CN106317778A - LED package material and preparation method thereof - Google Patents
LED package material and preparation method thereof Download PDFInfo
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- CN106317778A CN106317778A CN201610682021.5A CN201610682021A CN106317778A CN 106317778 A CN106317778 A CN 106317778A CN 201610682021 A CN201610682021 A CN 201610682021A CN 106317778 A CN106317778 A CN 106317778A
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- silicone oil
- epoxy resin
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Abstract
The invention discloses an LED package material and a preparation method thereof. The LED package material is prepared from, by mass, 20-25 parts of bisphenol-A epoxy resin, 13-14 parts of hydantoin epoxy resin, 5-8 parts of chlorophenyl silicone oil, 3-6 parts of methyl-ethyloxy silicone oil, 3-6 parts of curing agent, namely diethylaminopropylamine, 5-6 parts of dimethyl siloxane, 0.3-0.5 part of magnesium isooctanoate, 0.2-0.3 part of silicon nitride, 0.5-0.8 part of magnesium sulfate, 0.2-0.3 part of nanometer magnesia, 0.2-0.3 part of chromium sesquioxide, 0.5-0.8 part of barium hydroxide, 0.5-0.8 part of sodium hydroxide, 0.2-0.3 part of potassium hydroxide, 0.5-0.8 part of aluminium hydroxide, 0.1-0.2 part of copper chloride, 15-18 parts of kaolin, 0.1-0.2 part of zinc oxide, 0.1-0.2 part of calcium carbonate and 0.1-0.2 part of zinc borate. The preparation process of the LED package material includes the steps of mixing, dissolving, degassing, curing and preparing of the LED package material. The prepared LED package material has high refractive index, hardness and bonding strength and can be applied as the light-emitting diode package material in light-emitting diodes.
Description
Technical field
The present invention relates to LED lamp Material Field, be specifically related to a kind of LED encapsulation material and preparation method thereof.
Background technology
LED i.e. semiconductor light-emitting-diode, LED electricity-saving lamp is to use high brightness white light-emitting diode luminous source, light efficiency height,
Little power consumption, life-span length, easy to control, non-maintaining, safety and environmental protection；It is a new generation's solid cold light source, photochromic soft, gorgeous, abundant many
Coloured silk, low-loss, low energy consumption, environmental protection.
LED is made up of chip, metal wire, conducting resinl, encapsulating material etc..Wherein encapsulating material play the sealing to chip,
Protective effect, prevents chip from being disturbed by external environment.Encapsulating material needs to possess higher sealing, light transmission, bonding
Property and mechanical performance.
Improve LED encapsulation material refractive index and be effectively reduced the photon loss that refractive index physical barriers brings, improve light quantity
Sub-efficiency, the refractive index of encapsulating material is an important indicator, the highest more good.Prior art improves refractive index and can use to encapsulation
Introducing element sulphur in material, introducing form mostly is thioether bond, thioester key etc., with epithio form, element sulphur introduces polymer list
Body, and carry out being polymerized with epithio group for reactive group, it is a kind of newer method.
Summary of the invention
Offer one LED encapsulation material of present invention innovation and preparation method thereof.
The technical solution adopted in the present invention is:
A kind of LED encapsulation material, includes following raw material according to mass fraction meter: bisphenol A type epoxy resin 20-25 part, sea
Because of epoxy resin 13-14 part, chlorphenyl silicone oil 5-8 part, MethylethoxylsiliconFluid Fluid 3-6 part, firming agent diethylaminopropylamine 3-6
Part, dimethyl siloxane 5-6 part, isooctyl acid magnesium 0.3-0.5 part, silicon nitride 0.2-0.3 part, magnesium sulfate 0.5-0.8 part, nano oxygen
Change magnesium 0.2-0.3 part, chromic oxide 0.2-0.3 part, barium hydroxide 0.5-0.8 part, sodium hydroxide 0.5-0.8 part, hydroxide
Potassium 0.2-0.3 part, aluminium hydroxide 0.5-0.8 part, copper chloride 0.1-0.2 part, Kaolin 15-18 part, zinc oxide 0.1-0.2 part,
Calcium carbonate 0.1-0.2 part, Firebrake ZB 0.1-0.2 part.
