CN106373913A - Abnormity recovery method for semiconductor vertical furnace equipment - Google Patents
Abnormity recovery method for semiconductor vertical furnace equipment Download PDFInfo
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- CN106373913A CN106373913A CN201610930730.0A CN201610930730A CN106373913A CN 106373913 A CN106373913 A CN 106373913A CN 201610930730 A CN201610930730 A CN 201610930730A CN 106373913 A CN106373913 A CN 106373913A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H01L21/67011—Apparatus for manufacture or treatment
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Abstract
The invention provides an abnormity recovery method for semiconductor vertical furnace equipment. The abnormity recovery method comprises the steps of performing initialization configuration on carrier and wafer information according to attribute hierarchical structure of each module of the semiconductor vertical furnace equipment; in a technological process, updating attribute information of respective modules of all the semiconductor vertical furnace equipment of an information storage module; meanwhile, performing associated transmission and recoding of all wafer carriers of each module, and recording files of all wafer information in each wafer carrier; and if the semiconductor vertical furnace equipment suffers from an abnormal state, enabling a control module to determine the state information of all wafer carriers determined by the recording files, the state information of all wafers in each wafer carrier, and the state information of each module of the semiconductor vertical furnace equipment, and starting a processing flow of an abnormity recovery mechanism according to an abnormity recovery rule so as to protect materials (wafers and wafer carriers) in the equipment to the highest extent in order to ensure that abnormity recovery can be realized on any abnormal conditions.
Description
Technical field
The present invention relates to semiconductor equipment factory automation (factory automation) technical field, more particularly, to one
The method planting quasiconductor vertical furnace equipment abnormal restoring and material protection.
Background technology
Quasiconductor vertical furnace equipment is one of important technological equipment of operation before semiconductor production line, for large-scale integrated
The diffusion of the industries such as circuit, discrete device, power electronics, photoelectric device and optical fiberss, oxidation, annealing, alloy and sintering etc.
Technique.
Being continuously increased with wafer size, chip manufacturers can be using producing more cores in single-wafer
Piece.After 2000, the wafer standard of semi-conductor industry is decided to be 300 millimeters.
In order to simplify transport and reduce contaminated risk as far as possible, chip manufacturer utilizes " front open type standard wafer box "
I.e. so-called foup is carrying wafer.25 pieces of Silicon Wafers can be placed in each dustless ultra-clean wafer cassette.Foup can be docked at
The front end of great majority application material machine system, the blocks of inspiration of wafer can be gone by machine, is automatically processed.
That is, during quasiconductor vertical furnace equipment automatic operating, generally, the material participating in technique is (i.e. brilliant
Circle more than 125, wafer cassette is more than 5) be worth very huge.If board occurs under abnormality, in process board
Material face the danger scrapped.
It will be apparent to those skilled in the art that the abnormal restoring of quasiconductor vertical furnace equipment automatic operating is quasiconductor vertical heater
Equipment the key link.When board generating state is abnormal, need to take appropriate measures as early as possible makes board return to normal condition,
It can effective protection board extremely under material be not scrapped.I.e. in semiconductor equipment, to material under unit exception state
Process, and the time of abnormal restoring is all to investigate one of important indicator of board.
However, abnormal restoring mechanism is relatively deficient, therefore, industry is in the urgent need to advanced reliable abnormal restoring machine
System, specifically, the abnormal restoring mechanism that a set of suitable semiconductor equipment runs goes to process material and restorer.Abnormal restoring system
System includes how saving from damage under board abnormality and processing the material in board, how to recover automatization's fortune of board as soon as possible
OK.
Content of the invention
In order to overcome problem above, the present invention is intended to provide a kind of method of quasiconductor vertical furnace equipment abnormal restoring, this
For realizing the function of the abnormal restoring of quasiconductor vertical furnace equipment, how to save from damage and datatron including under board abnormality
How material (wafer and wafer carrier) in platform, recover the automatic operating of board as soon as possible, to ensure the safety of material,
And recover the automatic operating of board.
