CN106322332A - Heat dissipating device for lighting system of curing machine - Google Patents
Heat dissipating device for lighting system of curing machine Download PDFInfo
- Publication number
- CN106322332A CN106322332A CN201610800532.2A CN201610800532A CN106322332A CN 106322332 A CN106322332 A CN 106322332A CN 201610800532 A CN201610800532 A CN 201610800532A CN 106322332 A CN106322332 A CN 106322332A
- Authority
- CN
- China
- Prior art keywords
- chip
- heat sink
- radiating fin
- heat dissipating
- cooling body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention provides a heat dissipating device for a lighting system of a curing machine. The heat dissipating device comprises a heat dissipating body. A chip containing cavity is formed in the heat dissipating body. The heat dissipating body is provided with two chip heat dissipating bodies which protrude outwards and are provided with through holes. Each chip heat dissipating body is close to the chip containing cavity. The heat dissipating device for the lighting system of the curing machine has the beneficial effects that the two chip heat dissipating bodies are arranged and fixedly installed on the heat dissipating body, the two chip heat dissipating bodies are identical in structure, the distance between the two chip heat dissipating bodies is equal to the thickness of each chip heat dissipating body, and the surfaces of the corresponding faces of the two chip heat dissipating bodies are each provided with a protective layer; and tests prove that the design guarantees the heat dissipating effect.
Description
Technical field
The invention belongs to curing illumination system heat abstractor field, especially relate to a kind of for solidifying as LED
The heat abstractor of the illumination apparatus of machine UV light source.
Background technology
The advantages such as LED has that volume is little, all solid state, life-span length, environmental protection and power saving, therefore have been widely used for each big neck
Territory.LED curing uses the ultraviolet with LED as light source to irradiate the UV resins such as ink, coating and sticker, makes UV resin rapid
Solidification, is commonly used to the industrial circles such as printing, spraying and electronics.Illumination apparatus is the critical electronic unit device in LED curing
Part, its performance directly affects the working effect of LED curing.In prior art, imitate owing to the illumination apparatus of LED curing dispels the heat
The most undesirable, cause chip temperature to raise, so that the decrease in efficiency of fluorescent material, chip light emitting efficiency reduce.If LED
Curing is chronically at duty, and illumination apparatus can make, because by heat ageing, stability and irradiation uniformity that ultraviolet export
Being deteriorated, its life-span also can shorten.
Summary of the invention
The problem to be solved in the present invention is to provide a kind of curing illumination system heat abstractor, is especially suitable for strengthening
The radiating effect of the illumination apparatus of LED curing.
For solving above-mentioned technical problem, the technical solution used in the present invention is: a kind of curing illumination system heat radiation dress
Putting, including heat sink body, be provided with chip and accommodate chamber inside described heat sink body, described heat sink body is provided with evagination and with logical
The chip cooling body in hole, described chip cooling body closes on described chip and accommodates chamber.Chip cooling body arranges two, is fixedly mounted on
On heat sink body, two chip cooling body structures are identical.Between distance identical with chip cooling body thickness, obverse surface
It is provided with one layer of overcoat.
Described curing illumination system heat abstractor also includes radiating fin part, described radiating fin part and described chip
Radiator connects, and internal and described radiating fin part the inside of described heat sink body is provided with the power line communicated and accommodates chamber, described
Power line accommodates chamber and communicates with described chip receiving chamber.
Described radiating fin part is provided with side by side and the radiating fin of spaced setting.
Described radiating fin is the disk being set in described radiating fin part, and is each perpendicular to described radiating fin part
Central shaft.
Described chip cooling body is the cylinder being set on described heat sink body, and described chip cooling body is provided with some
Cylindrical hole.
The central shaft of each described cylindrical hole is all parallel with the central shaft of described heat sink body.
The cincture around described heat sink body of each described cylindrical hole is arranged.
By being connected sheet connection between described chip cooling body and heat sink body.
The present invention has the advantage that with good effect: technique scheme is by the illumination apparatus to LED curing
Effectively heat radiation, extends its service life, also enhances the stability of ultraviolet output simultaneously, improves the uniformity of irradiation.Have
Simple in construction, processing cost is low and the advantage such as good heat dissipation effect.In addition, chip cooling body arranges two, is fixedly mounted on
On heat sink body, two chip cooling body structures are identical.Between distance identical with chip cooling body thickness, obverse surface
It is provided with one layer of overcoat.Tests prove that, above-mentioned design, it is ensured that radiating effect.
Accompanying drawing explanation
Fig. 1 is that the present invention is equipped with the structural representation after illumination apparatus and power line.
In figure: 1, heat sink body, 2, chip cooling body, 3, power line, 4, radiating fin part, 5, radiating fin, 6, cylinder
Shape through hole.
