CN106366560A - Epoxy modified pressure-proof phenolic foam plate and preparation method thereof - Google Patents
Epoxy modified pressure-proof phenolic foam plate and preparation method thereof Download PDFInfo
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- CN106366560A CN106366560A CN201610780010.0A CN201610780010A CN106366560A CN 106366560 A CN106366560 A CN 106366560A CN 201610780010 A CN201610780010 A CN 201610780010A CN 106366560 A CN106366560 A CN 106366560A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/0061—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof characterized by the use of several polymeric components
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/0066—Use of inorganic compounding ingredients
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2361/00—Characterised by the use of condensation polymers of aldehydes or ketones; Derivatives of such polymers
- C08J2361/04—Condensation polymers of aldehydes or ketones with phenols only
- C08J2361/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2475/00—Characterised by the use of polyureas or polyurethanes; Derivatives of such polymers
- C08J2475/04—Polyurethanes
- C08J2475/08—Polyurethanes from polyethers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/14—Applications used for foams
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
Abstract
The invention discloses an epoxy modified pressure-proof phenolic foam plate and a preparation method thereof. The epoxy modified pressure-proof phenolic foam plate comprises the following components in parts by weight: 30 parts of epoxy resin, 70 parts of phenolic resin, 2 to 20 parts of a prepolymer, 5 to 10 parts of octadecylamine modified montmorillonite and 1 to 10 parts of a catalyst. The preparation method comprises the following steps: 1) mixing and stirring strong polyether, polypropylene and diisocyanate uniformly, quickly heating to 80 DEG C, maintaining the temperature to be 80 to 90 DEG C and reacting for 3 to 4 hours; 2) putting the epoxy resin, the phenolic resin and the catalyst into a reaction kettle, stirring uniformly, heating by a heating sleeve while stirring, quickly pouring into a mold cavity after heating to 100 DEG C, adding the prepolymer and the octadecylamine modified montmorillonite sequentially, stirring uniformly, putting into a drying oven at about 160 DEG C, foaming and curing for about 30 minutes and demolding. According to the epoxy modified pressure-proof phenolic foam plate and the preparation method thereof, foaming is realized through heating, the produced foam holes are uniform, and the foam plate has a good pressure-proof effect and a good sound-insulating effect.
Description
Technical field
The present invention relates to a kind of epoxide modified resistance to compression phenolic foam board and preparation method thereof, belong to building heat preservation sound insulating material
Preparation field.
Background technology
Phenol formaldehyde foam is to pass through a kind of foam plasticss obtained from foaming by phenolic resin.Account for leading market status with early stage
Polystyrene foam, polyvinyl chloride foam, the material such as polyurethane foam compare, at fire-retardant aspect, it has special Optimality
Energy.It is lightweight, and rigidity is big, good stability of the dimension, resistance to chemical attack, heat-resist, fire retardant, self-extinguishment, low smog, and flame resistant is worn
Thoroughly, meet the no unrestrained thing of fire, cheap, it is that the ideal insulated heat of the industries such as electrical equipment, instrument, building, petrochemical industry is protected
Adiabator, thus attract widespread attention.
Phenol formaldehyde foam has become one of kind with fastest developing speed in foam plasticss.Consumption figure constantly increases, and range of application is not
Disconnected expansion, research and development is all quite active both at home and abroad.But present phenolic foam board is by thermosetting phenolic tree mostly
Fat with send out agent and firming agent and react to each other prepared, it is uneven that the cystosepiment that is so obtained easily causes abscess, resistance to compression and sound insulation
Effect is bad.
Content of the invention
The present invention, in order to overcome now above not enough offer a kind of without foaming agent, is obtained internal foam by high-temperature heating
Even density, anti-impact force increases, and has a kind of epoxide modified resistance to compression phenolic foam board of high tenacity and preparation method thereof.
The present invention is achieved by the following technical solutions:
A kind of epoxide modified resistance to compression phenolic foam board, its component and mass fraction are:
30 parts of epoxy resin
70 parts of phenolic resin
Performed polymer 2-20
Filler octadecylamine modified montmorillonoid 5-10 part
Catalyst 1-10 part.
