CN106363468B - The modeling and simulating method and device of mechanical polishing process - Google Patents
The modeling and simulating method and device of mechanical polishing process Download PDFInfo
- Publication number
- CN106363468B CN106363468B CN201611093954.7A CN201611093954A CN106363468B CN 106363468 B CN106363468 B CN 106363468B CN 201611093954 A CN201611093954 A CN 201611093954A CN 106363468 B CN106363468 B CN 106363468B
- Authority
- CN
- China
- Prior art keywords
- operation object
- operand
- characterization
- data
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000007517 polishing process Methods 0.000 title claims abstract description 62
- 238000000034 method Methods 0.000 title claims abstract description 55
- 238000005498 polishing Methods 0.000 claims abstract description 140
- 238000012512 characterization method Methods 0.000 claims abstract description 123
- 239000012530 fluid Substances 0.000 claims abstract description 69
- 239000007788 liquid Substances 0.000 claims abstract description 56
- 230000008878 coupling Effects 0.000 claims abstract description 52
- 238000010168 coupling process Methods 0.000 claims abstract description 52
- 238000005859 coupling reaction Methods 0.000 claims abstract description 52
- 239000006061 abrasive grain Substances 0.000 claims abstract description 35
- 238000004088 simulation Methods 0.000 claims abstract description 31
- 230000033001 locomotion Effects 0.000 claims description 61
- 230000008569 process Effects 0.000 claims description 13
- 238000013481 data capture Methods 0.000 claims description 5
- 238000011156 evaluation Methods 0.000 claims description 5
- 230000010354 integration Effects 0.000 claims description 5
- 241000406668 Loxodonta cyclotis Species 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 2
- 241000208340 Araliaceae Species 0.000 claims 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 claims 1
- 235000003140 Panax quinquefolius Nutrition 0.000 claims 1
- 235000008434 ginseng Nutrition 0.000 claims 1
- 238000004458 analytical method Methods 0.000 abstract description 7
- 238000005495 investment casting Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 27
- 230000006870 function Effects 0.000 description 17
- 239000002245 particle Substances 0.000 description 11
- 238000012545 processing Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 230000008859 change Effects 0.000 description 7
- 238000002474 experimental method Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 230000006399 behavior Effects 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 6
- 238000003860 storage Methods 0.000 description 6
- 238000011160 research Methods 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 239000008187 granular material Substances 0.000 description 4
- 230000003993 interaction Effects 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 238000004590 computer program Methods 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000003082 abrasive agent Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000011439 discrete element method Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 208000012661 Dyskinesia Diseases 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000009760 electrical discharge machining Methods 0.000 description 1
- 210000003722 extracellular fluid Anatomy 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010534 mechanism of action Effects 0.000 description 1
- 238000009527 percussion Methods 0.000 description 1
- 238000007540 photo-reduction reaction Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000007514 turning Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
- B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/20—Design optimisation, verification or simulation
Abstract
The modeling and simulating method and device of a kind of mechanical polishing process provided in an embodiment of the present invention, it is related to super hot investment casting field, the method includes obtaining the first operation object of characterization polishing tool, the second operand for characterizing workpiece, the third operation object for characterizing polishing fluid and the 4th operation object for characterizing abrasive grain in the polishing fluid；The physical characteristic data of first, second and third and four operation object of acquisition respectively；Establish the solid-liquid coupling model of characterization mechanical polishing process；Based on the solid-liquid coupling model, the first kinematic parameter of the first operation object, the second kinematic parameter of second operand and preset simulation time section, it is emulated, and obtains the stress data of the second operand and the speed data of the 4th operation object；Then the first data and the second data are obtained；Analysis and the first data of comparison, obtain the first kinematic parameter and the second kinematic parameter, to improve polishing efficiency in actual machine polishing process.
Description
Technical field
The present invention relates to super hot investment casting field, in particular to a kind of modeling and simulating method of mechanical polishing process
And device.
Background technology
Micro-structure surface is the micro-structure surface that specific function can be realized with topological geometry, optics,
The fields such as machinery and physics are all widely used, and characteristic size is generally in the micron-scale.In order to improve adding for micro-structure surface
Working medium amount and processing efficiency, a variety of processing methods have been used for the processing of micro-structure surface, such as diamond precision turning, superfinishing
The methods of close grinding, electrical discharge machining and Laser Processing, but effect is all preferable not to the utmost.
Through research, the vibration assisted polishing of ultraprecise based on robot can effectively mitigate and avoid other processing methods
The shortcomings that, but the vibration assisted polishing technology of ultraprecise based on robot is also immature in itself, it is necessary to it carried out more
Deep theory and experimental study.The existing research to vibration auxiliary polishing material cutting mechanisms, it is common that pass through experimental study
Affecting laws of the controllable process parameters to material removing rate, surface roughness etc. are obtained, by micro- characterization method, to polishing machine
Reason is analyzed.At present about vibration parameters (frequency, amplitude etc.) to the distribution of polishing area abrasive grain, kinetic characteristic, microcosmic
The mechanism of action of cutting behavior etc. cannot still be explained well.Therefore, deeply understand and disclose vibration Field Assisted Ultraprecision and throw
The behavior of the abrasive grain cutting material of light method, probes into its processing mechanism, it has also become one is badly in need of the critical issue solved.
Invention content
In view of this, the modeling and simulating method and dress that are designed to provide a kind of mechanical polishing process of the embodiment of the present invention
It puts, to solve the above problems.
In a first aspect, an embodiment of the present invention provides a kind of modeling and simulating method of mechanical polishing process, the method packet
It includes：The first operation object for obtaining characterization polishing tool, the second operand for characterizing workpiece, the third operation for characterizing polishing fluid
4th operation object of abrasive grain in object and the characterization polishing fluid；First operation object, described second are obtained respectively
The physical characteristic data of operation object, the third operation object and the 4th operation object；Obtain first operation
The initial motion parameter of object so that generate relative motion between first operation object and the second operand；Base
In first operation object, the second operand, the third operation object, the 4th operation object and described
The initial motion parameter of first operation object establishes the solid-liquid coupling model of characterization mechanical polishing process；Obtain first behaviour
Make the first kinematic parameter of object and the second kinematic parameter of the second operand；It was mechanically polished based on the characterization
Second movement of the solid-liquid coupling model of journey, the first kinematic parameter of first operation object, the second operand is joined
Several and preset simulation time section, is emulated, and according to second described in the timing acquisition of the preset simulation time section
The speed data of the stress data of operation object and the 4th operation object；Calculating based on preset characterization polishing efficiency
The speed data of the stress data of regular, described second operand and the 4th operation object obtains second behaviour
Make the first data of the characterization polishing efficiency of object and the second data of the characterization polishing efficiency of the 4th operation object；Point
The first data of the characterization polishing efficiency of the second operand are analysed and compared, obtain characterization polishing efficiency preferable described the
First kinematic parameter of one operation object and the second kinematic parameter for characterizing the preferably described second operand of polishing efficiency,
To evaluate the feasibility in theory of the solid-liquid coupling model of the characterization mechanical polishing process.
