CN106303853A - A kind of manufacture method of wafer speaker - Google Patents
A kind of manufacture method of wafer speaker Download PDFInfo
- Publication number
- CN106303853A CN106303853A CN201610699590.0A CN201610699590A CN106303853A CN 106303853 A CN106303853 A CN 106303853A CN 201610699590 A CN201610699590 A CN 201610699590A CN 106303853 A CN106303853 A CN 106303853A
- Authority
- CN
- China
- Prior art keywords
- high molecular
- molecular polymer
- insulated substrate
- iron
- neodymium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
- H04R31/003—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/06—Loudspeakers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
Abstract
The invention discloses the manufacture method of a kind of wafer speaker, it relates to loudspeaker techniques field；It comprises the steps of: step one: bendable high molecular polymer insulated substrate is cropped to corresponding size, and is polished side；Step 2: prepare a spiral winding conductive metal film layer on bendable high molecular polymer insulated substrate by three-dimensional printing technology；Step 3: be stained with neodymium-iron-boron iron block on the another side of bendable high molecular polymer insulated substrate, neodymium-iron-boron iron block is drilled with hole, location, and neodymium-iron-boron iron block is positioned at the central area of conductive metal film layer；Location is provided with positioning needle in hole；Step 4: the port at conductive metal film layer arranges two conducting terminals, is provided with garment bag on conducting terminal；Step 5: be packaged by the bendable high molecular polymer insulated substrate of installation, installs fin, i.e. can be made into during encapsulation；The present invention extends service life, easy and simple to handle, and work efficiency is high, time-consuming.
Description
Technical field
The present invention relates to loudspeaker techniques field, be specifically related to the manufacture method of a kind of wafer speaker.
Background technology
Speaker is the energy transducer that a kind of the signal of telecommunication is changed into acoustical signal, the good and bad shadow to tonequality of the performance of speaker
Ring the biggest.Speaker is a device the weakest in stereo set, and for acoustics, it be again one the heaviest
The parts wanted.Speaker of a great variety, and price differs greatly.Audio frequency electric energy passes through electromagnetism, piezoelectricity or electrostatic effect, makes
Its cone or diaphragm vibration the air with surrounding produce resonance (sympathetic response) and send sound.
Low-grade plastic loudspeaker box, because its casing is thin, cannot overcome resonance, can say (also have the plastics that part designs without tonequality
Audio amplifier will be far better than wooden acoustic box inferior)；Wood cabinet reduces the sound dye that casing resonance is caused, and tonequality is generally better than
Plastic loudspeaker box.
Generally multimedia loudspeaker box is all double unit two divided-frequency designs, and a less speaker is responsible for alt output,
And another bigger speaker is responsible for the output of middle bass.
Select audio amplifier and be considered as the material of the two loudspeaker: the voice unit of active multimedia loudspeaker boxes is existing based on soft top dome
(the titanium film top dome etc. in addition with for simulating source of sound), it matches with digital tone source and can reduce the stiff sense of high-frequency signal,
Give gentle, smooth, fine and smooth sensation.Multimedia loudspeaker box is existing with soft balls such as the preferable cortina of quality and lower-cost PV films
That pushes up is in the majority.
Existing wafer speaker is not the most packaged, and causes service life in later stage short.
Summary of the invention
Present invention aims to defect and the deficiency of prior art, it is provided that the manufacturer of a kind of wafer speaker
Method.
In order to solve the problem existing for background technology, the manufacture method of a kind of wafer speaker of the present invention, it comprises
Following steps:
Step one: bendable high molecular polymer insulated substrate is cropped to corresponding size, and side is polished；
Step 2: prepare a spiral winding conductive gold on bendable high molecular polymer insulated substrate by three-dimensional printing technology
Belong to thin layer；
Step 3: be stained with neodymium-iron-boron iron block, neodymium-iron-boron on the another side of bendable high molecular polymer insulated substrate
It is drilled with hole, location on iron block, and neodymium-iron-boron iron block is positioned at the central area of conductive metal film layer；It is fixed to be provided with in hole, location
Position pin；
Step 4: the port at conductive metal film layer arranges two conducting terminals, is provided with garment bag on conducting terminal；
Step 5: be packaged by the bendable high molecular polymer insulated substrate of installation, installs fin, i.e. during encapsulation
Can be made into.
Present invention have the beneficial effect that and extend service life, easy and simple to handle, work efficiency is high, time-consuming.
Detailed description of the invention
This detailed description of the invention adopts the following technical scheme that it comprises the steps of:
Step one: bendable high molecular polymer insulated substrate is cropped to corresponding size, and side is polished；
Step 2: prepare a spiral winding conductive gold on bendable high molecular polymer insulated substrate by three-dimensional printing technology
Belong to thin layer；
Step 3: be stained with neodymium-iron-boron iron block, neodymium-iron-boron on the another side of bendable high molecular polymer insulated substrate
It is drilled with hole, location on iron block, and neodymium-iron-boron iron block is positioned at the central area of conductive metal film layer；It is fixed to be provided with in hole, location
Position pin；
Step 4: the port at conductive metal film layer arranges two conducting terminals, is provided with garment bag on conducting terminal；
Step 5: be packaged by the bendable high molecular polymer insulated substrate of installation, installs fin, i.e. during encapsulation
Can be made into.
The above, only in order to technical scheme to be described and unrestricted, those of ordinary skill in the art are to this
Other amendment or equivalent that bright technical scheme is made, without departing from the spirit and scope of technical solution of the present invention,
All should contain in the middle of scope of the presently claimed invention.
Claims (1)
1. the manufacture method of a wafer speaker, it is characterised in that: it comprises the steps of:
Step one: bendable high molecular polymer insulated substrate is cropped to corresponding size, and side is polished；
Step 2: prepare a spiral winding conductive gold on bendable high molecular polymer insulated substrate by three-dimensional printing technology
Belong to thin layer；
Step 3: be stained with neodymium-iron-boron iron block, neodymium-iron-boron on the another side of bendable high molecular polymer insulated substrate
It is drilled with hole, location on iron block, and neodymium-iron-boron iron block is positioned at the central area of conductive metal film layer；It is fixed to be provided with in hole, location
Position pin；
Step 4: the port at conductive metal film layer arranges two conducting terminals, is provided with garment bag on conducting terminal；
Step 5: be packaged by the bendable high molecular polymer insulated substrate of installation, installs fin, i.e. during encapsulation
Can be made into.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610699590.0A CN106303853A (en) | 2016-08-22 | 2016-08-22 | A kind of manufacture method of wafer speaker |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610699590.0A CN106303853A (en) | 2016-08-22 | 2016-08-22 | A kind of manufacture method of wafer speaker |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106303853A true CN106303853A (en) | 2017-01-04 |
Family
ID=57662261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610699590.0A Pending CN106303853A (en) | 2016-08-22 | 2016-08-22 | A kind of manufacture method of wafer speaker |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106303853A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108306463A (en) * | 2017-01-13 | 2018-07-20 | 通用电气航空系统有限责任公司 | Method for the stator module for manufacturing electric machine |
-
2016
- 2016-08-22 CN CN201610699590.0A patent/CN106303853A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108306463A (en) * | 2017-01-13 | 2018-07-20 | 通用电气航空系统有限责任公司 | Method for the stator module for manufacturing electric machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170104 |
|
| WD01 | Invention patent application deemed withdrawn after publication |