Further improvement of the present invention is, performed polymer is to close by polyethers, polypropylene, diisocyanate synthesis, catalyst
One or more of high silane series of porosity.
A kind of preparation method of epoxide modified resistance to compression phenolic foam board, comprises the following steps:
1) strong polyethers, polypropylene, diisocyanate are mixed and stirred for uniformly, being brought rapidly up 80 DEG C, and maintaining the temperature at 80-90
DEG C, react 3-4h；
2) epoxy resin, phenolic resin, catalyst are placed in reactor and stir, with heating mantle heats, stir in heating
Mix, pour into rapidly in die cavity after being heated to 100 DEG C, then sequentially add performed polymer, filler stirs, put into 160 DEG C of left sides
Foamed solidification about 30min in right baking oven, the demoulding.
Further improvement of the present invention is, described filler octadecylamine modified montmorillonoid can be replaced graphite powder, porcelain
One of powder, silica flour, blanc fixe or several mixture.
The method have the advantages that
Resin mobility under conditions of heating is gradually increased, and then has foam to generate.Being on the increase with foam, resin sticks
Degree is increasing, adds auxiliary agent when resin viscosity reaches the bubble that can wrap certain pressure, pours into after quickly stirring
In mould, put into foamed solidification about 30min, the demoulding in 160 DEG C about of baking oven, gained foam surface is smooth, even density, no
Improve only impulsive force, also improve toughness, foaming agent foam need not be added.Meanwhile, by the interpolation of filler.
Specific embodiment
With reference to example, the present invention will be further described.
Embodiment 1
A kind of epoxide modified resistance to compression phenolic foam board, its component and mass fraction are:
30 parts of epoxy resin
70 parts of phenolic resin
Performed polymer 2
5 parts of octadecylamine modified montmorillonoid
1 part of catalyst.
By polyethers, polypropylene, diisocyanate synthesis, catalyst is in the high silane series of rate of closed hole to performed polymer
Kind.
A kind of preparation method of epoxide modified resistance to compression phenolic foam board, comprises the following steps:
1) strong polyethers, polypropylene, diisocyanate are mixed and stirred for uniformly, being brought rapidly up 80 DEG C, and maintaining the temperature at 80-90
DEG C, react 3-4h；
2) epoxy resin, phenolic resin, catalyst are placed in reactor and stir, with heating mantle heats, stir in heating
Mix, pour into rapidly in die cavity after being heated to 100 DEG C, then sequentially add performed polymer, the stirring of octadecylamine modified montmorillonoid
Uniformly, foamed solidification about 30min, the demoulding in 160 DEG C about of baking oven are put into.
Embodiment 2
A kind of epoxide modified resistance to compression phenolic foam board, its component and mass fraction are:
30 parts of epoxy resin
70 parts of phenolic resin
Performed polymer 20
10 parts of blanc fixe
10 parts of catalyst.
By polyethers, polypropylene, diisocyanate synthesis, catalyst is in the high silane series of rate of closed hole to performed polymer
Kind.
Preparation process such as embodiment 1.
Embodiment 3
A kind of epoxide modified resistance to compression phenolic foam board, its component and mass fraction are:
30 parts of epoxy resin
70 parts of phenolic resin
Performed polymer 2
10 parts of porcelain powder
1 part of catalyst.
By polyethers, polypropylene, diisocyanate synthesis, catalyst is in the high silane series of rate of closed hole to performed polymer
Kind.
Preparation process such as embodiment 1.
Embodiment 4
A kind of epoxide modified resistance to compression phenolic foam board, its component and mass fraction are:
30 parts of epoxy resin
70 parts of phenolic resin
Performed polymer 20
5 parts of octadecylamine modified montmorillonoid
10 parts of catalyst.
By polyethers, polypropylene, diisocyanate synthesis, catalyst is in the high silane series of rate of closed hole to performed polymer
Kind.
Preparation process such as embodiment 1.
Embodiment 5
A kind of epoxide modified resistance to compression phenolic foam board, its component and mass fraction are:
30 parts of epoxy resin
70 parts of phenolic resin
Performed polymer 10
7 parts of silica flour
5 parts of catalyst.
