CN106374962A - Integrated wifi chip and packaging method therefor - Google Patents
Integrated wifi chip and packaging method therefor Download PDFInfo
- Publication number
- CN106374962A CN106374962A CN201610770425.XA CN201610770425A CN106374962A CN 106374962 A CN106374962 A CN 106374962A CN 201610770425 A CN201610770425 A CN 201610770425A CN 106374962 A CN106374962 A CN 106374962A
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- chip
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- wifi
- wireless charging
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- 238000000034 method Methods 0.000 title claims abstract description 17
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 50
- 229910052710 silicon Inorganic materials 0.000 claims description 50
- 239000010703 silicon Substances 0.000 claims description 50
- 239000000758 substrate Substances 0.000 claims description 45
- 230000010354 integration Effects 0.000 claims description 15
- 239000004568 cement Substances 0.000 claims description 11
- 238000003466 welding Methods 0.000 claims description 11
- 238000012856 packing Methods 0.000 claims description 9
- 238000001514 detection method Methods 0.000 claims description 8
- 238000005538 encapsulation Methods 0.000 claims description 6
- 230000005611 electricity Effects 0.000 claims description 5
- 238000004891 communication Methods 0.000 abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000000087 stabilizing effect Effects 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000004913 activation Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000968 intestinal effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
-
- H04B5/26—
-
- H04B5/79—
Abstract
The present invention provides an integrated wifi chip and a packaging method therefor. The chip comprises a CPU, a wifi control circuit, a wifi antenna, a battery, a wireless charging coil, and a power management circuit. The CPU, the wifi control circuit and the wifi antenna are connected in sequence. The battery and the wireless charging coil are connected to the power management circuit respectively. According to the present invention, the entire chip does not have any external physical electrical connection interface, the chip can work, by means of wireless charging and communication, in an environment, such as water, where original electronic equipment cannot work completely, and the application scenario range of the chip is greatly expanded. Moreover, a wifi chip does not need to be additionally arranged, thereby reducing the size.
Description
Technical field
The present invention relates to a kind of encapsulation of chip, particularly to a kind of totally enclosed chip packaging method and structure.
Background technology
With developing rapidly of soc chip technology, but technology of Internet of things is more and more important. restriction Internet of Things chip at present
One major issue of equipment is all of equipment and base chip all also relies on traditional physical electrical, and such as power supply is inserted
Seat, debugging socket etc., exchange and the applications such as power source charges into row information for connecting, therefore equipment cannot work and severe liquid
In body or in other adverse circumstances.
The communication of iot chip simultaneously is also the major issue of current techniques, and the realization of wifi function typically requires
The supporting special wifi chip of master chip periphery, so causes the complexity of scheme, also allows electrical connection be exposed to outside.Institute
A kind of integration wifi chip design is proposed with the present invention, whole chip does not have any external physical electrical connecting interface, leads to
Cross and wirelessly complete to charge and communicate, chip operation can be made in the environment that the medium original electronic equipment of water cannot work completely,
Greatly improve the application scenarios scope of chip；And separately need not set wifi chip, reduce volume.
Content of the invention
The technical problem to be solved in the present invention, is to provide a kind of integration wifi chip, whole chip does not have any right
Outer physical electrical connecting interface, by wirelessly completing to charge and communicating, can make chip operation set in the medium original electronics of water
In the standby environment that cannot work completely, greatly improve the application scenarios scope of chip；And separately need not set wifi chip, subtract
Little volume.
Chip of the present invention is achieved in that integrated wifi chip, including cpu, wifi control circuit, wifi antenna,
Battery, Wireless charging coil and electric power management circuit；Described cpu, wifi control circuit, wifi antenna are sequentially connected；Described
Battery, Wireless charging coil are all connected with described electric power management circuit.
The method for packing of the present invention is achieved in that the method for packing of integrated wifi chip, comprising:
S1, on chip silicon chip setting cpu, wifi control circuit and electric power management circuit；And in chip silicon chip peripheral hardware
Put battery, Wireless charging coil and wifi antenna；And described cpu, wifi control circuit and wifi antenna are sequentially connected；Institute
State battery, Wireless charging coil and connect electric power management circuit respectively；
S2, the chip silicon chip to chip, battery, Wireless charging coil and wifi antenna carry out integrative packaging, and seal
Chip surface after dress does not stay any electric interfaces.
