CN106336938A - Water-based cutting fluid - Google Patents

Water-based cutting fluid Download PDF

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Publication number
CN106336938A
CN106336938A CN201610722796.0A CN201610722796A CN106336938A CN 106336938 A CN106336938 A CN 106336938A CN 201610722796 A CN201610722796 A CN 201610722796A CN 106336938 A CN106336938 A CN 106336938A
Authority
CN
China
Prior art keywords
water
cutting fluid
cutting liquid
silicon wafer
extreme pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610722796.0A
Other languages
Chinese (zh)
Inventor
刘瑞鸿
孙培亚
余刚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZHENJIANG RIETECH NEW ENERGY TECHNOLOGY Co Ltd
Original Assignee
ZHENJIANG RIETECH NEW ENERGY TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ZHENJIANG RIETECH NEW ENERGY TECHNOLOGY Co Ltd filed Critical ZHENJIANG RIETECH NEW ENERGY TECHNOLOGY Co Ltd
Priority to CN201610722796.0A priority Critical patent/CN106336938A/en
Publication of CN106336938A publication Critical patent/CN106336938A/en
Pending legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C10PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10MLUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M173/00Lubricating compositions containing more than 10% water
    • C10M173/02Lubricating compositions containing more than 10% water not containing mineral or fatty oils
    • CCHEMISTRY; METALLURGY
    • C10PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10MLUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2207/00Organic non-macromolecular hydrocarbon compounds containing hydrogen, carbon and oxygen as ingredients in lubricant compositions
    • C10M2207/02Hydroxy compounds
    • C10M2207/021Hydroxy compounds having hydroxy groups bound to acyclic or cycloaliphatic carbon atoms
    • C10M2207/022Hydroxy compounds having hydroxy groups bound to acyclic or cycloaliphatic carbon atoms containing at least two hydroxy groups
    • CCHEMISTRY; METALLURGY
    • C10PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10MLUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2215/00Organic non-macromolecular compounds containing nitrogen as ingredients in lubricant compositions
    • C10M2215/02Amines, e.g. polyalkylene polyamines; Quaternary amines
    • C10M2215/04Amines, e.g. polyalkylene polyamines; Quaternary amines having amino groups bound to acyclic or cycloaliphatic carbon atoms
    • CCHEMISTRY; METALLURGY
    • C10PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10MLUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
    • C10M2219/00Organic non-macromolecular compounds containing sulfur, selenium or tellurium as ingredients in lubricant compositions
    • C10M2219/06Thio-acids; Thiocyanates; Derivatives thereof
    • C10M2219/062Thio-acids; Thiocyanates; Derivatives thereof having carbon-to-sulfur double bonds
    • C10M2219/066Thiocarbamic type compounds
    • C10M2219/068Thiocarbamate metal salts
    • CCHEMISTRY; METALLURGY
    • C10PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10NINDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
    • C10N2030/00Specified physical or chemical properties which is improved by the additive characterising the lubricating composition, e.g. multifunctional additives
    • C10N2030/06Oiliness; Film-strength; Anti-wear; Resistance to extreme pressure
    • CCHEMISTRY; METALLURGY
    • C10PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10NINDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
    • C10N2030/00Specified physical or chemical properties which is improved by the additive characterising the lubricating composition, e.g. multifunctional additives
    • C10N2030/10Inhibition of oxidation, e.g. anti-oxidants
    • CCHEMISTRY; METALLURGY
    • C10PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
    • C10NINDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
    • C10N2030/00Specified physical or chemical properties which is improved by the additive characterising the lubricating composition, e.g. multifunctional additives
    • C10N2030/12Inhibition of corrosion, e.g. anti-rust agents or anti-corrosives

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Organic Chemistry (AREA)
  • Lubricants (AREA)

Abstract

The present invention provides a water-based cutting fluid, which comprises, by weight, 65-70% ethylene glycol, 2-4% of triethanolamine oleate, 3-5% of a nonionic surfactant, 1-5% of an extreme pressure anti-wear agent, and 20-30% of water. According to the present invention, the extreme pressure anti-wear agent is added to the cutting fluid, such that the surface tension of the cutting fluid is substantially reduced, the fluidity and the permeability of the cutting fluid are substantially improved, the wettability of the cutting fluid on the abrasive material is substantially improved, the dispersion of the abrasive material is increased, the damage on the silicon wafer due to the agglomeration of the abrasive material is avoided, and the silicon wafer cutting yield can be easily improved; the protection film can be formed on the surface of the silicon wafer, such that the silicon wafer is easily washed; and the lubricating effect, the wear resistance and the cooling property of the cutting fluid are improved.

