CN106350844B - A kind of multilayer conductive device for narrow metallic tapes plating - Google Patents
A kind of multilayer conductive device for narrow metallic tapes plating Download PDFInfo
- Publication number
- CN106350844B CN106350844B CN201610783323.1A CN201610783323A CN106350844B CN 106350844 B CN106350844 B CN 106350844B CN 201610783323 A CN201610783323 A CN 201610783323A CN 106350844 B CN106350844 B CN 106350844B
- Authority
- CN
- China
- Prior art keywords
- conducting
- conductive
- conducting rod
- circular hole
- block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000007747 plating Methods 0.000 title claims abstract description 11
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000011521 glass Substances 0.000 claims abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/007—Current directing devices
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a kind of multilayer conductive devices for narrow metallic tapes plating, including using conducting rod made of copper-tungsten, one end of the conducting rod is provided with conductive interface, and the other end is provided with conductive seat；The side of the conducting rod is evenly distributed with multiple with the perpendicular conducting block of the conducting rod, and the end of each conducting block passes through that butterfly screw is adjustable to be fixed on the conducting rod；One circular hole is at least offered on each conducting block, the circular hole between adjacent conductive block corresponds to each other；Conducting blocks all between head and the tail are connected and fixed by a glass bar between the corresponding circular hole.The configuration of the present invention is simple, main body use copper-tungsten, and conductive effect is good；In addition, needing tool fixed outer except conductive seat, each conducting block only needs to be adjusted manually, and with previous single narrow band conductive phase ratio, the present invention can increase exponentially the production efficiency of production line.
Description
Technical field
The present invention relates to a kind of multilayer conductive devices for narrow metallic tapes plating.
Background technique
Currently, what production line was taken is the roll-to-roll plating of single product in metal continuous electroplating field.Electrically conducting manner one
As conduction is carried out by the way of wheeled or tray.When product width is lower than 15mm, and under conditions of customer requirement is plated entirely.It is single
The roll-to-roll plating mode of product seems that efficiency is extremely inefficient.
Summary of the invention
Object of the present invention is to provide a kind of multilayer conductive for narrow metallic tapes plating in view of the defects existing in the prior art
Device.
The present invention to achieve the above object, adopts the following technical scheme that a kind of multilayer conductive for narrow metallic tapes plating
Device, including using conducting rod made of copper-tungsten, one end of the conducting rod is provided with conductive interface, and the other end is provided with
Conductive seat；The side of the conducting rod is evenly distributed with the multiple and perpendicular conducting block of the conducting rod, each described to lead
The end of electric block passes through that butterfly screw is adjustable to be fixed on the conducting rod；It is at least offered on each conducting block
One circular hole, the circular hole between adjacent conductive block correspond to each other；It will by a glass bar between the corresponding circular hole
All conducting blocks are connected and fixed between head and the tail.
Further, the lowermost circular hole uses the structure of half hollow out.
Beneficial effects of the present invention: the configuration of the present invention is simple, main body use copper-tungsten, and conductive effect is good；In addition,
Need tool fixed outer except conductive seat, each conducting block only needs to be adjusted manually, with previous single narrow band conductive phase
Than the present invention can increase exponentially the production efficiency of production line.
Detailed description of the invention
Positive structure schematic Fig. 1 of the invention.
Side structure schematic diagram Fig. 2 of the invention.
Specific embodiment
Shown in Fig. 1, Fig. 2, a kind of multilayer conductive device for narrow metallic tapes plating is disclosed, including use copper-tungsten
Manufactured conducting rod 3, one end of the conducting rod 3 are provided with conductive interface 1, and the other end is provided with conductive seat 4；The conduction
The side of bar 3 is evenly distributed with the multiple and perpendicular conducting block 5 of the conducting rod 3, and the end of each conducting block 5 is logical
Cross that butterfly screw 2 is adjustable to be fixed on the conducting rod 3；One circular hole is at least offered on each conducting block 5
8, the circular hole 8 between adjacent conductive block 5 corresponds to each other；Pass through a glass bar 6 between corresponding circular hole 8 for institute between head and the tail
There is conducting block 5 to be connected and fixed.
