CN106357846A - Manufacturing method of 3D (three-dimensional) embossment cover plate - Google Patents
Manufacturing method of 3D (three-dimensional) embossment cover plate Download PDFInfo
- Publication number
- CN106357846A CN106357846A CN201610850578.5A CN201610850578A CN106357846A CN 106357846 A CN106357846 A CN 106357846A CN 201610850578 A CN201610850578 A CN 201610850578A CN 106357846 A CN106357846 A CN 106357846A
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- CN
- China
- Prior art keywords
- cover plate
- embossment
- photoresist
- manufacture method
- minutes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0279—Improving the user comfort or ergonomics
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/23—Construction or mounting of dials or of equivalent devices; Means for facilitating the use thereof
Landscapes
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Abstract
The invention discloses a manufacturing method of a 3D (three-dimensional) embossment cover plate. The manufacturing method comprises the following steps of coating the surface of the cover plate with photoresist, and curing for the first time; exposing both sides of the photoresist, and curing for the second time; developing the exposed photoresist, and curing for the third time; chemically etching the developed photoresist, so as to form a 3D embossment pattern. The manufacturing method of the 3D embossment cover plate provided by the invention has the advantage that by arranging the 3D embossment on the key pressing position of the cover plate of an electronic product, when a user presses the key, the judging is performed in a vision and touch combining way, so that the accuracy of key pressing is improved, and the user experience is improved.
Description
Technical field
The invention belongs to consumption electronic product technical field, more particularly to a kind of manufacture method of 3d embossment cover plate.
Background technology
The product of consumer electronics field emerges in an endless stream at present, and the raising with people's living standard, electronics is produced
The requirement of product is also more and more higher, increasingly diversification, and, current mobile phone glass cover plate only has the effect of plane taking mobile phone as a example
Really, when people carry out button operation it is necessary to rely on eyes to be certain about just can press correct button, and it is bad or people to work as light
It is possible to press the wrong button when having defective vision, lead to experience not good it is seen that this mobile phone can not provide simultaneously good visual experience with
Feel touches experience.
Content of the invention
For solving the above problems, the invention provides a kind of manufacture method of 3d embossment cover plate, can produce in consumer electronics
Key position setting 3d embossment on the cover plate of product, makes user in button, is judged in conjunction with vision and tactile simultaneously, improve
The accuracy rate of button operation, strengthens the experience of user.
A kind of manufacture method of 3d embossment cover plate that the present invention provides, comprising:
In the surface coating photoresist of cover plate, and carry out solidifying for the first time;
Double-sided exposure is carried out to described photoresist, and carries out second solidification;
Photoresist after exposure is developed, and carries out third time and solidify;
Chemical etching is carried out to the photoresist after development, forms 3d embossing pattern.
Preferably, in the manufacture method of above-mentioned 3d embossment cover plate,
The described surface coating photoresist in cover plate, and carry out solidifying for the first time including:
Carry out first time coating photoresist on the surface of described cover plate, and carry out prebake;
Carry out second coating photoresist on the surface of described cover plate, and carry out solidifying for the first time.
Preferably, in the manufacture method of above-mentioned 3d embossment cover plate,
Before the surface coating photoresist of described cover plate, also include:
Glass cover-plate is provided, and described glass cover-plate is cleaned.
Preferably, in the manufacture method of above-mentioned 3d embossment cover plate,
After described formation 3d embossing pattern, also include:
Described cover plate is carried out with cut, forms multiple screens.
Preferably, in the manufacture method of above-mentioned 3d embossment cover plate,
After the multiple screens of described formation, also include:
Demoulding and silk-screen are carried out to described 3d embossing pattern.
Preferably, in the manufacture method of above-mentioned 3d embossment cover plate,
The described surface in described cover plate carries out the surface coating thickness model that first time coating photoresist is in described cover plate
Enclose the photoresist for 20 microns to 30 microns;
The described surface in described cover plate carries out the surface coating thickness model that second coating photoresist is in described cover plate
Enclose the photoresist for 20 microns to 30 microns.
