CN106304609A - Printed circuit board (PCB) and apply the electronic equipment of this printed circuit board (PCB) - Google Patents
Printed circuit board (PCB) and apply the electronic equipment of this printed circuit board (PCB) Download PDFInfo
- Publication number
- CN106304609A CN106304609A CN201510301884.9A CN201510301884A CN106304609A CN 106304609 A CN106304609 A CN 106304609A CN 201510301884 A CN201510301884 A CN 201510301884A CN 106304609 A CN106304609 A CN 106304609A
- Authority
- CN
- China
- Prior art keywords
- pcb
- circuit board
- printed circuit
- concave surface
- electronic equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0231—Capacitors or dielectric substances
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- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
A kind of printed circuit board (PCB) includes bus plane, ground plane and dielectric layer.Described dielectric layer is between described bus plane and described ground plane；Wherein said bus plane includes that the first concave surface, described ground plane include the second concave surface, forms the first electric capacity between described first concave surface and the second concave surface.Present invention also offers a kind of electronic equipment including this printed circuit board (PCB).
Description
Technical field
The present invention relates to a kind of printed circuit board (PCB), the invention still further relates to the electronic equipment of a kind of this printed circuit board (PCB) of application.
Background technology
The portability requirements of electronic product is more and more higher at present, and density and integrated level to printed circuit board (PCB) require to increase therewith.Electric current greatly can be produced during level change when components and parts use on printed circuit board (PCB), for meet this require on printed circuit board (PCB) would generally integrated more electric capacity, but a fairly large number of electric capacity can increase printed circuit board (PCB) sheet side and amass, and brings certain electromagnetic interference.
Summary of the invention
Space availability ratio can be improved in consideration of it, be necessary to provide and reduce a kind of printed circuit board (PCB) of electromagnetic interference and apply the electronic equipment of this printed circuit board (PCB).
A kind of printed circuit board (PCB), including:
One bus plane, a ground plane and a dielectric layer, described dielectric layer is between described bus plane and described ground plane；Wherein said bus plane includes that the first concave surface, described ground plane include the second concave surface, forms the first electric capacity between described first concave surface and the second concave surface.
A kind of electronic equipment, described electronic equipment includes described printed circuit board (PCB).
The structure of described printed circuit board (PCB) forms described first electric capacity, and described first electric capacity can replace external capacitor to save sheet material space and to reduce electromagnetic interference.
Accompanying drawing explanation
Fig. 1 is the schematic cross-section of printed circuit board (PCB) better embodiment of the present invention.
Main element symbol description
Following detailed description of the invention will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Detailed description of the invention
Refer to the schematic cross-section that Fig. 1, Fig. 1 are described printed circuit board (PCB) 100.A kind of electronic equipment 101 includes that printed circuit board (PCB) 100, the better embodiment of described printed circuit board (PCB) 100 include bus plane 10, dielectric layer 20, ground plane 30.The first concave surface 50 is included on described bus plane 10, the second concave surface 60 is included on described ground plane 30, described first concave surface 50 is the concave surface formed by cutting or etching mode on described bus plane 10, and described second concave surface 60 is the concave surface formed by cutting or etching mode on described ground plane 30.
In the present embodiment, described first concave surface 50 and the second concave surface 60 are metal level.Preferably, described metal level is Copper Foil.Described dielectric layer 20 is formed by dielectric material, and described first concave surface 50 and the second concave surface 60 are formed by the way of cutting or etching.
During use, on printed circuit board (PCB) 100, the power pins of chip connects described bus plane 10 by via, the electric capacity decoupling that the electric current produced during chip operation is formed through described first concave surface the 50, second concave surface 60 and dielectric layer 20, can improve the stability of electric current.
When design, user can adjust according to testing result that the right opposite of the first concave surface 50 and the second concave surface 60 is long-pending or spacing adjustment capacitance size, to obtain preferable decoupling effect.As when needs increase electric capacity, user can increase the right opposite of the first concave surface 50 and the second concave surface 60 and amasss or reduce the first concave surface 50 and spacing of the second concave surface 60.Correspondingly, when needs reduce electric capacity, user can reduce the right opposite of the first concave surface 50 and the second concave surface 60 and amasss or increase the first concave surface and the spacing of the second concave surface 60.
Described printed circuit board (PCB) 100 can reduce the use of discrete capacitor, saves sheet material space.
Finally it should be noted that, above example is only in order to illustrate technical scheme and unrestricted, although the present invention being described in detail with reference to preferred embodiment, it will be understood by those within the art that, technical scheme can be modified or equivalent, without deviating from the spirit and scope of technical solution of the present invention.
Claims (6)
1. a printed circuit board (PCB), including:
One bus plane, a ground plane and a dielectric layer, described dielectric layer is between described bus plane and described ground plane；Wherein said bus plane includes that the first concave surface, described ground plane include the second concave surface, forms the first electric capacity between described first concave surface and the second concave surface.
2. printed circuit board (PCB) as claimed in claim 1, it is characterised in that: described first concave surface and the second concave surface are metal level.
3. printed circuit board (PCB) as claimed in claim 2, it is characterised in that: described metal level is Copper Foil.
4. printed circuit board (PCB) as claimed in claim 1, it is characterised in that: described first concave surface and the second concave surface are formed by etching mode.
5. printed circuit board (PCB) as claimed in claim 1, it is characterised in that: described first concave surface and the second concave surface are formed by cutting mode.
6. an electronic equipment, it is characterised in that: described electronic equipment includes the printed circuit board (PCB) as according to any one of claim 1-5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510301884.9A CN106304609A (en) | 2015-06-05 | 2015-06-05 | Printed circuit board (PCB) and apply the electronic equipment of this printed circuit board (PCB) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510301884.9A CN106304609A (en) | 2015-06-05 | 2015-06-05 | Printed circuit board (PCB) and apply the electronic equipment of this printed circuit board (PCB) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106304609A true CN106304609A (en) | 2017-01-04 |
Family
ID=57655921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510301884.9A Pending CN106304609A (en) | 2015-06-05 | 2015-06-05 | Printed circuit board (PCB) and apply the electronic equipment of this printed circuit board (PCB) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106304609A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050098346A1 (en) * | 2002-11-04 | 2005-05-12 | Jun Fan | Reducing noise effects in circuit boards |
| CN100336424C (en) * | 2001-04-19 | 2007-09-05 | 吉尔科技新加坡有限公司 | Method for forming printed circuit board and printed circuit board formed thereby |
| US20100126759A1 (en) * | 2008-11-27 | 2010-05-27 | Tatung Company | Structure of multi-layer printed circuit board |
-
2015
- 2015-06-05 CN CN201510301884.9A patent/CN106304609A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100336424C (en) * | 2001-04-19 | 2007-09-05 | 吉尔科技新加坡有限公司 | Method for forming printed circuit board and printed circuit board formed thereby |
| US20050098346A1 (en) * | 2002-11-04 | 2005-05-12 | Jun Fan | Reducing noise effects in circuit boards |
| US20100126759A1 (en) * | 2008-11-27 | 2010-05-27 | Tatung Company | Structure of multi-layer printed circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170104 |