CN106334882A - AgCuTi brazing filler metal and preparation method thereof - Google Patents
AgCuTi brazing filler metal and preparation method thereof Download PDFInfo
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- CN106334882A CN106334882A CN201610955634.1A CN201610955634A CN106334882A CN 106334882 A CN106334882 A CN 106334882A CN 201610955634 A CN201610955634 A CN 201610955634A CN 106334882 A CN106334882 A CN 106334882A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
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Abstract
The invention discloses AgCuTi brazing filler metal which comprises AgCu matrix brazing filler metal and a metal titanium electroplated coating coated outside the AgCu matrix brazing filler metal; a transition layer, which is formed by enabling a solid solution in the AgCu matrix brazing filler metal and the metal titanium electroplated coating to generate diffusion reaction, is arranged between the matrix brazing filler metal and the metal titanium electroplated coating. The preparation method for AgCuTi foil brazing filler metal provided by the invention is simple and convenient to operate, breaks through the technical bottleneck of a conventional method for preparing braing filler metal, and provides a novel green preparation method for novel-form high-quality active brazing filler metal. For the AgCuTi brazing filler metal, content of an active element Ti in the AgCuTi brazing filler metal is increased, and the defects that electroplated titanium in a saline system is difficult to form and melt by conventional AgCuTi brazing filler metal are overcome. The method has the advantages of being easy to form, high in processing efficiency, low in cost and the like, and provides a novel technical way for manufacturing and producing AgCuTi brazing filler metal.
Description
Technical field
The present invention relates to brazing material, especially relate to a kind of agcuti solder, and the preparation method of this agcuti solder.
Background technology
Agcuti solder, as a kind of active solder, is widely used in vacuum brazing field, but traditional agcuti solder is difficult
To shape, it is a great problem perplexing domestic and international soldering worker.
Titanium, as a kind of strategy light metal, has the advantages that specific strength is high, corrosion resistance is strong, is usually used in submarine, on aircraft,
Play a great role in navigation, aviation field, metal surface electrodeposition of titanium can play protection corrosion-resistant effect, can be applicable to as
Ocean, corrosive environment of sea water are medium.
The discharge potential of Titanium is low, and the deposition realizing titanium is more difficult, simultaneously the immature also imperfection of the electroplating technology of titanium.Mesh
Front conventional method is as follows: one be electric arc ionization electro-plating method, using Titanium ionize in vacuum or noble gases for titanium from
Son and then bombarding cathode enforcement plating；Two is second-level titanizing method, first plates last layer active metal (such as mainly on matrix
Magnesium), then it is carried out with titanium tetrachloride solution, by magnesium, Titanium is displaced and be then plated on matrix；Three is fuse salt
Electro-plating method, with carbon oxygen titanium as anode, plating metal as negative electrode, fuse salt be electrolyte implement plating.But, electric arc ionization electricity
Electroplating method processing step is many, and energy resource consumption is high, and process is complicated, and operation easier is big；In second-level titanizing method, the electrode potential of magnesium is same
Sample is relatively low, and plating is difficult to；Fuse salt electro-plating method includes titanium and smelts and titanium two processes of plating, coating quality and stability
Poor.
The preparation method of agcuti solder mainly has two kinds of electric arc melting, vacuum melting at present.In electric arc melting method by
Little in arc light heated perimeter, every time the agcuti solder of preparation less than 1000g it is impossible to industrialization production, electric arc melting side simultaneously
Method preparation agcuti solder due to arc light irradiation area narrow, easily occur tissue odds, ti element local segregation phenomenon so that
Agcuti solder performance deteriorates it is difficult to normal use.And vacuum smelting method has one in terms of preparing powdery agcuti solder
Fixed advantage, but when preparing agcuti foil solder, due to easily entraining impurity element fe, c etc. in course of hot rolling so that
The processing characteristics of agcuti solder, mechanical properties decrease, subsequently cannot shape, and be difficult to meet the performance of engineer applied simultaneously
Index request.Therefore, electric arc melting and vacuum smelting method have certain limitation in terms of preparing agcuti foil solder.
