CN106328799A - Deep-ultraviolet LED (light-emitting diode) package support - Google Patents
Deep-ultraviolet LED (light-emitting diode) package support Download PDFInfo
- Publication number
- CN106328799A CN106328799A CN201610910978.0A CN201610910978A CN106328799A CN 106328799 A CN106328799 A CN 106328799A CN 201610910978 A CN201610910978 A CN 201610910978A CN 106328799 A CN106328799 A CN 106328799A
- Authority
- CN
- China
- Prior art keywords
- box dam
- package support
- ultraviolet led
- led package
- deep ultraviolet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims abstract description 30
- 230000002745 absorbent Effects 0.000 claims abstract description 21
- 239000002250 absorbent Substances 0.000 claims abstract description 21
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 16
- 239000004411 aluminium Substances 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 229920001971 elastomer Polymers 0.000 claims description 7
- 239000000806 elastomer Substances 0.000 claims description 7
- 239000006097 ultraviolet radiation absorber Substances 0.000 claims description 7
- 229910017083 AlN Inorganic materials 0.000 claims description 5
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 5
- 229920003225 polyurethane elastomer Polymers 0.000 claims description 4
- 230000000903 blocking effect Effects 0.000 claims description 3
- 230000009970 fire resistant effect Effects 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000006096 absorbing agent Substances 0.000 claims 1
- 230000032683 aging Effects 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000006978 adaptation Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009172 bursting Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides a deep-ultraviolet LED (light-emitting diode) package support which comprises a base and a hollow surrounding dam. The bottom of the surrounding dam is connected with the base, LEDs are placed on the upper portion of the base and at the center of the surrounding dam, the outer edge of the surrounding dam is flush with the outer edge of the base, the surface of the surrounding dam is plated with mirror aluminum, and ultraviolet absorbent components are doped into surrounding dam materials. The deep-ultraviolet LED package support can reflect most deep-ultraviolet LED light, and the ultraviolet aging degree of the surrounding dam is reduced.
Description
Technical field
The invention belongs to deep ultraviolet LED technology field, be specifically related to a kind of deep ultraviolet LED package support.
Background technology
Deep ultraviolet LED electric light transformation efficiency is the lowest at present, and substantially 99% is converted into heat, so needing heat dispersion good
Support.Additionally, deep UV has penetrates destructiveness, the requirement to material is the highest, and general organic material shines at ultraviolet
Penetrate down quickly occur aging.Meanwhile, deep ultraviolet LED packaging cost remains high, and the cost of support is main cause, accounts for 50%
Cost.
In view of the foregoing, need a kind of deep ultraviolet LED package support of design, to solve to ask present in prior art
Topic.
Summary of the invention
The present invention provides a kind of deep ultraviolet LED package support, including base and box dam, bottom box dam hollow and box dam and the end
Seat connects, and LED is placed in base top and box dam center, and box dam outer rim flushes with base outer rim, wherein, and described box dam plated surface mirror
Mixed with ultraviolet absorber elements in face aluminum, and box dam material.
Preferably, the thermal coefficient of expansion of box dam material is much larger than the thermal coefficient of expansion of submount material.
Preferably, described UV absorbent include UV absorbent UV-O, UV absorbent UVP-327 and/or
Ultraviolet absorbent UV-531.
Preferably, each ultraviolet absorber elements proportioning in box dam material is as follows: UV absorbent UV-O is
0.1%-0.5%, UV absorbent UVP-327 is 1%～2%, and ultraviolet absorbent UV-531 is 0.1%-0.4%.
Preferably, specular aluminium is plated in the inner surface of box dam, upper surface and outer surface.
Preferably, elastomer coating is scribbled between described specular aluminium and box dam.
Preferably, described elastomer coating material includes transparent polyurethane elastomer.
Preferably, the making material of described base includes aluminium nitride ceramics, and the making material of described box dam includes organic moulding
Material PPA and/or fire resistant resin material.
Preferably, being provided with some card bases bottom box dam, base is provided with the draw-in groove suitable with described card base, and draw-in groove side
Wall is provided with the Ka Gou for blocking described card base.
Preferably, card base outside dimension and draw-in groove internal diameter size are equal in magnitude when 10 DEG C.
The deep ultraviolet LED package support that the present invention provides, has the advantages that
Box dam plated surface specular aluminium, it is possible to reflection major part deep ultraviolet LED light line, reduces the ultraviolet aging degree of box dam；
Meanwhile, mixed with ultraviolet absorber elements in box dam material, it is possible to reduce the ultraviolet aging damage to elastomer box dam further
Wound；The elastomer coating of minute surface aluminium film surface, so that box dam is unlikely when high-temperature expansion makes specular aluminium film cracking or de-
Fall；Its base uses aluminium nitride ceramics to make, and has high thermal conduction characteristic.