Second aspect, an embodiment of the present invention provides a kind of modeling and simulating device of mechanical polishing process, described device packets
It includes：Operation object acquiring unit, for the second operation pair for obtaining the first operation object of characterization polishing tool, characterizing workpiece
As the 4th operation object of abrasive grain in, the third operation object of characterization polishing fluid and the characterization polishing fluid；Physical characteristic number
According to acquiring unit, for obtain respectively first operation object, the second operand, the third operation object and
The physical characteristic data of 4th operation object；First kinematic parameter acquiring unit, for obtaining first operation object
Initial motion parameter so that generate relative motion between first operation object and the second operand；Solid-liquid coupling
Model foundation unit is closed, for being based on first operation object, the second operand, the third operation object, institute
The initial motion parameter of the 4th operation object and first operation object is stated, establishes the solid-liquid coupling of characterization mechanical polishing process
Molding type；Second kinematic parameter acquiring unit, for obtaining the first kinematic parameter of first operation object and described
Second kinematic parameter of two operation objects；Simulation unit, for based on it is described characterization mechanical polishing process solid-liquid coupling model,
When the first kinematic parameter of first operation object, the second kinematic parameter of the second operand and preset emulation
Between section, emulated, and according to the stress data of second operand described in the timing acquisition of the preset simulation time section
And the speed data of the 4th operation object；Polishing efficiency data capture unit, for being based on preset characterization polishing effect
The speed data of the computation rule of rate, the stress data of the second operand and the 4th operation object obtains institute
State the of the first data of the characterization polishing efficiency of second operand and the characterization polishing efficiency of the 4th operation object
Two data；Solid-liquid coupling model evaluation unit, for analyzing and comparing the of the characterization polishing efficiency of the second operand
One data, obtain preferable first operation object of characterization polishing efficiency the first kinematic parameter and characterization polishing efficiency compared with
Second kinematic parameter of the good second operand, to evaluate the solid-liquid coupling model of the characterization mechanical polishing process
Feasibility in theory.
An embodiment of the present invention provides the modeling and simulating methods and device of a kind of mechanical polishing process, are thrown by obtaining characterization
First operation object of optical tool, the second operand for characterizing workpiece, the third operation object and characterization for characterizing polishing fluid
4th operation object of abrasive grain in the polishing fluid；The first operation object, second operand, described is obtained respectively
The physical characteristic data of third operation object and the 4th operation object；Obtain the initial motion of first operation object
Parameter so that generate relative motion between first operation object and the second operand；Based on the described first operation
Object, the second operand, the third operation object, the 4th operation object and first operation object
Initial motion parameter establishes the solid-liquid coupling model of characterization mechanical polishing process；Obtain the first fortune of first operation object
Second kinematic parameter of dynamic parameter and the second operand；Solid-liquid coupling mould based on the characterization mechanical polishing process
Type, the first kinematic parameter of first operation object, the second kinematic parameter of the second operand and preset imitative
It the true period, is emulated, and according to the stress of second operand described in the timing acquisition of the preset simulation time section
The speed data of data and the 4th operation object；Computation rule based on preset characterization polishing efficiency, described second
The speed data of the stress data of operation object and the 4th operation object, the characterization for obtaining the second operand are thrown
Second data of the characterization polishing efficiency of the first data of light efficiency and the 4th operation object；It analyzes and compares described
First data of the characterization polishing efficiency of two operation objects obtain the of preferable first operation object of characterization polishing efficiency
One kinematic parameter and the second kinematic parameter for characterizing the preferably described second operand of polishing efficiency, so as in actual machine
Polishing efficiency is improved in polishing process.
Other features and advantages of the present invention will illustrate, also, partly become from specification in subsequent specification
It is clear that by implementing understanding of the embodiment of the present invention.The purpose of the present invention and other advantages can be by saying what is write
Specifically noted structure is realized and is obtained in bright book, claims and attached drawing.
Description of the drawings
It in order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached
Figure is briefly described, it should be understood that the following drawings illustrates only certain embodiments of the present invention, therefore is not construed as pair
The restriction of range, for those of ordinary skill in the art, without creative efforts, can also be according to this
A little attached drawings obtain other relevant attached drawings.
Fig. 1 is a kind of structure diagram that can be applied to the electronic equipment in the embodiment of the present application；
Fig. 2 is the flow chart of the modeling and simulating method of mechanical polishing process that first embodiment of the invention provides；
Fig. 3 is the flow chart of the modeling and simulating method of mechanical polishing process that second embodiment of the invention provides；
Fig. 4 is the schematic diagram of micro-structure surface vibration auxiliary polishing that second embodiment of the invention provides；
Fig. 5 is the schematic diagram of polishing tool that second embodiment of the invention provides；
Fig. 6 is the schematic diagram of workpiece that second embodiment of the invention provides；
Fig. 7 is the schematic diagram of abrasive grain that second embodiment of the invention provides；
Fig. 8 is the schematic diagram of fluid grid that second embodiment of the invention provides；
Fig. 9 is the schematic diagram of solid-liquid coupling model that second embodiment of the invention provides；
Figure 10 is the schematic diagram that the polishing tool that second embodiment of the invention provides moves downward under force；
Figure 11 be second embodiment of the invention provide it is without friction in the case of the schematic diagram that changes over time of fluid pressure；
Figure 12 be second embodiment of the invention provide it is without friction in the case of the schematic diagram that changes over time of fluid velocity；
Figure 13 is that the vibration frequency that second embodiment of the invention provides is the signal that 900Hz fluid pressures change over time
Figure；
Figure 14 is that the vibration frequency that second embodiment of the invention provides is the signal that 900Hz fluid velocities change over time
Figure；
Figure 15 is that the vibration frequency that second embodiment of the invention provides is the signal that 20000Hz fluid pressures change over time
Figure；
Figure 16 is that the vibration frequency that second embodiment of the invention provides is the signal that 20000Hz fluid velocities change over time
Figure；
Figure 17 is the schematic diagram of the movement locus of the 1st particle that second embodiment of the invention provides；
Figure 18 is the schematic diagram of the movement locus of the 2nd particle that second embodiment of the invention provides；
Figure 19 is the schematic diagram of the movement locus of the 3rd abrasive grain that second embodiment of the invention provides；
Figure 20 is the schematic diagram of the movement locus of the 4th abrasive grain that second embodiment of the invention provides；
Figure 21 is the schematic diagram of the movement locus of the 5th abrasive grain that second embodiment of the invention provides；
Figure 22 is the schematic diagram of the movement locus of the 6th abrasive grain that second embodiment of the invention provides；
Figure 23 is product of the low-frequency vibration frequency that provides of second embodiment of the invention to unbalanced force suffered by workpiece to the time
The schematic diagram of the influence divided；
Figure 24 is the low-frequency vibration frequency that provides of second embodiment of the invention to influence of the abrasive grain speed to time integral
Schematic diagram；
Figure 25 is product of the dither frequencies that provide of second embodiment of the invention to unbalanced force suffered by workpiece to the time
The schematic diagram of the influence divided；
Figure 26 is the dither frequencies that provide of second embodiment of the invention to influence of the abrasive grain speed to time integral
Schematic diagram；
Figure 27 is the modeling and simulating device of mechanical polishing process that third embodiment of the invention provides.