For achieving the above object, technical scheme is as follows:
A kind of method of quasiconductor vertical furnace equipment abnormal restoring, described quasiconductor vertical furnace equipment includes outside loading stage
Module, stocker module, stored equipment fingerprint block, wafer manipulator, internal loading stage module and/or technical module,
It also includes information storage module and control module；Methods described comprises the steps:
Step s1: according to described quasiconductor vertical furnace equipment each module attribute level frame of record in information storage module
Structure, initial configuration comprises all carrier information of described quasiconductor vertical furnace equipment module subordinate, and each carrier
The log file of interior all wafer informations；
Step s2: in technical process, each module of all described quasiconductor vertical furnace equipment of fresh information memory module
Attribute information, association simultaneously transmits and records all wafer carrier of each module subordinate, and its in each wafer carrier
The log file of all wafer informations；
Step s3: if abnormal phenomena in described quasiconductor vertical furnace equipment, described control module confirms described record
The status information of all wafers and described quasiconductor vertical heater in all wafer carrier of file determination, each wafer carrier
The status information of each module of equipment, and start the handling process of abnormal restoring mechanism according to abnormal restoring rule；Wherein, described place
Reason flow process executes the principle of wafer normal unloaded operation again according to first carrying out wafer carrier reclaimer operation, will be scattered and be distributed in institute
State the wafer in wafer manipulator, internal loading stage module and technical module and wafer carrier is recovered to described surge bunker
In storage module.
Preferably, step s3 in the method for described quasiconductor vertical furnace equipment abnormal restoring specifically includes:
Step s31: described control module confirms all wafer carrier of described log file determination, each wafer carrier
The status information of interior all wafers；
Step s32: described control module confirms the status information of each module of described quasiconductor vertical furnace equipment；If described
Some or multiple module in wafer manipulator, internal loading stage module and technical module are problematic；Execution step
s33；No person, execution step s34；
Step s33: according in problematic described wafer manipulator, internal loading stage module and/or technical module
The preferential using priciple of redundant component, is equipped with the part that described abnormal restoring mechanism handling process is used；
Step s34: the wafer carrier on described stored equipment fingerprint block is all sent back to described stocker module
In；
Step s35: by described internal loading stage module recovery to original state；
Step s36: the wafer carrier in described internal loading stage module is all sent back to described stocker module
In；
Step s37: according to the described abnormal restoring rule being determined according to quasiconductor vertical furnace equipment process characteristic, will be described
The cooperation by described wafer carrier and described internal loading stage module of wafer manipulator and all wafers of technical module
Send back in described stocker module；
Step s38: terminate.
Preferably, the wafer carrier information attribute of each described module recording on that module includes wafer carrying
Device name of the information, carrier in the activation situation of residing module, capacity, species, load slot status and/or access times.
Preferably, in this wafer carrier of record in described wafer carrier, each wafer information includes wafer title
Or address, capacity, species, the loading groove location in carrier and/or access times.
Preferably, described log file utilizes the status information of xml document storage device；Using .net Object-oriented Technique
Create the class of wafer carrier and the class of wafer, for the information of actual wafer carrier in recording equipment and wafer, pass through
The status information that the attribute definition wafer carrier of class and wafer comprise.
Preferably, described handling process executes wafer normal unloaded operation again according to first carrying out wafer carrier reclaimer operation
Principle particularly as follows: first processing the wafer carrier on stored equipment fingerprint block, the wafer in the internal loading stage module of reprocessing
Carrier, all wafer carrier execute the unloading operation of wafer again after returning to stocker module.
Preferably, described handling process executes wafer normal unloaded operation again according to first carrying out wafer carrier reclaimer operation
Principle in, described wafer normal unloaded operation be first process wafer manipulator on wafer, in re-treating process module
Wafer in cassette.
Preferably, the rule of described abnormal restoring is followed from where which goes back and forth, and that is, described wafer returns to source wafer carrier
Home position, described wafer carrier return to abnormal restoring mechanism handling process start before stocker module in position
Put.
Preferably, the rule of described abnormal restoring is supported to record in information storage module during following described abnormal restoring
The initial configuration information of described wafer unloading.