Content of the invention
Present invention aims to the deficiency of above-mentioned existing agcuti solder shaping and Titanium Electroplating technology, provide one kind
The agcuti solder of excellent performance, and easy shaping, high in machining efficiency, low cost preparation method are provided.
The purpose of the present invention is achieved in that
A kind of agcuti solder, including agcu matrix solder and the Titanium electrodeposited coating being coated on outside agcu matrix solder, matrix
Diffusion reaction is occurred to be formed for the solid solution in agcu matrix solder and Titanium electrodeposited coating between solder and Titanium electrodeposited coating
Transition zone.
Percentage thickness between described agcu matrix solder, transition zone and titanium electrodeposited coating be respectively as follows: matrix solder 65.0 ~
92.0 %, transition zone 7.5 ~ 33.5 %, metal level 0.5 ~ 1.5 %.
The thickness of described agcuti solder is 15 ~ 85 μm.
In described agcu matrix solder also containing quality the element y for matrix solder 0.5-1.0 %.
The preparation method of agcuti solder as above, comprises the following steps:
(1) prefabricated agcu matrix solder；
(2) with agcu matrix solder as negative electrode, simple substance titanium is anode, in agcu matrix solder electroplating surface titanium coating；
(3) after titanium technique to be electroplated finishes, by its vacuum drying infiltration 1 ~ 10 min, Ran Houyu at 1650 ~ 1700 DEG C
After diffusion 2 ~ 30 h in 1550 ~ 1650 DEG C of vacuum drying ovens, agcuti solder after cooling, is obtained.
Described step (2) particularly as follows: first with every 1000ml deionized water add titanium sulfate 0.146 ~ 0.208 mol,
Sodium sulfate 0.07 ~ 0.176 mol, sulphuric acid 0.736 ~ 1.288mol, surfactant 10 ~ 25 g are configured to electroplate liquid, then will
Implement Titanium Electroplating in negative electrode agcu matrix solder, anode simple substance titanium immersion electroplate liquid.
It is additionally added vanadic acid sodium 0.003 ~ 0.008 mol in described every 1000ml electroplate liquid.
Described surfactant is alkyl ether surfactant.
Described alkyl ether surfactant be op-10, polyoxyethylene lauryl ether, Polyethylene Glycol trimethyl nonyl ethers,
Any one of NPE.
Described electrodeposition of titanium is carried out under vacuum environment or inert gas shielding environment, and technological parameter is: electric current density 0.5
~5 a/dm2, 35 ~ 50 DEG C of electroplating solution temperature, plating time 2 ~ 15 min.
The preparation method of the agcuti foil solder that the present invention provides, simple, convenient, breach traditional method preparation
The technical bottleneck of solder, is that the high-quality active solder of neomorph provides a kind of new Method of Green Manufacture.To agcuti pricker
For material, improve the content of active element ti in agcuti solder, overcome traditional agcuti solder and be difficult to shape and melt
The shortcoming of salt system Titanium Electroplating, the method has easy shaping, high in machining efficiency, low cost and other advantages, is the system of agcuti solder
Making production provides a kind of new technological approaches.
Additionally, with binary and above silver alloy as matrix, such as silver-colored nickel, silver-colored manganese, Ag-Cu-Zn, silver-bearing copper nickel etc., using the present invention
Preparation method, in its ti coat on diamond, prepares titaniferous silver-base alloy or silver solder all in scope of patent protection of the present invention.