Specific embodiment
Below in conjunction with attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Ground describes, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.Usually exist
The component of the embodiment of the present invention described and illustrated in attached drawing can be configured to arrange and design with a variety of different herein.Cause
This, the detailed description of the embodiment of the present invention to providing in the accompanying drawings is not intended to limit claimed invention below
Range, but it is merely representative of the selected embodiment of the present invention.Based on the embodiment of the present invention, those skilled in the art are not doing
Go out all other embodiments obtained under the premise of creative work, shall fall within the protection scope of the present invention.
It should be noted that：Similar label and letter represents similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, does not then need to that it is further defined and explained in subsequent attached drawing.Meanwhile the present invention's
In description, term " first ", " second " etc. are only used for distinguishing description, and it is not intended that instruction or hint relative importance.
Referring to Fig. 1, Fig. 1 shows a kind of structure diagram of electronic equipment 100 that can be applied in the embodiment of the present application.
The electronic equipment 100 can be used as user terminal or computer or server, the user terminal can be mobile phone or
Tablet computer.As shown in Figure 1, electronic equipment 100 can include memory 110, storage control 111, processor 112 and machinery
The modeling and simulating device of polishing process.
It is directly or indirectly electrically connected between memory 110, storage control 111,112 each element of processor, to realize
The transmission or interaction of data.For example, can electricity be realized by one or more communication bus or signal bus between these elements
Connection.The modeling and simulating method of mechanical polishing process respectively include it is at least one can be with the shape of software or firmware (firmware)
Formula is stored in the software function module in memory 110, for example, the mechanical polishing process modeling and simulating device include it is soft
Part function module or computer program.
It is directly or indirectly electrically connected between memory 110, storage control 111,112 each element of processor, to realize
The transmission or interaction of data.For example, can electricity be realized by one or more communication bus or signal bus between these elements
Connection.The modeling and simulating method of mechanical polishing process respectively include it is at least one can be with the shape of software or firmware (firmware)
Formula is stored in the software function module in memory 110, for example, the mechanical polishing process modeling and simulating device include it is soft
Part function module or computer program.
Memory 110 can store various software programs and module, be mechanically polished Ru provided by the embodiments of the present application
Corresponding program instruction/the module of modeling and simulating method and device of journey.Processor 112 is by running storage in the memory 110
Software program and module, so as to perform various functions application and data processing, that is, realize the machine in the embodiment of the present application
The modeling and simulating method of tool polishing process.Memory 110 can include but is not limited to random access memory (Random
Access Memory, RAM), read-only memory (Read Only Memory, ROM), programmable read only memory
(Programmable Read-Only Memory, PROM), erasable read-only memory (ErasableProgrammable
Read-Only Memory, EPROM), electricallyerasable ROM (EEROM) (ElectricErasable Programmable
Read-Only Memory, EEPROM) etc..
Processor 112 can be a kind of IC chip, have signal handling capacity.Above-mentioned processor can be general
Processor, including central processing unit (Central Processing Unit, abbreviation CPU), network processing unit (Network
Processor, abbreviation NP) etc.；It can also be digital signal processor (DSP), application-specific integrated circuit (ASIC), ready-made programmable
Gate array (FPGA) either other programmable logic device, discrete gate or transistor logic, discrete hardware components.It can
To realize or perform disclosed each method, step and the logic diagram in the embodiment of the present application.General processor can be micro-
Processor or the processor can also be any conventional processors etc..
First embodiment
Referring to Fig. 2, a kind of modeling and simulating method of mechanical polishing process is present embodiments provided, the method includes：
S200：The first operation object for obtaining characterization polishing tool, the second operand for characterizing workpiece, characterization polishing fluid
Third operation object and the characterization polishing fluid in abrasive grain the 4th operation object；
S210：First operation object, the second operand, the third operation object and institute are obtained respectively
State the physical characteristic data of the 4th operation object；
S220：Obtain the initial motion parameter of first operation object so that first operation object and described the
Relative motion is generated between two operation objects；
S230：Based on first operation object, the second operand, the third operation object, the described 4th
The initial motion parameter of operation object and first operation object establishes the solid-liquid coupling for characterizing the mechanical polishing process
Model；
S240：Obtain the second movement of the first kinematic parameter and the second operand of first operation object
Parameter；
S250：First fortune of solid-liquid coupling model, first operation object based on the characterization mechanical polishing process
Dynamic parameter, the second kinematic parameter of the second operand and preset simulation time section, are emulated, and according to described
The speed of the stress data of second operand and the 4th operation object described in the timing acquisition of preset simulation time section
Degrees of data；
S260：Based on the preset characterization computation rule of polishing efficiency, the second operand stress data and
The speed data of 4th operation object obtains the first data and the institute of the characterization polishing efficiency of the second operand
State the second data of the characterization polishing efficiency of the 4th operation object；
S270：The first data of the characterization polishing efficiency of the second operand are analyzed and compared, obtain characterization polishing
Preferable second operation pair of the first kinematic parameter and characterization polishing efficiency of preferable first operation object of efficiency
The second kinematic parameter of elephant, to evaluate the feasibility in theory of the solid-liquid coupling model of the characterization mechanical polishing process.
An embodiment of the present invention provides a kind of modeling and simulating method of mechanical polishing process, by establishing characterization mechanical polishing
The solid-liquid coupling model of process, is emulated, and obtains the characterization preferable kinematic parameter of polishing efficiency, is thrown hence for vibration auxiliary
The research of luminescent material cutting mechanisms will greatly facilitate effect, have to the optimization of actual machine polishing process parameter good
Directive significance, to improve polishing efficiency in actual machine polishing process.
Second embodiment
Fig. 3 is please referred to, an embodiment of the present invention provides a kind of modeling and simulating method of mechanical polishing process, the method packets
It includes：
S300：The first operation object for obtaining characterization polishing tool, the second operand for characterizing workpiece, characterization polishing fluid
Third operation object and the characterization polishing fluid in abrasive grain the 4th operation object；
S310：First operation object, the second operand, the third operation object and institute are obtained respectively
State the physical characteristic data of the 4th operation object；
Please refer to Fig. 4, the vibration assisted polishing of micro-structure the polishing tool of vibration and contains abrasive material by the workpiece that rotates
Polishing fluid composition.Under the polishing tool rotary motion driving of reciprocating vibration with workpiece, the abrasive grain in polishing fluid obtains enough
Speed and energy, to workpiece surface carry out micro cutting, achieve the purpose that polishing.