Preferably, in the manufacture method of above-mentioned 3d embossment cover plate,
Described double-sided exposure carried out to described photoresist include:
First face exposure back side chromium plate, is exposed on index face;
Second face exposure front chromium plate, is exposed on non-marked face.
Preferably, in the manufacture method of above-mentioned 3d embossment cover plate,
Described prebake is to carry out prebake with 87 DEG C to 93 DEG C of temperature range, and continues 10 minutes to 15 minutes;
Described first time solidification includes:
Solidified 20 minutes to 25 minutes with 87 DEG C to 93 DEG C of temperature range;
Solidified 8 minutes to 12 minutes with 117 DEG C to 123 DEG C of temperature range.
Preferably, in the manufacture method of above-mentioned 3d embossment cover plate,
Described be cured as the second time being solidified with 87 DEG C to 93 DEG C of temperature range, and continue 25 minutes to 27 minutes.
Preferably, in the manufacture method of above-mentioned 3d embossment cover plate,
Described third time is cured as being solidified with 147 DEG C to 153 DEG C of temperature range, and continues 35 minutes to 37 points
Clock.
The manufacture method of the above-mentioned 3d embossment cover plate being provided by foregoing description, the present invention, due to first in cover plate
Surface coating photoresist, and carry out solidifying for the first time;Then double-sided exposure is carried out to described photoresist, and carry out second admittedly
Change;Again the photoresist after exposure is developed, and carry out third time and solidify;Finally chemistry erosion is carried out to the photoresist after development
Carve, form 3d embossing pattern, therefore, it is possible to the key position setting 3d embossment on the cover plate of consumption electronic product, so that user is existed
During button, judged in conjunction with vision and tactile simultaneously, improved the accuracy rate of button operation, strengthened the experience of user.
Brief description
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
Have technology description in required use accompanying drawing be briefly described it should be apparent that, drawings in the following description be only this
Inventive embodiment, for those of ordinary skill in the art, on the premise of not paying creative work, can also basis
The accompanying drawing providing obtains other accompanying drawings.
The schematic diagram of the manufacture method of the first 3d embossment cover plate that Fig. 1 provides for the embodiment of the present application;
Fig. 2 is the schematic diagram of the 3d embossment cover plate being made using the embodiment of the present application.
Specific embodiment
The core concept of the present invention is to provide a kind of manufacture method of 3d embossment cover plate, can be in consumption electronic product
Key position setting 3d embossment on cover plate, makes user in button, is judged in conjunction with vision and tactile simultaneously, improve button
The accuracy rate of operation, strengthens the experience of user.
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation description is it is clear that described embodiment is only a part of embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of not making creative work
Embodiment, broadly falls into the scope of protection of the invention.
The manufacture method of the first 3d embossment cover plate that the embodiment of the present application provides is as shown in figure 1, Fig. 1 is implemented for the application
The schematic diagram of the manufacture method of the first 3d embossment cover plate that example provides.The method comprises the steps:
S1: in the surface coating photoresist of cover plate, and carry out solidifying for the first time;
In this step, can be under thousand grades of net room cleanliness factor environment, and temperature range is 22 ± 3 DEG C, humidity range
Yellow light area for 50~75%rh carries out gluing, and gluing beat is 50s, carries out the coating of photoresist.
S2: double-sided exposure is carried out to described photoresist, and carries out second solidification;
It should be noted that about 20min after Exposing Lamp lighting, electric current reaches 115a, voltage 30v, that is, represent that Exposing Lamp is stable,
Just can produce afterwards, Exposing Lamp light intensity numerical value is generally 30~50mw/cm2, concrete numerical value can be according to light service life
Change.
S3: the photoresist after exposure being developed, and carries out third time solidifies;
In this step, developer solution can be alkaline solution, and development temperature scope is 45 ± 1 DEG C, and developing time scope
For 24 ± 1min.
S4: chemical etching is carried out to the photoresist after development, forms 3d embossing pattern.
