CN106337194A - Surface treatment composite additive capable of improving corrosion resistance of copper foil - Google Patents
Surface treatment composite additive capable of improving corrosion resistance of copper foil Download PDFInfo
- Publication number
- CN106337194A CN106337194A CN201610851223.8A CN201610851223A CN106337194A CN 106337194 A CN106337194 A CN 106337194A CN 201610851223 A CN201610851223 A CN 201610851223A CN 106337194 A CN106337194 A CN 106337194A
- Authority
- CN
- China
- Prior art keywords
- copper foil
- surface treatment
- compound additive
- corrosion resistance
- composite additive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/22—Electroplating: Baths therefor from solutions of zinc
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention belongs to the technical field of electrolytic copper foil processing and particularly relates to a surface treatment composite additive capable of improving the corrosion resistance of copper foil. Every liter of the aqueous solution of the composite additive contains 1.0-10 g of polyethylene glycol, 0.1-5.0 g of rare-earth salt, 0.1-15 g of sodium dodecyl benzene sulfonate and 0.2-3.0 g of chitosan. The prepared composite additive is good in control performance and high in stability. The composite additive is used during galvanization, and thus the crystal morphology of a coating can be changed. The coating on the surface of the produced copper foil is smooth and uniform, crystals are fine and compact, the hydrochloric acid degradation resistant rate of the copper foil is lower than 3%, and good corrosion resistance is achieved. In addition, the production process is simple and environmentally friendly, the cost is low, waste foil obtained after surface treatment can also be recycled, and the index of the copper foil is not influenced.
Description
Technical field
The invention belongs to electrolytic copper foil processing technique field, more particularly, to a kind of surface treatment improving Copper Foil corrosion resistance
Compound additive.
Background technology
Copper Foil is one of important electronic material of China's information industry, be copper-clad plate (abbreviation ccl) and printed circuit board (and
Claim printed circuit board (PCB), printed substrate, abbreviation pcb) important materials that manufacture.It is with industrial one-level cathode copper for main former material
Material, the high-quality Copper Foil produced by production equipment special and Technology with calendering or electrolysis, in electronic product
Play support, interconnection components and parts key electric action, for manufacturing the feature material of main part of conducting wire on printed circuit board,
It is maximum, the topmost metal forming of consumption in printed circuit.
The developing rapidly of information industry, importance in the construction such as industry, modernization of national defense for the high-performance Copper Foil is increasingly
Substantially, particularly printed circuit board, copper clad foil substrate industry grow with each passing day to the demand of high-performance Copper Foil, also will increase to height
The demand of performance Copper Foil, the requirement to high-performance Copper Foil, either all improve a lot in quality or in quantity.In future
Several years, high-performance Copper Foil market the biggest in the world will be developed in inland of China.Therefore, development has the high-performance of advanced level
Copper Foil industry has broad prospects.
The development of pcb technology, a lot of environment, condition, method have been different from the past, and the progress of technology is to materials application band
Carry out a series of new requirements, copper foil surface corrosion resistance can not meet printed board high density graph thinning, the requirement of miniaturization.Copper
Paper tinsel corrosion resistance is to be completed by forming zinc-plated or galvanized alloy in copper foil surface, the alloy such as general zinc-plated, zinc-plated nickel, zinc-tin
Technique plays the role of corrosion resistance, but because alloy-layer crystallization is not careful, uniform, corrosion resistance does not reach ideal effect,
Lead to copper foil circuit plate edge corrosion phenomenon to occur when etching high-precision fine rule road, when serious, occur that sheet material goes offline bar problem.
In recent years, for improving the corrosion resistance of Copper Foil, some Copper Foil producers develop zinc, nickel, cobalt, stannum, ferrum, molybdenum, arsenic, tungsten
Deng ternary, the quaternary alloy corrosion resistant etching technique of metal, Copper Foil corrosion resistance is made to be greatly improved, but its complex process,
Narrow ranges of process parameters, haves such problems as to operate, high cost, plating solution reclaim and wastewater treatment is difficult, not environmentally.In addition, copper
The useless paper tinsel of paper tinsel enterprise will recycle, including surface treatment useless paper tinsel, this will by surface treatment coating in zinc, nickel, cobalt,
The metallic elements such as stannum, ferrum, molybdenum, arsenic, tungsten take electrolyte system to.These metal impurities can be enriched with the electrolytic solution, and in Copper Foil
It is mingled with precipitation in crystal, change mechanics and the electrical properties of Copper Foil, the various indexs of impact Copper Foil, such as: warpage, elongation percentage, anti-
Tensile strength etc..
