CN106304717B

CN106304717B - Substrate storage structure, electronic device having substrate storage structure, and detection device

Info

Publication number: CN106304717B
Application number: CN201610422941.3A
Authority: CN
Inventors: 早川良
Original assignee: Furuno Electric Co Ltd
Current assignee: Furuno Electric Co Ltd
Priority date: 2015-06-26
Filing date: 2016-06-15
Publication date: 2020-05-26
Anticipated expiration: 2036-06-15
Also published as: JP2017017074A; GB2541103A; CN106304717A; JP6567894B2; GB201610904D0; GB2541103B

Abstract

The invention provides a substrate storage structure, an electronic device with the substrate storage structure, and a detection device, which can realize a structure capable of storing a plurality of substrates in a box body and easily inserting and pulling out each substrate without enlarging the box body. The substrate storage structure includes: a case having a 1 st surface and a 2 nd surface; a 1 st substrate accommodated in the case; a 2 nd substrate accommodated in the case; a plate-like 1 st structure connected substantially perpendicularly to an end of the 1 st substrate; and a plate-like 2 nd structure connected to the end of the 2 nd substrate substantially perpendicularly. The 1 st surface has a 1 st opening through which the 1 st substrate is inserted and removed in a 1 st direction, and the 2 nd surface has a 2 nd opening through which the 2 nd substrate is inserted and removed in a 2 nd direction different from the 1 st direction. When the 1 st substrate and the 2 nd substrate are accommodated in the case, the 1 st surface and the 1 st structure, and the 2 nd surface and the 2 nd structure are substantially parallel to each other, and the 1 st substrate and the 2 nd substrate are substantially parallel to each other.

Description

Substrate storage structure, electronic device having substrate storage structure, and detection device

Technical Field

The present invention relates to a substrate storage structure for storing a plurality of substrates in a case.

Background

Conventionally, electronic devices in which a plurality of substrates are housed in one case have been put to practical use (see, for example, patent documents 1 to 3).

For example, patent document 1 discloses a heat sink fixing device that fixes a plurality of printed boards to which heat sinks are fixed, in parallel, to a printed board that is a main board. Patent document 2 discloses a structure in which a plurality of printed boards arranged in parallel are housed in a sealed case. Patent document 3 discloses an ultrasonic diagnostic apparatus having a structure in which a plurality of substrates arranged in parallel are inserted perpendicularly to a mother substrate.

Such an electronic apparatus is generally configured to be inserted into and removed from a casing from one direction when a plurality of substrates are stored in the casing.

Prior art documents

Patent document

Patent document 1: japanese unexamined patent publication No. 6-037419

Patent document 2: JP-A5-067081

Patent document 3: japanese laid-open patent publication No. 2004-305416

Disclosure of Invention

Problems to be solved by the invention

However, the shape and structure of the substrate vary depending on the application. For example, when a structure such as a heat sink or a large fan is connected to an end of a substrate, if such a substrate is housed in a case, the structure becomes an obstacle and prevents the insertion and removal of another substrate.

Further, if the gap between the substrates is increased so that the structure does not interfere with the insertion and removal of other substrates, the number of substrates that can be accommodated in a case having the same size is reduced, and therefore, the case needs to be increased in size.

The present invention aims to provide a structure which can accommodate a plurality of substrates in a box body and can easily insert and remove each substrate without enlarging the box body.

Means for solving the problems

The substrate storage structure of the present invention includes: a case having a 1 st surface and a 2 nd surface; a 1 st substrate accommodated in the case; a 2 nd substrate accommodated in the case; a plate-like 1 st structure connected substantially perpendicularly to an end of the 1 st substrate; and a plate-like 2 nd structure connected substantially perpendicularly to an end of the 2 nd substrate, wherein the 1 st surface of the case has a 1 st opening through which the 1 st substrate is inserted and removed in a 1 st direction, the 2 nd surface of the case has a 2 nd opening through which the 2 nd substrate is inserted and removed in a 2 nd direction different from the 1 st direction, and the 1 st surface and the 1 st structure, and the 2 nd surface and the 2 nd structure are substantially parallel to each other, and the 1 st substrate and the 2 nd substrate are substantially parallel to each other, in a state where the 1 st substrate and the 2 nd substrate are housed in the case.