Specific embodiment
Embodiment 1
A kind of agcuti solder, including agcu matrix solder and the Titanium electrodeposited coating being coated on outside agcu matrix solder, matrix
Diffusion reaction is occurred to be formed for the solid solution in agcu matrix solder and Titanium electrodeposited coating between solder and Titanium electrodeposited coating
Transition zone；Percentage thickness between agcu matrix solder, transition zone and titanium electrodeposited coating be respectively as follows: matrix solder 65.0 ~
92.0 %, transition zone 7.5 ~ 33.5 %, metal level 0.5 ~ 1.5 %；The thickness of agcuti solder is 15 ~ 85 μm；Further,
Except the ag containing 50-70 % in agcu matrix solder, the cu of 29.0-49.5 %, also containing quality is matrix solder 0.5-
1.0% y, adds y can refine the tissue of matrix solder, improves the mechanical property of matrix solder, be that the shaping of matrix solder is established
Basis.
The preparation method of agcuti solder as above, comprises the following steps:
(1) prefabricated agcu matrix solder: put into raw metal ag, cu and micro y in smelting furnace first, through casting, annealing, squeeze
Pressure, roll forming, are made as agcu matrix solder in advance；
(2) with agcu matrix solder as negative electrode, simple substance titanium is anode, in agcu matrix solder electroplating surface titanium coating；
(3), after titanium technique to be electroplated finishes, it is dried in the vacuum environment at 1650 ~ 1700 DEG C infiltration 1 ~ 10 min, so
After 1550 ~ 1650 DEG C of diffusion in vacuum 2 ~ 30 h, to form transition zone；Then furnace cooling, prepared thickness is 15 ~ 85 μm
Agcuti solder.Wherein, transition zone contributes to matrix solder and titanium coating forms metallurgical binding, improves combination between the two
Power, can improve the mechanical property of agcuti solder, regulation and control combination interface tissue and thing phase composition simultaneously, contribute to strengthening agcuti
The active function of solder；Without transition zone, titanium electrodeposited coating (1660 DEG C) and matrix solder (770 ~ 795 DEG C) fusion temperature
Difference is larger, and silver-bearing copper titanium alloy is difficult to shape, easy embrittlement, does not have the effect of active solder.
Step (2) particularly as follows: with agcu matrix solder as negative electrode, with simple substance titanium as anode, to add in every 1000ml water
Titanium sulfate 0.146 ~ 0.208 mol, sodium sulfate 0.07 ~ 0.176 mol, sulphuric acid 0.736 ~ 1.288mol, surfactant 10 ~ 25
G is formulated as electroplate liquid, setting electric current, voltage, under vacuum environment or inert gas shielding environment, implements electrodeposition of titanium；Electricity is heavy
Long-pending titanium technological parameter is: electric current density 0.5 ~ 5 a/dm2, voltage 3 ~ 6 v, 35 ~ 50 DEG C of electroplating solution temperature, plating time 2 ~
15 min.
Preferably, it is additionally added dispersant vanadic acid sodium 0.003 ~ 0.008 mol, described surface activity in every 1000ml electroplate liquid
Agent is alkyl ether surfactant, further for op-10, polyoxyethylene lauryl ether, Polyethylene Glycol trimethyl nonyl ethers, nonyl
Any one of base phenol polyethenoxy ether.
The invention has the advantages that
1) electrodeposition of titanium-infiltration-diffusion composite preparation process that the present invention provides, overcomes traditional agcuti foil solder and is difficult to
Shaping and the deficiency of conventional electroplating method, a kind of new way of offer shaping for neomorph agcuti solder；2) in matrix solder
Containing trace element y, the tissue of matrix solder can be refined, improve the mechanical property of matrix solder, be that the shaping of matrix solder is established
Fixed basis；3) the electrodeposition of titanium method being provided, not only can implement titanizing in monometallic, alloy surface, and in welding material
Material ti coat on diamond, the shaping for neomorph metal material especially titaniferous welding material provides a kind of new approaches；4) electrodeposition of titanium
Bath temperature applied in process is low, the time is short, and sedimentation rate is high, has energy-conservation, consumption reduction effect；5) described electrodeposition of titanium-
Infiltration-diffusion composite preparation process is implemented under vacuum environment (or inert gas shielding), the agcuti solder cleanliness factor of preparation
Height, does not contain any impurity；6) electric current density, bath temperature, plating time, bath concentration multiparameter Collaborative Control skill are adopted
Art, improves the content of active element ti in agcuti solder by the thickness of regulation and control titanium electrodeposited coating, transition zone.