Preferably, described information memory module and control unit are made up of host computer+slave computer framework；Wherein, slave computer
For Programmable Logic Controller.
From technique scheme as can be seen that the present invention is designed with four most of compositions, it is to use extensible markup respectively
The record wafer of language (extensible markup language, abbreviation xml) file sub-module and wafer carrier information
Instantiation information, the peace run of the handling process of abnormal restoring mechanism, the executing rule of abnormal restoring mechanism and abnormal restoring
Full guard.Therefore, the present invention can be with the material (wafer and wafer carrier) in maximum protection equipment it is ensured that any different
Reason condition can realize abnormal restoring.
Brief description
Fig. 1 is quasiconductor vertical furnace equipment structural representation in the embodiment of the present invention
Fig. 2 is the method flow schematic diagram of quasiconductor vertical furnace equipment abnormal restoring in the embodiment of the present invention
Fig. 3 is the structural representation of event carrier class and wafer class in the embodiment of the present invention
Fig. 4 is xml configuration file structure chart in the embodiment of the present invention
Fig. 5 is quasiconductor vertical furnace equipment workflow schematic diagram in the embodiment of the present invention
Fig. 6 is quasiconductor vertical furnace equipment abnormal restoring schematic flow sheet in the embodiment of the present invention
Specific embodiment
Embody feature of present invention to describe in detail in the explanation of back segment with the embodiment of advantage.It should be understood that the present invention
Can have various changes in different examples, it neither departs from the scope of the present invention, and therein illustrate and be shown in
Substantially regard purposes of discussion, and be not used to limit the present invention.
1-6 below in conjunction with the accompanying drawings, is described in further detail to the specific embodiment of the present invention.
It should be noted that after the semiconductor equipment software restarting of the present invention recovering state method, be suitably applied half
Conductor device includes the system of information storage module and control unit.In said system, information storage module and control unit are permissible
Combined realization by hardware, software or software and hardware, in the present embodiment, said units are made up of host computer+slave computer framework；Its
In, slave computer is Programmable Logic Controller (programmable logic device, abbreviation pld).
Refer to Fig. 1, Fig. 1 is quasiconductor vertical furnace equipment structural representation in the embodiment of the present invention.As illustrated, partly leading
Body vertical furnace equipment includes outside loading stage module loadporta, stocker module stocker, stored equipment fingerprint block
Str, wafer manipulator loadlock, internal loading stage module wtr and technical module pm.
Refer to Fig. 2, Fig. 2 is that the method flow of quasiconductor vertical furnace equipment abnormal restoring in the embodiment of the present invention is illustrated
Figure.As illustrated, technical scheme in embodiments of the present invention can be summarized as follows: i.e. the method specifically includes following steps:
Step s1: according in information storage module record quasiconductor vertical furnace equipment each module attribute level framework, just
Beginningization configuration comprises all wafer carrier (foup) information of quasiconductor vertical furnace equipment module subordinate, and each wafer holds
Carry the log file of all wafer informations in device；In an embodiment of the present invention, wafer carrier is wafer cassette；
Step s2: in technical process, the genus of each module of all quasiconductor vertical furnace equipment of fresh information memory module
Property information, association simultaneously transmits and records all wafer carrier of each module subordinate, and its all in each wafer carrier
The log file of wafer information；
Step s3: if abnormal phenomena in quasiconductor vertical furnace equipment, control module confirms the institute that log file determines
There are the status information of all wafers in wafer carrier, each wafer carrier and each module of described quasiconductor vertical furnace equipment
Status information, and start the handling process of abnormal restoring mechanism according to abnormal restoring rule；Wherein, described handling process is according to elder generation
Execution wafer carrier reclaimer operation executes the principle of wafer normal unloaded operation again, will be scattered and be distributed in described wafer mechanical hand
Wafer in module, internal loading stage module and technical module and wafer carrier are recovered in described stocker module.
In the following embodiment of the present invention, can be using extensible markup language (extensible markup
Language, abbreviation xml) the record wafer of file sub-module and the instantiation information of wafer carrier information, abnormal restoring machine
The safeguard protection that the handling process of system, the executing rule of abnormal restoring mechanism and abnormal restoring run.
