CN106313433A - Guiding balance device for multi-injection head packaging mold - Google Patents
Guiding balance device for multi-injection head packaging mold Download PDFInfo
- Publication number
- CN106313433A CN106313433A CN201610976765.8A CN201610976765A CN106313433A CN 106313433 A CN106313433 A CN 106313433A CN 201610976765 A CN201610976765 A CN 201610976765A CN 106313433 A CN106313433 A CN 106313433A
- Authority
- CN
- China
- Prior art keywords
- balance
- cylinder
- pin bushing
- guide pin
- self
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002347 injection Methods 0.000 title claims abstract description 25
- 239000007924 injection Substances 0.000 title claims abstract description 25
- 238000004806 packaging method and process Methods 0.000 title abstract 2
- 239000000428 dust Substances 0.000 claims abstract description 7
- 238000010276 construction Methods 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- 229910002804 graphite Inorganic materials 0.000 claims description 6
- 239000010439 graphite Substances 0.000 claims description 6
- NIFIFKQPDTWWGU-UHFFFAOYSA-N pyrite Chemical compound [Fe+2].[S-][S-] NIFIFKQPDTWWGU-UHFFFAOYSA-N 0.000 claims description 6
- 229910052683 pyrite Inorganic materials 0.000 claims description 6
- 239000011028 pyrite Substances 0.000 claims description 6
- 230000003442 weekly effect Effects 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 abstract description 4
- 229920000647 polyepoxide Polymers 0.000 abstract description 4
- 239000002775 capsule Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229920002449 FKM Polymers 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The invention discloses a guiding balance device for a multi-injection head packaging mold. The guiding balance device comprises a balancing guide pillar which is arranged on an injection push plate, wherein a balancing guide sleeve is arranged on the balancing guide pillar in a sliding form; an anti-dust ring is arranged at the upper end of the balancing guide sleeve; and a self-lubricating bearing is arranged between the balancing guide pillar and the balancing guide sleeve. The guiding balance device is novel in structure design; when the guiding balance device is applied to the lower frame base plate on the injection push plate, the working stability of the injection push plate can be excellently guaranteed; and the flow speeds of the epoxy resin in different charging barrels are identical to each other and the curing time is identical, so that the product quality is increased.
Description
Technical field:
The present invention relates to semiconductor packages processing, particularly relate to a kind of guiding balance device being suitable for multi-gate pole encapsulating mould.
Background technology:
At present semiconductor packages aspect the most at home, it is contemplated that production capacity, the many factors such as cost, more than 80% semiconductor packages factory
Family is all carrying out the encapsulation of IC components and parts with multi-gate pole encapsulating mould, wherein according to the profile of IC product, lead frame
The aspects such as size, encapsulating mould is divided into the different structures such as four groups of diaphragm capsules, six groups of diaphragm capsules, eight groups of diaphragm capsules, but whether use several groups
The structure of diaphragm capsule, its mould is required for relying on injection push pedal to promote injection head to complete epoxy the most slowly injection when
The injection moulding process of resin, and the quantity of diaphragm capsule is the most, the quantity of injection head is the most, and the overall dimensions of injection push pedal is more
Greatly.
The most maximum injection push pedal overall dimensions can reach about 1100mmX950mmX75mm, if in injection
Time, injection push pedal is unstable, unstable, and the flow velocity that may result in epoxy resin in different barrel is different, and hardening time is not
With, and then have influence on the quality of product, need to arrange multiple bascule on lower mold holder backing plate in injection push pedal for this.
Summary of the invention:
In order to make up the deficiency of prior art problem, it is an object of the invention to provide leading of a kind of applicable multi-gate pole encapsulating mould
To bascule, novel in structural design, use in injection push pedal on lower mold holder backing plate, can well ensure to inject push pedal work
The stationarity made so that the flow velocity of the epoxy resin in different barrels is identical same, and hardening time is identical, improves the product of product
Matter.
Technical scheme is as follows:
It is suitable for the guiding balance device of multi-gate pole encapsulating mould, it is characterised in that include the balance being installed in injection push pedal
Guide pillar, balance guide pillar is slidably fitted with balance guide pin bushing, and balance guide pin bushing upper end is provided with dust ring, balance guide pillar and balance guide pin bushing it
Between be provided with self-lubricating bearing.
The described guiding balance device being suitable for multi-gate pole encapsulating mould, it is characterised in that described balance guide pillar bag
Include the cap head of cylinder and end thereof, cylinder include with the balance guide section that is slidably matched of guide pin bushing and with injection push pedal interference fits
Construction section is constituted, and described cap head is positioned at construction section afterbody, cap head is provided with several spaced apart along construction section periphery
Fixing hole.