Embodiment 2
A kind of agcuti solder, contains yttrium 0.5% by matrix solder bag55cu() and the gold that is coated on outside bag55cu matrix solder
Belong to titanium electrodeposited coating composition, transition zone is agti compound phase and cuti, cuyti compound phase composition.Matrix solder, transition zone,
The percentage thickness of electrodeposited coating is as follows, matrix solder: 85.0 %, transition zone: 14.5 %, electrodeposited coating: 0.5 %.
The preparation method of agcuti solder as above, comprises the following steps:
First argent 550 g, copper 445 g, yttrium 5 g are inserted smelting furnace, through casting, annealing, extruding, roll forming, prefabricated
It is 30 μm of ribbon base solder bag55cu for thickness；Then adopt Titanium Electroplating technique in bag55cu matrix solder positive and negative electricity
Titanizing (10 μm of one side thickness)；After technique to be electroplated finishes, permeate 8 min in the vacuum drying oven putting it into 1700 DEG C, so
After spreading 20 h in the vacuum drying oven putting into 1650 DEG C afterwards, furnace cooling, prepared thickness is 35 μm of agcuti solder.
Wherein: plating titanium solution is by titanium sulfate 50 g/l(0.208mol/l), sodium sulfate 25 g/l(0.176mol/l), matter
Amount fraction is 98% concentrated sulphuric acid 70 ml/l(1.288mol/l), op-10 25 g/l, deionized water 1000 ml form.Specifically electricity
Technology for plating titanium parameter is as follows: electric current density 5 a/dm2, voltage 3 v, 50 DEG C of solution temperature, plating time 4 min, this Titanium Electroplating
Technique is carried out in helium environmental protection.
The agcuti solder of said method preparation, compared with matrix solder bag55cu, silver content reduces by 9.3%, moistening face
Long-pending raising 12.5 %.
Embodiment 3
A kind of agcuti solder, by matrix solder bag60cu(% containing yttrium 0.8) and the gold that is coated on outside bag60cu matrix solder
Belong to titanium electrodeposited coating composition, transition zone is agti compound phase and cuti, cuyti compound phase composition.Matrix solder, transition zone,
The percentage thickness of electrodeposited coating is as follows, matrix solder: 92.0 %, transition zone: 7.5 %, electrodeposited coating: 0.5 %.
The preparation method of agcuti solder as above, comprises the following steps:
First argent 600 g, copper 392 g, yttrium 8 g are inserted smelting furnace, through casting, annealing, extruding, roll forming, prefabricated
It is 40 μm of ribbon base solder bag60cu for thickness；Then adopt Titanium Electroplating technique in bag60cu matrix solder positive and negative electricity
Titanizing (15 μm of one side thickness)；After titanium technique to be electroplated finishes, put it into and in 1700 DEG C of vacuum drying oven, permeate 10
Min, after spreading 30 h in the vacuum drying oven being then placed in 1650 DEG C, furnace cooling, prepared thickness is 43 μm of agcuti solder.
Wherein: plating titanium solution is by titanium sulfate 35g/l(0.146mol/l), sodium sulfate 10 g/l(0.07mol/l), quality
Fraction is 98% concentrated sulphuric acid 40 ml/l(0.736mol/l), polyoxyethylene lauryl ether 10 g/l, deionized water 1000 ml group
Become.Concrete electroplating technological parameter is as follows: electric current density 1.5 a/dm2, voltage 3.5 v, 35 DEG C of solution temperature, plating time 15
Min, this Titanium Electroplating technique is carried out in vacuum environment.
The agcuti solder of said method preparation, compared with matrix solder bag60cu, silver content reduces by 7.2%, moistening face
Long-pending raising 9.5 %.