Refer to Fig. 3, Fig. 3 is the structural representation of event carrier class and wafer class in the embodiment of the present invention.At this
In embodiment, create wafer carrier (carrier) class and wafer (wafer) class using .net Object-oriented Technique, for remembering
The information of actual carrier and wafer in recording apparatus, is believed by the state that attribute definition carrier and wafer of class comprises
Breath.
For carrier class, including for recording the title of carrier or the substrat id of address, being used for recording
The materialtype of carrier type, for recording the usagecount of carrier access times, be used for recording carrier
Capacity can load quantity capacity of wafer, be used for recording the state of each loading chute (slot) carrier Nei
Slotmap etc..
Wafer class had to the sourcecarrier of the carrier information for recording wafer place, be used for recording
The materialtype of wafer type, for recording the usagecount of wafer access times, being used for recording wafer and exist
Slot position currentslot of carrier etc..
Refer to Fig. 4, Fig. 4 is xml configuration file structure chart in the embodiment of the present invention.It is known that xml be independently of soft
The information transfer instrument of part and hardware, extensible markup language makes it have structural labelling language for labelling e-file
Speech.It can be used to flag data, defines data type, is a kind of source allowing user that the markup language of oneself is defined
Language；Therefore, it is highly suitable for describing and to exchange the structural data independent of application program or supplier.
In the present embodiment it is simply that utilizing the status information of xml document storage device.As shown in figure 4, this xml configuration literary composition
Part has special hierarchy and node name, because xml is a kind of unit Markup Language, that is, defines special for defining other
Determine relevant semantic, the structurized markup language in field, document is divided into many parts and to these parts by these markup languages
Label.
In the present embodiment, the special hierarchy of xml configuration file and node name, you can with by xml document according to
The actual process module of semiconductor equipment is divided into five parts.Therefore, the information of carrier and wafer can be divided into record half
Conductor vertical furnace equipment includes outside loading stage module loadporta, stocker module stocker, stored equipment fingerprint block
Information on str, wafer manipulator loadlock, internal loading stage module wtr and technical module pm module process boat.
That is, record has carrier information on that module on the attribute of each module above-mentioned, including record
The substrate id of the title of carrier or address, carrierpresence, use for recording carrier use state
In the carriertype of record carrier type, for recording the usagecount of carrier access times, being used for recording
The capacity of carrier can load quantity capacity of wafer, be used for recording each slot (loading chute) in carrier
State slotmap etc..
Wafer information on each slot in carrier be have recorded on the child node of carrier, including for recording
The sourcecarrier of carrier information that wafer is located, for recording the materialtype of wafer type, be used for remembering
Usagecount of record wafer access times etc..
Refer to Fig. 5, Fig. 5 is quasiconductor vertical furnace equipment workflow schematic diagram in the embodiment of the present invention.As illustrated,
Stored equipment fingerprint block removes out wafer carrier from buffering storage module, and by internally placed for wafer carrier loading stage
On, wafer carrier is opened, wafer reprinting/unloading operation that wafer manipulator is carried out, and stored equipment fingerprint block returns simultaneously
Go out wafer carrier to original position from buffering storage module；After wafer carrier taking-up, wafer carrier closes all wafers
Close, wafer carrier is sent back in stocker module stored equipment fingerprint block.
The flow process run according to the work (job) of above-mentioned vertical furnace equipment, quasiconductor vertical furnace equipment abnormality may
There is each stage run in job, can be divided into following several situation:
Specifically, if quasiconductor vertical furnace equipment abnormality occurs in that in this embodiment, step s3 specifically can be wrapped
Include:
Step s31: control module confirms all crystalline substances in all wafer carrier of log file determination, each wafer carrier
The status information of circle；
Step s32: control module confirms the status information of each module of quasiconductor vertical furnace equipment；If wafer machinery fingerprint
Some or multiple module in block, internal loading stage module and technical module are problematic；Execution step s33；No person, executes step
Rapid s34；
Step s33: according in problematic described wafer manipulator, internal loading stage module and/or technical module
The preferential using priciple of redundant component, is equipped with the part that described Restoration Mechanism handling process is used；
Step s34: the wafer carrier on stored equipment fingerprint block is all sent back in stocker module；
Step s35: by internal loading stage module recovery to original state；
Step s36: the wafer carrier in internal loading stage module is all sent back in stocker module；
Step s37: according to the abnormal restoring rule being determined according to quasiconductor vertical furnace equipment process characteristic, by wafer machinery
Fingerprint block and all wafers of technical module send back to stocker mould by the cooperation of wafer carrier and internal loading stage module
In block；
Step s38: terminate.