Therefore how to produce and there is preferable surface corrosion resistance, and simple production process, environmental protection, cost is relatively low,
The recyclable recycling of surface treated useless paper tinsel and do not affect Copper Foil index, be the invention solves the problems that an important technology difficult problem.
Content of the invention
The present invention is directed to the deficiency that above-mentioned prior art exists, and provides a kind of surface treatment improving Copper Foil corrosion resistance again
Close additive.
The technical scheme is that a kind of surface treatment improving Copper Foil corrosion resistance is again
Close additive, contain in the aqueous solution of every liter of compound additive: 1.0-10g Polyethylene Glycol, 0.1-5.0g rare-earth salts, 0.1-15g
Dodecylbenzene sodium sulfonate and 0.2-3.0g shitosan.
Preferably, a kind of improve Copper Foil corrosion resistance surface treatment compound additive, every liter of compound additive water-soluble
Contain in liquid: 1.0-7.0g Polyethylene Glycol, 0.3-3.5g rare-earth salts, 0.1-13g dodecylbenzene sodium sulfonate and 0.2-1.5g shell
Polysaccharide.
Further, described rare-earth salts rare earth elements are ce or la.
Further, described rare-earth salts is cerous sulfate, cerous nitrate, cerium chloride, lanthanum sulfate or Lanthanum (III) nitrate.
Further, the molecular weight of described Polyethylene Glycol is 1000-20000.
Further, the molecular weight of described Polyethylene Glycol is 1000-2000.
The invention has the beneficial effects as follows: preferably, stability is stronger for the compound additive control performance that the present invention is obtained, in plating
Using this compound additive during zinc, coating crystal habit, the copper foil surface coating even uniform of production, crystallization can be changed
Careful tight, Copper Foil resistance to hydrochloric acid deterioration rate is less than less than 3%, has preferable corrosion resistance, and simple production process, ring
Protect, cost is relatively low, surface treated useless paper tinsel also recyclable recycling and do not affect Copper Foil index.
Brief description
Fig. 1 is the 2000 times of sem photos of 18 μm of electrolytic copper foils being produced using compound additive of the present invention.
Fig. 2 is the 2000 times of sem photos of 35 μm of electrolytic copper foils being produced using compound additive of the present invention.
Specific embodiment
Below in conjunction with accompanying drawing, the principle of the present invention and feature are described, example is served only for explaining the present invention, and
Non- for limiting the scope of the present invention.
In the embodiment of the present invention, the method for testing of properties is:
1st, peel strength: take grand core electronics epoxy resin semi-solid preparation material (ga-170b-ll, tg175), using vacuum pressure
Machine is hot pressed into copper coated foil plate, is etched into 1mm lines on etching machine, is tested according to the method that ipc-tm-650 specifies.
2nd, resistance to hydrochloric acid deterioration rate: take the 1mm circuit sample that etching obtains, soak under room temperature condition in 18wt% hydrochloric acid solution
After bubble 30min, test peel strength value.Peel strength decay percent after soak with hydrochloric acid, as resistance to hydrochloric acid deterioration rate.
3rd, lateral erosion: the circuit through soak with hydrochloric acid, test resistance to hydrochloric acid deterioration rate after, super depth-of-field microscope (japan,
Keyence, vhx-1000) under measurement circuitry edge reddened area width, 0-0.1mm be no lateral erosion, more than 0.1mm then be have
Lateral erosion.
Embodiment 1
A kind of surface treatment compound additive improving Copper Foil corrosion resistance, contains in the aqueous solution of every liter of compound additive
Have: 1.2g Polyethylene Glycol, 0.4g cerous nitrate, 6.0g dodecylbenzene sodium sulfonate and 0.6g shitosan.