Embodiment 4
A kind of agcuti solder, by matrix solder bag50cu(% containing yttrium 0.6) and the gold that is coated on outside matrix solder bag50cu
Belong to titanium electrodeposited coating composition, transition zone is agti compound phase and cuti, cuyti compound phase composition.Matrix solder, transition zone,
The percentage thickness of electrodeposited coating is as follows, matrix solder: 65.0 %, transition zone: 33.5 %, electrodeposited coating: 1.5 %.
The preparation method of agcuti solder as above, comprises the following steps:
First argent 500 g, copper 494 g, yttrium 6 g are inserted smelting furnace, through casting, annealing, extruding, roll forming, prefabricated
It is 10 μm of ribbon base solder bag50cu for thickness；Then adopt Titanium Electroplating technique in bag50cu matrix solder positive and negative electricity
Titanizing (5 μm of one side thickness)；After technique to be electroplated finishes, permeate 1 min in the vacuum drying oven putting it into 1650 DEG C, so
After spreading 2 h in the vacuum drying oven putting into 1550 DEG C afterwards, furnace cooling, prepared thickness is 15 μm of agcuti solder.
Wherein: plating titanium solution is by titanium sulfate 40 g/l(0.167mol/l), sodium sulfate 20 g/l(0.141mol/l), matter
Amount fraction is 98% concentrated sulphuric acid 55 ml/l(1.012mol/l), Polyethylene Glycol trimethyl nonyl ethers 15 g/l, deionized water 1000
Ml forms.Concrete electroplating technological parameter is as follows: electric current density 3.5 a/dm2, voltage 6 v, 40 DEG C of solution temperature, plating time 2
Min, this Titanium Electroplating technique is carried out in argon environmental protection.
The agcuti solder of said method preparation, compared with matrix solder bag50cu, silver content reduces by 8.5%, moistening face
Long-pending raising 20.7 %.
Embodiment 5
A kind of agcuti solder, contains yttrium 0.9% by matrix solder bag70cu() and the metal that is coated on outside matrix solder bag70cu
Titanium electrodeposited coating forms, and transition zone is agti compound phase and cuti, cuyti compound phase composition.Matrix solder, transition zone, electricity
The percentage thickness of coating is as follows, matrix solder: 75.0 %, transition zone: 24.0 %, electrodeposited coating: 1.0 %.As above
The preparation method of agcuti solder, comprises the following steps:
First argent 700 g, copper 291 g, yttrium 9 g are inserted smelting furnace, through casting, annealing, extruding, roll forming, prefabricated
It is 65 μm of ribbon base solder bag70cu for thickness；Then adopt Titanium Electroplating technique in bag70cu matrix solder positive and negative electricity
Titanizing (15 μm of one side thickness)；After technique to be electroplated finishes, permeate 6 min in the vacuum drying oven putting it into 1700 DEG C, so
After spreading 24 h in the vacuum drying oven putting into 1650 DEG C afterwards, furnace cooling, prepared thickness is 85 μm of agcuti solder.
Wherein: plating titanium solution is by titanium sulfate 45 g/l(0.188mol/l), sodium sulfate 22 g/l(0.155mol/l), matter
Amount fraction is 98% concentrated sulphuric acid 60 ml/l(1.104mol/l), NPE 18 g/l, deionized water 1000 ml
Composition.Concrete electroplating technological parameter is as follows: electric current density 3.5 a/dm2, voltage 5 v, 42 DEG C of solution temperature, plating time 8
Min, this Titanium Electroplating technique is carried out in helium environmental protection.
The agcuti solder of said method preparation, compared with matrix solder bag70cu, silver content reduces by 7.6 %, moistening face
Long-pending raising 16.8 %.
Embodiment 6
A kind of agcuti solder, by matrix solder bag65cu(% containing yttrium 1.0) and the gold that is coated on outside matrix solder bag65cu
Belong to titanium electrodeposited coating composition, transition zone is agti compound phase and cuti, cuyti compound phase composition.Matrix solder, transition zone,
The percentage thickness of electrodeposited coating is as follows, matrix solder: 68.5 %, transition zone: 30.0 %, electrodeposited coating: 1.5 %.
