CN106347014A - Process for laminating ultrathin precious metal card - Google Patents
Process for laminating ultrathin precious metal card Download PDFInfo
- Publication number
- CN106347014A CN106347014A CN201510425181.7A CN201510425181A CN106347014A CN 106347014 A CN106347014 A CN 106347014A CN 201510425181 A CN201510425181 A CN 201510425181A CN 106347014 A CN106347014 A CN 106347014A
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- Prior art keywords
- card
- precious metal
- sheet material
- ultra
- noble
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Abstract
The invention discloses a process for laminating an ultrathin precious metal card. The process comprises the following steps: A, performing roll compacting, namely, performing roll compacting on a precious metal material so as to obtain a sheet material; B, cutting, namely, cutting the sheet material according to the size of a precious metal card to be made actually; C, laminating, namely, paving the cut sheet material on a surface of a base card, and laminating the sheet material with the base card in an ultrasonic welding manner so as to form a laminated card; D, carving patterns, namely, carving designed patterns on a precious metal surface of the laminated card through laser micro carving; E, performing lamination packaging, namely, performing sealing treatment on the laminated card by using a transparent plasticization material, and performing sealing filming, thereby obtaining a molded ultrathin precious metal card. The process has the beneficial effects that the process for laminating the ultrathin precious metal card is provided, and due to adoption of lamination process methods, the precious metal card is combined with the base card effectively, so that the card is convenient to carry over, meanwhile friction of a precious metal layer and the base card can be avoided, and the attractiveness of precious metal texture can be ensured.
Description
[technical field]
The present invention relates to a kind of processing technology of noble metal card, compound particularly to a kind of ultra-thin noble card
Technique.
[background technology]
Existing metal card production technology is comparatively fairly simple, typically adopts copper (rustless steel) as base
Material, along with etch process, single due to technique, cause the metal card effect of this technique productions substantially all
Only a kind of form exists, and all cannot solve all the time other noble metals (such as gold, silver,
Platinum, porpezite and other alloying metals) upper use, thus also leading to the consumption aspect in metal card market cannot
Further expanded, on the other hand, due to noble metal material do thin after, quality is softer, is easily deformed,
And easily scratch, not Portable belt, the development of impact noble metal gift market.
[content of the invention]
It is an object of the invention to overcoming the deficiencies in the prior art, provide a kind of compound work of ultra-thin noble card
Skill, it passes through compound process meanses, noble metal card is combined with base card effectively, is easy to carry, with
When avoid the friction between layer of precious metal and base card it is ensured that noble metal quality is attractive in appearance.
The technical scheme is that and be achieved in that: a kind of combination process of ultra-thin noble card of the present invention,
It thes improvement is that: this technique comprises the following steps:
A, roll compacting: precious metal material roll compacting is become the sheet material that thickness is 0.001 millimeter -0.003 millimeter；
B, cut out: the size of the noble metal card prepared according to actual needs, the sheet material in step a is cut
Cut out；
C, laminating: the sheet material cut out in step b is laid on the face of base card, by ultra-sonic welded by piece
Material is closed with base sticker and forms composite card；
D, embossed: by laser microscopic carvings, the noble metal face of composite card in step c to be carried out by the pattern designing
Embossed, before embossed, Heat Conduction Material coating film treatment is passed through in noble metal face, and this plated film is used for radiating, and prevents from carving
The too high profile destroying noble metal pattern of temperature at stricture of vagina；
E, composite package: the composite card after processing through step d is packaged by transparent plasticization material
Process, package temperature is 150 DEG C -220 DEG C, obtains the ultra-thin noble card of molding, press mold after encapsulated press mold
Time is 2s-5s.
It is preferred that the sheet material through cutting out also is coated with wear-resisting coating in step b, the material of described wear-resisting coating is
Resin.
It is preferred that described base card is plastic card or metal card.
It is preferred that the plasticization material in described step e is pc or pet or pvc.
The beneficial effects of the present invention is: the invention provides a kind of combination process of ultra-thin noble card, it leads to
Cross compound process meanses, noble metal card is combined with base card effectively, is easy to carry, avoid simultaneously
Friction between layer of precious metal and base card is it is ensured that noble metal quality is attractive in appearance.
[specific embodiment]
With reference to specific embodiment, the invention will be further described:
Embodiment 1
In the present embodiment, disclose a kind of combination process of ultra-thin noble card, this technique comprises the following steps:
A, roll compacting: precious metal material roll compacting is become the sheet material that thickness is 0.001 millimeter；
B, cut out: the size of the noble metal card prepared according to actual needs, the sheet material in step a is cut
Cut out；Without the form considering raw material, unified dimensional standard can be obtained by cutting out, for batch production
Lay the foundation.