It should be understood that
In an embodiment of the present invention, the handling process in above-mentioned steps s33 can be returned according to first carrying out wafer carrier
Bring drill to an end execute again wafer normal unloaded operation principle particularly as follows:
1., first process the wafer carrier on stored equipment fingerprint block, the wafer in the internal loading stage module of reprocessing holds
Carry device, all wafer carrier execute the unloading operation of wafer again after returning to stocker module.
2., according in the principle first carrying out wafer carrier reclaimer operation and executing again wafer normal unloaded operation, described crystalline substance
Circle normal unloaded operation is the wafer first processing in wafer manipulator, the wafer in cassette in re-treating process module.
3., first process the wafer in wafer manipulator, on (boat) in re-treating process module pm cassette
wafer.
In addition, in step s37 abnormal restoring rule, can according to the requirement of the feature of vertical furnace technology and client,
Vertical furnace equipment abnormal restoring follow rule performed below:
1., the rule of abnormal restoring is followed from where which goes back and forth, and that is, wafer returns to the home position of source wafer carrier, brilliant
Circle carrier return to abnormal restoring mechanism handling process start before stocker module in position.
2., the rule of abnormal restoring is supported to record described wafer in information storage module during following described abnormal restoring
The initial configuration information of unloading.
During abnormal restoring, the order of the configuration of support module and unloading (unload) can configure, different under default situations
Configuration consistency during normal configuration and job.
In sum, the abnormal restoring mechanism that the semiconductor equipment of the present invention runs goes to process material and restorer, energy
With the wafer in maximum protection equipment and wafer carrier it is ensured that any abnormal conditions can realize abnormal restoring, that is,
Recover the automatic operating of board.
Above-described only embodiments of the invention, described embodiment is simultaneously not used to limit the patent protection model of the present invention
Enclose, the equivalent structure change that the description of therefore every utilization present invention and accompanying drawing content are made, should be included in this in the same manner
In bright protection domain.
Claims (10)
1. a kind of method of quasiconductor vertical furnace equipment abnormal restoring, described quasiconductor vertical furnace equipment includes outside loading stage mould
Block, stocker module, stored equipment fingerprint block, wafer manipulator, internal loading stage module and/or technical module, its
It is characterised by, it also includes information storage module and control module；Methods described comprises the steps:
Step s1: according in information storage module record described quasiconductor vertical furnace equipment each module attribute level framework, just
Beginningization configuration comprises all carrier information of described quasiconductor vertical furnace equipment module subordinate, and the institute in each carrier
There is the log file of wafer information；
Step s2: in technical process, the genus of each module of all described quasiconductor vertical furnace equipment of fresh information memory module
Property information, association simultaneously transmits and records all wafer carrier of each module subordinate, and its all in each wafer carrier
The log file of wafer information；
Step s3: if abnormal phenomena in described quasiconductor vertical furnace equipment, described control module confirms described log file
The status information of all wafers and described quasiconductor vertical furnace equipment in all wafer carrier of determination, each wafer carrier
The status information of each module, and start the handling process of abnormal restoring mechanism according to abnormal restoring rule；Wherein, described processing stream
Journey executes the principle of wafer normal unloaded operation again according to first carrying out wafer carrier reclaimer operation, will be scattered and be distributed in described crystalline substance
Wafer in circle manipulator, internal loading stage module and technical module and wafer carrier are recovered to described stocker mould
In block.