In this configuration, the 1 st substrate and the 2 nd substrate are inserted and removed in different directions from each other, and are inserted and removed from different surfaces of the housing. In a state where the 1 st substrate and the 2 nd substrate are housed in the case, the 1 st surface and the 1 st structure, and the 2 nd surface and the 2 nd structure are substantially parallel to each other, and the 1 st substrate and the 2 nd substrate are substantially parallel to each other. Therefore, the 1 st substrate and the 2 nd substrate do not interfere with each other. Therefore, with this configuration, it is possible to realize a substrate storage structure that can store a plurality of substrates in a box and that can easily insert and remove each substrate without increasing the size of the box.

Effects of the invention

According to the present invention, it is possible to realize a substrate storage structure capable of storing a plurality of substrates in a case and easily inserting and removing the respective substrates without increasing the size of the case.

Drawings

Fig. 1 is an exploded perspective view of an electronic apparatus 101 having a substrate storage structure according to the present invention.

Fig. 2 is an external perspective view of an electronic device 101 having the substrate storage structure of the present invention.

Fig. 3 is an external perspective view of the electronic device 101 in a state where the box cover 1 is detached.

Fig. 4 is an external perspective view of the casing 2 of the electronic device 101.

Fig. 5 is an exploded perspective view of the casing 2 of the electronic device 101.

Fig. 6 is an exploded perspective view of the housing 2 of the electronic device 101 viewed from another perspective.

Fig. 7 is a plan view showing the structure of the 1 st substrate 11.

Fig. 8 is a right side view showing the structure of the 1 st substrate 11.

Fig. 9 is a rear view showing the structure of the 1 st substrate 11.

Fig. 10 is a plan view showing the structure of the 2 nd substrate 12.

Fig. 11 is a right side view showing the structure of the 2 nd substrate 12.

Fig. 12 is a bottom view showing the structure of the 2 nd substrate 12.

Fig. 13 is a rear view showing the structure of the 2 nd substrate 12.

Description of reference numerals:

OP1 No. 1 opening part

OP2 No. 2 opening part

VS1 No. 1

Surface 2 of VS2

1 case body cover

2 case body

11 st substrate

12 nd 2 nd substrate

13 item 1 structure (Heat sink)

14 nd 2 structure (Heat sink)

21 bottom panel

22. 23 side panel

24. 25, 26 baffle

31A, 31B, 32A locating pin (case side)

32B hook (case side)

41A, 41B pin insertion port (1 st substrate side)

42A Pin insertion opening (2 nd substrate side)

42B hook (2 nd substrate side)

51 connector

101 an electronic device.

Detailed Description

Fig. 1 is an exploded perspective view of an electronic apparatus 101 having a substrate storage structure according to the present invention. Fig. 2 is an external perspective view of an electronic device 101 having the substrate storage structure of the present invention. Fig. 3 is an external perspective view of the electronic device 101 in a state where the box cover 1 is detached. Fig. 4 is an external perspective view of the casing 2 of the electronic device 101. Fig. 5 is an exploded perspective view of the casing 2 of the electronic device 101. Fig. 6 is an exploded perspective view of the housing 2 of the electronic device 101 viewed from another perspective. In fig. 1, the case lid 1 is not shown for ease of understanding of the structure. In fig. 5, the illustration of the partition plate 24 is omitted for ease of understanding the configuration. In fig. 6, the partition 26 is not shown for ease of understanding of the structure.

The electronic device 101 has a rectangular parallelepiped shape having a 1 st surface VS1 and a 2 nd surface VS 2. The electronic apparatus 101 includes a case 2, a 1 st substrate 11, a 2 nd substrate 12, a heat sink 13, a heat sink 14, and a case lid 1. The electronic device according to the present embodiment is used for a detection device such as a fish finder provided with an ultrasonic transceiver and a signal processing circuit, for example. The heat sink 13 is an example of the "1 st structure" of the present invention, and corresponds to the "1 st heat dissipation function unit". The heat sink 14 is an example of the "2 nd structure" of the present invention, and corresponds to the "2 nd heat dissipation function unit".

The substrate storage structure of the present embodiment is composed of a case 2, a 1 st substrate 11, a 2 nd substrate 12, a heat dissipation plate 13, and a heat dissipation plate 14.

The case 2 has a rectangular parallelepiped shape having a 1 st surface VS1 and a 2 nd surface VS 2. The casing 2 has a 1 st opening OP1 in the 1 st surface VS1 and a 2 nd opening OP2 in the 2 nd surface VS 2. The box body 2 includes a bottom panel 21, a side panel 22, a side panel 23, a partition 24, a partition 25, and a partition 26.