Further, described electric power management circuit further includes that charging detector unit, mu balanced circuit, the first path select
Unit, alternate path select unit and supply network unit；Described Wireless charging coil connect respectively charging detector unit and
Mu balanced circuit；Described charging detector unit connects the first path selection unit and alternate path select unit respectively；Described voltage stabilizing
Circuit connects the first path selection unit and alternate path select unit respectively；Described battery, the first path selection unit, second
Path selection unit and supply network unit are sequentially connected.
Further, described electric power management circuit also includes electric power detection unit and display lamp control unit；Described second
Path selection unit, electric power detection unit and display lamp control unit are sequentially connected.
Further,
Described cpu, wifi control circuit and electric power management circuit are each provided on chip silicon chip；
Described battery is set to cell panel；
Described Wireless charging coil is set to Wireless charging coil film or plate；
Described wifi antenna is set to wifi antenna film or plate.
Further, the packaged type of described integrated chip is following any one:
(1), described wifi antenna film or plate, chip silicon chip, cell panel, Wireless charging coil film or plate be from top to bottom successively
Stacking is adhesively fixed on a substrate and by insulating cement, and between described wifi antenna film or plate and chip silicon chip, described core
Between piece silicon chip and cell panel, between described cell panel and Wireless charging coil film or plate, Wireless charging coil film or plate and base
Between plate, and between chip silicon chip and substrate, form electrical connection respectively after welding wire bonding；
(2), described wifi antenna film or plate, chip silicon chip, cell panel and Wireless charging coil film or plate tiling are distributed in
The front surface of one substrate is simultaneously adhesively fixed by insulating cement, and forms electrical connection with substrate after wire bonding by welding respectively；
(3), described wifi antenna film or plate, chip silicon chip, cell panel stack gradually from top to bottom and pass through to insulate gluing
Connect the front being fixed on a substrate, described Wireless charging coil film or plate are then adhesively fixed on the back side of substrate；Described wifi days
Between line film or plate and chip silicon chip, between described chip silicon chip and cell panel, between described cell panel and substrate, wireless charging
Between coil film or plate and substrate, and between chip silicon chip and substrate, form electrical connection respectively after welding wire bonding；
And substrate is provided with metallic vias to connect the signal of the front and back of substrate.
The present invention has the advantage that
(1) integrated chip of the present invention design, completes to charge by wifi wireless mode and correspondence with foreign country is it is not necessary to outside
Printed circuit board (PCB) can single-chip work independently；
(2) wifi communication is integrated and master chip is integrated in chips, and volume can be made very little；
(3) whole chip does not have any external physical electrical connecting interface, can make in chip operation human body in the water
In the environment that cannot work completely etc. original electronic equipment, do not affected by the adverse environment in intestinal, greatly improved Internet of Things
The application scenarios scope of web-roll core piece.
Brief description
The present invention is further illustrated in conjunction with the embodiments with reference to the accompanying drawings.
Fig. 1 is the inventive method execution flow chart.
Fig. 2 is a kind of encapsulating structure of present invention integration wifi chip.
Fig. 2 a is the forward sight structural representation of Fig. 2.
Fig. 3 is another kind of encapsulating structure of present invention integration wifi chip.
Fig. 3 a is the forward sight structural representation of Fig. 3.
Fig. 4 is another encapsulating structure of present invention integration wifi chip.
Specific embodiment
As shown in figure 1, the integrated wifi chip of the present invention, including cpu, wifi control circuit 101, wifi antenna 102,
Battery 103, Wireless charging coil 104 and electric power management circuit 105；Described cpu, wifi control circuit 101, wifi antenna
102 are sequentially connected；Described battery 103, Wireless charging coil 104 are all connected with described electric power management circuit 105.
