CN106383000A - 一种基于单晶体双电光调制实时测量光学材料微观应力的装置及方法 - Google Patents
一种基于单晶体双电光调制实时测量光学材料微观应力的装置及方法 Download PDFInfo
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- CN106383000A CN106383000A CN201610805081.1A CN201610805081A CN106383000A CN 106383000 A CN106383000 A CN 106383000A CN 201610805081 A CN201610805081 A CN 201610805081A CN 106383000 A CN106383000 A CN 106383000A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/25—Measuring force or stress, in general using wave or particle radiation, e.g. X-rays, microwaves, neutrons
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CN201610805081.1A CN106383000B (zh) | 2016-09-01 | 2016-09-01 | 一种基于单晶体双电光调制实时测量光学材料微观应力的装置 |
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CN201610805081.1A CN106383000B (zh) | 2016-09-01 | 2016-09-01 | 一种基于单晶体双电光调制实时测量光学材料微观应力的装置 |
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CN106383000A true CN106383000A (zh) | 2017-02-08 |
CN106383000B CN106383000B (zh) | 2019-09-10 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111380501A (zh) * | 2020-03-25 | 2020-07-07 | 华中科技大学 | 基于双折射晶体视场效应的姿态角实时测量方法及装置 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06317484A (ja) * | 1993-04-30 | 1994-11-15 | Nippon Steel Corp | 微小領域応力測定のためのx線露光方法及び装置 |
CN1618004A (zh) * | 2001-11-26 | 2005-05-18 | 特维特程序控制技术有限公司 | 用于测量半导体晶片中的应力的方法和装置 |
CN1834623A (zh) * | 2005-03-17 | 2006-09-20 | 中国科学院半导体研究所 | 半导体材料残余应力的测试装置及方法 |
CN101251472A (zh) * | 2008-03-19 | 2008-08-27 | 中国科学院上海光学精密机械研究所 | 双光束在线实时测量光学薄膜应力的装置及其测量方法 |
CN201780263U (zh) * | 2009-12-18 | 2011-03-30 | 福建福晶科技股份有限公司 | 一种激光回馈法光学材料应力测量装置 |
US20130039469A1 (en) * | 2011-08-08 | 2013-02-14 | Rigaku Corporation | X-ray stress measurement apparatus |
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2016
- 2016-09-01 CN CN201610805081.1A patent/CN106383000B/zh not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06317484A (ja) * | 1993-04-30 | 1994-11-15 | Nippon Steel Corp | 微小領域応力測定のためのx線露光方法及び装置 |
CN1618004A (zh) * | 2001-11-26 | 2005-05-18 | 特维特程序控制技术有限公司 | 用于测量半导体晶片中的应力的方法和装置 |
CN1834623A (zh) * | 2005-03-17 | 2006-09-20 | 中国科学院半导体研究所 | 半导体材料残余应力的测试装置及方法 |
CN101251472A (zh) * | 2008-03-19 | 2008-08-27 | 中国科学院上海光学精密机械研究所 | 双光束在线实时测量光学薄膜应力的装置及其测量方法 |
CN201780263U (zh) * | 2009-12-18 | 2011-03-30 | 福建福晶科技股份有限公司 | 一种激光回馈法光学材料应力测量装置 |
US20130039469A1 (en) * | 2011-08-08 | 2013-02-14 | Rigaku Corporation | X-ray stress measurement apparatus |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111380501A (zh) * | 2020-03-25 | 2020-07-07 | 华中科技大学 | 基于双折射晶体视场效应的姿态角实时测量方法及装置 |
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Inventor after: Yan Wenbo Inventor after: Li Shaobei Inventor after: Chen Hongjian Inventor after: Chen Lipin Inventor after: Wang Xuliang Inventor after: Fan Bolin Inventor after: Li Feifei Inventor after: Du Chengwei Inventor after: Wang Xiaomin Inventor before: Li Shaobei Inventor before: Yan Wenbo Inventor before: Chen Hongjian Inventor before: Chen Lipin Inventor before: Wang Xuliang Inventor before: Fan Bolin Inventor before: Li Feifei Inventor before: Du Chengwei Inventor before: Wang Xiaomin |
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Granted publication date: 20190910 Termination date: 20200901 |