The bottom panel 21, the side panels 22, and the side panels 23 are flat metal panels having a rectangular planar shape. A bottom panel 21 is disposed on the bottom surface of the case 2.

Side panels

22 and 23 are disposed on both side surfaces of the case 2 in the longitudinal direction (direction 1). The main surface of the bottom panel 21 is parallel to both the longitudinal direction (1 st direction) and the lateral direction (3 rd direction). The

side panels

22 and 23 are connected to both ends of the bottom panel 21 in the longitudinal direction (1 st direction) so as to be orthogonal to the main surface of the bottom panel 21. Therefore, the bottom panel 21, the side panels 22, and the side panels 23 are connected to each other in a v-shape (2127490) (U-shape) as viewed in the lateral direction (3 rd direction).

The side panel 22 has 2 positioning pins 31A aligned in the thickness direction (2 nd direction). The positioning pin 31A is a columnar pin and is disposed near the 1 st opening OP 1. The positioning pin 31A is provided on a first surface of the side panel 22 (a surface of the side panel 22 on the front side in fig. 4). That is, positioning pin 31A is exposed on surface VS1 No. 1 of case 2.

As shown in fig. 5, the side panel 23 has 2 positioning pins 31B aligned in the thickness direction (2 nd direction). The positioning pin 31B is a columnar pin, and is provided on a first surface of the side plate 23 (a surface of the side plate 23 near the front side in fig. 5). That is, the positioning pin 31B is provided inside the case 2.

The

separators

24, 25, and 26 are flat plates made of metal having a rectangular planar shape. The 3 sides of each of the separator 24, the separator 25, and the separator 26 are connected to the main surface of the bottom panel 21, the main surface of the side panel 22, and the main surface of the side panel 23, respectively. The main surfaces of the separator 24, the separator 25, and the separator 26 are parallel to any one of the longitudinal direction (1 st direction) and the thickness direction (2 nd direction), and are arranged in the transverse direction (3 rd direction). That is, the main surfaces of the

partition plates

24, 25, and 26 are arranged to be orthogonal to the main surfaces of the

side panels

22 and 23. To be described later in detail, the 1 st substrate 11 is accommodated between the partition plate 24 and the partition plate 25, and the 2 nd substrate 12 is accommodated between the partition plate 25 and the partition plate 26. Therefore, the

spacers

24 and 25 are arranged with a space in the lateral direction (3 rd direction) so as to be insertable through the 1 st substrate 11. In the lateral direction (3 rd direction), the

spacers

25 and 26 are arranged with a space through which the 2 nd substrate 12 can be inserted.

As shown in fig. 6, the spacer 25 has 2

positioning pins

32A and 2 hooking portions 32B. Positioning pin 32A is a columnar pin and is disposed near 2 nd opening OP 2. The hook portion 32B is a flat plate made of metal having an L-shaped planar shape, and is disposed near the bottom panel 21. The hook portion 32B and the spacer 25 are connected with a predetermined gap. Therefore, the main surface of the hook portion 32B and the main surface of the separator 25 are parallel to each other.

Fig. 7 is a plan view showing the structure of the 1 st substrate 11. Fig. 8 is a right side view showing the structure of the 1 st substrate 11. Fig. 9 is a rear view showing the structure of the 1 st substrate 11.

The 1 st substrate 11 is a flat plate made of metal having a rectangular planar shape. A heat sink 13 is connected to a first side (a lower side of the 1 st substrate 11 in fig. 7) of the 1 st substrate 11 substantially vertically. The heat sink 13 includes a substrate 13A and a plurality of heat sinks 13B. The substrate 13A is a flat plate made of metal having a rectangular planar shape. A plurality of flat plate-shaped heat sinks 13B are connected (or integrated) to the front surface of the substrate 13A (the left surface of the substrate 13A in fig. 8) so as to be perpendicular to the front surface. That is, the first side of the 1 st substrate 11 is connected to the back surface of the substrate 13A (the surface on the right side of the substrate 13A in fig. 8). The 1 st substrate 11 is, for example, a power supply substrate.