Granular media substance is prevalent in nature, and many engineering problems are related to the processing analysis of granular media substance.Granular media
The structure of matter is various, has the dry granular media without gas and liquid, there is the heterogeneous fluid all contained containing gas, liquid or both,
And the wet granular group that interstitial fluid and compact grain body blend together.For granular media substance there are two feature, one is " scattered ", i.e. granular media
Shape, granularity and the physical property of grain all show dispersibility.Secondly for collision, fluctuation during " dynamic " and the granular media motion of matter
Cohesion, decomposition with aggregates body.It is verified, by the theoretical origin of continuum mechanics in granular media object Quality Research be have it is very big
Drawback.Because uniform, continuous solution is set inconsistent in the feature and continuum theory of granular media substance, so that granular media substance connects
Continuous body theory cannot be simulated well.Distinct element method comes into being with advancing by leaps and bounds for computer technology, becomes simulation
The brand-new numerical analysis method of granular media substance.
The unit that discrete element method uses has two major class of granule and block, these units are as basic unit in discrete element
For forming granular media substance in method, the number of unit is limited, in the situation that this discussion unit is granule.Discrete element
Using application of explicit difference method in method, and each unit is allowed to meet Newton's second law, with movements such as this speed, the positions that obtain unit
Information.
PFC3DWith the movement and interaction of discrete-time epidemic model spheric granules, can also simulate by by two or two
Motor behavior (use block Clump order) of a above spheric granules bonding for the object with independence of arbitrary shape.
PFC3DBrittle solid (by the way that each particle is bonded to each other) can also be simulated, obtained aggregate has elastic characteristic, when viscous
Connect destroyed, gained aggregate can be ruptured, be damaged.Model entity can be built into it is isotropic, can also include not
Connatural region or block.
As a kind of embodiment, PFC is utilized3D4.0 softwares are first to workpiece and polishing tool contact area micro-structure
Simplified, in favor of subsequently modeling；Then suitable simulation parameter is chosen according to actual conditions；Then according to the model after simplifying
It is modeled with selected parameter；It is finally emulated, records data, analysis result.
Specifically, workpiece and polishing tool contact area micro-structure are simplified first, uses PFC3DIn 4.0 softwares
Clump functions establish polishing tool and workpiece, model such as Fig. 5 and Fig. 6, Clump after simplifying are by a certain number of Ball groups
Into；Use PFC3DBall functions in 4.0 softwares establish the abrasive grain in polishing fluid, and the model after simplifying please refers to Fig. 7；It uses
PFC3DBasic Fluid Analysis Option functions in 4.0 softwares establish the liquid portion of polishing fluid, the mould after simplifying
Type such as Fig. 8, entire model general effect please refer to Fig. 9.
Secondly, suitable simulation parameter is chosen according to actual conditions.It is chosen according to the actual conditions simulated and is thrown for creating
The rigidity of the Ball of optical tool and workpiece and abrasive grain, density, friction coefficient and size, number parameter；Selection polishing fluid density,
The boundary condition of viscosity and reflection reality；When choosing suitable vibration parameters, polish pressure, feed-speed and emulation
It is long.Since abrasive grain is to suspend in diamond polishing liquid, so ignoring the effect of buoyancy and gravity in experiment.
As a kind of embodiment, polishing tool material therefor is polyurethane, is made of the particle that 66 radiuses are 30 μm
Clump establish, a length of 405 μm, width be 187.3 μm, a height of 60 μm, density 1170kg/m3, normal stiffness is：Kn=6*
104N/m, shear stiffness are：Ks=6*104N/m, friction coefficient 0.2；Workpiece is made of the particle that 200 radiuses are 30 μm
Clump, material is silicon carbide, a length of 1026 μm, width be 216.5 μm, a height of 60 μm, density 3200kg/m3, normal stiffness
For kn=4.92*107N/m, shear stiffness ks=4.92*107N/m, friction coefficient 0.12；Abrasive material is diadust, is used
The Ball of 500 0.25 μm of radiuses is established, density 3500kg/m3, normal stiffness kn=1.32*108N/m, shear stiffness
For ks=1.32*108N/m, friction coefficient 0.08；Polishing fluid be room temperature liquid water, density 997.048kg/m3, viscosity is
0.8937*10-3Pa*s, with a length of 250 μm, width is 130 μm, and a height of 130 μm of fluid grid is simulated, fluid outermost layer grid
For applying fluid boundary condition, fluid is all around and top is using pressure boundary condition (fluid may pass through), under fluid
Portion uses moving boundary condition (fluid not may pass through).The a diameter of 2mm of workpiece polishing area.Emulation experiment polishing tool and workpiece
The area of contact area is 4.39*10-8m2.Since abrasive grain is to suspend in diamond polishing liquid, so ignoring buoyancy in experiment
With the effect of gravity.System damping coefficient is set as 0.1.
S330：Using the third operation object as running environment variable, the initial motion based on first operation object
Parameter so that first operation object moves and the second operand is pushed to contact and produce with the 4th operation object
Raw relative motion, until relative motion reaches stable state, the solid-liquid coupling model of foundation characterization mechanical polishing process；
PFC3DThe coupling Simulation of fluid and particle is carried out using fixed rough segmentation grid fluid flow scheme, this scheme is stream
Body solves the quality and the equation of momentum of the two-phase (fluid and solid) of local average.Interaction for fluid and solid, this
Scheme is considered the general type of Navier-Stokes equations.Fluid solver uses famous SIMPLE schemes, this
A little fluids are incompressible viscosity or non-viscous fluid, are present in the rectangle solid being fixed in cartesian coordinate system, are flowed
Body internal discrete is fixed and regular, and multiple fluid boundary condition can be applied on the outside of fixed rectangle solid.Base
Plinth coupling formula assumes PFC3DParticle radius be much smaller than single element of fluid length.
Modeling process is：It is generated in model in addition to the other parts of polishing fluid by selected parameter first.Then apply one
Power contacts polishing tool downlink and workpiece abrasive grain, such as Figure 10, and the direction of arrow represents the direction of abrasive grain speed, arrow in figure
Length represent particle speed size.Running the sufficiently long time makes model reach metastable state (speed is sufficiently small).
When model running to stable state, in addition fluid grid, model foundation is completed.
S340：Obtain the second movement of the first kinematic parameter and the second operand of first operation object
Parameter；
As a kind of embodiment, all vibrations are that polishing tool horizontal one-dimensional is of reciprocating vibration, direction and workpiece motion s
Direction is consistent.
