layer, wherein the openings are aligned with the pixel openings and are larger than the pixel openings.
For example, a support layer is formed on the pixel defining layer by a coating method, for example, a support layer is formed by coating polyimide on the pixel defining layer, for example, the support layer having a plurality of openings is formed by coating polyimide on the pixel defining layer and exposing and developing the polyimide on the pixel defining layer. For example, polyimide is coated on the pixel defining layer, and the polyimide on the pixel defining layer is exposed and developed with UV rays to form a support layer having an opening.
In order to accurately form the support layer and prevent the support layer from covering the pixel openings, for example, the polyimide on the pixel defining layer is exposed and developed by UV rays according to a particle (mask) which is used for defining the shape of the support layer, the particle has a predetermined shape, the particle has a plurality of predetermined leak holes, each leak hole is aligned with one pixel opening of the pixel support layer, and the area of the leak hole is larger than that of the pixel opening, so that the support layer is formed according to the shape of the particle, the support layer after being exposed and developed has a plurality of openings, each opening of the support layer is aligned with one pixel opening, and the area of the opening is larger than that of the pixel opening. The supporting layer can be formed according to the pattern of the particle, so that the supporting layer is formed more accurately, the supporting layer can be effectively prevented from covering the pixel port, and the yield of the organic light-emitting display device is effectively improved.
In order to accelerate the formation of the support layer, for example, after the pixel defining layer is coated with polyimide to form the support layer, the support layer is cured by heating, so that the curing and molding of the support layer can be accelerated.
Step 210, forming a pixel block within the pixel aperture.
Specifically, in this step, a pixel block is formed in the pixel port through the opening of the support layer, for example, an organic light emitting material is filled in the pixel port through the opening of the support layer to form a pixel block, and for example, an organic light emitting material is deposited in the pixel port to form a pixel block.
For example, the organic light emitting material includes an electron transporting material, a hole transporting material, and a light emitting layer, for example, the organic light emitting material includes a fluorescent dye compound, for example, the organic light emitting material includes an aromatic amine compound, for example, the organic light emitting material includes a fluorescent host material and a fluorescent dopant. The pixel blocks are formed to include a green pixel block, a red pixel block and a blue pixel block, the pixel blocks are arranged at intervals, and the pixel blocks are spaced from each other due to the pixel definition layer between the pixel blocks, so that the organic light emitting display device displays various colors through the combination of the pixel blocks of different colors.
In order to enable pixel blocks to be accurately formed within pixel ports, for example, pixel blocks are formed within the pixel ports according to a MASK (MASK), and for example, pixel blocks are formed within the pixel ports according to a MASK (MASK) by evaporating an organic light emitting material. Specifically, in this embodiment, before the organic light emitting material is evaporated, the mask is placed on the support layer, the support layer can effectively support the mask, the support layer supports the mask when the organic light emitting material is evaporated, the mask has a preset pattern, that is, the preset pattern of the mask defines the formation position and the shape of the pixel block, so that the organic material is evaporated in the pixel port according to the mask to form the pixel block, the pixel block can be accurately formed in the pixel port, and further the yield of the organic light emitting display device is higher.
For example, the mask is made of titanium alloy, and the area of the supporting layer is large enough, so that effective support and protection can be provided, the pixel block can be prevented from being scratched by the mask, and the display effect is better.
A cathode layer is formed on the support layer, step 212.
For example, the cathode layer is formed on the support layer by evaporation, for example, a magnesium-silver alloy is evaporated on the support layer to form the cathode layer, and for example, a lithium-aluminum alloy is evaporated on the support layer to form the cathode layer, for example, magnesium metal and silver metal are sequentially evaporated on the support layer to form the cathode layer.
Specifically, the cathode layer formed by evaporation is attached to the support layer, and a part of the cathode layer is attached to a part of the pixel definition layer through the opening of the support layer and is attached to the pixel block through the pixel opening of the pixel definition layer, that is, the pixel block is connected to the cathode layer.
In the above embodiment, the supporting layer is directly formed on the pixel defining layer, and the supporting layer completely covers the pixel defining layer, and only the pixel opening is exposed at the opening, so that the area of the supporting layer is larger, the cover plate is effectively supported, scratches can be effectively avoided, and the display effect of the organic light emitting display device is better.
For example, the manufacturing method of the organic light emitting display device is used for preparing the organic light emitting display device according to any embodiment of the present specification, and for example, the manufacturing method includes corresponding steps for implementing each technical feature in the organic light emitting display device according to any embodiment of the present specification.
In one embodiment, the thickness of the support layer is 1 μm to 2 μm.
For example, a polyimide layer with a thickness of 1 μm to 2 μm is coated on the pixel definition layer to form a support layer, and an opening is formed in the support layer by an exposure and development method, it should be understood that the thickness of the support layer should not be too large, and the too large thickness of the support layer may easily cause the cathode to be broken at a large drop, resulting in the breaking of the cathode layer, and the too small thickness of the support layer may not well support the cover plate, and may not well support the mask when the organic light emitting material is evaporated, therefore, in this embodiment, the thickness of the support layer is preferably 1 μm to 2 μm, which may effectively avoid the breaking of the cathode layer, and may well support the mask, avoid scratching the pixel block of the mask, and may well support the cover plate.
In one embodiment, the pixel defining layer has a thickness of 1 μm to 2 μm.
For example, polyimide with a thickness of 1 μm to 2 μm is coated on the anode layer to form a pixel defining layer. It should be noted that the thickness of the pixel defining layer is not too large, and the thickness of the pixel defining layer is too large, which may cause the cathode layer to be broken during evaporation due to a large drop, and the thickness of the pixel defining layer is not too small, and the thickness of the pixel defining layer is too small, which may cause the limiting effect on the pixel block to be poor, so that the pixel block is formed outside the pixel opening, which may cause the evaporation effect of the cathode layer to be poor, and further may cause the display effect of the organic light emitting display device to be poor.