It is single that described electric power management circuit 105 further includes that charging detector unit 51, mu balanced circuit 52, the first path select
Unit 53, alternate path select unit 54 and supply network unit 55；Also include electric power detection unit 56 and display lamp controls list
Unit 57；Described Wireless charging coil 4 connects charging detector unit 51 and mu balanced circuit 52 respectively；51 points of described charging detector unit
Do not connect the first path selection unit 53 and alternate path select unit 54；Described mu balanced circuit 52 connects the first path choosing respectively
Select unit 53 and alternate path select unit 54；Described battery 3, the first path selection unit 51, alternate path select unit 52
And supply network unit 55 is sequentially connected；Described alternate path select unit 54, electric power detection unit 56 and display lamp control
Unit 57 is sequentially connected.
The function of above-mentioned each circuit unit is as follows:
Described cpu is responsible for the routine processes of chip, including data processing and Control on Communication, can send the data to wifi control
Circuit 101, the wifi that simultaneously can receive wifi control circuit 103 input accepts information and is processed；
Described wifi control circuit 103 is responsible for carrying out wifi data is activation and reception, and wifi sends and refers to that accepting cpu transmits
Data to be sent be sent to wifi antenna 102 after wifi modulation, wifi receives and refers to accept wifi antenna 102 input
Signal is sent to cpu process after being demodulated becoming digital signal；
Described wifi antenna 102 is responsible for sending and receiving wifi wireless signal；
Described battery 103 is responsible for whole chip and provides power supply；
Described Wireless charging coil 104 is responsible for carrying out wireless charging to battery 103；
Described electric power management circuit 105 is used for detecting the working condition of battery 103, and controls the Wireless charging coil 104 to be
No being charged to described battery 103.
Described charging detector unit 51 is responsible for whether monitoring Wireless charging coil 104 is in charged state,
(1) if being in charged state, controlling the first path selection unit 53 to gate mu balanced circuit 52 and arriving battery 103
Charging path, gates the supply access that mu balanced circuit 52 arrives supply network unit 55 simultaneously, allows Wireless charging coil 104 to battery
103 are charged providing the powered operation of chip simultaneously；
(2) if Wireless charging coil 104 is not on charged state, control the first path selection unit 53, second
Path selection unit 54 gates the path that battery 103 arrives supply network unit 55, allows battery 103 complete powered operation.
Described mu balanced circuit 52 is responsible for carrying out voltage stabilizing process to the power supply energy of charge coil input, then by after voltage stabilizing
Electric energy exports battery 103 and is charged, and the supply network unit 55 being simultaneously outputting to chip provides the powered operation of chip.
Electric power detection unit 56 is responsible for the voltage of input is detected, when voltage is less than electricity voltage threshold, sends
Low battery control signal, to display lamp control unit 57, controls display lamp to remind user to be filled by display lamp control unit 57
Electricity.
Based on said chip, the present invention provides a kind of method for packing of integration wifi chip, comprising:
S1, on chip silicon chip setting cpu, wifi control circuit 101 and electric power management circuit 105；And in chip silicon
Setting battery 103, Wireless charging coil 104 and wifi antenna 102 outside piece；And described cpu, wifi control circuit 101 and
Wifi antenna 102 is sequentially connected；Described battery 103, Wireless charging coil 104 connect electric power management circuit 105 respectively；
S2, the chip silicon chip 1 to chip, battery 103, Wireless charging coil 104 and wifi antenna 102 carry out integration
Chip surface after encapsulation, and encapsulation does not stay any electric interfaces.
When implementing, described cpu, wifi control circuit 101 and electric power management circuit are each provided at chip silicon chip 1
On；
Described battery 103 is set to cell panel 3；
Described Wireless charging coil 104 is set to Wireless charging coil film or plate 4；
Described wifi antenna 102 is set to wifi antenna film or plate 2.
Described chip also includes substrate 5；Described wifi antenna film or plate 2, chip silicon chip 1, cell panel 3, wireless charging electric wire
Circle film or plate 4 and substrate 5 carry out integral type encapsulation and form packaging body 300, and any physical electrical is not stayed on packaging body 300 surface
Interface.
