CN106304826A - A kind of silica gel piece method for dismounting - Google Patents
A kind of silica gel piece method for dismounting Download PDFInfo
- Publication number
- CN106304826A CN106304826A CN201610719388.XA CN201610719388A CN106304826A CN 106304826 A CN106304826 A CN 106304826A CN 201610719388 A CN201610719388 A CN 201610719388A CN 106304826 A CN106304826 A CN 106304826A
- Authority
- CN
- China
- Prior art keywords
- silica gel
- gel piece
- electronic device
- lubricating oil
- dismounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Lubricants (AREA)
Abstract
The present invention relates to silica gel piece field, be specifically related to a kind of silica gel piece method for dismounting, comprise the steps: that silica gel piece is connected with electronic device；Between silica gel piece and electronic device, coat lubricating oil, uncover silica gel piece from silica gel piece and electronic device link position edge, gently make lubricating oil enter the position that silica gel piece separates with electronic device；Along with silica gel piece is gradually uncovered so that lubricating oil constantly enters the position that silica gel piece separates with electronic device；Remove the lubricating oil on electronic device surface, and the silica gel piece separated is added ethyl acetate, further take out silica gel piece and heating makes ethyl acetate evaporate；Remove the burr on silica gel piece surface.The present invention uses lubricating oil so that silica gel piece, when dismounting, does not stay defective material, and by removing flash removed, improves silica gel piece surface smoothness.
Description
Technical field
The present invention relates to silica gel piece field, be specifically related to a kind of silica gel piece method for dismounting.
Background technology
Silica gel sheet material, when dismounting, often leads to dismantle completely, meeting residual silicon film material, silica gel on the electronic devices
Sheet surface also out-of-flatness.
Summary of the invention
The present invention is directed to the deficiencies in the prior art, it is provided that one makes dismounting leave no trace, makes silica gel piece surface light
Sliding silica gel piece method for dismounting.
In order to realize foregoing invention purpose, the present invention by the following technical solutions: a kind of silica gel piece method for dismounting, including such as
Lower step:
(1) silica gel piece is connected with electronic device；
(2) between silica gel piece and electronic device, coat lubricating oil, uncover silicon from silica gel piece and electronic device link position edge
Film, gently makes lubricating oil enter the position that silica gel piece separates with electronic device；
(3) gradually uncover along with silica gel piece so that lubricating oil constantly enters the position that silica gel piece separates with electronic device；
(4) remove the lubricating oil on electronic device surface, and the silica gel piece separated is added ethyl acetate, further take out silica gel piece and add
Heat makes ethyl acetate evaporate；
(5) burr on silica gel piece surface is removed.
In step (4), heating-up temperature is 80 degrees Celsius.In step (3), silica gel piece opens certain area, after lubricating oil
Just it is full of the position that silica gel piece separates with electronic device；The area that silica gel piece is opened is the biggest, and the spreading area of lubricating oil is the biggest.This
Invention uses lubricating oil so that silica gel piece, when dismounting, does not stay defective material, and by removing flash removed, improves silica gel piece smooth surface
Property.
Detailed description of the invention
Below in conjunction with specific embodiment, the present invention is further described in detail.
A kind of silica gel piece method for dismounting, comprises the steps:
(1) silica gel piece is connected with electronic device；
(2) between silica gel piece and electronic device, coat lubricating oil, uncover silicon from silica gel piece and electronic device link position edge
Film, gently makes lubricating oil enter the position that silica gel piece separates with electronic device；
(3) gradually uncover along with silica gel piece so that lubricating oil constantly enters the position that silica gel piece separates with electronic device；
(4) remove the lubricating oil on electronic device surface, and the silica gel piece separated is added ethyl acetate, further take out silica gel piece and add
Heat makes ethyl acetate evaporate；
(5) burr on silica gel piece surface is removed.
In step (4), heating-up temperature is 80 degrees Celsius.In step (3), silica gel piece opens certain area, after lubricating oil
Just it is full of the position that silica gel piece separates with electronic device；The area that silica gel piece is opened is the biggest, and the spreading area of lubricating oil is the biggest.