As preferably, described a kind of LED encapsulation material, include following raw material according to mass fraction meter: bisphenol type epoxy
Resin 22 parts, glycolylurea epoxide resin 13 parts, chlorphenyl silicone oil 6 parts, MethylethoxylsiliconFluid Fluid 5 parts, firming agent diethylaminopropylamine 4
Part, dimethyl siloxane 5 parts, 0.4 part of isooctyl acid magnesium, silicon nitride 0.2 part, 0.7 part of magnesium sulfate, nano magnesia 0.2 part, three oxygen
Change two chromium 0.2 part, barium hydroxide 0.6 part, sodium hydroxide 0.6 part, potassium hydroxide 0.2 part, aluminium hydroxide 0.6 part, copper chloride 0.2
Part, Kaolin 16 parts, zinc oxide 0.1 part, calcium carbonate 0.1 part, Firebrake ZB 0.1 part.
Described encapsulating material preparation method comprises the following steps:
(1) bisphenol A type epoxy resin 20-25 part, glycolylurea epoxide resin 13-14 part, chlorphenyl silicone oil 5-8 are taken by weight
Part, MethylethoxylsiliconFluid Fluid 3-6 part, by bisphenol A type epoxy resin, glycolylurea epoxide resin, chlorphenyl silicone oil, methyl ethoxy silicon
Dissolve after four kinds of composition heating of oil, stir to mix homogeneously after dissolving；
(2) firming agent diethylaminopropylamine 3-6 part, dimethyl siloxane 5-6 part, isooctyl acid magnesium 3-5 part are added again, stirring
Uniformly obtain organic solute A；
(3) respectively by silicon nitride, magnesium sulfate, nano magnesia, chromic oxide, barium hydroxide, sodium hydroxide, hydroxide
Potassium, aluminium hydroxide, copper chloride, Kaolin, zinc oxide, calcium carbonate, Firebrake ZB carry out mechanical activation comminution, are crushed into inorganic powder B；
Open the mixing of the organic solute A after inorganic powder B and step 2 are solidified by pyroreaction still, stir；
(4) step 3 mixture carrying out in vacuum defoamation machine deaeration, inclined heated plate is 3h；
(5) feeding the mixture in mould and solidify, solidification temperature is 140 DEG C～150 DEG C, is cooled to room after solidification
Temperature, prepares LED encapsulation material.
The invention have the benefit that the preparation process of LED encapsulation material of the present invention include mixing, dissolve, deaerate, solid
Change, prepare LED encapsulation material.The LED encapsulation of preparation has higher refractive index, hardness and adhesion strength, can be as sending out
Light diode encapsulating material is applied in light emitting diode.
Detailed description of the invention
For the ease of the understanding of present invention, below in conjunction with embodiment, the invention will be further described, real below
Execute example and be only a part of embodiment of the present invention.
Embodiment 1
A kind of LED encapsulation material, preparation method comprises the following steps:
(1) take respectively according to weight: bisphenol A type epoxy resin 2000g, glycolylurea epoxide resin 1300g, chlorphenyl silicone oil
500g, MethylethoxylsiliconFluid Fluid 300g, firming agent diethylaminopropylamine 300g, dimethyl siloxane 500g, isooctyl acid magnesium 30g,
Silicon nitride 20g, magnesium sulfate 50g, nano magnesia 20g, chromic oxide 20g, barium hydroxide 50g, sodium hydroxide 50g, hydrogen-oxygen
Change potassium 20g, aluminium hydroxide 50g, copper chloride 10g, Kaolin 1500g, zinc oxide 10g, calcium carbonate 10g, Firebrake ZB 10g.