Produce 18 μm of Copper Foils using existing Copper Foil production technology to be surface-treated, science and engineering at the copper foil surface being used
Skill flow process is: the zinc-plated anti-oxidation painting silane coupler of roughening solidification is dried.Using this enforcement in galvanizing process
The compound additive that example is obtained, contains in galvanizing solution: zn2+2-4g/l, ni2+0.3-0.9g/l, potassium pyrophosphate 200-300g/l,
Ph is 8-10, and temperature is 30-40 DEG C, and electric current density is 1.5-3a/dm2.
By the Copper Foil after surface treatment and fr-4 base material pressing plate, the peel strength of test Copper Foil, resistance to hydrochloric acid deterioration rate, side
The performances such as erosion, testing result is shown in Table 1.
Embodiment 2
A kind of surface treatment compound additive improving Copper Foil corrosion resistance, contains in the aqueous solution of every liter of compound additive
Have: 2.0g Polyethylene Glycol, 0.6g cerium chloride, 13g dodecylbenzene sodium sulfonate and 0.8g shitosan.
Produce 18 μm of Copper Foils using existing Copper Foil production technology to be surface-treated, science and engineering at the copper foil surface being used
Skill flow process is: the zinc-plated anti-oxidation painting silane coupler of roughening solidification is dried.Using this enforcement in galvanizing process
The compound additive that example is obtained, contains in galvanizing solution: zn2+2-4g/l, ni2+0.3-0.9g/l, potassium pyrophosphate 200-300g/l,
Ph is 8-10, and temperature is 30-40 DEG C, and electric current density is 1.5-3a/dm2.
By the Copper Foil after surface treatment and fr-4 base material pressing plate, the peel strength of test Copper Foil, resistance to hydrochloric acid deterioration rate, side
The performances such as erosion, testing result is shown in Table 1.
Embodiment 3
A kind of surface treatment compound additive improving Copper Foil corrosion resistance, contains in the aqueous solution of every liter of compound additive
Have: 4.0g Polyethylene Glycol, 0.6g Lanthanum (III) nitrate, 4.0g dodecylbenzene sodium sulfonate and 1.0g shitosan.
Produce 18 μm of Copper Foils using existing Copper Foil production technology to be surface-treated, science and engineering at the copper foil surface being used
Skill flow process is: the zinc-plated anti-oxidation painting silane coupler of roughening solidification is dried.Using this enforcement in galvanizing process
The compound additive that example is obtained, contains in galvanizing solution: zn2+2-4g/l, ni2+0.3-0.9g/l, potassium pyrophosphate 200-300g/l,
Ph is 8-10, and temperature is 30-40 DEG C, and electric current density is 1.5-3a/dm2.
By the Copper Foil after surface treatment and fr-4 base material pressing plate, the peel strength of test Copper Foil, resistance to hydrochloric acid deterioration rate, side
The performances such as erosion, testing result is shown in Table 1.
Embodiment 4
A kind of surface treatment compound additive improving Copper Foil corrosion resistance, contains in the aqueous solution of every liter of compound additive
Have: 4.0g Polyethylene Glycol, 1.2g lanthanum sulfate, 4.0g dodecylbenzene sodium sulfonate and 1.5g shitosan.
Produce 35 μm of Copper Foils using existing Copper Foil production technology to be surface-treated, science and engineering at the copper foil surface being used
Skill flow process is: the zinc-plated anti-oxidation painting silane coupler of roughening solidification is dried.Using this enforcement in galvanizing process
The compound additive that example is obtained, contains in galvanizing solution: zn2+2-4g/l, ni2+0.3-0.9g/l, potassium pyrophosphate 200-300g/l,
Ph is 8-10, and temperature is 30-40 DEG C, and electric current density is 1.5-3a/dm2.
By the Copper Foil after surface treatment and fr-4 base material pressing plate, the peel strength of test Copper Foil, resistance to hydrochloric acid deterioration rate, side
The performances such as erosion, testing result is shown in Table 1.
Embodiment 5
A kind of surface treatment compound additive improving Copper Foil corrosion resistance, contains in the aqueous solution of every liter of compound additive
Have: 7.0g Polyethylene Glycol, 3.0g cerous sulfate, 0.6g dodecylbenzene sodium sulfonate and 1.5g shitosan.