On the back surface of the 1

st substrate

11, 2 pin insertion holes 41B are provided at positions corresponding to the positions of the positioning pins 31B in a state where the 1 st substrate 11 is housed in the case 2. Pin insertion opening 41B is a circular opening having an inner diameter (diameter) larger than an outer diameter (diameter) of positioning pin 31B. When the pin insertion opening 41B has a shape other than a circular shape, the size thereof is larger than the size of the positioning pin 31B. In a state where the 1 st substrate 11 is stored in the case 2, the positioning pins 31B are inserted into the pin insertion holes 41B. Further, on the rear surface of the heat sink 13 (the rear surface of the substrate 13A), 2 pin insertion holes 41A are provided at positions corresponding to the positions of the positioning pins 31A in a state where the 1 st substrate 11 is accommodated in the case 2. Pin insertion opening 41A is a circular opening having an inner diameter (diameter) larger than an outer diameter (diameter) of positioning pin 31A. When the pin insertion opening 41A has a shape other than a circular shape, the size thereof is larger than the size of the positioning pin 31A. In a state where the 1 st substrate 11 is stored in the case 2, the positioning pins 31A are inserted into the pin insertion holes 41A.

In this way, the position of the 1 st substrate 11 is fixed in a state where the 1 st substrate 11 is accommodated in the casing 2. In the present embodiment, the positioning pins 31A, the positioning pins 31B, the pin insertion ports 41A, and the pin insertion ports 41B correspond to a "positioning mechanism" for fixing the 1 st substrate 11.

Fig. 10 is a plan view showing the structure of the 2 nd substrate 12. Fig. 11 is a right side view showing the structure of the 2 nd substrate 12. Fig. 12 is a bottom view showing the structure of the 2 nd substrate 12. Fig. 13 is a rear view showing the structure of the 2 nd substrate 12.

The 2 nd substrate 12 is a flat plate made of metal having a rectangular planar shape. A heat sink 14 is connected substantially perpendicularly to a second side of the 2 nd substrate 12 (an upper side of the 2 nd substrate 12 in fig. 10). The heat dissipation plate 14 is a flat plate having a rectangular planar shape. The heat sink 14 is housed in the case 2 together with the 2 nd substrate 12, and abuts against the inside (bottom surface plate 21) of the case 2. The 2 nd substrate 12 is, for example, a substrate for signal processing for processing an echo signal of a probe apparatus.

On the front surface of the 2

nd substrate

12, 2 pin insertion holes 42A are provided at positions corresponding to the positions of the positioning pins 32A in a state where the 2 nd substrate 12 is housed in the casing 2. Pin insertion opening 42A is a circular opening having an inner diameter (diameter) larger than an outer diameter (diameter) of positioning pin 32A. When pin insertion opening 42A has a shape other than a circular shape, its size is larger than that of positioning pin 32A. In a state where the 2 nd substrate 12 is housed in the case 2, the positioning pins 32A are inserted into the pin insertion holes 42A. Further, on the bottom surface of the 2

nd substrate

12, 2 hook portions 42B are provided at positions corresponding to the positions of the hook portions 32B in a state where the 2 nd substrate 12 is stored in the casing 2. In a state where the 2 nd substrate 12 is housed in the casing 2, the hook portion 32B is inserted between the 2 nd substrate 12 and the hook portion 42B. The hook portion 32B may be inserted between the 2 nd substrate 12 and the hook portion 42B and sandwiched between the 2 nd substrate 12 and the hook portion 42B.

In this way, the position of the 2 nd substrate 12 is fixed in a state where the 2 nd substrate 12 is accommodated in the casing 2. In the present embodiment, the positioning pins 32A, the pin insertion ports 42A, the hook portions 32B, and the hook portions 42B correspond to a "positioning mechanism" that fixes the 2 nd substrate 12.

Further, the 2 nd substrate 12 has 2 connectors 51 for connecting cables and the like. The connector 51 is disposed near a first side of the 2 nd substrate 12 (a lower side of the 2 nd substrate 12 in fig. 10). Therefore, as shown in fig. 3, in a state where the 2 nd substrate 12 is accommodated in the housing 2, the connector 51 is disposed in the vicinity of the 2 nd opening OP 2. The connector 51 is, for example, a terminal (connector for communication) connected to another substrate.

The term "vicinity" of the 2 nd opening OP2 does not mean that the vicinity of the 2 nd opening OP2 is very close. The "vicinity" of the 2 nd opening OP2 is a range in which the manual operation can be performed through the 2 nd opening OP2 in a state in which the 2 nd substrate 12 is stored in the casing 2. For example, a range from the 2 nd opening OP2 toward the 1/3 total length in the thickness direction (2 nd direction) of the 2 nd substrate 12 in the thickness direction (2 nd direction) is referred to as "vicinity" of the 2 nd opening OP 2.