Detailed description of the invention
As it is shown in figure 1, the present invention provides a kind of curing illumination system heat abstractor, including heat sink body 1, heat radiation is main
The internal chip that is provided with of body 1 accommodates chamber, and heat sink body 1 is provided with evagination and the chip cooling body with through hole, and chip cooling body 2 faces
Nearly chip accommodates chamber.Chip cooling body is flexibly connected with heat sink body, and described chip cooling body is cylindrical structural, and it is upper and lower
Area is the twice of heat sink body floor space, height is heat sink body the 1/2 of described chip cooling body；Described chip dissipates
The material of hot body is consistent with heat sink body.
Chip cooling body 2 is the cylinder being set on heat sink body 1, and chip cooling body 2 is provided with some cylinders and leads to
Hole 6.The central shaft of each cylindrical hole 6 is all parallel with the central shaft of heat sink body 1.Each cylindrical hole 6 is main in heat radiation
Body 1 surrounding is around arranging.
Curing illumination system heat abstractor also includes radiating fin part 4, radiating fin part 4 and chip cooling body 2 phase
Connecing, internal and radiating fin part 4 the inside of heat sink body 1 is provided with the power line communicated and accommodates chamber, and power line accommodates chamber and chip
Accommodate chamber to communicate.
Radiating fin part 4 is provided with side by side and the radiating fin 5 of spaced setting.
Radiating fin 5 is the disk being set in radiating fin part 4, and is each perpendicular to the central shaft of radiating fin part 4.
Chip accommodates chamber and allows that illumination apparatus loads, and power line accommodates chamber and allows that power line 3 loads, and power line accommodates chamber
Central shaft overlaps with the central shaft of radiating fin part 4.
The diameter of chip cooling body 2 is more than the diameter of radiating fin 5, and the thickness of chip cooling body 2 is more than radiating fin 5
Thickness.
The work process of this example: illumination apparatus is arranged on chip and accommodates in chamber, and power line 3 is arranged on power line and accommodates chamber
In, illumination apparatus is electrical connected with power line 3, and illumination apparatus produces heat in the course of the work, by being positioned at by illumination apparatus
Major part heat is dispersed by the chip cooling body 2 on limit, and is dispersed by remaining heat by radiating fin part 4.Chip cooling body 2
Area of dissipation big, and the air flow amount in each cylindrical hole 6 is big, thus is favorably improved radiating efficiency.
Above one embodiment of the present of invention is described in detail, but described content has been only the preferable enforcement of the present invention
Example, it is impossible to be considered the practical range for limiting the present invention.All impartial changes made according to the present patent application scope and improvement
Deng, within all should still belonging to the patent covering scope of the present invention.
The present invention has the advantage that with good effect: chip cooling body arranges two, is fixedly mounted on heat sink body,
Two chip cooling body structures are identical.Between distance identical with chip cooling body thickness, obverse surface configuration has one layer
Overcoat.Tests prove that, above-mentioned design, it is ensured that radiating effect.
Claims (8)
1. a curing illumination system heat abstractor, including heat sink body (1), described heat sink body (1) is internal is provided with core
Sheet accommodates chamber, and it is helicitic texture that described chip accommodates intracavity portion, and described heat sink body is provided with evagination and the core with through hole
Sheet radiator (2), described chip cooling body (2) is closed on described chip and is accommodated chamber, the profile in corresponding chip receiving intracavity portion；
It is characterized in that, described chip cooling body (2) arranges two, is fixedly mounted on heat sink body, two chip coolings
Body (2) structure is identical.
2. the distance between is identical with chip cooling body (2) thickness, and obverse surface configuration has one layer of overcoat.
A kind of curing illumination system heat abstractor the most according to claim 1, it is characterised in that: described chip dissipates
Hot body (2) is flexibly connected with heat sink body (1), and described chip cooling body (2) is cylindrical structural, and its upper and lower area is heat radiation
The twice of main body (1) floor space, height is heat sink body (1) the 1/2 of described chip cooling body (2)；Described chip dissipates
The material of hot body (2) is consistent with heat sink body (1).
A kind of curing illumination system heat abstractor the most according to claim 1, it is characterised in that: described for solidifying
The radiator structure of machine illumination apparatus (7) also includes radiating fin part (4), described radiating fin part (4) and described chip cooling body
(2) connecting, internal and described radiating fin part (4) the inside of described heat sink body (2) is provided with the power line (3) communicated and accommodates
Chamber, described power line accommodates chamber and communicates with described chip receiving chamber.
A kind of curing illumination system heat abstractor the most according to claim 2, it is characterised in that: described radiating fin portion
(4) are divided to be provided with side by side and the radiating fin (5) of spaced setting.
A kind of curing illumination system heat abstractor the most according to claim 3, it is characterised in that: described radiating fin
(5) it is and is set in the disk of described radiating fin part (4), and be each perpendicular to the central shaft of described radiating fin part (4).
7. according to the curing illumination system heat abstractor described in any one in claim 1-4, it is characterised in that: described
Chip cooling body (2) is for be set in the cylinder on described heat sink body, and described chip cooling body (2) is provided with some cylinders
Through hole (6).