Produce 35 μm of Copper Foils using existing Copper Foil production technology to be surface-treated, science and engineering at the copper foil surface being used
Skill flow process is: the zinc-plated anti-oxidation painting silane coupler of roughening solidification is dried.Using this enforcement in galvanizing process
The compound additive that example is obtained, contains in galvanizing solution: zn2+2-4g/l, ni2+0.3-0.9g/l, potassium pyrophosphate 200-300g/l,
Ph is 8-10, and temperature is 30-40 DEG C, and electric current density is 1.5-3a/dm2.
By the Copper Foil after surface treatment and fr-4 base material pressing plate, the peel strength of test Copper Foil, resistance to hydrochloric acid deterioration rate, side
The performances such as erosion, testing result is shown in Table 1.
Embodiment 6
A kind of surface treatment compound additive improving Copper Foil corrosion resistance, contains in the aqueous solution of every liter of compound additive
Have: 7.0g Polyethylene Glycol, 3.6g cerous sulfate, 0.6g dodecylbenzene sodium sulfonate and 2.5g shitosan.
Produce 35 μm of Copper Foils using existing Copper Foil production technology to be surface-treated, science and engineering at the copper foil surface being used
Skill flow process is: the zinc-plated anti-oxidation painting silane coupler of roughening solidification is dried.Using this enforcement in galvanizing process
The compound additive that example is obtained, contains in galvanizing solution: zn2+2-4g/l, ni2+0.3-0.9g/l, potassium pyrophosphate 200-300g/l,
Ph is 8-10, and temperature is 30-40 DEG C, and electric current density is 1.5-3a/dm2.
By the Copper Foil after surface treatment and fr-4 base material pressing plate, the peel strength of test Copper Foil, resistance to hydrochloric acid deterioration rate, side
The performances such as erosion, testing result is shown in Table 1.
Table 1
Can be seen that the Copper Foil being obtained using the compound additive of the present invention, Copper Foil coating by table 1, with reference to Fig. 1 and Fig. 2
Even uniform, crystallization is careful closely, and Copper Foil resistance to hydrochloric acid deterioration rate is less than less than 3%, effectively solves the corrosion-resistant of copper foil surface
Property.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all spirit in the present invention and
Within principle, any modification, equivalent substitution and improvement made etc., should be included within the scope of the present invention.
Claims (6)
1. a kind of surface treatment compound additive improving Copper Foil corrosion resistance is it is characterised in that the water of every liter of compound additive
Contain in solution: 1.0-10g Polyethylene Glycol, 0.1-5.0g rare-earth salts, 0.1-15g dodecylbenzene sodium sulfonate and 0.2-3.0g shell
Polysaccharide.
2. surface treatment compound additive according to claim 1 is it is characterised in that the aqueous solution of every liter of compound additive
In contain: 1.0-7.0g Polyethylene Glycol, 0.3-3.5g rare-earth salts, 0.1-13g dodecylbenzene sodium sulfonate and 0.2-1.5g shell gather
Sugar.
3. surface treatment compound additive according to claim 1 and 2 is it is characterised in that described rare-earth salts middle rare earth
Element is ce or la.
4. surface treatment compound additive according to claim 3 it is characterised in that described rare-earth salts be cerous sulfate,
Cerous nitrate, cerium chloride, lanthanum sulfate or Lanthanum (III) nitrate.
5. surface treatment compound additive according to claim 1 and 2 it is characterised in that described Polyethylene Glycol point
Son is measured as 1000-20000.