The case lid 1 is a rectangular parallelepiped case formed as a flat plate on a surface other than the bottom surface (lower surface in fig. 2). The case lid 1 is attached to the case 2 in a state where the 1 st substrate 11 and the 2 nd substrate 12 are housed, from the 2 nd surface VS2 side toward the thickness direction (2 nd direction). The case lid 1 is, for example, a metal box (box).

Next, a method of storing the 1 st substrate 11 and the 2 nd substrate 12 in the case 2 will be described with reference to the drawings.

The 1 st substrate 11 is inserted and removed in the vertical direction (1 st direction) from the 1 st opening OP1 formed in the 1 st surface VS1 of the casing 2 (see the arrow in fig. 1). As shown in fig. 1 and 3, in a state where the 1 st substrate 11 is housed in the case 2, the heat sink 13 is exposed on the 1 st surface VS 1.

The 1 st substrate 11 is inserted between the

partition plates

24 and 25. The main surface of the separator 25 and the main surface of the separator 26 are parallel to both the longitudinal direction (1 st direction) and the thickness direction (2 nd direction). Therefore, the 1 st substrate 11 is accommodated in the case 2 such that the main surface of the 1 st substrate 11 is parallel to both the main surface of the spacer 24 and the main surface of the spacer 25. The position of the 1 st substrate 11 stored in the casing 2 is fixed by the positioning pins 31A, 31B, the

pin insertion ports

41A, and 41B. In this way, the

spacers

24 and 25 function as jig members for guiding the insertion direction of the 1 st substrate 11.

The 2 nd substrate 12 is inserted and removed in the thickness direction (2 nd direction) from the 2 nd opening OP2 formed in the 2 nd surface VS2 of the casing 2 (see the arrow in fig. 1). As shown in fig. 1 and 3, the heat sink 14 and the 2 nd substrate 12 are housed in the case 2 and abut against the inside of the case 2.

The 2 nd substrate 12 is inserted between the partition plate 25 and the partition plate 26. The main surface of the separator 25 and the main surface of the separator 26 are parallel to both the longitudinal direction (1 st direction) and the thickness direction (2 nd direction). Therefore, the 2 nd substrate 12 is accommodated in the case 2 such that the main surface of the 2 nd substrate 12 is parallel to both the main surface of the spacer 25 and the main surface of the spacer 26. The position of the 2 nd substrate 12 stored in the casing 2 is fixed by the positioning pins 32A, the pin insertion ports 42A, the hook portions 32B, and the hook portions 42B. In this way, the

spacers

25 and 26 function as jig members for guiding the insertion direction of the 2 nd substrate 12.

Therefore, as shown in fig. 3, in a state where the 1 st substrate 11 and the 2 nd substrate 12 are accommodated in the casing 2, the main surface of the 1 st substrate 11 and the main surface of the 2 nd substrate 12 are parallel to each other and are parallel to either the longitudinal direction (the 1 st direction) or the thickness direction (the 2 nd direction). Further, the longitudinal direction (1 st direction) in which the 1 st substrate 11 is inserted and removed is orthogonal to the thickness direction (2 nd direction) in which the 2 nd substrate 12 is inserted and removed, as viewed in the lateral direction (3 rd direction).

According to the substrate storage structure of the present embodiment, the following effects are exhibited.

(a) In the substrate storage structure of the present embodiment, the 1 st substrate 11 and the 2 nd substrate 12 are inserted into and removed from different directions (the 1 st direction and the 2 nd direction) from each other, and are inserted into and removed from different surfaces (the 1 st surface VS1 and the 2 nd surface VS2) of the casing 2 from each other. In a state where the 1 st substrate 11 and the 2 nd substrate 12 are housed in the case 2, the 1 st surface VS1 and the heat sink 13, and the 2 nd surface VS2 and the heat sink 14 are substantially parallel to each other, and the 1 st substrate 11 and the 2 nd substrate 12 are substantially parallel to each other. Therefore, the 1 st substrate 11 and the 2 nd substrate 12 do not interfere with insertion and removal of each other. Therefore, a substrate storage structure can be realized in which a plurality of substrates are stored in the casing 2 and the respective substrates can be easily inserted and removed without increasing the size of the casing.