Description

A kind of water base cutting liquid
Technical field
The invention belongs to photovoltaic field, particularly water base silicon chip cutting fluid.
Background technology
In photovoltaic solar silicon chip cutting process, water base silicon chip cutting fluid has to use for as in silicon chip cutting process A kind of auxiliary material consumable product, its consumption extends with the growth of the silicon chip processing industry of photovoltaic solar industry and China.
Water base silicon chip cutting fluid presses composition classification main inclusion oiliness cutting liquid and aqueous cutting liquid two big class.The first kind is cut Cut the oiliness cutting liquid mainly with mineral oil as main component for the liquid product, wherein contain mineral oil, anticorrosive, anti-extrusion machine Deng material;Cutting liquid itself is inflammable, and environmental pollution is larger, needs fluorine-containing alkane solvent during cleaning silicon chip simultaneously.Equations of The Second Kind Aqueous cutting liquid product can be dissolved in water or be water dispersible, and cleaning silicon chip water, without organic solvent, to human body and environment Harmless.Therefore Equations of The Second Kind cutting liquid is to use more species at present.
At present in the production process in cutting it may appear that cutting liquid fail to soak well silicon chip and discrete cut under The silica flour coming is so that silica flour is gathered in the situation that silicon chip surface produces abrasion to silicon chip.
Content of the invention
Goal of the invention: for solving Shortcomings in prior art, the present invention provides a kind of water base cutting liquid, existing for solving There is the technical problem that in technology, silicon chip is worn and torn by silica flour.
Technical scheme:
A kind of water base cutting liquid, each component including forming according to following percentage by weight: ethylene glycol 65%~70%, Triethanolamine oleate 2%~4%, nonionic surfactant 3%~5%, extreme pressure anti-wear additives 1%~5%, water 20%~ 30%.
Further, in the present invention, described triethanolamine oleate is the mixture of oleic acid and triethanolamine.
Further, in the present invention, described extreme pressure anti-wear additives are dialkyl dithiocarbamate, dialkyl disulfides For one of phosphate, lead naphthenate, coconut oil triglycolyl amine.Here organic-molybdenum salt, antimonic salt, lead salt not only can have Effect ground improves the extreme pressure anti-wear of lubricating grease, can also improve oxidation stability and the rust-preventing characteristic of lubricating grease simultaneously.
Beneficial effect:
Increased extreme pressure anti-wear additives in the cutting liquid of the present invention so that the surface tension of cutting liquid reduces, substantially increase The mobility of cutting liquid and permeability, greatly improve the wetability to abrasive material for the cutting liquid, improve the dispersiveness of abrasive material, it is to avoid Abrasive agglomerate is formed block and is brought damage to silicon chip, is conducive to improving the yield rate of silicon chip cutting;And guarantor can be formed in silicon chip surface Cuticula, makes silicon chip be easier to be cleaned by, and improves lubricant effect, wearability and the cooling of cutting liquid.
Specific embodiment
Embodiment 1
A kind of water base cutting liquid, each component including forming according to following percentage by weight: ethylene glycol 70%, oleic acid three Monoethanolamine 3%, nonionic surfactant 3%, dialkyldithiocarbamacompositions sodium 2%, deionized water 22%.Described non-from Sub- surfactant is with rosin, cis-butenedioic anhydride and polyamine etc. as Material synthesis.
Embodiment 2
A kind of water base cutting liquid, each component including forming according to following percentage by weight: ethylene glycol 67%, oleic acid three Monoethanolamine 3%, nonionic surfactant 2%, dialkyldithiocarbamacompositions sodium 1%, deionized water 27%.
According to the ratio in embodiment, each component is mixed, at a temperature of 120 DEG C, with the speed stirring of 120r/min 2min~5min, you can obtain water base silicon chip cutting fluid.Extreme pressure anti-wear additives in the present embodiment are chosen as dialkyl dithio ammonia Base sodium formate, forms chemical reaction film in metal surface, plays lubrication, prevents scratches on metal surface so that silicon chip can hold It is extreme boundary lubrication by boundary lubrication the harshest, prevent silicon chip surface to be worn.
The above is only the preferred embodiment of the present invention it is noted that ordinary skill people for the art For member, under the premise without departing from the principles of the invention, some improvements and modifications can also be made, these improvements and modifications also should It is considered as protection scope of the present invention.

Claims (4)

1. a kind of water base cutting liquid it is characterised in that: include according to following percentage by weight composition each component: ethylene glycol 65%~70%, triethanolamine oleate 2%~4%, nonionic surfactant 3%~5%, extreme pressure anti-wear additives 1%~5%, Water 20%~30%.
2. water base cutting liquid according to claim 1 it is characterised in that: described triethanolamine oleate be oleic acid and three ethanol The mixture of amine.
3. water base cutting liquid according to claim 2 it is characterised in that: described extreme pressure anti-wear additives be dialkyl dithio ammonia One of base formates, dialkyl dithiophosphate, lead naphthenate, coconut oil triglycolyl amine.
4. water base cutting liquid according to claim 3 it is characterised in that: water be deionized water.
CN201610722796.0A 2016-08-25 2016-08-25 Water-based cutting fluid Pending CN106336938A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610722796.0A CN106336938A (en) 2016-08-25 2016-08-25 Water-based cutting fluid

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610722796.0A CN106336938A (en) 2016-08-25 2016-08-25 Water-based cutting fluid

Publications (1)

Publication Number Publication Date
CN106336938A true CN106336938A (en) 2017-01-18

Family

ID=57824874

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610722796.0A Pending CN106336938A (en) 2016-08-25 2016-08-25 Water-based cutting fluid

Country Status (1)

Country Link
CN (1) CN106336938A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107529545A (en) * 2017-06-30 2018-01-02 煤炭科学技术研究院有限公司 A kind of water-ethanol type flame retardant hydraulic fluid for underground coal mine hydraulic system and preparation method thereof
CN111171801A (en) * 2018-11-13 2020-05-19 中国石油化工股份有限公司 Preparation method of self-assembled cleaning acid tackifier

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107529545A (en) * 2017-06-30 2018-01-02 煤炭科学技术研究院有限公司 A kind of water-ethanol type flame retardant hydraulic fluid for underground coal mine hydraulic system and preparation method thereof
CN111171801A (en) * 2018-11-13 2020-05-19 中国石油化工股份有限公司 Preparation method of self-assembled cleaning acid tackifier

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PB01 Publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20170118

WD01 Invention patent application deemed withdrawn after publication