8. function heating plate, it is characterised in that described high temp glass plate is Pyrex plate, the thickness of described Pyrex plate is
3mm。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610800532.2A CN106322332A (en) | 2016-09-04 | 2016-09-04 | Heat dissipating device for lighting system of curing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610800532.2A CN106322332A (en) | 2016-09-04 | 2016-09-04 | Heat dissipating device for lighting system of curing machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106322332A true CN106322332A (en) | 2017-01-11 |
Family
ID=57786413
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610800532.2A Pending CN106322332A (en) | 2016-09-04 | 2016-09-04 | Heat dissipating device for lighting system of curing machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106322332A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2791649Y (en) * | 2005-05-10 | 2006-06-28 | 葛跃春 | Double-sealing type metering screen of electric energy metering element |
| CN101368713A (en) * | 2007-08-17 | 2009-02-18 | 富准精密工业(深圳)有限公司 | Heat radiator |
| CN202452450U (en) * | 2012-02-14 | 2012-09-26 | 江苏固立得精密光电有限公司 | Radiating module of ultraviolet light curing forming machine |
| CN202469997U (en) * | 2011-12-30 | 2012-10-03 | 深圳市能佳自动化设备有限公司 | Water-cooling LED (Light-Emitting Diode) point light source curing machine |
| CN203131762U (en) * | 2013-01-05 | 2013-08-14 | 多普（天津）科技发展有限公司 | Light-emitting diode (LED) chip radiation device |
| CN203917916U (en) * | 2014-06-16 | 2014-11-05 | 天津天建众旺科技有限公司 | 3D printer shaped platform |
| CN105526571A (en) * | 2015-12-01 | 2016-04-27 | 芜湖纯元光电设备技术有限公司 | Radiating structure for lighting device of curing machine |
-
2016
- 2016-09-04 CN CN201610800532.2A patent/CN106322332A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2791649Y (en) * | 2005-05-10 | 2006-06-28 | 葛跃春 | Double-sealing type metering screen of electric energy metering element |
| CN101368713A (en) * | 2007-08-17 | 2009-02-18 | 富准精密工业(深圳)有限公司 | Heat radiator |
| CN202469997U (en) * | 2011-12-30 | 2012-10-03 | 深圳市能佳自动化设备有限公司 | Water-cooling LED (Light-Emitting Diode) point light source curing machine |
| CN202452450U (en) * | 2012-02-14 | 2012-09-26 | 江苏固立得精密光电有限公司 | Radiating module of ultraviolet light curing forming machine |
| CN203131762U (en) * | 2013-01-05 | 2013-08-14 | 多普（天津）科技发展有限公司 | Light-emitting diode (LED) chip radiation device |
| CN203917916U (en) * | 2014-06-16 | 2014-11-05 | 天津天建众旺科技有限公司 | 3D printer shaped platform |
| CN105526571A (en) * | 2015-12-01 | 2016-04-27 | 芜湖纯元光电设备技术有限公司 | Radiating structure for lighting device of curing machine |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN205806980U (en) | A kind of LED corn lamp | |
| CN109027958A (en) | A kind of radiator for matrix LED car light | |
| CN103791439B (en) | Novel LED lighting device | |
| CN202984040U (en) | High-power LED (light-emitting diode) light source curing machine | |
| CN106322332A (en) | Heat dissipating device for lighting system of curing machine | |
| CN105240774A (en) | LED vehicle lamp | |
| CN108548156A (en) | Novel lightweight LED car lamp cooling system | |
| CN203131762U (en) | Light-emitting diode (LED) chip radiation device | |
| CN206545875U (en) | LED car lamp | |
| CN105526571A (en) | Radiating structure for lighting device of curing machine | |
| CN206112563U (en) | Super rocket big gun LED lamp convenient to installation | |
| CN107740938A (en) | Lighting device | |
| CN104728643B (en) | A kind of internal and external pressure balance structure of liquid LED light and liquid LED light | |
| CN104006317A (en) | LED lamp shade and LED lighting device | |
| CN108019627A (en) | A kind of high-powered LED lamp of high heat dispersion | |
| CN203348989U (en) | Light source | |
| CN112032613A (en) | Tunnel lamp capable of dissipating heat quickly and design method thereof | |
| CN205278937U (en) | Heat abstractor , head -light and car light of car light | |
| CN202327687U (en) | LED bulb | |
| CN205118885U (en) | LED (Light emitting diode) automobile lamp | |
| CN205919215U (en) | Car light heat radiation structure of bionical optimization | |
| CN104251388A (en) | Light source | |
| CN108036286A (en) | Radiator | |
| CN205640256U (en) | Reinforcing life's LED lamp | |
| CN205979200U (en) | Two -way illumination lamps and lanterns |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170111 |
|
| WD01 | Invention patent application deemed withdrawn after publication |