For example, an organic light emitting material having a thickness of 1 μm is deposited in a pixel opening to form a pixel block, and for example, an organic light emitting material having a thickness smaller than that of a pixel defining layer is deposited in a pixel opening to form a pixel block, the thickness of the pixel block is preferably not larger than that of the pixel defining layer.
In one embodiment, the width of the pixel defining layer attached to the anode layer is greater than 1 μm.
For example, a polyimide is coated on the anode layer to form a pixel defining layer, an exposure development method is adopted to form a pixel opening on the pixel defining layer, the pixel defining layer is partially attached on the anode of the anode layer, i.e. the width of the pixel opening is smaller than the width of the anode, the width of the portion of the pixel defining layer attached on the anode layer is larger than 1 μm,
specifically, the pixel definition layer needs to cover the anode of the anode layer, so as to enable the pixel block to be completely limited and aligned with the anode, and prevent the abnormal brightness phenomenon of the pixel block, preferably, the width of the pixel definition layer attached to the anode layer is 1 μm to 2 μm, it should be understood that the width of the portion of the pixel definition layer attached to the anode is not too large, and too large results in a smaller area of the anode leakage, and the area of the pixel opening is also smaller, resulting in a smaller area of the pixel block, which affects the display effect, therefore, the width of the portion of the pixel definition layer attached to the anode layer is preferably 1 μm to 2 μm, which can effectively prevent the abnormal brightness of the pixel block, and can enable the area of the pixel block to be larger, and the display effect to be better.
In one embodiment, the slope of the openings of the support layer is varied using a UV rinse.
For example, the slope of the opening of the support layer is reduced by using a UV (ultraviolet) bleaching (rinsing) method, specifically, an inclined portion is disposed at a position of the support layer close to the opening, for example, the inclined portion is disposed at the opening of the support layer, and has a certain slope, which is an included angle between a surface of the inclined portion and a surface of the pixel definition layer, and the inclined portion can provide a transition for the cathode layer, thereby preventing the cathode layer from being broken due to an excessively large drop during evaporation.
For example, the support layer is UV rinsed using an exposure machine, which is low cost. This exposure machine's angle of illumination can be adjusted, have the characteristics that use is convenient, can adjust the angle of illumination that the open-ended slope to the supporting layer carries out UVblazing (rinsing), and can adjust the UV blazing's to the supporting layer position of shining, and then make the adjustment of the open-ended slope of supporting layer more convenient and accurate, and then make the open-ended slope of supporting layer more unified, make the supporting effect to the cathode layer better, avoid the negative pole more effectively because the drop is great and fracture.
Therefore, in order to avoid the cathode layer from being broken due to a large difference between the support layer and the pixel defining layer during the evaporation, in this embodiment, a UV rinsing method is used to change the slope of the opening of the support layer, so as to avoid the cathode layer from being broken due to an excessively large difference.
In one embodiment, when the distance between the edge of the opening and the edge of the pixel opening is 2 μm, the slope of the inclined portion of the support layer is less than or equal to 20 °, since the edge of the opening is closer to the edge of the pixel opening, the cathode layer needs to continuously face two drops at the edge of the opening, that is, the drop from the support layer to the pixel defining layer, and the drop from the pixel defining layer to the pixel block. In another embodiment, when the distance between the edge of the opening and the edge of the pixel opening is 5 μm, the slope of the inclined portion of the support layer is greater than 20 °, and the difference between the support layer and the pixel defining layer and the difference between the pixel defining layer and the pixel block are separated by a large distance, the cathode layer is not easily broken during evaporation even if the slope of the inclined portion is greater than 20 °, and the yield of the organic light emitting display device can be further improved.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (5)

1. A method of manufacturing an organic light emitting display device, comprising:
providing a circuit layer;
forming an anode layer on the circuit layer;
forming a pixel defining layer with a plurality of pixel openings on the anode layer, wherein the pixel openings are aligned with the anode layer, the pixel defining layer is at least partially attached to the anode layer, and the anode layer is at least partially exposed from the pixel openings;
coating a support layer with a plurality of openings on the pixel defining layer, wherein the openings are aligned with the pixel openings and are larger than the pixel openings, the support layer is used for supporting a cover plate for packaging the organic light-emitting display device and is also used for supporting a mask when evaporating organic light-emitting materials;
an inclined part is arranged at the position, close to the opening, of the supporting layer, and the gradient of the opening of the supporting layer is changed in a UV rinsing mode;
forming a pixel block within the pixel aperture;
a cathode layer is formed on the support layer.
2. The method of manufacturing an organic light emitting display device according to claim 1, wherein the thickness of the support layer is 1 μm to 2 μm.
3. The method of manufacturing an organic light emitting display device according to claim 1, wherein the thickness of the pixel defining layer is 1 μm to 2 μm.
4. The method of manufacturing an organic light emitting display device according to claim 1, wherein the width of the pixel defining layer over the anode layer is greater than 1 μm;
the step of coating and forming a support layer with a plurality of openings on the pixel definition layer comprises;
and coating polyimide on the pixel defining layer, exposing and developing the polyimide on the pixel defining layer by adopting UV rays to form the supporting layer with an opening, and then curing the supporting layer by adopting a heating mode.
5. The method of manufacturing an organic light emitting display device according to claim 1, wherein when the distance between the edge of the opening and the edge of the pixel aperture is 2 μm, the slope of the inclined portion of the support layer is 20 ° or less; when the edge of the opening is 5 μm away from the edge of the pixel aperture, the slope of the slope portion of the support layer is greater than 20 °.
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