(b) The casing 2 of the substrate storage structure of the present embodiment has a positioning mechanism (positioning pin 31A, positioning pin 31B, pin insertion opening 41A, and pin insertion opening 41B) for the 1 st substrate 11, and a positioning mechanism (positioning pin 32A, pin insertion opening 42A, hook 32B, and hook 42B) for the 2 nd substrate 12. Therefore, the positions of the 1 st substrate 11 and the 2 nd substrate 12 housed in the casing 2 are fixed, and the mounting accuracy can be improved.

(c) The positioning mechanism (positioning pin 31A) for the 1 st substrate 11 is exposed on the 1 st surface VS1 of the case 2. By providing the positioning mechanism for the 1 st substrate 11 outside the casing 2, the mounting accuracy of the 1 st substrate 11 housed in the casing 2 can be further improved, as compared with the case where the positioning mechanism for the 1 st substrate 11 is provided only inside the casing 2.

(d) The electronic apparatus 101 having the substrate storage structure of the present embodiment is configured such that the heat sink 14 is in contact with the case 2 in a state where the 2 nd substrate is stored in the case 2. As described above, since the case 2 can be used as a part of the heat dissipation function portion by bringing the 2 nd heat dissipation function portion into contact with the case, it is not necessary to provide a separate space for exposing the heat dissipation function portion from the case 2. Therefore, even with a structure including a plurality of heat dissipation functional units, the electronic apparatus can be downsized.

(e) In the electronic apparatus 101 having the board mounting structure of the present embodiment, the connector 51 provided on the 2 nd board 12 is disposed in the vicinity of the 2 nd opening OP2 in a state where the 2 nd board 12 is housed in the casing 2. Therefore, the operation of connecting the cables and the like through the 2 nd opening OP2 is facilitated, and as a result, the insertion and removal of the 2 nd substrate 12 accommodated in the casing 2 is facilitated.

In the above embodiment, the substrate storage structure including the 1 st substrate 11 and the 1 nd substrate 12 is shown, but the present invention is not limited to this structure. The substrate storage structure may be configured to include a plurality of the 1 st substrates 11, or may be configured to include a plurality of the 2 nd substrates 12.

In the above-described embodiment, the substrate storing structure in which the 1 st direction in which the 1 st substrate 11 is inserted and removed and the 2 nd direction in which the 2 nd substrate 12 is inserted and removed are orthogonal to each other when viewed from the 3 rd direction is shown, but the present invention is not limited to this configuration. The 1 st direction and the 2 nd direction can be appropriately changed within a range that exhibits the operational effect of accommodating a plurality of substrates in the casing 2 and easily inserting and removing the respective substrates without increasing the size of the casing. In this case, it is preferable that the main surfaces of the 1 st substrate 11 and the 2 nd substrate 12 are parallel to each other and to both of the 1 st direction and the 2 nd direction in a state where the 1 st substrate 11 and the 2 nd substrate 12 are accommodated in the casing 2.

In the above-described embodiment, the substrate accommodating structure in which the

spacers

24, 25, and 26 function as the jig members for guiding the insertion direction of the 1 st substrate 11 and the 2 nd substrate 12 is shown, but the present invention is not limited to this structure. The jig member for guiding the insertion direction of the 1 st substrate 11 and the 2 nd substrate 12 is not necessarily configured. That is, the partition plate 24, the partition plate 25, and the partition plate 26 are not necessarily configured. Instead of using the

partition plates

24, 25, and 26, the jig member may be made of a pin, a bolt, a steel material for support, or the like.

In the above embodiment, the heat dissipation plate 14 corresponding to the 2 nd heat dissipation function portion is connected to the 2 nd substrate 12, but the present invention is not limited to this configuration. For example, the heat sink 14 may be connected to the 1 st substrate 11.

In the above embodiment, the connector 51 provided on the 2 nd substrate 12 is disposed in the vicinity of the 2 nd opening OP2 in a state where the 2 nd substrate 12 is accommodated in the casing 2, but the present invention is not limited to this configuration. The connector 51 may be provided on the 1 st substrate 11. The connector 51 may be provided on both the 1 st substrate 11 and the 2 nd substrate 12. Further, it may be: in a state where the 1 st board 11 is accommodated in the housing 2, the connector 51 provided in the 1 st board 11 is disposed in the vicinity of the 2 nd opening OP 2. It can also be: in a state where the 2 nd substrate 12 is accommodated in the housing 2, the connector provided on the 2 nd substrate 12 is arranged in the vicinity of the 1 st opening OP 1.