C, laminating: the sheet material cut out in step b is laid on the face of base card, by ultra-sonic welded by piece
Material is closed with base sticker and forms composite card；Ultra-sonic welded makes the sheet material of noble metal penetrate into the inside of base card, this knot
Conjunction is less prone to tomography, has effectively ensured the quality of composite card and attractive in appearance.
D, embossed: by laser microscopic carvings, the noble metal face of composite card in step c to be carried out by the pattern designing
Embossed, before embossed, Heat Conduction Material coating film treatment is passed through in noble metal face, and this plated film is used for radiating, and prevents from carving
The too high profile destroying noble metal pattern of temperature at stricture of vagina.
E, composite package: the composite card after processing through step d is packaged by transparent plasticization material
Process, package temperature is 150 DEG C, obtains the ultra-thin noble card of molding after encapsulated press mold, and the press mold time is
2s, under this temperature conditions, layer of precious metal has preferable toughness, is difficult to tear, and this proper temperature can
The degeneration of plastifying material, improves the reliability of press mold.
Embodiment 2
In the present embodiment, disclose a kind of combination process of ultra-thin noble card, this technique comprises the following steps:
A, roll compacting: precious metal material roll compacting is become the sheet material that thickness is 0.003 millimeter；
B, cut out: the size of the noble metal card prepared according to actual needs, the sheet material in step a is cut
Cut out；
C, laminating: the sheet material cut out in step b is laid on the face of base card, by ultra-sonic welded by piece
Material is closed with base sticker and forms composite card；
D, embossed: by laser microscopic carvings, the noble metal face of composite card in step c to be carried out by the pattern designing
Embossed, before embossed, Heat Conduction Material coating film treatment is passed through in noble metal face, and this plated film is used for radiating, and prevents from carving
The too high profile destroying noble metal pattern of temperature at stricture of vagina；
E, composite package: the composite card after processing through step d is packaged by transparent plasticization material
Process, package temperature is 220 DEG C, obtains the ultra-thin noble card of molding after encapsulated press mold, and the press mold time is
5s.
Embodiment 3
In the present embodiment, disclose a kind of combination process of ultra-thin noble card, this technique comprises the following steps:
A, roll compacting: precious metal material roll compacting is become the sheet material that thickness is 0.001 millimeter；
B, cut out: the size of the noble metal card prepared according to actual needs, the sheet material in step a is cut
Cut out；
C, laminating: the sheet material cut out in step b is laid on the face of base card, by ultra-sonic welded by piece
Material is closed with base sticker and forms composite card；
D, embossed: by laser microscopic carvings, the noble metal face of composite card in step c to be carried out by the pattern designing
Embossed, before embossed, Heat Conduction Material coating film treatment is passed through in noble metal face, and this plated film is used for radiating, and prevents from carving
The too high profile destroying noble metal pattern of temperature at stricture of vagina；
E, composite package: the composite card after processing through step d is packaged by transparent plasticization material
Process, package temperature is 150 DEG C, obtains the ultra-thin noble card of molding after encapsulated press mold, and the press mold time is
5s.
Embodiment 4
In the present embodiment, disclose a kind of combination process of ultra-thin noble card, this technique comprises the following steps:
A, roll compacting: precious metal material roll compacting is become the sheet material that thickness is 0.003 millimeter；
B, cut out: the size of the noble metal card prepared according to actual needs, the sheet material in step a is cut
Cut out；
C, laminating: the sheet material cut out in step b is laid on the face of base card, by ultra-sonic welded by piece
Material is closed with base sticker and forms composite card；
D, embossed: by laser microscopic carvings, the noble metal face of composite card in step c to be carried out by the pattern designing
Embossed, before embossed, Heat Conduction Material coating film treatment is passed through in noble metal face, and this plated film is used for radiating, and prevents from carving
The too high profile destroying noble metal pattern of temperature at stricture of vagina；
E, composite package: the composite card after processing through step d is packaged by transparent plasticization material
Process, package temperature is 220 DEG C, obtains the ultra-thin noble card of molding after encapsulated press mold, and the press mold time is
2s.
In above-described embodiment, in step b, the sheet material through cutting out also is coated with wear-resisting coating, the material of wear-resisting coating
For resin；Above-mentioned base card is plastic card or metal card；Preferably, the plasticization material in step e be pc or
Pet or pvc.
Described above is only presently preferred embodiments of the present invention, and above-mentioned specific embodiment is not to the present invention
Limit.In the technological thought category of the present invention, various modifications and modification can occur, all this areas general
Retouching, modification or equivalent that logical technical staff is made as described above, belong to the present invention and are protected
Scope.