(2) bisphenol A type epoxy resin, glycolylurea epoxide resin, chlorphenyl silicone oil, MethylethoxylsiliconFluid Fluid are taken by weight, will
Dissolve after bisphenol A type epoxy resin, glycolylurea epoxide resin, chlorphenyl silicone oil, four kinds of composition heating of MethylethoxylsiliconFluid Fluid, dissolve
Rear stirring is to mix homogeneously；
(3) add firming agent diethylaminopropylamine, dimethyl siloxane, isooctyl acid magnesium again, be uniformly mixing to obtain organic molten
Solve thing A；
(4) respectively by silicon nitride, magnesium sulfate, nano magnesia, chromic oxide, barium hydroxide, sodium hydroxide, hydroxide
Potassium, aluminium hydroxide, copper chloride, Kaolin, zinc oxide, calcium carbonate, Firebrake ZB carry out mechanical activation comminution, are crushed into inorganic powder B；
Open the mixing of the organic solute A after inorganic powder B and step 2 are solidified by pyroreaction still, stir；
(5) step 3 mixture carrying out in vacuum defoamation machine deaeration, inclined heated plate is 3h；
(6) feeding the mixture in mould and solidify, solidification temperature is 140 DEG C～150 DEG C, is cooled to room after solidification
Temperature, prepares LED encapsulation material.
Embodiment 2
A kind of LED encapsulation material, preparation method comprises the following steps:
(1) take respectively according to weight: bisphenol A type epoxy resin 2500g, glycolylurea epoxide resin 1400g, chlorphenyl silicone oil
800g, MethylethoxylsiliconFluid Fluid 600g, firming agent diethylaminopropylamine 600g, dimethyl siloxane 600g, isooctyl acid magnesium 50g,
Silicon nitride 30g, magnesium sulfate 80g, nano magnesia 30g, chromic oxide 30g, barium hydroxide 80g, sodium hydroxide 80g, hydrogen-oxygen
Change potassium 30g, aluminium hydroxide 80g, copper chloride 20g, Kaolin 1800g, zinc oxide 20g, calcium carbonate 20g, Firebrake ZB 20g.
(2) bisphenol A type epoxy resin, glycolylurea epoxide resin, chlorphenyl silicone oil, MethylethoxylsiliconFluid Fluid are taken by weight, will
Dissolve after bisphenol A type epoxy resin, glycolylurea epoxide resin, chlorphenyl silicone oil, four kinds of composition heating of MethylethoxylsiliconFluid Fluid, dissolve
Rear stirring is to mix homogeneously；
(3) add firming agent diethylaminopropylamine, dimethyl siloxane, isooctyl acid magnesium again, be uniformly mixing to obtain organic molten
Solve thing A；
(4) respectively by silicon nitride, magnesium sulfate, nano magnesia, chromic oxide, barium hydroxide, sodium hydroxide, hydroxide
Potassium, aluminium hydroxide, copper chloride, Kaolin, zinc oxide, calcium carbonate, Firebrake ZB carry out mechanical activation comminution, are crushed into inorganic powder B；
Open the mixing of the organic solute A after inorganic powder B and step 2 are solidified by pyroreaction still, stir；
(5) step 3 mixture carrying out in vacuum defoamation machine deaeration, inclined heated plate is 3h；
(6) feeding the mixture in mould and solidify, solidification temperature is 140 DEG C～150 DEG C, is cooled to room after solidification
Temperature, prepares LED encapsulation material.