The described guiding balance device being suitable for multi-gate pole encapsulating mould, it is characterised in that described balance guide pin bushing is same
Heart circle hollow cylinder, goes up hollow cylinder, hollow core cylinder, lower hollow cylinder, three sections of hollow cylinder bore inner diameter phases from top to bottom
With, wherein going up hollow Cylinder inner bore upper end and be provided with dust ring mounting groove, hollow core cylindrical outer wall is provided with along running through
To the self-lubricating bearing locking hole of endoporus, lower hollow cylinder and hollow core cylinder junction outer wall are provided with adpting flange, even
Matching in hole, acting flange and lower mold backing plate location, adpting flange outer wall is provided with spaced breach, connecting hole, breach with
Connecting hole quantity is four, and breach matches with backing plate upper support column outer wall, and connecting hole matches with hole, lower mold backing plate location
Close.
The described guiding balance device being suitable for multi-gate pole encapsulating mould, it is characterised in that described self-lubricating bearing
Interference fit is installed in balance guide pin bushing endoporus, and self-lubricating bearing is pyrite and graphite assembly, and self-lubricating bearing is that pyrite adds
The cylinder that work becomes, cylinder inboard wall is interval with cannelure, is provided with graphite circle in cannelure.
The invention have the advantage that
Present configuration is novel in design, uses in injection push pedal on lower mold holder backing plate, can well ensure to inject push pedal work
The stationarity made so that the flow velocity of the epoxy resin in different barrels is identical same, and hardening time is identical, improves the product of product
Matter.
Accompanying drawing illustrates:
Fig. 1 is the structural representation of the present invention.
Fig. 2 is the structural representation that the present invention balances guide pillar.
Fig. 3 is the top view that the present invention balances guide pillar.
Fig. 4 is balance guide pin bushing and the self-lubricating bearing assembling unit structure schematic diagram of the present invention.
Fig. 5 is the balance guide pin bushing top view of the present invention.
Detailed description of the invention:
See accompanying drawing:
Being suitable for the guiding balance device of multi-gate pole encapsulating mould, including the balance guide pillar 1 being installed in injection push pedal, balance is led
Being slidably fitted with balance guide pin bushing 2 on post 1, balance guide pin bushing 2 upper end is provided with dust ring 3, it is possible to use viton seal ring plays
Dustproof effect, is provided with self-lubricating bearing 4 between balance guide pillar 1 and balance guide pin bushing 2.
Balance guide pillar 1 includes cap head 1-1 of cylinder and end thereof, and cylinder includes the guide section being slidably matched with balance guide pin bushing
1-2 and the construction section 1-3 with injection push pedal interference fits is constituted, and cap head 1-1 is positioned at construction section 1-3 afterbody, and cap head 1-1 is arranged
There are several fixing hole 1-4s spaced apart along construction section periphery.
Balance guide pin bushing 2 concentric circular hollow cylinder, goes up hollow cylinder 2-1, hollow core cylinder 2-2, lower open circles from top to bottom
Post 2-3, three sections of hollow cylinder bore inner diameter are identical, wherein go up hollow cylinder 2-1 endoporus upper end and are provided with dust ring mounting groove 2-
4, hollow core cylinder 2-2 outer wall is provided with along the self-lubricating bearing locking hole 2-5 carrying out being through to endoporus, lower hollow cylinder
2-3 and hollow core cylinder 2-2 junction outer wall are provided with adpting flange 2-6, adpting flange 2-6 and hole, lower mold backing plate location phase
Coordinating, adpting flange 2-6 outer wall is provided with spaced breach 2-7, connecting hole 2-8, breach 2-7 and connecting hole 2-8 quantity
Being four, breach 2-7 matches with backing plate upper support column outer wall, it is therefore an objective to dodge the support column on backing plate, connecting hole 2-8 with
Match in hole, lower mold backing plate location.
Self-lubricating axle 4 holds interference fit and is installed in balance guide pin bushing endoporus, by again bearing being knocked in after heating shell, from
Lubrication bearing 4 is pyrite and graphite assembly, and self-lubricating bearing is the cylinder 4-1 that pyrite is processed into, and cylinder 4-1 inwall interval sets
There is cannelure, in cannelure, be provided with graphite circle 4-2.
It is usually when the present invention uses and multiple uses in groups, injection push pedal installs four groups altogether, is separately mounted to close
The position at four angles, during injection push pedal work, balance guide pillar 1 moves up and down in balance guide pin bushing 2, and balance guide pillar 1 is led with balance
Set self-lubricating bearing 42 within contacts, and is always ensured that injection push pedal with lower mold backing plate center on one wire, and move time
Wait and ensure that the height at four angles keeps consistent substantially, with making injection push pedal move the most smoothly, use 300,000 moulds at mould
Secondary left and right, according to the degree of wear of bearing, can select to change brass bearing.