Wherein, the packaged type of described integral type encapsulation is following any one:
(1), as shown in figures 2 and 2 a, described wifi antenna film or plate 2, chip silicon chip 1, cell panel 3, wireless charging electric wire
Circle film or plate 4 are stacked gradually from top to bottom on the substrate 5 and are adhesively fixed by insulating cement, and described wifi antenna film or plate 2
And chip silicon chip 1 between, between described chip silicon chip 1 and cell panel 3, described cell panel 3 and Wireless charging coil film or plate 4 it
Between, between Wireless charging coil film or plate 4 and substrate 5, and pass through respectively between chip silicon chip 1 and substrate 5 to weld wire bonding
Form electrical connection afterwards；
(2), as shown in Fig. 3 and Fig. 3 a, described wifi antenna film or plate 2, chip silicon chip 1, cell panel 3 and wireless charging electric wire
Circle film or plate 4 tiling are distributed in the front surface of substrate 5 and are adhesively fixed by insulating cement, and pass through sealing wire with substrate 5 respectively
Form electrical connection after welding；
(3) as shown in figure 4, described wifi antenna film or plate 2, chip silicon chip 1, cell panel 3 stack gradually simultaneously from top to bottom
It is adhesively fixed on the front of substrate 5 by insulating cement, described Wireless charging coil film or plate 4 are then adhesively fixed on the back of the body of substrate 5
Face；Between described wifi antenna film or plate 2 and chip silicon chip 1, between described chip silicon chip 1 and cell panel 3, described cell panel 3
And substrate 5 between, between described Wireless charging coil film or plate 4 and substrate 5, and lead to respectively between chip silicon chip 1 and substrate 5
Form electrical connection after crossing welding wire bonding；And substrate is provided with metallic vias 52 to connect the letter of the front and back of substrate
Number.
Although the foregoing describing the specific embodiment of the present invention, those familiar with the art should manage
Solution, we are merely exemplary described specific embodiment, rather than for the restriction to the scope of the present invention, are familiar with this
Equivalent modification and change that the technical staff in field is made in the spirit according to the present invention, all should cover the present invention's
In scope of the claimed protection.
Claims (10)
1. integrated wifi chip it is characterised in that: include cpu, wifi control circuit, wifi antenna, battery, wireless charging electric wire
Circle and electric power management circuit；Described cpu, wifi control circuit, wifi antenna are sequentially connected；Described battery, wireless charging electric wire
Circle is all connected with described electric power management circuit.
2. according to claim 1 integration wifi chip it is characterised in that: described electric power management circuit further includes
Charging detector unit, mu balanced circuit, the first path selection unit, alternate path select unit and supply network unit；Described
Wireless charging coil connects charging detector unit and mu balanced circuit respectively；Described charging detector unit connects the first path choosing respectively
Select unit and alternate path select unit；Described mu balanced circuit connects the first path selection unit respectively and alternate path selects list
Unit；Described battery, the first path selection unit, alternate path select unit and supply network unit are sequentially connected.
3. according to claim 2 integration wifi chip it is characterised in that: described electric power management circuit also includes electricity
Detector unit and display lamp control unit；Described alternate path select unit, electric power detection unit and display lamp control unit according to
Secondary connection.
4. according to claim 1 integration wifi chip it is characterised in that:
Described cpu, wifi control circuit and electric power management circuit are each provided on chip silicon chip；
Described battery is set to cell panel；
Described Wireless charging coil is set to Wireless charging coil film or plate；
Described wifi antenna is set to wifi antenna film or plate.