Specifically, can be in the process environments in common room, ambient temperature range is set to 22 ± 3 DEG C.First carry out glass
Small pieces etch, and vertically insert in the basket tool of customization, and setting etch temperature is 49 ± 1 DEG C, and etch quantity is 300 ± 30um, etching
Wash with water immediately afterwards and dry up, when normal production, open interior circulation and outer circulation;In production process, acid solution speed is in 6.0 μ
M/min~7.0 μm/min, can put into production.In this step, by controlling etching period, rate controlled etch depth, pass through
Change chromium plate design and control embossing pattern, can be very good to display the stereoeffect of etching embossing pattern.
The method, with reference to the high advantage of chemical etching and exposure imaging craft precision, will be designed by chemical method
Pattern transfer on cover plate, perfectly hand-set lid stereoeffect is embodied, it is to avoid traditional manufacturer production is out
The problem of chemical cover plate poor visual effect it is achieved that plane to plastic relief leap.
The manufacture method of the above-mentioned 3d embossment cover plate being provided by foregoing description, the embodiment of the present application, due to first existing
The surface coating photoresist of cover plate, and carry out solidifying for the first time;Then double-sided exposure is carried out to described photoresist, and carry out second
Secondary solidification;Again the photoresist after exposure is developed, and carry out third time and solidify;Finally to the photoresist after development
Learn etching, form 3d embossing pattern, therefore, it is possible to the key position setting 3d embossment on the cover plate of consumption electronic product, use
Family, in button, is judged in conjunction with vision and tactile simultaneously, improves the accuracy rate of button operation, strengthens the experience of user.
The manufacture method of the second 3d embossment cover plate that the embodiment of the present application provides, is in the first 3d embossment cover plate above-mentioned
Manufacture method on the basis of, also include following technical characteristic:
The described surface coating photoresist in cover plate, and carry out solidifying for the first time including:
Carry out first time coating photoresist on the surface of described cover plate, and carry out prebake;
Carry out second coating photoresist on the surface of described cover plate, and carry out solidifying for the first time.
The manufacture method of the third 3d embossment cover plate that the embodiment of the present application provides, is in the first 3d embossment cover plate above-mentioned
Manufacture method on the basis of, also include following technical characteristic:
Before the surface coating photoresist of described cover plate, also include:
Glass cover-plate is provided, and described glass cover-plate is cleaned.
Specifically, it is possible to use ethanol and non-dust cloth cleaning glass surface be not it is ensured that have any foreign body, glue on glass surface
Mark and dirty.
The manufacture method of the 4th kind of 3d embossment cover plate that the embodiment of the present application provides, is in the first 3d embossment cover plate above-mentioned
Manufacture method on the basis of, also include following technical characteristic:
After described formation 3d embossing pattern, also include:
Described cover plate is carried out with cut, forms multiple screens.
In this case it becomes possible to make multiple screens simultaneously, improve work efficiency.
The manufacture method of the 5th kind of 3d embossment cover plate that the embodiment of the present application provides, is in above-mentioned 4th kind of 3d embossment cover plate
Manufacture method on the basis of, also include following technical characteristic:
After the multiple screens of described formation, also include:
Demoulding and silk-screen are carried out to described 3d embossing pattern.
In this case it becomes possible to according to demand, different colors are arranged to pattern, improves its aesthetic property further.
The manufacture method of the 6th kind of 3d embossment cover plate that the embodiment of the present application provides, is in above-mentioned second 3d embossment cover plate
Manufacture method on the basis of, also include following technical characteristic:
The described surface in described cover plate carries out the surface coating thickness model that first time coating photoresist is in described cover plate
Enclose the photoresist for 20 microns to 30 microns;
The described surface in described cover plate carries out the surface coating thickness model that second coating photoresist is in described cover plate
Enclose the photoresist for 20 microns to 30 microns.
The manufacture method of the 7th kind of 3d embossment cover plate that the embodiment of the present application provides, be above-mentioned the first to the 6th kind of 3d
In the manufacture method of embossment cover plate on the basis of any one, also include following technical characteristic:
Described double-sided exposure carried out to described photoresist include:
First face exposure back side chromium plate, is exposed on index face;
Second face exposure front chromium plate, is exposed on non-marked face.