The preparation method of agcuti solder as above, comprises the following steps:
First argent 650 g, copper 340 g, yttrium 10 g are inserted smelting furnace, through casting, annealing, extruding, roll forming, prefabricated
It is 50 μm of ribbon base solder bag65cu for thickness；Then adopt Titanium Electroplating technique in bag65cu matrix solder positive and negative electricity
Titanizing (15 μm of one side thickness)；After technique to be electroplated finishes, permeate 6 min in the vacuum drying oven putting it into 1650 DEG C, so
After spreading 20 h in the vacuum drying oven putting into 1550 DEG C afterwards, furnace cooling, prepared thickness is 72 μm of agcuti solder.
Wherein: plating titanium solution is by titanium sulfate 40 g/l(0.167mol/l), sodium sulfate 20 g/l(0.141mol/l), matter
Amount fraction is 98% concentrated sulphuric acid 55 ml/l(1.012mol/l), Polyethylene Glycol trimethyl nonyl ethers 20 g/l, deionized water 1000
Ml forms.Concrete electroplating technological parameter is as follows: electric current density 3.2 a/dm2, voltage 6 v, 45 DEG C of solution temperature, plating time
6.5 min, this Titanium Electroplating technique is carried out in vacuum environment.
The agcuti solder of said method preparation, compared with matrix solder bag65cu, silver content reduces by 6.5 %, moistening face
Long-pending raising 11.7 %.
Embodiment 7
A kind of agcuti solder, by matrix solder bag50cu(% containing yttrium 0.5) and the gold that is coated on outside matrix solder bag50cu
Belong to titanium electrodeposited coating composition, transition zone is agti compound phase and cuti, cuyti compound phase composition.Matrix solder, transition zone,
The percentage thickness of electrodeposited coating is as follows, matrix solder: 80%, transition zone: and 18.8%, electrodeposited coating: 1.2 %.
The preparation method of agcuti solder as above, comprises the following steps:
First argent 500 g, copper 495g, yttrium 5 g are inserted smelting furnace, through casting, annealing, extruding, roll forming, be made as in advance
Thickness is 50 μm of ribbon base solder bag50cu；Then Titanium Electroplating technique is adopted to electroplate in bag50cu matrix solder positive and negative
Titanium (10 μm of one side thickness)；After technique to be electroplated finishes, permeate 4 min in the vacuum drying oven putting it into 1680 DEG C, then
After spreading 2 h in the vacuum drying oven putting into 1600 DEG C, furnace cooling, prepared thickness is 60 μm of agcuti solder.
Wherein: plating titanium solution is by titanium sulfate 0.18mol/l, sodium sulfate 0.12mol/l, vanadic acid sodium 0.008mol/l, matter
Amount fraction is 98% concentrated sulphuric acid 1mol/l, and NPE 20 g/l, deionized water 1000 ml form.Concrete galvanizer
Skill parameter is as follows: electric current density 0.5 a/dm2, voltage 3 v, 45 DEG C of solution temperature, plating time 15min, this Titanium Electroplating technique
Helium environmental protection is carried out.
The agcuti solder of said method preparation, compared with matrix solder bag50cu, silver content reduces by 6.1%, moistening face
Long-pending raising 10.5%.
Embodiment 8
A kind of agcuti solder, by matrix solder bag55cu(% containing yttrium 1) and the metal that is coated on outside matrix solder bag55cu
Titanium electrodeposited coating forms, and transition zone is agti compound phase and cuti, cuyti compound phase composition.Matrix solder, transition zone, electricity
The percentage thickness of coating is as follows, matrix solder: 90%, transition zone: and 9%, electrodeposited coating: 1 %.