5. according to claim 4 integration wifi chip it is characterised in that: the packaged type of described integrated chip is
Following any one:
(1), described wifi antenna film or plate, chip silicon chip, cell panel, Wireless charging coil film or plate stack gradually from top to bottom
It is adhesively fixed on a substrate and by insulating cement, and between described wifi antenna film or plate and chip silicon chip, described chip silicon
Between piece and cell panel, between described cell panel and Wireless charging coil film or plate, Wireless charging coil film or plate and substrate it
Between, and between chip silicon chip and substrate, form electrical connection respectively after welding wire bonding；
(2), described wifi antenna film or plate, chip silicon chip, cell panel and Wireless charging coil film or plate tiling are distributed in a base
The front surface of plate is simultaneously adhesively fixed by insulating cement, and forms electrical connection with substrate after wire bonding by welding respectively；
(3), described wifi antenna film or plate, chip silicon chip, cell panel stack gradually from top to bottom and pass through insulating cement bonding admittedly
It is scheduled on the front of a substrate, described Wireless charging coil film or plate are then adhesively fixed on the back side of substrate；Described wifi antenna film
Or between plate and chip silicon chip, between described chip silicon chip and cell panel, between described cell panel and substrate, Wireless charging coil
Between film or plate and substrate, and between chip silicon chip and substrate, form electrical connection respectively after welding wire bonding；And base
Plate is provided with metallic vias to connect the signal of the front and back of substrate.
6. integrated wifi chip method for packing it is characterised in that: include:
S1, on chip silicon chip setting cpu, wifi control circuit and electric power management circuit；And electricity is set outside chip silicon chip
Pond, Wireless charging coil and wifi antenna；And described cpu, wifi control circuit and wifi antenna are sequentially connected；Described electricity
Pond, Wireless charging coil connect electric power management circuit respectively；
S2, the chip silicon chip to chip, battery, Wireless charging coil and wifi antenna carry out integrative packaging, and after encapsulation
Chip surface do not stay any electric interfaces.
7. according to claim 6 integration wifi chip method for packing it is characterised in that: described electric power management circuit
Further include charging detector unit, mu balanced circuit, the first path selection unit, alternate path select unit and supply network
Unit；Described Wireless charging coil connects charging detector unit and mu balanced circuit respectively；Described charging detector unit connects respectively
First path selection unit and alternate path select unit；Described mu balanced circuit connects the first path selection unit and second respectively
Path selection unit；Described battery, the first path selection unit, alternate path select unit and supply network unit connect successively
Connect.
8. according to claim 7 integration wifi chip method for packing it is characterised in that: described electric power management circuit
Also include electric power detection unit and display lamp control unit；Described alternate path select unit, electric power detection unit and display lamp
Control unit is sequentially connected.
9. integration wifi chip according to claim 6 method for packing it is characterised in that: described cpu, wifi control
Circuit and electric power management circuit are each provided on chip silicon chip；
Described battery is set to cell panel；
Described Wireless charging coil is set to Wireless charging coil film or plate；
Described wifi antenna is set to wifi antenna film or plate.
10. according to claim 6 integration wifi chip method for packing it is characterised in that: described integrated chip
Packaged type be following any one:
(1), described wifi antenna film or plate, chip silicon chip, cell panel, Wireless charging coil film or plate stack gradually from top to bottom
It is adhesively fixed on a substrate and by insulating cement, and between described wifi antenna film or plate and chip silicon chip, described chip silicon
Between piece and cell panel, between described cell panel and Wireless charging coil film or plate, Wireless charging coil film or plate and substrate it
Between, and between chip silicon chip and substrate, form electrical connection respectively after welding wire bonding；
(2), described wifi antenna film or plate, chip silicon chip, cell panel and Wireless charging coil film or plate tiling are distributed in a base
