CN106348751A - Method for preparing fingerprint recognition module ceramic cover plate - Google Patents

Method for preparing fingerprint recognition module ceramic cover plate Download PDF

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Publication number
CN106348751A
CN106348751A CN201610766768.9A CN201610766768A CN106348751A CN 106348751 A CN106348751 A CN 106348751A CN 201610766768 A CN201610766768 A CN 201610766768A CN 106348751 A CN106348751 A CN 106348751A
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cover plate
ceramic
fingerprint recognition
recognition module
ceramic cover
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CN106348751B (en
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周光杰
张维龙
刘英海
刘顺松
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CHONGQING PARTNER FINE CERAMIC Co Ltd
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CHONGQING PARTNER FINE CERAMIC Co Ltd
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    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/48—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates
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    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
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    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
    • C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
    • C04B35/632—Organic additives
    • C04B35/634—Polymers
    • C04B35/63404—Polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
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    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/64—Burning or sintering processes
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
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    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3224—Rare earth oxide or oxide forming salts thereof, e.g. scandium oxide
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/60—Aspects relating to the preparation, properties or mechanical treatment of green bodies or pre-forms
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
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Abstract

The invention discloses a method for preparing a fingerprint recognition module ceramic cover plate. The method comprises the following steps, firstly, putting a ceramic powder blank into a mold, and pressing by using a pressing method so as to obtain a ceramic blank; secondly, sintering the ceramic blank so as to obtain a sintered ceramic body; finally, sequentially performing plane abrasion, rough grinding, fine grinding and polishing on the sintered ceramic body, thereby obtaining a finished product of the ceramic cover plate. The Vickers hardness, the Young modulus, the dielectric constant, the room-temperature anti-bending strength and the room-temperature breakage toughness of the ceramic cover plate prepared by using the method for the fingerprint recognition module ceramic cover plate are all relatively remarkably improved when being compared with those of a conventional ceramic cover plate, and the fingerprint recognition module ceramic cover plate is relatively high in product strength, relatively good in durability, relatively high in sensitivity, relatively short in reaction time and relatively excellent in quality.