S350：It is described in preset simulation time section in the solid-liquid coupling model of the characterization mechanical polishing process
First kinematic parameter of the first operation object causes first operation object to do one-dimensional reciprocating motion, the second operand
The second kinematic parameter so that the second operand and first operation object do the movement of the same direction, obtain simultaneously
Each stress data of second operand described in the moment and the 4th operation object in preset simulation time section
Speed data；
S360：Stress data based on impluse formulae and the second operand, obtains the second operand
Characterization polishing efficiency the first data；The number of speed of formula and the 4th operation object based on velocity versus time integration
According to the second data of the characterization polishing efficiency of acquisition the 4th operation object；
S370：The first data of the characterization polishing efficiency of the second operand are analyzed, obtain second operation pair
The maximum value of first data of the characterization polishing efficiency of elephant, so as to obtain and the characterization polishing efficiency of the second operand
First kinematic parameter of the second operand corresponding to the maximum value of the first data and the second operand
First kinematic parameter, to evaluate the feasibility in theory of the solid-liquid coupling model of the characterization mechanical polishing process.
And then emulated, data are recorded, analysis result is：Data record is carried out along with emulation, and the data of record have
The x, y, z of each moment all particles is to average speed in Fluid pressure, fluid velocity, abrasive grain track, single fluid grid
The x, y, z that size, workpiece are subject at each moment is to the size of unbalanced force.The quality of polishing efficiency is in single fluid grid
The average value of all particle speed sizes is to the size of unbalanced force suffered by the size and workpiece of the integrated value of time to the time
The size of integrated value characterizes.
It as a kind of embodiment, is carried out in the case of no abrasive grain, has carried out three experiments, vibration frequency is respectively
0Hz, 900Hz and 20000Hz, other experiment parameters are identical：30 μm, work speed 3.52m/s, polish pressure 30mN of amplitude.With
PFC3D4.0 software records simultaneously depict fluid velocity and pressure and change with time situation, as shown in Figure 11 to Figure 16.
It can be seen that in the case of no vibration input from Figure 11, Figure 13 and Figure 15, fluid pressure curvilinear motion is more
Steadily, value is in -0.64*103Pa to 0.74*103Between Pa.When vibration frequency is 900Hz, fluid pressure curve occurs bright
Aobvious fluctuation, value is in -1.3*103Pa to 2.3*103Between Pa.When vibration frequency is 20000Hz, fluid pressure significantly increases,
Its value is in -92*103Pa to 88*103Between Pa.The situation in no vibration input is can be seen that from Figure 12, Figure 14 and Figure 16
Under, fluid velocity profiles variation is more steady, and value is between 2.51m/s to 2.57m/s.When vibration frequency is 900Hz, stream
There is apparent fluctuation in body rate curve, and value is between 2.4m/s to 2.71m/s.When vibration frequency is 20000Hz, fluid speed
Degree significantly increases, and value is between 1.4m/s to 3.5m/s.
Therefore, analysis obtains：In the case of no vibration input, Fluid pressure and rate curve variation are all more flat
Surely；When there is vibration input, significantly fluctuating all occur in Fluid pressure and rate curve, and the amplitude of Fluid pressure and speed have it is bright
Aobvious increase, when vibration frequency is bigger, fluid is bigger by being influenced.It can be seen that vibration can effectively accelerate the stream of fluid
It moves and strengthens the effect of internal fluid pressure, this will promote vibration that abrasive grain in polishing is assisted to have stronger percussion to workpiece.
As a kind of embodiment, the movement locus experiment of a cycle endoparticle is present embodiments provided.In vibration frequency
Rate is 20000Hz, 30 μm of amplitude, work speed 5.23*10-3M/s, under the Parameter Conditions of polish pressure 30mN.Follow-up observation
The movement locus of randomly selected 1st, the 2nd, the 3rd, the 4th, the 5th and the 6th abrasive grain, a length of 5*10 during experiment- 5S, as shown in Figure 17 to Figure 22.
As can be seen that grain motion is more irregular in from Figure 17 to Figure 22, this is because the input of vibration causes polishing fluid
Movement becomes irregular, and abrasive grain shows irregularities under the drive of polishing fluid.In a short time, particle trajectories line occurs
Multiple deflecting intuitively reflects that the input of vibration is with causing the dyskinesia of abrasive grain active.
As a kind of embodiment, influence experiment of the vibration frequency to polishing efficiency is present embodiments provided.
Under 11 kinds of vibration frequencies (100Hz, 300Hz, 500Hz, 700Hz, 900Hz, 1500Hz, 3000Hz, 5000Hz,
10000Hz, 20000Hz, 30000Hz) have studied influence of the vibration frequency to polishing efficiency.Amplitude is 30 μm, and work speed is
5.23*10-3M/s, polish pressure 30mN, a length of 2*10 during single experiment-4Work speed is when s, 100Hz to 1500Hz
Work speed is 5.23*10 when 3.52m/s, 3000Hz to 30000Hz-3m/s.Experimental result is as shown in Figure 23 to Figure 26.
Comparison diagram 23 finds that no matter under height frequency, frequency is to unbalanced force suffered by workpiece to the product of time to Figure 26
The affecting laws and frequency divided all have stronger consistency to abrasive grain speed to the affecting laws of time integral.This shows workpiece
The size and abrasive grain totality active degree of suffered unbalanced force are proportionate.
In the case where low-frequency vibration is plus high workpiece speed conditions, unbalanced force suffered by workpiece is to the integration and abrasive grain speed of time
To time integral with the increase of vibration frequency, all there are one fall before rise again after the process that declines again, be in vibration frequency
Reach minimum during 300Hz or so, frequency reaches higher value when being 100Hz and 1000Hz.Low workpiece rotational frequency is added in high-frequency vibration
Under the conditions of, unbalanced force suffered by workpiece to the integration of time and abrasive grain speed to time integral with the increase of vibration frequency, all
Substantially the trend to grow steadily is presented.This discovery has directive significance to the selection of actual processing condition lower frequency.
An embodiment of the present invention provides a kind of modeling and simulating method of mechanical polishing process, by establishing characterization mechanical polishing
The solid-liquid coupling model of process, is emulated, obtain characterization polishing efficiency preferable low-frequency vibration plus high workpiece speed conditions,
High-frequency vibration adds low workpiece rotational frequency condition, will have great rush hence for the research of vibration auxiliary polishing material cutting mechanisms
Into effect, there is good directive significance to the optimization of actual machine polishing process parameter, so as in actual machine polishing process
Middle raising polishing efficiency.