Embodiment 3
A kind of LED encapsulation material, preparation method comprises the following steps:
(1) take respectively according to weight: bisphenol A type epoxy resin 2200g, glycolylurea epoxide resin 1300g, chlorphenyl silicone oil
600g, MethylethoxylsiliconFluid Fluid 500g, firming agent diethylaminopropylamine 400g, dimethyl siloxane 500g, isooctyl acid magnesium 40g,
Silicon nitride 20g, magnesium sulfate 70g, nano magnesia 20g, chromic oxide 20g, barium hydroxide 60g, sodium hydroxide 60g, hydrogen-oxygen
Change potassium 20g, aluminium hydroxide 60g, copper chloride 20g, Kaolin 1600g, zinc oxide 10g, calcium carbonate 10g, Firebrake ZB 10g；
(2) bisphenol A type epoxy resin, glycolylurea epoxide resin, chlorphenyl silicone oil, MethylethoxylsiliconFluid Fluid are taken by weight, will
Dissolve after bisphenol A type epoxy resin, glycolylurea epoxide resin, chlorphenyl silicone oil, four kinds of composition heating of MethylethoxylsiliconFluid Fluid, dissolve
Rear stirring is to mix homogeneously；
(3) add firming agent diethylaminopropylamine, dimethyl siloxane, isooctyl acid magnesium again, be uniformly mixing to obtain organic molten
Solve thing A；
(4) respectively by silicon nitride, magnesium sulfate, nano magnesia, chromic oxide, barium hydroxide, sodium hydroxide, hydroxide
Potassium, aluminium hydroxide, copper chloride, Kaolin, zinc oxide, calcium carbonate, Firebrake ZB carry out mechanical activation comminution, are crushed into inorganic powder B；
Open the mixing of the organic solute A after inorganic powder B and step 2 are solidified by pyroreaction still, stir；
(5) step 3 mixture carrying out in vacuum defoamation machine deaeration, inclined heated plate is 3h；
(6) feeding the mixture in mould and solidify, solidification temperature is 140 DEG C～150 DEG C, is cooled to room after solidification
Temperature, prepares LED encapsulation material.
Above content is only citing made for the present invention and explanation, and affiliated those skilled in the art are to being retouched
The specific embodiment stated makes various amendment or supplements or use similar mode to substitute, without departing from the design of invention
Or surmount scope defined in the claims, protection scope of the present invention all should be belonged to.
Claims (3)
1. a LED encapsulation material, it is characterised in that include following raw material according to mass fraction meter: bisphenol A type epoxy resin
20-25 part, glycolylurea epoxide resin 13-14 part, chlorphenyl silicone oil 5-8 part, MethylethoxylsiliconFluid Fluid 3-6 part, firming agent diethylamino
Base propylamine 3-6 part, dimethyl siloxane 5-6 part, isooctyl acid magnesium 0.3-0.5 part, silicon nitride 0.2-0.3 part, magnesium sulfate 0.5-0.8
Part, nano magnesia 0.2-0.3 part, chromic oxide 0.2-0.3 part, barium hydroxide 0.5-0.8 part, sodium hydroxide 0.5-0.8
Part, potassium hydroxide 0.2-0.3 part, aluminium hydroxide 0.5-0.8 part, copper chloride 0.1-0.2 part, Kaolin 15-18 part, zinc oxide
0.1-0.2 part, calcium carbonate 0.1-0.2 part, Firebrake ZB 0.1-0.2 part.
A kind of LED encapsulation material the most according to claim 1, it is characterised in that include the most former according to mass fraction meter
Material: bisphenol A type epoxy resin 22 parts, glycolylurea epoxide resin 13 parts, chlorphenyl silicone oil 6 parts, MethylethoxylsiliconFluid Fluid 5 parts, solidification
Agent diethylaminopropylamine 4 parts, dimethyl siloxane 5 parts, 0.4 part of isooctyl acid magnesium, silicon nitride 0.2 part, 0.7 part of magnesium sulfate, nanometer
Magnesium oxide 0.2 part, chromic oxide 0.2 part, barium hydroxide 0.6 part, sodium hydroxide 0.6 part, potassium hydroxide 0.2 part, hydroxide
0.6 part of aluminum, copper chloride 0.2 part, Kaolin 16 parts, zinc oxide 0.1 part, calcium carbonate 0.1 part, Firebrake ZB 0.1 part.