Description

The preparation method of fingerprint recognition module ceramic cover plate
Technical field
The present invention relates to fingerprint recognition module is and in particular to a kind of preparation method of fingerprint recognition module ceramic cover plate.
Background technology
Fingerprint module is the core component of Fingerprint Lock, is arranged on as on the devices such as fingerprint access control or mobile phone, for completing The module of the identification of the collection of fingerprint and fingerprint.Fingerprint module is mainly by finger print acquisition module, fingerprint identification module and extension work( Can module (as lockset drive module) composition.Fingerprint recognition cover plate be in finger print acquisition module with finger directly contact important Part, the fingerprint recognition cover plate using at present has sapphire, coating type, glass and pottery.
Sapphire hardness is high, corrosion-resistant；But have that relatively costly, drop resistant is indifferent, penetrance is poor, toughness is slightly worse, The thicker shortcoming of finished product thickness；
Coating type fingerprinting scheme is not high due to coating hardness, the shortcomings of there is easy abrasion and corroded by sweat, matter Sense is poor；
It is simple that safety glass possesses processing technology, low cost and other advantages, but hardness is far away from sapphire, easily by by higher The fine dust mill flower of hardness, dielectric constant, bending strength are also poor, and thickness cannot do thin (minimal thickness at present further For 0.175mm), affect recognition speed；
More above-mentioned three kinds of the quality of ceramic cover plate has more obvious advantage, but the product such as dielectric constant, cost, hardness Quality still has much room for improvement, and preparation method is to be improved.
Content of the invention
For solving above technical problem, the present invention provides a kind of preparation method of fingerprint recognition module ceramic cover plate.
Technical scheme is as follows:
A kind of preparation method of fingerprint recognition module ceramic cover plate, it is critical only that and comprises the following steps:
Step one, by ceramics blank as in mould, ceramic body is pressed into using dry pressing；
Step 2, described ceramic body is sintered, obtains ceramic sintered bodies；
Step 3, successively by described ceramic sintered bodies plain grinding, slightly grind, lappingout, polishing, finally obtain diameter phi=40- The ceramic cover plate finished product of 60mm, thickness d=0.075-1mm.
In above-mentioned steps one, described ceramics blank is made up of the raw material of following weight percentage: zirconia ceramics powder 95%th, aluminium oxide 2%, yittrium oxide 1.5%, polyvinyl alcohol 1.5%.
In above-mentioned steps one, the specific operation process of described dry pressing is:
By described ceramics blank as in mould, using unidirectional dry pressing, carry out precompressed under the pressure of 5-6mpa, obtain To pre- tabletting；
Again multiple pre- tabletting overlaps are placed in mould, using two-way dry pressing, are pressed under the pressure of 10-12mpa System, obtains described ceramic body.
After above-mentioned steps one are obtained described ceramic body, under the conditions of described ceramic body is placed in 5-8mpa, keep 10- 15min, is placed on vacuum environment 10-15min again after taking-up, circulate 2-3 time, finally carry out under the pressure of 10-12mpa again Multiple pressure.
In above-mentioned steps two, described ceramic body sinters according to the following steps: described ceramic body is placed in sintering furnace, will Sintering furnace is warming up to 1100-1200 DEG C of heat preservation sintering 30-35min, then is warming up to 1380-1460 DEG C of heat preservation sintering 45-50min, Finally it is naturally cooling to 800-900 DEG C, and be incubated 60-90min.
Specific embodiment
First, the invention will be further described in conjunction with the embodiments.
Embodiment 1:
A kind of preparation method of fingerprint recognition module ceramic cover plate, comprises the following steps:
Step one, by ceramics blank as in mould, ceramic body is pressed into using dry pressing；
Described ceramics blank is made up of the raw material of following weight percentage: zirconia ceramics powder 95%, aluminium oxide 2%th, yittrium oxide 1.5%, polyvinyl alcohol 1.5%；
The specific operation process of described dry pressing is:
By described ceramics blank as in mould, using unidirectional dry pressing, carry out precompressed under the pressure of 5mpa, obtain Pre- tabletting；
Again multiple pre- tabletting overlaps are placed in mould, using two-way dry pressing, are suppressed under the pressure of 10mpa, Obtain described ceramic body.
Step 2, described ceramic body is placed in keeps 10min under the conditions of 5mpa, after taking-up, be placed on vacuum environment again 10min, circulates 2 times, finally carries out multiple pressure again under the pressure of 10mpa；
Obtain diameter 40mm, the multiple pressure ceramic body of thickness 1.5mm.
Step 3, by described again pressure ceramic body be sintered, obtain ceramic sintered bodies；
Described ceramic body sinters according to the following steps: described ceramic body is placed in sintering furnace, sintering furnace is warming up to 1100 DEG C of heat preservation sintering 30min, then it is warming up to 1380 DEG C of heat preservation sintering 45min, finally it is naturally cooling to 800 DEG C, and be incubated 60min.
Step 4, the thickness plain grinding of described ceramic sintered bodies is ground to 0.13mm to 0.15mm, more slightly, then be lapping to 0.085mm, is finally polished to 0.08mm, obtains ceramic cover plate finished product.
Embodiment 2:
A kind of preparation method of fingerprint recognition module ceramic cover plate, it is critical only that and comprises the following steps:
Step one, by ceramics blank as in mould, ceramic body is pressed into using dry pressing；
Described ceramics blank is made up of the raw material of following weight percentage: zirconia ceramics powder 95%, aluminium oxide 2%th, yittrium oxide 1.5%, polyvinyl alcohol 1.5%；
The specific operation process of described dry pressing is:
By described ceramics blank as in mould, using unidirectional dry pressing, carry out precompressed under the pressure of 6mpa, obtain Pre- tabletting；
Again multiple pre- tabletting overlaps are placed in mould, using two-way dry pressing, are suppressed under the pressure of 12mpa, Obtain described ceramic body.
Step 2, described ceramic body is placed in keeps 15min under the conditions of 8mpa, after taking-up, be placed on vacuum environment again 15min, circulates 3 times, finally carries out multiple pressure again under the pressure of 12mpa；
Obtain diameter 60mm, the multiple pressure ceramic body of thickness 2.0mm.
Step 3, by described again pressure ceramic body be sintered, obtain ceramic sintered bodies；
Described ceramic body sinters according to the following steps: described ceramic body is placed in sintering furnace, sintering furnace is warming up to 1200 DEG C of heat preservation sintering 35min, then it is warming up to 1460 DEG C of heat preservation sintering 50min, finally it is naturally cooling to 900 DEG C, and be incubated 90min.
Step 4, the thickness plain grinding of described ceramic sintered bodies is ground to 0.13mm to 0.15mm, more slightly, then be lapping to 0.085mm, is finally polished to 0.08mm, obtains ceramic cover plate finished product.
The thickness of ceramic cover plate finished product is controlled in 0.075-1mm.
2nd, with reference to detection data, invention is described further:
Ceramic cover plate (sample 1) that above example 1 is obtained, existing commercially available certain brand ceramic cover plate (sample 2), Lan Bao Stone (sample 3) and the ceramic cover plate (sample 4) obtaining with embodiment 2 are contrasted, and detect respective Vickers hardness, dielectric respectively Constant, room temperature bending strength, Room-Temperature Fracture Toughness, Young's moduluss, room temperature thermal conductivity, thermal coefficient of expansion, surface roughness, detection The results are shown in Table shown in 1:
Table 1, sample 1,2,3,4 Quality Detection result
As can be seen from Table 1:
The Vickers hardness of ceramic cover plate that above example 1 and 2 obtains and Young's moduluss are better than existing commercially available certain brand pottery Porcelain cover plate, close to sapphire Vickers hardness and Young's moduluss；
The dielectric constant of ceramic cover plate that above example 1 and 2 obtains, room temperature bending strength, Room-Temperature Fracture Toughness are more existing Certain brand ceramic cover plate commercially available and sapphire are significantly increased；
The room temperature thermal conductivity of the ceramic cover plate that above example 1 and 2 obtains, thermal coefficient of expansion and existing commercially available certain brand pottery Porcelain cover plate is more or less the same.
Analyzed from above, the beneficial effect of the preparation method of fingerprint recognition module ceramic cover plate of the present invention is: adopt The ceramic cover plate that dry pressing prepares, its Vickers hardness, Young's moduluss, dielectric constant, room temperature bending strength and room temperature fracture Toughness is compared with existing ceramic cover plate, all has and is more obviously improved, and product strength is higher, and more preferably, susceptiveness is higher for durability, Response time is shorter；Quality is more excellent.
Finally it should be noted that foregoing description is only the preferred embodiments of the present invention, the ordinary skill people of this area Member, under the enlightenment of the present invention, without prejudice on the premise of present inventive concept and claim, can make table as multiple types Show, such conversion each falls within protection scope of the present invention.