3rd embodiment
Figure 27 is please referred to, an embodiment of the present invention provides a kind of modeling and simulating device 400 of mechanical polishing process, the dresses
400 are put to include：
Operation object acquiring unit 410, for obtaining the first operation object of characterization polishing tool, characterizing the second of workpiece
4th operation object of abrasive grain in operation object, the third operation object for characterizing polishing fluid and the characterization polishing fluid；
Physical characteristic data acquiring unit 420, for obtaining first operation object, second operation pair respectively
As the physical characteristic data of, the third operation object and the 4th operation object；
First kinematic parameter acquiring unit 430, for obtaining the initial motion parameter of first operation object so that institute
It states and generates relative motion between the first operation object and the second operand；
Solid-liquid coupling model foundation unit 440, for being based on first operation object, the second operand, institute
The initial motion parameter of third operation object, the 4th operation object and first operation object is stated, establishes characterization machine
The solid-liquid coupling model of tool polishing process；
As a kind of embodiment, the solid-liquid coupling model foundation unit 440, for using the third operation object as
Running environment variable, the initial motion parameter based on first operation object so that first operation object is moved and pushed away
It moves the second operand to contact with the 4th operation object and generate relative motion, until relative motion reaches stable shape
State establishes the solid-liquid coupling model for characterizing the mechanical polishing process.
Second kinematic parameter acquiring unit 450, for obtaining the first kinematic parameter of first operation object and institute
State the second kinematic parameter of second operand；
Simulation unit 460, for the solid-liquid coupling model based on the characterization mechanical polishing process, first operation pair
The first kinematic parameter of elephant, the second kinematic parameter of the second operand and preset simulation time section, are emulated,
And according to the stress data of second operand described in the timing acquisition of the preset simulation time section and the 4th behaviour
Make the speed data of object；
As a kind of embodiment, the simulation unit 460, in the solid-liquid coupling of the characterization mechanical polishing process
In model, in preset simulation time section, the first kinematic parameter of first operation object causes first operation pair
As doing one-dimensional reciprocating motion, the second kinematic parameter of the second operand causes the second operand and described first
Operation object does the movement of the same direction, while obtains each second operand described in the moment in preset simulation time section
Stress data and the 4th operation object speed data.
Polishing efficiency data capture unit 470, for the computation rule based on preset characterization polishing efficiency, described second
The speed data of the stress data of operation object and the 4th operation object, the characterization for obtaining the second operand are thrown
Second data of the characterization polishing efficiency of the first data of light efficiency and the 4th operation object；
As a kind of embodiment, polishing efficiency data capture unit 470, for being based on impluse formulae and described second
The stress data of operation object obtains the first data of the characterization polishing efficiency of the second operand；During based on speed pair
Between the speed data of the formula that integrates and the 4th operation object, obtain the characterization polishing efficiency of the 4th operation object
The second data.
Solid-liquid coupling model evaluation unit 480, for analyzing and comparing the characterization polishing efficiency of the second operand
The first data, obtain the first kinematic parameter of preferable first operation object of characterization polishing efficiency and characterization polishing effect
Second kinematic parameter of the preferably described second operand of rate, to evaluate the solid-liquid coupling mould of the characterization mechanical polishing process
The feasibility in theory of type.
As a kind of embodiment, the solid-liquid coupling model evaluation unit 480, for analyzing the second operand
Characterization polishing efficiency the first data, obtain the second operand characterization polishing efficiency the first data maximum
Value, so as to obtain and described second corresponding to the maximum value of the first data of the characterization polishing efficiency of the second operand
First kinematic parameter of operation object and the first kinematic parameter of the second operand are thrown with evaluating the characterization machinery
The feasibility in theory of the solid-liquid coupling model of photoreduction process.
It should be noted that each unit in the present embodiment can be by software code realization, at this point, above-mentioned each unit
It can be stored in memory 110.More than each unit can equally be realized by hardware such as IC chip.
In several embodiments provided herein, it should be understood that disclosed device and method can also pass through
Other modes are realized.The apparatus embodiments described above are merely exemplary, for example, flow chart and block diagram in attached drawing
Show the device of multiple embodiments according to the present invention, the architectural framework in the cards of method and computer program product,
Function and operation.In this regard, each box in flow chart or block diagram can represent the one of a module, program segment or code
Part, a part for the module, program segment or code include one or more and are used to implement holding for defined logic function
Row instruction.It should also be noted that at some as in the realization method replaced, the function that is marked in box can also be to be different from
The sequence marked in attached drawing occurs.For example, two continuous boxes can essentially perform substantially in parallel, they are sometimes
It can perform in the opposite order, this is depended on the functions involved.It is it is also noted that every in block diagram and/or flow chart
The combination of a box and the box in block diagram and/or flow chart can use function or the dedicated base of action as defined in performing
It realizes or can be realized with the combination of specialized hardware and computer instruction in the system of hardware.
In addition, each function module in each embodiment of the present invention can integrate to form an independent portion
Point or modules individualism, can also two or more modules be integrated to form an independent part.
If the function is realized in the form of software function module and is independent product sale or in use, can be with
It is stored in a computer read/write memory medium.Based on such understanding, technical scheme of the present invention is substantially in other words
The part contribute to the prior art or the part of the technical solution can be embodied in the form of software product, the meter
Calculation machine software product is stored in a storage medium, is used including some instructions so that a computer equipment (can be
People's computer, server or network equipment etc.) perform all or part of the steps of the method according to each embodiment of the present invention.
And aforementioned storage medium includes：USB flash disk, mobile hard disk, read-only memory (ROM, Read-OnlyMemory), arbitrary access are deposited
The various media that can store program code such as reservoir (RAM, Random Access Memory), magnetic disc or CD.It needs
Illustrate, herein, relational terms such as first and second and the like be used merely to by an entity or operation with
Another entity or operation distinguish, and without necessarily requiring or implying between these entities or operation, there are any this realities
The relationship or sequence on border.Moreover, term " comprising ", "comprising" or its any other variant are intended to the packet of nonexcludability
Contain so that process, method, article or equipment including a series of elements not only include those elements, but also including
It other elements that are not explicitly listed or further includes as elements inherent to such a process, method, article, or device.
In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that including the element
Process, method, also there are other identical elements in article or equipment.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, that is made any repaiies
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.It should be noted that：Similar label and letter exists
Similar terms are represented in following attached drawing, therefore, once being defined in a certain Xiang Yi attached drawing, are then not required in subsequent attached drawing
It is further defined and is explained.
The above description is merely a specific embodiment, but protection scope of the present invention is not limited thereto, any
Those familiar with the art in the technical scope disclosed by the present invention, can readily occur in change or replacement, should all contain
Lid is within protection scope of the present invention.Therefore, protection scope of the present invention described should be subject to the protection scope in claims.
It should be noted that herein, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any this practical relationship or sequence.Moreover, term " comprising ", "comprising" or its any other variant are intended to
Non-exclusive inclusion, so that process, method, article or equipment including a series of elements not only will including those
Element, but also including other elements that are not explicitly listed or further include as this process, method, article or equipment
Intrinsic element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that
Also there are other identical elements in process, method, article or equipment including the element.