By polyethers, polypropylene, diisocyanate synthesis, catalyst is in the high silane series of rate of closed hole to performed polymer
Kind.
Preparation process such as embodiment 1.
Embodiment 6
A kind of epoxide modified resistance to compression phenolic foam board, its component and mass fraction are:
30 parts of epoxy resin
70 parts of phenolic resin
Performed polymer 15
8 parts of octadecylamine modified montmorillonoid
7 parts of catalyst.
By polyethers, polypropylene, diisocyanate synthesis, catalyst is in the high silane series of rate of closed hole to performed polymer
Kind.
Preparation process such as embodiment 1.
The performance of the epoxide modified resistance to compression phenolic foam board of embodiment 1-6 gained is shown in Table 1.
The performance of table 1 phenolic foam board
| Example | General phenolic foam board | Example 1 | Example 2 | Example 3 | Example 4 | Example 5 | Example 6 |
| Rate of slag falling (%) | 4.35 | 2.55 | 2.64 | 2.95 | 2.82 | 2.74 | 2.54 |
| Compressive strength (mpa) | 0.20 | 0.39 | 0.35 | 0.36 | 0.35 | 0.43 | 0.49 |
Water absorption rate test is carried out by the cystosepiment that above-described embodiment is made.The water absorption rate of foam changes with the change of unit weight,
Unit weight is bigger, and abscess is finer and closely woven, and water absorption rate is less, but variable quantity is simultaneously less.Carry out above by foamable knowable to final
The embodiment of 1-6, resin solidification obtains relatively good, and foam rate of closed hole is higher, and water absorption rate is lower than foaming at normal temp, and water absorption is also less than normal
Temperature adds the half of firming agent foaming.
To sum up find out, the epoxide modified resistance to compression phenolic foam board of present invention preparation, foam is more uniform than foaming at normal temp, fine and smooth,
It is easy to construct and produces, and the main performance of foam is all greatly improved, compressive strength is doubled, and water absorption rate is down to
Half originally, heat conductivity is low, high insulating effect, is not clearly distinguished from foaming at normal temp in heat resistance.
The foregoing is only explanation embodiments of the present invention, be not limited to the present invention, for the technology of this area
For personnel, all any modification, equivalent substitution and improvement within the spirit and principles in the present invention, made etc., should be included in
Within protection scope of the present invention.
Claims (4)
1. a kind of epoxide modified resistance to compression phenolic foam board is it is characterised in that described a kind of epoxide modified resistance to compression phenolic foam board
Component and mass fraction be:
30 parts of epoxy resin
70 parts of phenolic resin
Performed polymer 2-20
Filler octadecylamine modified montmorillonoid 5-10 part
Catalyst 1-10 part.
2. according to claim 1 a kind of epoxide modified resistance to compression phenolic foam board it is characterised in that described performed polymer is by gathering
Ether, polypropylene, diisocyanate synthesis, catalyst is one or more of high silane series of rate of closed hole.
3. according to claim 1 a kind of preparation method of epoxide modified resistance to compression phenolic foam board it is characterised in that preparation side
Method comprises the following steps:
1) strong polyethers, polypropylene, diisocyanate are mixed and stirred for uniformly, being brought rapidly up 80 DEG C, and maintaining the temperature at 80-90
DEG C, react 3-4h；
2) epoxy resin, phenolic resin, catalyst are placed in reactor and stir, with heating mantle heats, stir in heating
Mix, pour into rapidly in die cavity after being heated to 100 DEG C, then sequentially add performed polymer, filler stirs, put into 160 DEG C of left sides
Foamed solidification about 30min in right baking oven, the demoulding.