In use, product passes through in conducting block 5, conductive seat 4 is fixed in producing line by hollow out mode, and can be passed through
Front and back adjusts the straightness of control product in the production line, and each conducting block 5 is fixed on conducting rod 3 by butterfly screw 2
Face, conducting rod 3 equally uses pierced process with conductive seat 4, so 5 upper-lower height of each conducting block is adjustable, to match difference
Product width.For prevent product from tilting between conducting block 5 and occur it is conductive bad, using glass bar 6 to fixation.To guarantee
Product can open multiple circular holes 8, the fixation for glass bar 6 in the straightness of producing line on each conducting block 5.
The foregoing is merely presently preferred embodiments of the present invention, is not intended to limit the invention, it is all in spirit of the invention and
Within principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (2)
1. a kind of multilayer conductive device for narrow metallic tapes plating, which is characterized in that including being led using made of copper-tungsten
Electric pole, one end of the conducting rod are provided with conductive interface, and the other end is provided with conductive seat；The side of the conducting rod is uniform
The multiple and perpendicular conducting block of the conducting rod is distributed with, it is adjustable that the end of each conducting block passes through butterfly screw
Be fixed on the conducting rod；One circular hole, the circle between adjacent conductive block are at least offered on each conducting block
Hole corresponds to each other；Conducting blocks all between head and the tail are fastened on one by a glass bar between the corresponding circular hole
It rises.
2. a kind of multilayer conductive device for narrow metallic tapes plating as described in claim 1, which is characterized in that the circular hole
Using the structure of half hollow out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610783323.1A CN106350844B (en) | 2016-08-31 | 2016-08-31 | A kind of multilayer conductive device for narrow metallic tapes plating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610783323.1A CN106350844B (en) | 2016-08-31 | 2016-08-31 | A kind of multilayer conductive device for narrow metallic tapes plating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106350844A CN106350844A (en) | 2017-01-25 |
| CN106350844B true CN106350844B (en) | 2019-03-26 |
Family
ID=57857023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610783323.1A Active CN106350844B (en) | 2016-08-31 | 2016-08-31 | A kind of multilayer conductive device for narrow metallic tapes plating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106350844B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114737240A (en) * | 2022-04-27 | 2022-07-12 | 潍坊裕元电子有限公司 | Adjustable conductive wheel structure |
| CN116516449B (en) * | 2023-07-04 | 2023-09-19 | 江苏固家智能科技有限公司 | Copper-tungsten alloy multi-pass continuous electroplating equipment and method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005272999A (en) * | 2004-02-27 | 2005-10-06 | Jfe Steel Kk | Electroplated steel plate manufacturing method and electroplating apparatus |
| CN203546176U (en) * | 2013-09-24 | 2014-04-16 | 宁波韵升粘结磁体有限公司 | Hanger for magnet ring electrophoresis |
| CN203593804U (en) * | 2013-11-22 | 2014-05-14 | 上海华友金裕微电子有限公司 | Multiple-stripe electroplated efficient electric conduction device |
| CN204370032U (en) * | 2015-03-18 | 2015-06-03 | 江苏华久辐条制造有限公司 | A kind of Electropolating hangers for bicycle spoke plating |
-
2016
- 2016-08-31 CN CN201610783323.1A patent/CN106350844B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005272999A (en) * | 2004-02-27 | 2005-10-06 | Jfe Steel Kk | Electroplated steel plate manufacturing method and electroplating apparatus |
| CN203546176U (en) * | 2013-09-24 | 2014-04-16 | 宁波韵升粘结磁体有限公司 | Hanger for magnet ring electrophoresis |
| CN203593804U (en) * | 2013-11-22 | 2014-05-14 | 上海华友金裕微电子有限公司 | Multiple-stripe electroplated efficient electric conduction device |
| CN204370032U (en) * | 2015-03-18 | 2015-06-03 | 江苏华久辐条制造有限公司 | A kind of Electropolating hangers for bicycle spoke plating |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106350844A (en) | 2017-01-25 |
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