The manufacture method of the 8th kind of 3d embossment cover plate that the embodiment of the present application provides, is in above-mentioned second 3d embossment cover plate
Manufacture method on the basis of, also include following technical characteristic:
Described prebake is to carry out prebake with 87 DEG C to 93 DEG C of temperature range, and continues 10 minutes to 15 minutes;
Described first time solidification includes:
Solidified 20 minutes to 25 minutes with 87 DEG C to 93 DEG C of temperature range;
Solidified 8 minutes to 12 minutes with 117 DEG C to 123 DEG C of temperature range.
The manufacture method of the 9th kind of 3d embossment cover plate that the embodiment of the present application provides, is in above-mentioned 8th kind of 3d embossment cover plate
Manufacture method on the basis of, also include following technical characteristic:
Described be cured as the second time being solidified with 87 DEG C to 93 DEG C of temperature range, and continue 25 minutes to 27 minutes.
The manufacture method of the tenth kind of 3d embossment cover plate that the embodiment of the present application provides, is in above-mentioned 9th kind of 3d embossment cover plate
Manufacture method on the basis of, also include following technical characteristic:
Described third time is cured as being solidified with 147 DEG C to 153 DEG C of temperature range, and continues 35 minutes to 37 points
Clock.
The 3d embossment cover plate being made using said method, with reference to Fig. 2, Fig. 2 is to be floated using the 3d that the embodiment of the present application makes
The schematic diagram of carving cover plate, from figure 2 it can be seen that can be applied in automatic navigator, each below screen
Button can adopt this 3d relief shape, form 3d button, more intuitively show the function of this button, allows people in pressing
When with the function of tactilely-perceptible to this button.
For synthesis, said method can obtain the 3d embossment of arbitrary graphic pattern and any depth, and embossment faces outwardly, Ke Yiti
Rise and touch experience and stereoeffect, may apply on mobile phone protecgulum, bonnet and laptop touchpad, this projection button
Human oriented design, touch-control sense is strong, improves the accuracy of order after vision further with tactile, in addition, this button and lid
Plate integrated design, more more robust than sandblasting, there is longer service life.
Described above to the disclosed embodiments, makes professional and technical personnel in the field be capable of or uses the present invention.
Multiple modifications to these embodiments will be apparent from for those skilled in the art, as defined herein
General Principle can be realized without departing from the spirit or scope of the present invention in other embodiments.Therefore, the present invention
It is not intended to be limited to the embodiments shown herein, and be to fit to and principles disclosed herein and features of novelty phase one
The scope the widest causing.
Claims (10)
1. a kind of manufacture method of 3d embossment cover plate is it is characterised in that include:
In the surface coating photoresist of cover plate, and carry out solidifying for the first time;
Double-sided exposure is carried out to described photoresist, and carries out second solidification;
Photoresist after exposure is developed, and carries out third time and solidify;
Chemical etching is carried out to the photoresist after development, forms 3d embossing pattern.
2. 3d embossment cover plate according to claim 1 manufacture method it is characterised in that
The described surface coating photoresist in cover plate, and carry out solidifying for the first time including:
Carry out first time coating photoresist on the surface of described cover plate, and carry out prebake;
Carry out second coating photoresist on the surface of described cover plate, and carry out solidifying for the first time.
3. 3d embossment cover plate according to claim 1 manufacture method it is characterised in that
Before the surface coating photoresist of described cover plate, also include:
Glass cover-plate is provided, and described glass cover-plate is cleaned.
4. 3d embossment cover plate according to claim 1 manufacture method it is characterised in that
After described formation 3d embossing pattern, also include:
Described cover plate is carried out with cut, forms multiple screens.
5. 3d embossment cover plate according to claim 4 manufacture method it is characterised in that
After the multiple screens of described formation, also include:
Demoulding and silk-screen are carried out to described 3d embossing pattern.
6. 3d embossment cover plate according to claim 2 manufacture method it is characterised in that
It is to be in the surface coating thickness scope of described cover plate that the described surface in described cover plate carries out first time coating photoresist
20 microns to 30 microns of photoresist;
It is to be in the surface coating thickness scope of described cover plate that the described surface in described cover plate carries out second coating photoresist
20 microns to 30 microns of photoresist.