The front surface of plate is simultaneously adhesively fixed by insulating cement, and forms electrical connection with substrate after wire bonding by welding respectively；
(3), described wifi antenna film or plate, chip silicon chip, cell panel stack gradually from top to bottom and pass through insulating cement bonding admittedly
It is scheduled on the front of a substrate, described Wireless charging coil film or plate are then adhesively fixed on the back side of substrate；Described wifi antenna film
Or between plate and chip silicon chip, between described chip silicon chip and cell panel, between described cell panel and substrate, Wireless charging coil
Between film or plate and substrate, and between chip silicon chip and substrate, form electrical connection respectively after welding wire bonding；And base
Plate is provided with metallic vias to connect the signal of the front and back of substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610770425.XA CN106374962B (en) | 2016-08-30 | 2016-08-30 | Integrated wifi chip and its packaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610770425.XA CN106374962B (en) | 2016-08-30 | 2016-08-30 | Integrated wifi chip and its packaging method |
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| Publication Number | Publication Date |
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| CN106374962A true CN106374962A (en) | 2017-02-01 |
| CN106374962B CN106374962B (en) | 2019-03-12 |
Family
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| CN201610770425.XA Active CN106374962B (en) | 2016-08-30 | 2016-08-30 | Integrated wifi chip and its packaging method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108832262A (en) * | 2018-05-31 | 2018-11-16 | 出门问问信息科技有限公司 | Electronic equipment |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1614713A (en) * | 2003-11-06 | 2005-05-11 | 尔必达存储器股份有限公司 | Stacked memory, memory module and memory system |
| CN1866515A (en) * | 2005-05-20 | 2006-11-22 | 恩益禧电子股份有限公司 | SIP (system-in-package) type package containing analog semiconductor chip and digital semiconductor chip stacked in order, and method for manufacturing the same |
| CN101131990A (en) * | 2006-08-21 | 2008-02-27 | 日月光半导体制造股份有限公司 | Stacked chip packaging construction |
| CN102035265A (en) * | 2010-12-06 | 2011-04-27 | 无锡索垠飞科技有限公司 | Wireless charging system of capacitor storage battery |
| TW201347730A (en) * | 2012-05-25 | 2013-12-01 | Chung-Che Wu | Wireless detection system of physiological signals and method thereof |
| CN203813502U (en) * | 2014-04-04 | 2014-09-03 | 深圳市金溢科技股份有限公司 | Intelligent power management chip realizing wireless charge and ultra-thin on-board unit |
| CN104618831A (en) * | 2015-01-27 | 2015-05-13 | 深圳市百泰实业有限公司 | Wireless intelligent headphone |
| CN105762871A (en) * | 2016-04-05 | 2016-07-13 | 宁波力芯科信息科技有限公司 | Wireless charging mobile power supply device with WIFI signal enhancement |
-
2016
- 2016-08-30 CN CN201610770425.XA patent/CN106374962B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1614713A (en) * | 2003-11-06 | 2005-05-11 | 尔必达存储器股份有限公司 | Stacked memory, memory module and memory system |
| CN1866515A (en) * | 2005-05-20 | 2006-11-22 | 恩益禧电子股份有限公司 | SIP (system-in-package) type package containing analog semiconductor chip and digital semiconductor chip stacked in order, and method for manufacturing the same |
| CN101131990A (en) * | 2006-08-21 | 2008-02-27 | 日月光半导体制造股份有限公司 | Stacked chip packaging construction |
| CN102035265A (en) * | 2010-12-06 | 2011-04-27 | 无锡索垠飞科技有限公司 | Wireless charging system of capacitor storage battery |
| TW201347730A (en) * | 2012-05-25 | 2013-12-01 | Chung-Che Wu | Wireless detection system of physiological signals and method thereof |
| CN203813502U (en) * | 2014-04-04 | 2014-09-03 | 深圳市金溢科技股份有限公司 | Intelligent power management chip realizing wireless charge and ultra-thin on-board unit |
| CN104618831A (en) * | 2015-01-27 | 2015-05-13 | 深圳市百泰实业有限公司 | Wireless intelligent headphone |
| CN105762871A (en) * | 2016-04-05 | 2016-07-13 | 宁波力芯科信息科技有限公司 | Wireless charging mobile power supply device with WIFI signal enhancement |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108832262A (en) * | 2018-05-31 | 2018-11-16 | 出门问问信息科技有限公司 | Electronic equipment |
Also Published As
| Publication number | Publication date |
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| CN106374962B (en) | 2019-03-12 |
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Address after: 350000 building, No. 89, software Avenue, Gulou District, Fujian, Fuzhou 18, China Patentee after: Ruixin Microelectronics Co., Ltd Address before: 350000 building, No. 89, software Avenue, Gulou District, Fujian, Fuzhou 18, China Patentee before: Fuzhou Rockchips Electronics Co.,Ltd. |