A kind of LED encapsulation material the most according to claim 1, it is characterised in that described encapsulating material preparation method includes
Following steps:
(1) take by weight bisphenol A type epoxy resin 20-25 part, glycolylurea epoxide resin 13-14 part, chlorphenyl silicone oil 5-8 part,
MethylethoxylsiliconFluid Fluid 3-6 part, by bisphenol A type epoxy resin, glycolylurea epoxide resin, chlorphenyl silicone oil, MethylethoxylsiliconFluid Fluid
Dissolve after four kinds of composition heating, stir to mix homogeneously after dissolving；
(2) add firming agent diethylaminopropylamine 3-6 part, dimethyl siloxane 5-6 part, isooctyl acid magnesium 3-5 part again, stir
Obtain organic solute A；
(3) respectively by silicon nitride, magnesium sulfate, nano magnesia, chromic oxide, barium hydroxide, sodium hydroxide, potassium hydroxide,
Aluminium hydroxide, copper chloride, Kaolin, zinc oxide, calcium carbonate, Firebrake ZB carry out mechanical activation comminution, are crushed into inorganic powder B；Beat
Open the mixing of the organic solute A after inorganic powder B and step 2 are solidified by pyroreaction still, stir；
(4) step 3 mixture carrying out in vacuum defoamation machine deaeration, inclined heated plate is 3h；
(5) feeding the mixture in mould and solidify, solidification temperature is 140 DEG C～150 DEG C, is cooled to room temperature after solidification,
Prepare LED encapsulation material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610682021.5A CN106317778A (en) | 2016-08-17 | 2016-08-17 | LED package material and preparation method thereof |
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| CN201610682021.5A CN106317778A (en) | 2016-08-17 | 2016-08-17 | LED package material and preparation method thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107722530A (en) * | 2017-08-29 | 2018-02-23 | 陈瑞琼 | LED lamp tube sheathing material |
| CN107936896A (en) * | 2017-12-07 | 2018-04-20 | 安徽新欧电子科技有限公司 | A kind of LED light source thin plate encapsulating material and preparation method thereof |
| CN108410406A (en) * | 2018-03-12 | 2018-08-17 | 常州五荣化工有限公司 | A kind of preparation method of modified epoxy casting glue |
| CN117106286A (en) * | 2023-10-19 | 2023-11-24 | 聚灿光电科技（宿迁）有限公司 | LED composite packaging material and preparation method thereof |
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| CN104004325A (en) * | 2014-06-12 | 2014-08-27 | 苏州经贸职业技术学院 | LED packaging material and preparation method thereof |
| CN104292755A (en) * | 2014-10-16 | 2015-01-21 | 苏州思莱特电子科技有限公司 | High-molecule LED (Light-Emitting Diode) packaging material and preparation method thereof |
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| CN102618195A (en) * | 2012-01-21 | 2012-08-01 | 金安国纪科技股份有限公司 | Light shading adhesive, laminated plate, preparation method of light shading adhesive, and application of light shading adhesive |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107722530A (en) * | 2017-08-29 | 2018-02-23 | 陈瑞琼 | LED lamp tube sheathing material |
| CN107936896A (en) * | 2017-12-07 | 2018-04-20 | 安徽新欧电子科技有限公司 | A kind of LED light source thin plate encapsulating material and preparation method thereof |
| CN108410406A (en) * | 2018-03-12 | 2018-08-17 | 常州五荣化工有限公司 | A kind of preparation method of modified epoxy casting glue |
| CN117106286A (en) * | 2023-10-19 | 2023-11-24 | 聚灿光电科技（宿迁）有限公司 | LED composite packaging material and preparation method thereof |
| CN117106286B (en) * | 2023-10-19 | 2024-03-22 | 聚灿光电科技（宿迁）有限公司 | LED composite packaging material and preparation method thereof |
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