7. the 3d embossment cover plate according to any one of claim 1-6 manufacture method it is characterised in that
Described double-sided exposure carried out to described photoresist include:
First face exposure back side chromium plate, is exposed on index face;
Second face exposure front chromium plate, is exposed on non-marked face.
8. 3d embossment cover plate according to claim 2 manufacture method it is characterised in that
Described prebake is to carry out prebake with 87 DEG C to 93 DEG C of temperature range, and continues 10 minutes to 15 minutes;
Described first time solidification includes:
Solidified 20 minutes to 25 minutes with 87 DEG C to 93 DEG C of temperature range;
Solidified 8 minutes to 12 minutes with 117 DEG C to 123 DEG C of temperature range.
9. 3d embossment cover plate according to claim 8 manufacture method it is characterised in that
Described be cured as the second time being solidified with 87 DEG C to 93 DEG C of temperature range, and continue 25 minutes to 27 minutes.
10. 3d embossment cover plate according to claim 9 manufacture method it is characterised in that
Described third time is cured as being solidified with 147 DEG C to 153 DEG C of temperature range, and continues 35 minutes to 37 minutes.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201610850578.5A CN106357846A (en) | 2016-09-26 | 2016-09-26 | Manufacturing method of 3D (three-dimensional) embossment cover plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201610850578.5A CN106357846A (en) | 2016-09-26 | 2016-09-26 | Manufacturing method of 3D (three-dimensional) embossment cover plate |
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CN106357846A true CN106357846A (en) | 2017-01-25 |
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CN201610850578.5A Pending CN106357846A (en) | 2016-09-26 | 2016-09-26 | Manufacturing method of 3D (three-dimensional) embossment cover plate |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106865993A (en) * | 2017-03-10 | 2017-06-20 | 信利光电股份有限公司 | A kind of preparation method of touch-screen cover plate |
CN110001269A (en) * | 2019-04-04 | 2019-07-12 | 维沃移动通信有限公司 | The production method of PET film, cover board, electronic equipment, mobile terminal and PET film |
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FR2709391A1 (en) * | 1993-08-24 | 1995-03-03 | Hoang Andre | Telephone instruments for the blind |
CN101409735A (en) * | 2007-10-09 | 2009-04-15 | 金荣准 | Metal sticker for keypad of mobile phone and method for manufacturing the same |
CN104045055A (en) * | 2014-06-18 | 2014-09-17 | 上海先进半导体制造股份有限公司 | Manufacturing method of cover plate |
CN105302321A (en) * | 2015-05-08 | 2016-02-03 | 姚晓宁 | Glass touch keyboard |
CN105948520A (en) * | 2016-05-23 | 2016-09-21 | 信利光电股份有限公司 | 3D (three-dimensional) glass cover plate and method for manufacturing same |
-
2016
- 2016-09-26 CN CN201610850578.5A patent/CN106357846A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2709391A1 (en) * | 1993-08-24 | 1995-03-03 | Hoang Andre | Telephone instruments for the blind |
CN101409735A (en) * | 2007-10-09 | 2009-04-15 | 金荣准 | Metal sticker for keypad of mobile phone and method for manufacturing the same |
CN104045055A (en) * | 2014-06-18 | 2014-09-17 | 上海先进半导体制造股份有限公司 | Manufacturing method of cover plate |
CN105302321A (en) * | 2015-05-08 | 2016-02-03 | 姚晓宁 | Glass touch keyboard |
CN105948520A (en) * | 2016-05-23 | 2016-09-21 | 信利光电股份有限公司 | 3D (three-dimensional) glass cover plate and method for manufacturing same |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106865993A (en) * | 2017-03-10 | 2017-06-20 | 信利光电股份有限公司 | A kind of preparation method of touch-screen cover plate |
CN110001269A (en) * | 2019-04-04 | 2019-07-12 | 维沃移动通信有限公司 | The production method of PET film, cover board, electronic equipment, mobile terminal and PET film |
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Application publication date: 20170125 |