Claims (4)
1. the guiding balance device being suitable for multi-gate pole encapsulating mould, it is characterised in that include being installed in injection push pedal
Balance guide pillar, balance guide pillar is slidably fitted with balance guide pin bushing, balance guide pin bushing upper end is provided with dust ring, balance guide pillar and balance
Self-lubricating bearing it is provided with between guide pin bushing.
The guiding balance device being suitable for multi-gate pole encapsulating mould the most according to claim 1, it is characterised in that described
Balance guide pillar include the cap head of cylinder and end thereof, cylinder include the guide section being slidably matched with balance guide pin bushing and with inject push pedal
The construction section of interference fits is constituted, and described cap head is positioned at construction section afterbody, cap head is provided with several along outside construction section
The fixing hole of weekly interval distribution.
The guiding balance device being suitable for multi-gate pole encapsulating mould the most according to claim 1, it is characterised in that described
Balance guide pin bushing concentric circular hollow cylinder, goes up hollow cylinder, hollow core cylinder, lower hollow cylinder, three sections of hollow cylinders from top to bottom
Bore inner diameter is identical, wherein goes up hollow Cylinder inner bore upper end and is provided with dust ring mounting groove, and hollow core cylindrical outer wall is provided with edge
The self-lubricating bearing locking hole carrying out being through to endoporus, lower hollow cylinder and hollow core cylinder junction outer wall are provided with even
Acting flange, adpting flange matches with hole, lower mold backing plate location, and adpting flange outer wall is provided with spaced breach, connection
Hole, breach and connecting hole quantity are four, and breach matches with backing plate upper support column outer wall, and connecting hole is fixed with lower mold backing plate
Match in hole, position.
The guiding balance device being suitable for multi-gate pole encapsulating mould the most according to claim 1, it is characterised in that described
Self-lubricating bearing interference fit is installed in balance guide pin bushing endoporus, and self-lubricating bearing is pyrite and graphite assembly, self-lubricating axle
Holding the cylinder being processed into for pyrite, cylinder inboard wall is interval with cannelure, is provided with graphite circle in cannelure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610976765.8A CN106313433A (en) | 2016-11-08 | 2016-11-08 | Guiding balance device for multi-injection head packaging mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610976765.8A CN106313433A (en) | 2016-11-08 | 2016-11-08 | Guiding balance device for multi-injection head packaging mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106313433A true CN106313433A (en) | 2017-01-11 |
Family
ID=57816020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610976765.8A Pending CN106313433A (en) | 2016-11-08 | 2016-11-08 | Guiding balance device for multi-injection head packaging mold |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106313433A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2518216Y (en) * | 2001-12-13 | 2002-10-23 | 铜陵三佳模具股份有限公司 | Push pedal balancing mechanism of multi-injecting head plastic sealed mould |
| CN200974321Y (en) * | 2006-06-17 | 2007-11-14 | 铜陵三佳科技股份有限公司 | Multi-head injection circuit packaging mould for big material cakes |
| CN203765848U (en) * | 2014-03-21 | 2014-08-13 | 德科摩橡塑科技(东莞)有限公司 | Opening and closing mould structure of telescopic guide pillar |
| CN104002423A (en) * | 2014-05-16 | 2014-08-27 | 铜陵三佳山田科技有限公司 | Dust-proof injection mechanism for integrated circuit plastic packaging die |
| CN206140805U (en) * | 2016-11-08 | 2017-05-03 | 铜陵中锐电子科技有限公司 | Be suitable for direction balancing unit who injects first package mold more |
-
2016
- 2016-11-08 CN CN201610976765.8A patent/CN106313433A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2518216Y (en) * | 2001-12-13 | 2002-10-23 | 铜陵三佳模具股份有限公司 | Push pedal balancing mechanism of multi-injecting head plastic sealed mould |
| CN200974321Y (en) * | 2006-06-17 | 2007-11-14 | 铜陵三佳科技股份有限公司 | Multi-head injection circuit packaging mould for big material cakes |
| CN203765848U (en) * | 2014-03-21 | 2014-08-13 | 德科摩橡塑科技(东莞)有限公司 | Opening and closing mould structure of telescopic guide pillar |
| CN104002423A (en) * | 2014-05-16 | 2014-08-27 | 铜陵三佳山田科技有限公司 | Dust-proof injection mechanism for integrated circuit plastic packaging die |
| CN206140805U (en) * | 2016-11-08 | 2017-05-03 | 铜陵中锐电子科技有限公司 | Be suitable for direction balancing unit who injects first package mold more |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170111 |
|
| RJ01 | Rejection of invention patent application after publication |