2. the method for quasiconductor vertical furnace equipment abnormal restoring as claimed in claim 1 is it is characterised in that described step s3 has
Body includes:
Step s31: described control module confirms institute in all wafer carrier of described log file determination, each wafer carrier
There is the status information of wafer；
Step s32: described control module confirms the status information of each module of described quasiconductor vertical furnace equipment；If described wafer
Some or multiple module in manipulator, internal loading stage module and technical module are problematic；Execution step s33；No
Person, execution step s34；
Step s33: according to redundancy in problematic described wafer manipulator, internal loading stage module and/or technical module
The preferential using priciple of part, is equipped with the part that described abnormal restoring mechanism handling process is used；
Step s34: the wafer carrier on described stored equipment fingerprint block is all sent back in described stocker module；
Step s35: by described internal loading stage module recovery to original state；
Step s36: the wafer carrier in described internal loading stage module is all sent back in described stocker module；
Step s37: according to the described abnormal restoring rule being determined according to quasiconductor vertical furnace equipment process characteristic, by described wafer
Manipulator and all wafers of technical module are sent back to by the cooperation of described wafer carrier and described internal loading stage module
To in described stocker module；
Step s38: terminate.
3. the method for quasiconductor vertical furnace equipment abnormal restoring as claimed in claim 1 is it is characterised in that the genus of each module
The wafer carrier information recording on that module in property includes wafer carrier name of the information, carrier in residing module
Activation situation, capacity, species, loading slot status and/or access times.
4. the method for quasiconductor vertical furnace equipment abnormal restoring as claimed in claim 1 is it is characterised in that in wafer carrier
In this wafer carrier of interior record each wafer information include wafer title or address, capacity, species, carrier loading
Groove location and/or access times.
5. the method for quasiconductor vertical furnace equipment abnormal restoring as claimed in claim 1 is it is characterised in that described log file
Status information using xml document storage device；Create the class of wafer carrier and wafer using .net Object-oriented Technique
Class, for the information of actual wafer carrier in recording equipment and wafer, by attribute definition wafer carrier and the crystalline substance of class
The status information that circle comprises.
6. the method for quasiconductor vertical furnace equipment abnormal restoring as claimed in claim 1 is it is characterised in that described handling process
Execute the principle of wafer normal unloaded operation according to first carrying out wafer carrier reclaimer operation again particularly as follows: first processing stored equipment
Wafer carrier on fingerprint block, the wafer carrier in the internal loading stage module of reprocessing, all wafer carrier return to slow
The unloading operation of wafer is executed again after rushing storage module.
7. the method for quasiconductor vertical furnace equipment abnormal restoring as claimed in claim 1 is it is characterised in that described handling process
According in the principle first carrying out wafer carrier reclaimer operation and executing wafer normal unloaded operation, described wafer normally unloads behaviour
As the wafer first processing in wafer manipulator, the wafer in cassette in re-treating process module.
8. the method for quasiconductor vertical furnace equipment abnormal restoring as claimed in claim 1 is it is characterised in that described abnormal restoring
Rule follow from where which goes back and forth, that is, described wafer returns to the home position of source wafer carrier, and described wafer carrier returns
To abnormal restoring mechanism handling process start before stocker module in position.
9. the method for quasiconductor vertical furnace equipment abnormal restoring as claimed in claim 1 is it is characterised in that described abnormal restoring
Rule follow the initial configuration letter supporting to record described wafer unloading in information storage module during described abnormal restoring
Breath.
10. the method for quasiconductor vertical furnace equipment abnormal restoring as claimed in claim 1 is it is characterised in that described information is deposited
Storage module and control unit are made up of host computer+slave computer framework；Wherein, slave computer is Programmable Logic Controller.
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| CN110378646A (en) * | 2019-06-17 | 2019-10-25 | 北海惠科光电技术有限公司 | Manage the method and glass substrate production control system of abnormal glass substrate |
| CN110378646B (en) * | 2019-06-17 | 2023-07-28 | 北海惠科光电技术有限公司 | Method for controlling abnormal glass substrate and glass substrate production control system |
| CN115305461A (en) * | 2022-09-29 | 2022-11-08 | 江苏邑文微电子科技有限公司 | Automatic control method and device for wafer long film under abnormal working condition |
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