Claims (8)
1. a kind of modeling and simulating method of mechanical polishing process, which is characterized in that the method includes：
The first operation object for obtaining characterization polishing tool, the second operand for characterizing workpiece, the third behaviour for characterizing polishing fluid
Make the 4th operation object of abrasive grain in object and the characterization polishing fluid；
First operation object, the second operand, the third operation object and the 4th behaviour are obtained respectively
Make the physical characteristic data of object；
Obtain the initial motion parameter of first operation object so that first operation object and the second operand
Between generate relative motion；
Based on first operation object, the second operand, the third operation object, the 4th operation object with
And the initial motion parameter of first operation object, establish the solid-liquid coupling model for characterizing mechanical polishing process；
Obtain the first kinematic parameter of first operation object and the second kinematic parameter of the second operand；
Based on the characterization solid-liquid coupling model of mechanical polishing process, the first kinematic parameter of first operation object, institute
The second kinematic parameter of second operand and preset simulation time section are stated, is emulated, and according to described preset imitative
The stress data of second operand and the speed data of the 4th operation object described in the timing acquisition of true period；
The stress data of computation rule, the second operand based on preset characterization polishing efficiency and the 4th behaviour
Make the speed data of object, obtain the first data of the characterization polishing efficiency of the second operand and the 4th operation
Second data of the characterization polishing efficiency of object；
The first data of the characterization polishing efficiency of the second operand are analyzed and compared, it is preferable to obtain characterization polishing efficiency
First kinematic parameter of first operation object and the second fortune for characterizing the preferably described second operand of polishing efficiency
Dynamic parameter, to evaluate the feasibility in theory of the solid-liquid coupling model of the characterization mechanical polishing process；
It is described to be based on first operation object, the second operand, the third operation object, the 4th operation pair
As and first operation object initial motion parameter, establish characterization mechanical polishing process solid-liquid coupling model, including：
Using the third operation object as running environment variable, the initial motion parameter based on first operation object so that
First operation object moves and the second operand is pushed to be contacted with the 4th operation object and generates opposite fortune
It is dynamic, until relative motion reaches stable state, the solid-liquid coupling model of foundation characterization mechanical polishing process.
2. the according to the method described in claim 1, it is characterized in that, solid-liquid coupling based on the characterization mechanical polishing process
Molding type, the first kinematic parameter of first operation object, the second kinematic parameter of the second operand and default
Simulation time section, emulated, and according to second operand described in the timing acquisition of the preset simulation time section
The speed data of stress data and the 4th operation object, including:
In the solid-liquid coupling model of the characterization mechanical polishing process, in preset simulation time section, first operation
First kinematic parameter of object causes first operation object to do one-dimensional reciprocating motion, the second fortune of the second operand
Dynamic parameter causes the second operand to do the movement of the same direction with first operation object, while obtains preset
The speed data of each stress data of second operand described in the moment and the 4th operation object in simulation time section.
3. the according to the method described in claim 1, it is characterized in that, calculating rule based on preset characterization polishing efficiency
Then, the speed data of the stress data of the second operand and the 4th operation object obtains second operation
Second data of the first data of the characterization polishing efficiency of object and the characterization polishing efficiency of the 4th operation object, packet
It includes：
Stress data based on impluse formulae and the second operand obtains the characterization polishing of the second operand
First data of efficiency；The speed data of formula and the 4th operation object based on velocity versus time integration, obtains institute
State the second data of the characterization polishing efficiency of the 4th operation object.
4. the according to the method described in claim 1, it is characterized in that, characterization analyzed and compare the second operand
First data of polishing efficiency, the first kinematic parameter and characterization for obtaining the second operand of characterization polishing efficiency are thrown
Second kinematic parameter of the 4th operation object of light efficiency, to evaluate the solid-liquid coupling mould of the characterization mechanical polishing process
The feasibility in theory of type, including：
The first data of the characterization polishing efficiency of the second operand are analyzed, the characterization for obtaining the second operand is thrown
The maximum value of first data of light efficiency, so as to obtain and the first data of the characterization polishing efficiency of the second operand
First kinematic parameter of the second operand corresponding to maximum value and the first movement ginseng of the second operand
Number, to evaluate the feasibility in theory of the solid-liquid coupling model of the characterization mechanical polishing process.
5. the modeling and simulating device of a kind of mechanical polishing process, which is characterized in that described device includes：
Operation object acquiring unit, for the second operation pair for obtaining the first operation object of characterization polishing tool, characterizing workpiece
As the 4th operation object of abrasive grain in, the third operation object of characterization polishing fluid and the characterization polishing fluid；
Physical characteristic data acquiring unit, for obtaining first operation object, the second operand, described respectively
The physical characteristic data of three operation objects and the 4th operation object；
First kinematic parameter acquiring unit, for obtaining the initial motion parameter of first operation object so that described first
Relative motion is generated between operation object and the second operand；
Solid-liquid coupling model foundation unit, for being based on first operation object, the second operand, third behaviour
Make the initial motion parameter of object, the 4th operation object and first operation object, establish characterization and mechanically polished
The solid-liquid coupling model of journey；
Second kinematic parameter acquiring unit, for obtaining the first kinematic parameter of first operation object and second behaviour
Make the second kinematic parameter of object；
Simulation unit, for the based on the characterization solid-liquid coupling model of mechanical polishing process, first operation object
One kinematic parameter, the second kinematic parameter of the second operand and preset simulation time section, are emulated, and according to
The stress data of second operand and the 4th operation object described in the timing acquisition of the preset simulation time section
Speed data；
Polishing efficiency data capture unit, for the computation rule based on preset characterization polishing efficiency, second operation pair
The speed data of the stress data of elephant and the 4th operation object obtains the characterization polishing efficiency of the second operand
The first data and the 4th operation object characterization polishing efficiency the second data；
Solid-liquid coupling model evaluation unit, for analyzing and comparing the first number of the characterization polishing efficiency of the second operand
According to the first kinematic parameter and the characterization polishing efficiency for obtaining preferable first operation object of characterization polishing efficiency are preferable
Second kinematic parameter of the second operand, to evaluate the theory of the solid-liquid coupling model of the characterization mechanical polishing process
Feasibility；
The solid-liquid coupling establishes unit, for using the third operation object as running environment variable, being grasped based on described first
Make the initial motion parameter of object so that first operation object moves and pushes the second operand and the described 4th
Operation object contacts and generates relative motion, and until relative motion reaches stable state, foundation characterizes the mechanical polishing process
Solid-liquid coupling model.
6. device according to claim 5, which is characterized in that the simulation unit, in the characterization mechanical polishing
In the solid-liquid coupling model of process, in preset simulation time section, the first kinematic parameter of first operation object causes
First operation object does one-dimensional reciprocating motion, and the second kinematic parameter of the second operand causes second operation
Object does the movement of the same direction with first operation object, while obtains each moment institute in preset simulation time section
State the stress data of second operand and the speed data of the 4th operation object.