Accompanying drawing explanation
The deep ultraviolet LED package support top view that Fig. 1 provides for present pre-ferred embodiments；
The deep ultraviolet LED package support disassembly diagram that Fig. 2 a provides for present pre-ferred embodiments；
The deep ultraviolet LED package support low-temperature assembled schematic diagram that Fig. 2 b provides for present pre-ferred embodiments；
The deep ultraviolet LED package support room temperature box dam that Fig. 2 c provides for present pre-ferred embodiments expands schematic diagram；
The deep ultraviolet LED package support disassembly diagram that Fig. 3 provides for another embodiment of the present invention.
In figure:
1-box dam；11-card base；2-base；21,21 '-Ka Gou；22-draw-in groove；D-LED position.
Detailed description of the invention
Below in conjunction with drawings and Examples, the invention will be further described.
Embodiment 1
Referring to Fig. 1 and Fig. 2 a, the deep ultraviolet LED package support that present pre-ferred embodiments provides includes box dam 1 and the end
Seat 2, connects with base 2 bottom box dam 1 hollow and box dam 1, and LED is placed in base 2 top and box dam 1 center, i.e. D position in Fig. 1
Place.Box dam 1 outer rim flushes with base 2 outer rim, and mixed with ultraviolet absorber elements in box dam 1 material.If being provided with bottom box dam 1
Dry card base 11, base 2 is provided with the draw-in groove 22 suitable with card base 11, and draw-in groove 22 sidewall is provided with the Ka Gou for blocking card base
21.In this, box dam 1 plated surface specular aluminium, surface refers to that specular aluminium is plated in the inner surface of box dam 1, upper surface and outer surface herein,
Its lower surface, i.e. bottom surface and card base are not provided with above-mentioned aluminium coat.
Specifically, the thermal coefficient of expansion of box dam 1 material is much larger than the thermal coefficient of expansion of base 2 material, for example, respectively
The thermal coefficient of expansion of material is as follows: aluminium nitride ceramics 4～6*10- 6；Ppa plastics 30～60*10-6.Based on above-mentioned restriction, card base
11 outside dimensions and draw-in groove 22 internal diameter size are equal in magnitude when 10 DEG C.This kind of set-up mode, can reach following effect: during low temperature
(less than 10 DEG C), card base 11 shrinks, and it is slightly less than draw-in groove 22 size, and support easily assembles；Recover to room temperature or with LED heating temperature
When degree raises (higher than 10 DEG C), card base 11 degrees of expansion is higher than draw-in groove 22, it is possible to ensure air-tightness between card base 11 and draw-in groove 22.
In the present embodiment, base 2 is made up of aluminium nitride ceramics material, box dam 1 be organic plastics PPA or fire resistant resin material or
Both persons doping is made.
With reference to Fig. 2 b and Fig. 2 c, based on principle of expanding with heat and contracting with cold: under low temperature state, card base 11 size reduction, be slightly less than with
The draw-in groove 22 of its adaptation, now can put into draw-in groove 22 by card base 11 easily；When recovering room temperature or arriving high temperature, card base 11
Expand, be connected to bottom it in card ditch 21, prevent box dam 1 from getting loose.During this, base 2 size that thermal coefficient of expansion is less is several
Constant.In the present embodiment, card ditch 21 is that one week indent is formed bottom draw-in groove 22, also will have different realization in other embodiments
Mode.
Embodiment 2
For reducing the aging speed of box dam 1, the present embodiment is doped with UV absorbent, after mixing in it makes material
Extruded for box dam 1.Specifically, inhale including UV absorbent UV-O, UV absorbent UVP-327 and/or ultraviolet
Receive agent UV-531.Each ultraviolet absorber elements proportioning in box dam 1 material is as follows: UV absorbent UV-O is 0.1%-
0.5%, UV absorbent UVP-327 is 1%～2%, and ultraviolet absorbent UV-531 is 0.1%-0.4%.Each ultraviolet
The concrete ratio of absorbent can adjust in the actually used amount of box dam 1 accordingly according to three in each self-corresponding ratio range.
Additionally, box dam 1 plated surface specular aluminium, even come off, at mirror for preventing specular aluminium from bursting in box dam 1 expansion process
Elastomer coating is scribbled between face aluminum and box dam 1 surface.In this, elastomer coating material includes transparent polyurethane elastomer, real
In the operation of border, also as required transparent polyurethane elastomer can be replaced with other material, to this present invention and be not construed as limiting.