6. surface treatment compound additive according to claim 5 is it is characterised in that the molecular weight of described Polyethylene Glycol
For 1000-2000.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610851223.8A CN106337194A (en) | 2016-09-26 | 2016-09-26 | Surface treatment composite additive capable of improving corrosion resistance of copper foil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610851223.8A CN106337194A (en) | 2016-09-26 | 2016-09-26 | Surface treatment composite additive capable of improving corrosion resistance of copper foil |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106337194A true CN106337194A (en) | 2017-01-18 |
Family
ID=57839264
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610851223.8A Pending CN106337194A (en) | 2016-09-26 | 2016-09-26 | Surface treatment composite additive capable of improving corrosion resistance of copper foil |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106337194A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109137013A (en) * | 2018-07-13 | 2019-01-04 | 铜陵市华创新材料有限公司 | A kind of electrolytic copper foil surface electro-deposition ZN-NI-P-LA alloying technology |
| CN109267111A (en) * | 2018-12-06 | 2019-01-25 | 湖北工程学院 | Additive for electrolytic copper foil and its application, electrolytic copper foil and its preparation method and application, lithium ion battery |
| CN110042438A (en) * | 2019-04-24 | 2019-07-23 | 福建清景铜箔有限公司 | The preparation method of electrolytic copper foil |
| CN110079840A (en) * | 2019-04-26 | 2019-08-02 | 山东金宝电子股份有限公司 | A kind of surface treatment additive package improving copper foil high-temp antioxidizing performance |
| CN110129839A (en) * | 2019-05-20 | 2019-08-16 | 梁生 | A kind of preparation method of copper brightener |
| CN110791793A (en) * | 2019-11-26 | 2020-02-14 | 江东电子材料有限公司 | Production process of electrolytic copper foil of high-Tg plate |
| CN112962128A (en) * | 2021-01-29 | 2021-06-15 | 山东金宝电子股份有限公司 | Coarsening process method of high-peeling-resistance copper foil |
| CN113046797A (en) * | 2021-03-10 | 2021-06-29 | 四川恒创博联科技有限责任公司 | Electrolytic copper foil additive |
| CN113692111A (en) * | 2021-08-24 | 2021-11-23 | 江苏耀鸿电子有限公司 | High-corrosion-resistance flexible copper-clad plate and preparation method thereof |
| CN113991086A (en) * | 2021-10-28 | 2022-01-28 | 东北师范大学 | Zinc ion battery cathode composite material and preparation method and application thereof |
| CN114197000A (en) * | 2021-12-27 | 2022-03-18 | 山东金宝电子股份有限公司 | Surface treatment method for improving corrosion resistance of electrolytic copper foil |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1580332A (en) * | 2004-05-20 | 2005-02-16 | 昆明理工大学 | Zn-Ni-RE electroplating layer and its electroplating method and electrolytic liquor |
| CN101063219A (en) * | 2007-05-22 | 2007-10-31 | 昆明理工大学 | Technique for preparing zinc and Zn-Fe alloy electroplating brightener |
| CN105002530A (en) * | 2015-08-10 | 2015-10-28 | 灵宝华鑫铜箔有限责任公司 | Surface treatment process for improving copper foil high-temperature anti-oxidation performance |
| CN105369301A (en) * | 2015-12-17 | 2016-03-02 | 中国科学院海洋研究所 | Chitosan compounded zinc coating and preparation method thereof |
-
2016
- 2016-09-26 CN CN201610851223.8A patent/CN106337194A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1580332A (en) * | 2004-05-20 | 2005-02-16 | 昆明理工大学 | Zn-Ni-RE electroplating layer and its electroplating method and electrolytic liquor |
| CN101063219A (en) * | 2007-05-22 | 2007-10-31 | 昆明理工大学 | Technique for preparing zinc and Zn-Fe alloy electroplating brightener |
| CN105002530A (en) * | 2015-08-10 | 2015-10-28 | 灵宝华鑫铜箔有限责任公司 | Surface treatment process for improving copper foil high-temperature anti-oxidation performance |
| CN105369301A (en) * | 2015-12-17 | 2016-03-02 | 中国科学院海洋研究所 | Chitosan compounded zinc coating and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 李付绍等: "稀土在硫酸盐体系电镀锌镍合金中的应用", 《表面技术》 * |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109137013A (en) * | 2018-07-13 | 2019-01-04 | 铜陵市华创新材料有限公司 | A kind of electrolytic copper foil surface electro-deposition ZN-NI-P-LA alloying technology |
| CN109267111A (en) * | 2018-12-06 | 2019-01-25 | 湖北工程学院 | Additive for electrolytic copper foil and its application, electrolytic copper foil and its preparation method and application, lithium ion battery |
| CN110042438A (en) * | 2019-04-24 | 2019-07-23 | 福建清景铜箔有限公司 | The preparation method of electrolytic copper foil |