The preparation method of agcuti solder as above, comprises the following steps:
First argent 550 g, copper 440g, yttrium 10 g are inserted smelting furnace, through casting, annealing, extruding, roll forming, prefabricated
It is 50 μm of ribbon base solder bag55cu for thickness；Then adopt Titanium Electroplating technique in bag55cu matrix solder positive and negative electricity
Titanizing (12 μm of one side thickness)；After technique to be electroplated finishes, in the vacuum drying oven putting it into 1670 DEG C, permeate 8 min,
After spreading 15 h in the vacuum drying oven being then placed in 1600 DEG C, furnace cooling, prepared thickness is 50 μm of agcuti solder.
Wherein: plating titanium solution is by titanium sulfate 0.16mol/l, sodium sulfate 0.07mol/l, vanadic acid sodium 0.005mol/l, matter
Amount fraction is 98% concentrated sulphuric acid 1.2mol/l, and polyoxyethylene lauryl ether 18 g/l, deionized water 1000 ml form.Concrete plating
Technological parameter is as follows: electric current density 2 a/dm2, voltage 3.5 v, 40 DEG C of solution temperature, plating time 10min, this Titanium Electroplating work
Skill is carried out in argon environmental protection.
The agcuti solder of said method preparation, compared with matrix solder bag55cu, silver content reduces by 8.5%, moistening face
Long-pending raising 11.4%.
Embodiment 9
A kind of agcuti solder, by matrix solder bag65cu(% containing yttrium 1) and the metal that is coated on outside matrix solder bag65cu
Titanium electrodeposited coating forms, and transition zone is agti compound phase and cuti, cuyti compound phase composition.Matrix solder, transition zone, electricity
The percentage thickness of coating is as follows, matrix solder: 70%, transition zone: and 29.2%, electrodeposited coating: 0.8 %.
The preparation method of agcuti solder as above, comprises the following steps:
First argent 650 g, copper 340g, yttrium 10 g are inserted smelting furnace, through casting, annealing, extruding, roll forming, prefabricated
It is 20 μm of ribbon base solder bag65cu for thickness；Then adopt Titanium Electroplating technique in bag65cu matrix solder positive and negative electricity
Titanizing (6 μm of one side thickness)；After technique to be electroplated finishes, permeate 5 min in the vacuum drying oven putting it into 1660 DEG C, so
After spreading 25 h in the vacuum drying oven putting into 1580 DEG C afterwards, furnace cooling, prepared thickness is 25 μm of agcuti solder.
Wherein: plating titanium solution is by titanium sulfate 0.2mol/l, sodium sulfate 0.15mol/l, vanadic acid sodium 0.003mol/l, quality
Fraction is 98% concentrated sulphuric acid 0.9mol/l, and Polyethylene Glycol trimethyl nonyl ethers 25 g/l, deionized water 1000 ml form.Specifically electricity
Depositing process parameter is as follows: electric current density 1 a/dm2, voltage 3.2 v, 35 DEG C of solution temperature, plating time 4min, this Titanium Electroplating work
Skill is carried out in vacuum environment.
The agcuti solder of said method preparation, compared with matrix solder bag65cu, silver content reduces by 5.8%, moistening face
Long-pending raising 9.6%.
Above-described is only the preferred embodiment of the present invention it is noted that for a person skilled in the art,
Under the premise of without departing from general idea of the present invention, some changes and improvements can also be made, these also should be considered as the present invention's
Protection domain.
Claims (10)
1. a kind of agcuti solder it is characterised in that: include agcu matrix solder and the metal that is coated on outside agcu matrix solder
Titanium electrodeposited coating, is that the solid solution in agcu matrix solder is occurred with Titanium electrodeposited coating between matrix solder and Titanium electrodeposited coating
The transition zone that diffusion reaction is formed.
2. agcuti solder as claimed in claim 1 it is characterised in that: described agcu matrix solder, transition zone and titanium plating
Percentage thickness between layer is respectively as follows: matrix solder 65.0 ~ 92.0 %, transition zone 7.5 ~ 33.5 %, metal level 0.5 ~ 1.5
%.
3. agcuti solder as claimed in claim 1 it is characterised in that: the thickness of described agcuti solder be 15 ~ 85 μm.