4. according to claim 1 a kind of epoxide modified resistance to compression phenolic foam board it is characterised in that described filler octadecyl
Amine modified montmorillonoid can be replaced one of graphite powder, porcelain powder, silica flour, blanc fixe or several mixture.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610780010.0A CN106366560A (en) | 2016-08-30 | 2016-08-30 | Epoxy modified pressure-proof phenolic foam plate and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610780010.0A CN106366560A (en) | 2016-08-30 | 2016-08-30 | Epoxy modified pressure-proof phenolic foam plate and preparation method thereof |
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| Publication Number | Publication Date |
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| CN106366560A true CN106366560A (en) | 2017-02-01 |
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ID=57899714
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610780010.0A Pending CN106366560A (en) | 2016-08-30 | 2016-08-30 | Epoxy modified pressure-proof phenolic foam plate and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106832754A (en) * | 2017-03-22 | 2017-06-13 | 广东电网有限责任公司电力科学研究院 | A kind of phenol-formaldehyde resin modified material and its application |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102504194A (en) * | 2011-11-01 | 2012-06-20 | 湖南中野高科技特种材料有限公司 | Production method of modified phenol formaldehyde foam high in closed cell rate and small in cell diameter |
| CN102558756A (en) * | 2011-12-29 | 2012-07-11 | 上海应用技术学院 | Method for preparing high-performance phenolic foam material |
| CN102649866A (en) * | 2012-05-23 | 2012-08-29 | 北京化工大学 | Phenolic foam prepared by using incombustible foaming agent and preparation method for phenolic foam |
| CN102850715A (en) * | 2012-09-10 | 2013-01-02 | 西安西达地质技术服务有限责任公司 | Modified phenol formaldehyde foam board |
| CN103788570A (en) * | 2012-10-31 | 2014-05-14 | 合肥杰事杰新材料股份有限公司 | Modified phenolic foam and preparation method thereof |
| CN104086794A (en) * | 2014-07-01 | 2014-10-08 | 中国林业科学研究院林产化学工业研究所 | Preparation method of polyurethane prepolymer-toughened modified phenolic foam plastic |
| CN104262898A (en) * | 2014-09-11 | 2015-01-07 | 北京化工大学 | Organic-inorganic composite modified flame-retardant phenolic foam |
-
2016
- 2016-08-30 CN CN201610780010.0A patent/CN106366560A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102504194A (en) * | 2011-11-01 | 2012-06-20 | 湖南中野高科技特种材料有限公司 | Production method of modified phenol formaldehyde foam high in closed cell rate and small in cell diameter |
| CN102558756A (en) * | 2011-12-29 | 2012-07-11 | 上海应用技术学院 | Method for preparing high-performance phenolic foam material |
| CN102649866A (en) * | 2012-05-23 | 2012-08-29 | 北京化工大学 | Phenolic foam prepared by using incombustible foaming agent and preparation method for phenolic foam |
| CN102850715A (en) * | 2012-09-10 | 2013-01-02 | 西安西达地质技术服务有限责任公司 | Modified phenol formaldehyde foam board |
| CN103788570A (en) * | 2012-10-31 | 2014-05-14 | 合肥杰事杰新材料股份有限公司 | Modified phenolic foam and preparation method thereof |
| CN104086794A (en) * | 2014-07-01 | 2014-10-08 | 中国林业科学研究院林产化学工业研究所 | Preparation method of polyurethane prepolymer-toughened modified phenolic foam plastic |
| CN104262898A (en) * | 2014-09-11 | 2015-01-07 | 北京化工大学 | Organic-inorganic composite modified flame-retardant phenolic foam |
Non-Patent Citations (4)
| Title |
|---|
| 柳云骐等: "《材料化学》", 28 February 2013, 中国石油大出版社 * |
| 申开智: "《塑料制品设计方法及应用实例》", 31 January 2007, 国防工业出版社 * |
| 谢圣英: "《塑料材料》", 31 January 2010, 中国轻工业出版社 * |
| 阳建斌等: ""水性聚氨酯/聚丙烯酸酯/蒙脱土纳米复合纺织品涂层整理剂的研究进展"", 《成都纺织高等专科学校学报》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106832754A (en) * | 2017-03-22 | 2017-06-13 | 广东电网有限责任公司电力科学研究院 | A kind of phenol-formaldehyde resin modified material and its application |
| CN106832754B (en) * | 2017-03-22 | 2019-07-05 | 广东电网有限责任公司电力科学研究院 | A kind of modified phenolic resin material and its application |
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