It should be noted that the foregoing is only embodiments of the invention, not thereby limit the scope of the claims of the present invention,
Every equivalent structure utilizing description of the invention content to be done or equivalence flow process conversion, or directly or indirectly it is used in other phases
Close technical field, be the most in like manner included in the scope of patent protection of the present invention.
Claims (3)
1. a silica gel piece method for dismounting, comprises the steps:
(1) silica gel piece is connected with electronic device；
(2) between silica gel piece and electronic device, coat lubricating oil, uncover silicon from silica gel piece and electronic device link position edge
Film, gently makes lubricating oil enter the position that silica gel piece separates with electronic device；
(3) gradually uncover along with silica gel piece so that lubricating oil constantly enters the position that silica gel piece separates with electronic device；
(4) remove the lubricating oil on electronic device surface, and the silica gel piece separated is added ethyl acetate, further take out silica gel piece and add
Heat makes ethyl acetate evaporate；
(5) burr on silica gel piece surface is removed.
The using method of a kind of silica gel sheet material the most according to claim 1, it is characterised in that: in step (4), heating-up temperature
It it is 80 degrees Celsius.
The using method of a kind of silica gel sheet material the most according to claim 1, it is characterised in that: in step (3), silica gel piece is taken off
Open certain area, after lubricating oil, be just full of the position that silica gel piece separates with electronic device；The area that silica gel piece is opened is the biggest, profit
The spreading area of lubricating oil is the biggest.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610719388.XA CN106304826A (en) | 2016-08-25 | 2016-08-25 | A kind of silica gel piece method for dismounting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610719388.XA CN106304826A (en) | 2016-08-25 | 2016-08-25 | A kind of silica gel piece method for dismounting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106304826A true CN106304826A (en) | 2017-01-04 |
Family
ID=57615117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610719388.XA Pending CN106304826A (en) | 2016-08-25 | 2016-08-25 | A kind of silica gel piece method for dismounting |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106304826A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1796522A (en) * | 2004-12-23 | 2006-07-05 | 北京东方天甲科技发展有限公司 | Adhesive cleaning agent |
| CN103117241A (en) * | 2013-01-31 | 2013-05-22 | 中国科学院上海技术物理研究所 | Coating method in physical etching technology |
| CN103552125A (en) * | 2013-09-29 | 2014-02-05 | 胜宏科技（惠州）股份有限公司 | Machining method of red rubber sheet through hole |
| CN105140155A (en) * | 2015-07-15 | 2015-12-09 | 桂林电子科技大学 | Die bonding method used for GaAs MMIC thinning technology |
| US20160238945A1 (en) * | 2013-07-03 | 2016-08-18 | Kempur Microelectronics, Inc. | Novel photoresist stripper and application process thereof |
-
2016
- 2016-08-25 CN CN201610719388.XA patent/CN106304826A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1796522A (en) * | 2004-12-23 | 2006-07-05 | 北京东方天甲科技发展有限公司 | Adhesive cleaning agent |
| CN103117241A (en) * | 2013-01-31 | 2013-05-22 | 中国科学院上海技术物理研究所 | Coating method in physical etching technology |
| US20160238945A1 (en) * | 2013-07-03 | 2016-08-18 | Kempur Microelectronics, Inc. | Novel photoresist stripper and application process thereof |
| CN103552125A (en) * | 2013-09-29 | 2014-02-05 | 胜宏科技（惠州）股份有限公司 | Machining method of red rubber sheet through hole |
| CN105140155A (en) * | 2015-07-15 | 2015-12-09 | 桂林电子科技大学 | Die bonding method used for GaAs MMIC thinning technology |
Non-Patent Citations (2)
| Title |
|---|
| 生活妙招网: "6个小方法轻松去除玻璃上的贴纸", 《HTTP://WWW.LIFESKILL.CN/HTML_RY_RCMZ/2016/2016080526504.SHTML》 * |
| 生活妙招网: "皮肤上粘着的膏药怎样去除？", 《HTTP://WWW.LIFESKILL.CN/HTML_RY_RCMZ/2015/2015121625566.SHTML》 * |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170104 |