Claims (4)
1. a kind of combination process of ultra-thin noble card it is characterised in that: this technique comprises the following steps:
A, roll compacting: precious metal material roll compacting is become the sheet material that thickness is 0.001 millimeter -0.003 millimeter；
B, cut out: the size of the noble metal card prepared according to actual needs, the sheet material in step a is cut
Cut out；
C, laminating: the sheet material cut out in step b is laid on the face of base card, by ultra-sonic welded by piece
Material is closed with base sticker and forms composite card；
D, embossed: by laser microscopic carvings, the noble metal face of composite card in step c to be carried out by the pattern designing
Embossed, before embossed, Heat Conduction Material coating film treatment is passed through in noble metal face, and this plated film is used for radiating, and prevents from carving
The too high profile destroying noble metal pattern of temperature at stricture of vagina；
E, composite package: the composite card after processing through step d is packaged by transparent plasticization material
Process, package temperature is 150 DEG C -220 DEG C, obtains the ultra-thin noble card of molding, press mold after encapsulated press mold
Time is 2s-5s.
2. a kind of ultra-thin noble card according to claim 1 combination process it is characterised in that: step
In rapid b, the sheet material through cutting out also is coated with wear-resisting coating, and the material of described wear-resisting coating is resin.
3. a kind of ultra-thin noble card according to claim 2 combination process it is characterised in that: institute
Stating base card is plastic card or metal card.
4. a kind of ultra-thin noble card according to claim 3 combination process it is characterised in that: institute
Stating the plasticization material in step e is pc or pet or pvc.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510425181.7A CN106347014A (en) | 2015-07-17 | 2015-07-17 | Process for laminating ultrathin precious metal card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510425181.7A CN106347014A (en) | 2015-07-17 | 2015-07-17 | Process for laminating ultrathin precious metal card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106347014A true CN106347014A (en) | 2017-01-25 |
Family
ID=57842712
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510425181.7A Pending CN106347014A (en) | 2015-07-17 | 2015-07-17 | Process for laminating ultrathin precious metal card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106347014A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018192211A1 (en) * | 2017-04-17 | 2018-10-25 | 深圳市金宝盈文化股份有限公司 | Manufacturing method for precious metal craft card |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03275355A (en) * | 1990-03-26 | 1991-12-06 | Mitsui Mining & Smelting Co Ltd | Preparation of noble metal card |
| US6006456A (en) * | 1997-07-11 | 1999-12-28 | Heiwa Creation Co., Ltd. | Novelty card |
| CN201020960Y (en) * | 2007-03-16 | 2008-02-13 | 朱义兵 | Noble metal inlaid card |
| CN202878797U (en) * | 2012-10-24 | 2013-04-17 | 深圳市金宝盈珠宝首饰有限公司 | Ultrathin composite 3D (Three-Dimensional) vacuum metalized paper |
| CN203282935U (en) * | 2013-05-22 | 2013-11-13 | 深圳市金宝盈珠宝首饰有限公司 | Practical ultra-thin metal card |
| CN103781285A (en) * | 2014-02-18 | 2014-05-07 | 华中科技大学 | Method for manufacturing and repairing conducting circuits on surfaces of ceramic substrates |
| CN104129215A (en) * | 2013-05-03 | 2014-11-05 | 深圳市崇宁实业有限公司 | Manufacturing method of noble metal card |
| CN104339963A (en) * | 2013-07-30 | 2015-02-11 | 上海唐彩实业有限公司 | Microscopic carving method for making fine pattern die by adopting metal material |
-
2015
- 2015-07-17 CN CN201510425181.7A patent/CN106347014A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03275355A (en) * | 1990-03-26 | 1991-12-06 | Mitsui Mining & Smelting Co Ltd | Preparation of noble metal card |
| US6006456A (en) * | 1997-07-11 | 1999-12-28 | Heiwa Creation Co., Ltd. | Novelty card |
| CN201020960Y (en) * | 2007-03-16 | 2008-02-13 | 朱义兵 | Noble metal inlaid card |
| CN202878797U (en) * | 2012-10-24 | 2013-04-17 | 深圳市金宝盈珠宝首饰有限公司 | Ultrathin composite 3D (Three-Dimensional) vacuum metalized paper |
| CN104129215A (en) * | 2013-05-03 | 2014-11-05 | 深圳市崇宁实业有限公司 | Manufacturing method of noble metal card |
| CN203282935U (en) * | 2013-05-22 | 2013-11-13 | 深圳市金宝盈珠宝首饰有限公司 | Practical ultra-thin metal card |
| CN104339963A (en) * | 2013-07-30 | 2015-02-11 | 上海唐彩实业有限公司 | Microscopic carving method for making fine pattern die by adopting metal material |
| CN103781285A (en) * | 2014-02-18 | 2014-05-07 | 华中科技大学 | Method for manufacturing and repairing conducting circuits on surfaces of ceramic substrates |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018192211A1 (en) * | 2017-04-17 | 2018-10-25 | 深圳市金宝盈文化股份有限公司 | Manufacturing method for precious metal craft card |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170125 |
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| RJ01 | Rejection of invention patent application after publication |