7. device according to claim 5, which is characterized in that the polishing efficiency data capture unit, for being based on rushing
The stress data of formula and the second operand is measured, obtains the first of the characterization polishing efficiency of the second operand
Data；The speed data of formula and the 4th operation object based on velocity versus time integration obtains the 4th operation
Second data of the characterization polishing efficiency of object.
8. device according to claim 5, which is characterized in that the solid-liquid coupling model evaluation unit, for analyzing
The first data of the characterization polishing efficiency of second operand are stated, obtain the of the characterization polishing efficiency of the second operand
The maximum value of one data is right with the maximum value institute of the first data of the characterization polishing efficiency of the second operand so as to obtain
First kinematic parameter of the second operand answered and the first kinematic parameter of the second operand, to evaluate
State the feasibility in theory of the solid-liquid coupling model of characterization mechanical polishing process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611093954.7A CN106363468B (en) | 2016-12-02 | 2016-12-02 | The modeling and simulating method and device of mechanical polishing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611093954.7A CN106363468B (en) | 2016-12-02 | 2016-12-02 | The modeling and simulating method and device of mechanical polishing process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106363468A CN106363468A (en) | 2017-02-01 |
| CN106363468B true CN106363468B (en) | 2018-06-08 |
Family
ID=57892798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611093954.7A Active CN106363468B (en) | 2016-12-02 | 2016-12-02 | The modeling and simulating method and device of mechanical polishing process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106363468B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101833604A (en) * | 2010-04-29 | 2010-09-15 | 浙江工业大学 | Soft abrasive flow ultra-precision machining two-phase flow monitoring method based on discrete phase model |
| CN104657564A (en) * | 2015-03-16 | 2015-05-27 | 长春理工大学 | Abrasive flow machining numerical simulation research method based on molecular dynamics |
| CN105320782A (en) * | 2014-06-16 | 2016-02-10 | 复旦大学 | Feature-size-level chemical mechanical polishing process simulation method considering polishing solution influences |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG170805A1 (en) * | 2006-02-09 | 2011-05-30 | Kla Tencor Tech Corp | Methods and systems for determining a characteristic of a wafer |
-
2016
- 2016-12-02 CN CN201611093954.7A patent/CN106363468B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101833604A (en) * | 2010-04-29 | 2010-09-15 | 浙江工业大学 | Soft abrasive flow ultra-precision machining two-phase flow monitoring method based on discrete phase model |
| CN105320782A (en) * | 2014-06-16 | 2016-02-10 | 复旦大学 | Feature-size-level chemical mechanical polishing process simulation method considering polishing solution influences |
| CN104657564A (en) * | 2015-03-16 | 2015-05-27 | 长春理工大学 | Abrasive flow machining numerical simulation research method based on molecular dynamics |
Non-Patent Citations (1)
| Title |
|---|
| 化学机械抛光机理的建模分析;魏昕等;《全国生产工程第九届年会暨第四届青年科技工作者学术会议论文集（二）》;20040601 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106363468A (en) | 2017-02-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Zhao et al. | The role of particle shape in computational modelling of granular matter | |
| Lin et al. | A finite-discrete element based appoach for modelling the hydraulic fracturing of rocks with irregular inclusions | |
| EP2919140A1 (en) | Apparatus, method, and computer readable storage medium storing a program for simulating injection molding | |
| CN106363468B (en) | The modeling and simulating method and device of mechanical polishing process | |
| CN100483426C (en) | Method of border modeling with CAD model based discrete element method | |
| CN104915471A (en) | Structure surface wear simulation method based on discrete element method | |
| CHEN et al. | Application of the DEM to screening process: a 3D simulation | |
| CN104239627B (en) | Step-by-step coupling simulation method of dry sliding friction heat, stress and abrasion | |
| Sun et al. | Dynamics and structures of segregation in a dense, vibrating granular bed | |
| JPWO2014045416A1 (en) | Simulation program, simulation method, and simulation apparatus | |
| US9020784B2 (en) | Methods for providing a bonded-particle model in computer aided engineering system | |
| Shamseddine et al. | A novel spatio-temporally adaptive parallel three-dimensional DSMC solver for unsteady rarefied micro/nano gas flows | |
| Park et al. | Modeling the dynamics of fabric in a rotating horizontal drum using the discrete element method | |
| CN113205858A (en) | Simulation model and method for simulating dynamics of hinge mechanism motion molecules in flutter environment | |
| CN106197467A (en) | A kind of counting walks the processing method of parameter, device and mobile terminal | |
| Rath et al. | An introductory catalog of computer-synthesized contact sounds, in real-time | |
| Huber et al. | Evaluation of Surface Tension Models for SPH-Based Fluid Animations Using a Benchmark Test. | |
| Zhang et al. | Study on grinding force of Si3N4 ceramics in random rotation grinding with truncated polyhedral grains | |
| Ulrich et al. | Dilute wet granular particles: nonequilibrium dynamics and structure formation | |
| CN105320782B (en) | A kind of characteristic size grade CMP process emulation mode for considering polishing fluid and influencing | |
| Mohaghegh et al. | Modeling collisions of arbitrary-shaped particles in simulations of particulate flows | |
| Kim et al. | Efficient collision detection among moving spheres with unknown trajectories | |
| CN115145171A (en) | Digital twin-based performance prediction system and method for magneto-rheological delay mechanism | |
| JP2002109445A (en) | Behavior simulation method of particles in vessel, behavior simulation system and computer-readable recording medium | |
| Boltežar et al. | Dynamical behaviour of the planar non-linear mechanical system—part II: experiment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190225 Address after: 215000 Area D, South of Building 3, No. 38 North Guandu Road, Yuexi Street, Wuzhong District, Suzhou City, Jiangsu Province Patentee after: SUZHOU TMOX AUTOMATION TECHNOLOGY CO.,LTD. Address before: Room 101, Building 112, Yingchun South Road, Wuzhong Economic Development Zone, Suzhou City, Jiangsu Province Patentee before: SUZHOU HINDES ROBOTICS SYSTEMS ENGINEERING CO.,LTD. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 215000 D District, 3 building, 1 North Road, Wuzhong District, Suzhou, Jiangsu, Guandu, 38 Patentee after: Suzhou Tomas robot Group Co.,Ltd. Address before: 215000 D District, 3 building, 1 North Road, Wuzhong District, Suzhou, Jiangsu, Guandu, 38 Patentee before: SUZHOU TMOX AUTOMATION TECHNOLOGY CO.,LTD. |
|
| CP03 | Change of name, title or address |
Address after: 215000, Room 101, Building 16, Mingjin Business Center, Hengjing Street, Wuzhong Economic Development Zone, Suzhou City, Jiangsu Province Patentee after: Suzhou Tomas robot Group Co.,Ltd. Country or region after: China Address before: 215000 Area D, South of Building 3, No. 38 North Guandu Road, Yuexi Street, Wuzhong District, Suzhou City, Jiangsu Province Patentee before: Suzhou Tomas robot Group Co.,Ltd. Country or region before: China |