In the above-described embodiment, the configuration in which the positioning mechanism (positioning pin 31A) is exposed on the 1 st surface VS1 is shown, but the present invention is not limited to this configuration. The positioning mechanism for the 2 nd substrate 12 may be exposed on the 2 nd surface VS 2.

In the above-described embodiment, the electronic apparatus 101 in which the positioning mechanism is constituted by the positioning pin, the hook portion, or the like is shown, but the present invention is not limited to this configuration. The positioning mechanism according to the above-described embodiment is merely an example. The position of the 1 st substrate 11 and the 2 nd substrate 12 can be appropriately changed within a range that exhibits the operational effect of being able to fix the position of the 1 st substrate 11 and the 2 nd substrate 12 in a state where the 1 st substrate 11 and the 2 nd substrate 12 are accommodated in the casing 2.

In the above-described embodiment, the electronic apparatus 101 is shown as an example of the detection device, but is not limited thereto. The substrate housing structure can be widely applied to all electronic apparatuses housing a plurality of substrates in a case.

In the above-described embodiment, the substrate storage structure including the rectangular parallelepiped case 2 is shown, but the structure is not limited to this. The shape of the case 2 can be appropriately changed within a range that exhibits the operational effect of accommodating a plurality of substrates in the case and easily inserting and removing the respective substrates without increasing the size of the case.

Claims

1. A substrate storage structure is characterized by comprising:

a case having a 1 st surface and a 2 nd surface;

a 1 st substrate accommodated in the case;

a 2 nd substrate accommodated in the case;

a plate-like 1 st structure connected substantially perpendicularly to an end of the 1 st substrate; and

a plate-like 2 nd structure connected to an end of the 2 nd substrate substantially perpendicularly,

the 1 st surface of the case has a 1 st opening through which the 1 st substrate is inserted and removed along a 1 st direction,

the 2 nd surface of the case has a 2 nd opening for inserting and extracting the 2 nd substrate in a 2 nd direction different from the 1 st direction,

the 1 st surface is substantially parallel to the 1 st structure, the 2 nd surface is substantially parallel to the 2 nd structure, and the 1 st substrate and the 2 nd substrate are substantially parallel to each other in a state where the 1 st substrate and the 2 nd substrate are accommodated in the case,

the substrate storage structure further includes a plurality of spacers, a main surface of each spacer is parallel to either the 1 st direction or the 2 nd direction, and two adjacent spacers are provided to function as a jig member for guiding an insertion direction of the 1 st substrate or the 2 nd substrate.

2. The substrate receiving structure according to claim 1,

the box body is provided with a positioning mechanism for fixing at least one of the 1 st substrate and the 2 nd substrate.

3. The substrate receiving structure according to claim 2,

at least a part of the positioning mechanism is exposed on at least one of the 1 st surface and the 2 nd surface of the case.

4. The substrate receiving structure according to claim 1,

at least one of the 1 st substrate and the 2 nd substrate has a connector,

the connector is disposed in the vicinity of the 1 st opening or the 2 nd opening in a state where the 1 st substrate or the 2 nd substrate having the connector is accommodated in the case.

5. The substrate receiving structure according to claim 2,

at least one of the 1 st substrate and the 2 nd substrate has a connector,

6. The substrate receiving structure according to claim 3,

at least one of the 1 st substrate and the 2 nd substrate has a connector,

7. The substrate receiving structure according to any one of claims 1 to 6,

the 1 st structure is a 1 st heat dissipation functional unit.

8. The substrate receiving structure according to any one of claims 1 to 6,

the 2 nd structure is a 2 nd heat dissipation function part,

the 2 nd heat dissipation function portion abuts against the case in a state where the 2 nd substrate is accommodated in the case.

9. The substrate receiving structure according to claim 7,

the 2 nd structure is a 2 nd heat dissipation function part,

10. An electronic apparatus having the substrate storage structure according to any one of claims 1 to 9,

the 1 st substrate is a power supply substrate.

11. A detection device is provided with:

the electronic device of claim 10;

a transceiver that transmits and receives ultrasonic waves; and

and a signal processing circuit for processing the ultrasonic signal acquired by the transceiver.