| CN110079840A (en) * | 2019-04-26 | 2019-08-02 | 山东金宝电子股份有限公司 | A kind of surface treatment additive package improving copper foil high-temp antioxidizing performance |
| CN110129839A (en) * | 2019-05-20 | 2019-08-16 | 梁生 | A kind of preparation method of copper brightener |
| CN110791793A (en) * | 2019-11-26 | 2020-02-14 | 江东电子材料有限公司 | Production process of electrolytic copper foil of high-Tg plate |
| CN112962128A (en) * | 2021-01-29 | 2021-06-15 | 山东金宝电子股份有限公司 | Coarsening process method of high-peeling-resistance copper foil |
| CN113046797A (en) * | 2021-03-10 | 2021-06-29 | 四川恒创博联科技有限责任公司 | Electrolytic copper foil additive |
| CN113692111A (en) * | 2021-08-24 | 2021-11-23 | 江苏耀鸿电子有限公司 | High-corrosion-resistance flexible copper-clad plate and preparation method thereof |
| CN113692111B (en) * | 2021-08-24 | 2022-08-23 | 江苏耀鸿电子有限公司 | High-corrosion-resistance flexible copper-clad plate and preparation method thereof |
| CN113991086A (en) * | 2021-10-28 | 2022-01-28 | 东北师范大学 | Zinc ion battery cathode composite material and preparation method and application thereof |
| CN113991086B (en) * | 2021-10-28 | 2023-06-20 | 东北师范大学 | Zinc ion battery negative electrode composite material and preparation method and application thereof |
| CN114197000A (en) * | 2021-12-27 | 2022-03-18 | 山东金宝电子股份有限公司 | Surface treatment method for improving corrosion resistance of electrolytic copper foil |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106337194A (en) | Surface treatment composite additive capable of improving corrosion resistance of copper foil | |
| CN106011965B (en) | A kind of fine roughening treatment technique of electrolytic copper foil surface | |
| CN102560584B (en) | Additive for electrolytic copper foil and surface treatment process of very low profile electrolytic copper foil | |
| KR101129471B1 (en) | Surface treatment copper foil and circuit board | |
| CN103397342B (en) | A kind of high heat-resisting electrolytic copper foil and preparation method thereof | |
| CN1962944A (en) | Gray surface treatment process for electrolytic copper foil | |
| CN105408525A (en) | Treated surface copper foil, copper foil with carrier, substrate, resin substrate, printed circuit board, copper clad laminate, and printed circuit board manufacturing method | |
| JPH0754183A (en) | Electrodeposited copper foil and production of electro- deposited copper foil by using electrolyte solution containing chloride ion and additive for controlling organic additive | |
| CN103469267A (en) | Process method for carrying out surface treatment on electrolysis copper foil, and cooper foil treated by using the same | |
| CN102586831A (en) | Surface treatment process for reducing roughness of electrolytic copper foil | |
| CN112981481B (en) | Ultrathin copper foil and preparation method thereof | |
| CN103060859B (en) | An additive for improving the peak shape of the rough surface of rough foil, and a production process for electrolytic copper foil | |
| CN104651884A (en) | Compound additive for electrolytic copper foil | |
| CN103481583B (en) | A kind of surface has the preparation method processing Copper Foil of loose structure | |
| CN1995473A (en) | Enivironment-friendly type surface treatment process for electrolytic copper foil | |
| KR20230129209A (en) | Electrodeposited copper foil with its surfaceprepared, process for producing the same and usethereof | |
| CN111304709A (en) | Surface treating agent for improving corrosion resistance of electrolytic copper foil | |
| CN103014792A (en) | Tin-cobalt alloy decorative chromium-substituted electroplate liquid and electroplate method thereof | |
| US7794578B2 (en) | Method for preparing a circuit board material having a conductive base and a resistance layer | |
| CN107587173A (en) | A kind of nickel plating solution and its application | |
| CN108060443B (en) | A kind of preparation method of the melanism composite layer on extruded metal foil surface | |
| CN102548202B (en) | Roughly-processed copper foil and manufacture method thereof | |
| CN116695192A (en) | Ultrathin copper foil suitable for HDI board and preparation method and application thereof | |
| TW200946719A (en) | Electrolytic solution for producing electrolytic copper foil | |
| CN112962128B (en) | Coarsening process method of high-peeling-resistance copper foil |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170118 |
|
| RJ01 | Rejection of invention patent application after publication |