4. agcuti solder as claimed in claim 1 it is characterised in that: also contain in described agcu matrix solder quality be base
The element y of body solder 0.5-1.0 %.
5. the preparation method of the agcuti solder according to any one of claim 1-4 is it is characterised in that comprise the following steps:
(1) prefabricated agcu matrix solder；
(2) with agcu matrix solder as negative electrode, simple substance titanium is anode, in agcu matrix solder electroplating surface titanium coating；
(3) after titanium technique to be electroplated finishes, by its vacuum drying infiltration 1 ~ 10 min, Ran Houyu at 1650 ~ 1700 DEG C
After diffusion 2 ~ 30 h in 1550 ~ 1650 DEG C of vacuum drying ovens, agcuti solder after cooling, is obtained.
6. agcuti solder according to claim 5 preparation method it is characterised in that: described step (2) is particularly as follows: head
First to add titanium sulfate 0.146 ~ 0.208 mol, sodium sulfate 0.07 ~ 0.176 mol, sulphuric acid in every 1000ml deionized water
0.736 ~ 1.288mol, surfactant 10 ~ 25 g are configured to electroplate liquid, then by negative electrode agcu matrix solder, anode simple substance
Implement Titanium Electroplating in titanium immersion electroplate liquid.
7. agcuti solder according to claim 5 preparation method it is characterised in that: in described every 1000ml electroplate liquid
It is additionally added vanadic acid sodium 0.003 ~ 0.008 mol.
8. agcuti solder according to claim 5 preparation method it is characterised in that: described surfactant be alkyl
Ether surfactant.
9. agcuti solder according to claim 8 preparation method it is characterised in that: described alkyl ether surface activity
Agent be op-10, polyoxyethylene lauryl ether, Polyethylene Glycol trimethyl nonyl ethers, NPE any one.
10. agcuti solder according to claim 5 preparation method it is characterised in that: described electrodeposition of titanium is in vacuum
Carry out under environment or inert gas shielding environment, technological parameter is: electric current density 0.5 ~ 5 a/dm2, electroplating solution temperature 35 ~ 50
DEG C, plating time 2 ~ 15 min.
Priority Applications (1)
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| CN1127945A (en) * | 1994-09-20 | 1996-07-31 | 惠特克公司 | Connector |
| JP2006509635A (en) * | 2002-12-13 | 2006-03-23 | コラス・アルミニウム・バルツプロドウクテ・ゲーエムベーハー | Brazed sheet product having a clad layer and a coating layer of an iron alloy and method for producing the same |
| CN105345304A (en) * | 2015-12-02 | 2016-02-24 | 华北水利水电大学 | Supersaturated brazing filler metal and preparation method thereof |
| CN205188464U (en) * | 2015-12-02 | 2016-04-27 | 华北水利水电大学 | Supersaturation brazing filler metal plating increases material device |
| CN105598541A (en) * | 2016-02-23 | 2016-05-25 | 深圳市昌龙盛机电技术有限公司 | Method for plating surfaces of Ni-Cr alloy wires with zinc at low temperature |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1127945A (en) * | 1994-09-20 | 1996-07-31 | 惠特克公司 | Connector |
| JP2006509635A (en) * | 2002-12-13 | 2006-03-23 | コラス・アルミニウム・バルツプロドウクテ・ゲーエムベーハー | Brazed sheet product having a clad layer and a coating layer of an iron alloy and method for producing the same |
| CN105345304A (en) * | 2015-12-02 | 2016-02-24 | 华北水利水电大学 | Supersaturated brazing filler metal and preparation method thereof |
| CN205188464U (en) * | 2015-12-02 | 2016-04-27 | 华北水利水电大学 | Supersaturation brazing filler metal plating increases material device |
| CN105598541A (en) * | 2016-02-23 | 2016-05-25 | 深圳市昌龙盛机电技术有限公司 | Method for plating surfaces of Ni-Cr alloy wires with zinc at low temperature |
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