Claims (5)

1. a kind of preparation method of fingerprint recognition module ceramic cover plate is it is characterised in that comprise the following steps:
Step one, by ceramics blank as in mould, ceramic body is pressed into using dry pressing；
Step 2, described ceramic body is sintered, obtains ceramic sintered bodies；
Step 3, successively by described ceramic sintered bodies plain grinding, slightly grind, lappingout, polishing, finally obtain diameter phi=40-60mm, thick The ceramic cover plate finished product of degree d=0.075-1mm.
2. the preparation method of fingerprint recognition module ceramic cover plate according to claim 1 is it is characterised in that described step one In, described ceramics blank is made up of the raw material of following weight percentage: zirconia ceramics powder 95%, aluminium oxide 2%, oxidation Yttrium 1.5%, polyvinyl alcohol 1.5%.
3. the preparation method of fingerprint recognition module ceramic cover plate according to claim 1 is it is characterised in that described step one In, the specific operation process of described dry pressing is:
By described ceramics blank as in mould, using unidirectional dry pressing, under the pressure of 5-6mpa, carry out precompressed, obtain pre- Tabletting；
Again multiple pre- tabletting overlaps are placed in mould, using two-way dry pressing, are suppressed under the pressure of 10-12mpa, obtain To described ceramic body.
4. the preparation method of fingerprint recognition module ceramic cover plate according to claim 1, described step one is obtained described pottery After porcelain base substrate, keep 10-15min under the conditions of described ceramic body is placed in 5-8mpa, after taking-up, be placed on vacuum environment again 10-15min, circulates 2-3 time, finally carries out multiple pressure again under the pressure of 10-12mpa.
5. the preparation method of fingerprint recognition module ceramic cover plate according to claim 1 is it is characterised in that described step 2 In, described ceramic body sinters according to the following steps: described ceramic body is placed in sintering furnace, sintering furnace is warming up to 1100- 1200 DEG C of heat preservation sintering 30-35min, then it is warming up to 1380-1460 DEG C of heat preservation sintering 45-50min, finally it is naturally cooling to 800- 900 DEG C, and it is incubated 60-90min.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114477960A (en) * 2020-10-23 2022-05-13 Oppo广东移动通信有限公司 Shell, manufacturing method thereof and electronic equipment

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002060287A (en) * 2000-06-07 2002-02-26 Toshiba Ceramics Co Ltd Firing vessel
CN104446457A (en) * 2014-11-18 2015-03-25 潮州三环（集团）股份有限公司 Modified zirconium oxide ceramic material and application thereof
CN105732026A (en) * 2016-01-11 2016-07-06 潮州三环（集团）股份有限公司 Ceramic material and preparation method thereof
CN105777113A (en) * 2016-02-04 2016-07-20 潮州三环（集团）股份有限公司 Black ceramic and preparing method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002060287A (en) * 2000-06-07 2002-02-26 Toshiba Ceramics Co Ltd Firing vessel
CN104446457A (en) * 2014-11-18 2015-03-25 潮州三环（集团）股份有限公司 Modified zirconium oxide ceramic material and application thereof
CN105732026A (en) * 2016-01-11 2016-07-06 潮州三环（集团）股份有限公司 Ceramic material and preparation method thereof
CN105777113A (en) * 2016-02-04 2016-07-20 潮州三环（集团）股份有限公司 Black ceramic and preparing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114477960A (en) * 2020-10-23 2022-05-13 Oppo广东移动通信有限公司 Shell, manufacturing method thereof and electronic equipment

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