Embodiment 3
Referring to Fig. 3, card ditch 21 may also be configured to agnail shape.As it was previously stated, after card base 11 expands, the card of reversed acanthoid
Box dam 1 can be fixed by ditch 21.In this, card base 11 and draw-in groove 22 number with its adaptation are all higher than equal to 3, in the present embodiment
It it is 4.
In other embodiments, card ditch 21 also can be replaced ridge design, to increase the frictional force of base 2 and card base 11.
The above is only the preferred embodiments of the present invention, it is noted that for those skilled in the art
For, under the premise without departing from the principles of the invention, it is also possible to make some improvements and modifications, these improvements and modifications also should regard
For protection scope of the present invention.
Claims (10)
1. a deep ultraviolet LED package support, it is characterised in that include base and box dam, bottom box dam hollow and box dam and the end
Seat connects, and LED is placed in base top and box dam center, and box dam outer rim flushes with base outer rim, wherein, and described box dam plated surface mirror
Mixed with ultraviolet absorber elements in face aluminum, and box dam material.
Deep ultraviolet LED package support the most according to claim 1, it is characterised in that the thermal coefficient of expansion of box dam material is big
Thermal coefficient of expansion in submount material.
Deep ultraviolet LED package support the most according to claim 1, it is characterised in that described UV absorbent includes purple
Ultraviolet absorbers UV-O, UV absorbent UVP-327 and/or ultraviolet absorbent UV-531.
Deep ultraviolet LED package support the most according to claim 3, it is characterised in that each ultraviolet absorber elements is enclosing
In dam material, proportioning is as follows: UV absorbent UV-O is 0.1%-0.5%, and UV absorbent UVP-327 is 1%～2%,
Ultraviolet absorbent UV-531 is 0.1%-0.4%.
Deep ultraviolet LED package support the most according to claim 1, it is characterised in that specular aluminium be plated in box dam inner surface,
Upper surface and outer surface.
Deep ultraviolet LED package support the most according to claim 5, it is characterised in that be coated with between described specular aluminium and box dam
Flexible body coating.
Deep ultraviolet LED package support the most according to claim 6, it is characterised in that described elastomer coating material includes
Transparent polyurethane elastomer.
Deep ultraviolet LED package support the most according to claim 1, it is characterised in that the making material of described base includes
Aluminium nitride ceramics, the making material of described box dam includes organic plastics PPA and/or fire resistant resin material.
Deep ultraviolet LED package support the most according to claim 1, it is characterised in that be provided with some card bases, the end bottom box dam
Seat is provided with the draw-in groove suitable with described card base, and draw-in groove sidewall is provided with the Ka Gou for blocking described card base.
Deep ultraviolet LED package support the most according to claim 9, it is characterised in that card base outside dimension and draw-in groove internal diameter
Size is equal in magnitude when 10 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610910978.0A CN106328799A (en) | 2016-10-19 | 2016-10-19 | Deep-ultraviolet LED (light-emitting diode) package support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610910978.0A CN106328799A (en) | 2016-10-19 | 2016-10-19 | Deep-ultraviolet LED (light-emitting diode) package support |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106328799A true CN106328799A (en) | 2017-01-11 |
Family
ID=57817967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610910978.0A Pending CN106328799A (en) | 2016-10-19 | 2016-10-19 | Deep-ultraviolet LED (light-emitting diode) package support |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106328799A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108231973A (en) * | 2017-12-08 | 2018-06-29 | 开发晶照明（厦门）有限公司 | Package support |
| CN110504347A (en) * | 2019-09-16 | 2019-11-26 | 北京中科优唯科技有限公司 | A kind of deep ultraviolet LED package support |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005317881A (en) * | 2004-04-30 | 2005-11-10 | Citizen Electronics Co Ltd | Light-emitting diode |
| KR20110065676A (en) * | 2009-12-10 | 2011-06-16 | 동우 화인켐 주식회사 | Light reflector and led device including the same |
-
2016
- 2016-10-19 CN CN201610910978.0A patent/CN106328799A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005317881A (en) * | 2004-04-30 | 2005-11-10 | Citizen Electronics Co Ltd | Light-emitting diode |
| KR20110065676A (en) * | 2009-12-10 | 2011-06-16 | 동우 화인켐 주식회사 | Light reflector and led device including the same |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108231973A (en) * | 2017-12-08 | 2018-06-29 | 开发晶照明（厦门）有限公司 | Package support |
| CN108231973B (en) * | 2017-12-08 | 2019-08-27 | 开发晶照明（厦门）有限公司 | Package support |
| CN110504347A (en) * | 2019-09-16 | 2019-11-26 | 北京中科优唯科技有限公司 | A kind of deep ultraviolet LED package support |
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