CN106298624A - A kind of wafer support mechanism being conveniently replaceable - Google Patents
A kind of wafer support mechanism being conveniently replaceable Download PDFInfo
- Publication number
- CN106298624A CN106298624A CN201510367887.2A CN201510367887A CN106298624A CN 106298624 A CN106298624 A CN 106298624A CN 201510367887 A CN201510367887 A CN 201510367887A CN 106298624 A CN106298624 A CN 106298624A
- Authority
- CN
- China
- Prior art keywords
- ceramics pole
- hot plate
- ceramic jacket
- height
- land portions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A kind of wafer support mechanism being conveniently replaceable, solves the most easily changeable problem of existing wafer support mechanism.This mechanism includes hot plate, ceramic jacket, ceramics pole and clamp specially.Described hot plate is machined with circular counter bore, ceramic jacket is put into counterbore, then ceramics pole is put into ceramic jacket.Described ceramic jacket inner port edge is shaped with chamfering, and ceramics pole land portions can be made to expose, and the land portions of ceramics pole is shaped with wedge-shaped slot.When clamp specially loosens, clamp opening portion can be enclosed within the land portions of ceramics pole by the land portions of ceramics pole, upwards pulled up and can be extracted in ceramic jacket by ceramics pole.Described ceramics pole top has spherical surface hill, for support wafer, the height of ceramics pole spherical surface hill and hot plate upper surface is measured with height gauge, ceramics pole is extracted with clamp specially, change corresponding ceramics pole and reach desired height, with same method, the whole support mechanisms in hot plate are adjusted to sustained height, make the gap between wafer with hot plate keep consistent.Can be widely applied to semiconductive thin film deposition arts.
Description
Technical field
The present invention relates to the wafer support mechanism of a kind of semiconductor coated film equipment, this mechanism is mainly used in
In semiconductor coated film equipment reaction intracavity room temperature or elevated temperature processes, belong to answering of semiconductive thin film deposition
Use technical field.
Background technology
Certain gap is needed, the size pair in gap between wafer and hot plate in semiconductor coated film equipment
Process results has a significant impact, and current wafer support mechanism is unadjustable, needs by changing different high
Degree wafer support mechanism, makes gap keep consistent, adjusts height in this way, take out ceramics pole ratio
More difficult, especially after hot plate had carried out high-temperature technology, " stuck " phenomenon and nothing easily occur
Method is taken out.
Summary of the invention
The present invention, to solve for the purpose of the problems referred to above, devises the wafer support mechanism being conveniently replaceable, solves
The most easily changeable problem of existing wafer support mechanism.This mechanism utilize change differing heights there is special knot
The ceramics pole regulation height of structure, makes the gap between wafer with hot plate keep consistent, it is simple to the wafer of replacing
Support mechanism,
For achieving the above object, the present invention uses following technical proposals: a kind of wafer support being conveniently replaceable
Mechanism, this mechanism includes hot plate (1), ceramic jacket (2), ceramics pole (3) and clamp specially (4).
Described hot plate (1) is machined with circular counter bore, and ceramic jacket (2) is put into counterbore, then by ceramics pole (3)
Put into ceramic jacket (2).Described ceramic jacket (2) inner port edge is shaped with chamfering (5), can make ceramics pole (3)
Land portions is exposed, and the land portions of ceramics pole (3) is shaped with wedge-shaped slot, and clamp specially (4) loosens shape
During state, clamp opening (6) part can pass through the land portions of ceramics pole (3), is enclosed within ceramics pole (3)
Land portions on, when firmly clutching clamp specially (4), the opening part of clamp specially (4) less than pottery
The diameter of porcelain knob land portions, upwards pulls up, and can be extracted in ceramic jacket (2) by ceramics pole (3).
Described ceramics pole (3) top has spherical surface hill, for support wafer, measures pottery with height gauge
The height of porcelain knob (3) spherical surface hill and hot plate (1) upper surface, the height measured according to reality higher than or
Less than requiring height, entangle the wedge-shaped slot of ceramics pole with clamp specially (4), extract ceramics pole (3),
Change corresponding ceramics pole (3) and reach desired height, with complete by hot plate (1) of same method
Support mechanism of portion is adjusted to sustained height.
Beneficial effects of the present invention and feature are:
Due to the fact that and have employed the design of new structure, solve existing wafer support mechanism the most easily changeable
Problem.Desired height is reached, with complete by hot plate of same method by changing corresponding ceramics pole
Support mechanism of portion is adjusted to sustained height, makes the gap between wafer with hot plate keep consistent.There is design new
Clever, rational in infrastructure, simple to operate, easy accessibility and safe and reliable feature.Can be widely applied to partly lead
Body thin film deposition arts.,
Accompanying drawing explanation
Fig. 1 is the structural representation of the present invention.
In figure, piece mark represents respectively:
1, hot plate；2, ceramic jacket；3, ceramics pole；4, clamp specially；5, chamfering；6, clamp leaves
Mouthful.
Detailed description of the invention
Embodiment
Referring to the drawings 1, a kind of wafer support mechanism being conveniently replaceable, this mechanism includes hot plate 1, pottery
Set 2, ceramics pole 3 and clamp specially 4.Described hot plate 1 is machined with circular counter bore, is put by ceramic jacket 2
Enter counterbore, then ceramics pole 3 is put into ceramic jacket 2.Described ceramic jacket 2 inner port edge is shaped with chamfering 5,
Ceramics pole 3 land portions can be made to expose, and the land portions of ceramics pole 3 is shaped with wedge-shaped slot, and clamp 4 loosens
During state, clamp opening 6 part can be enclosed within the sphere of ceramics pole 3 by the land portions of ceramics pole 3
In part, when firmly clutching clamp specially 4, the opening part of clamp is less than the diameter of ceramics pole land portions,
Upwards pull up, ceramics pole 3 can be extracted in ceramic jacket 2.
Described ceramics pole 3 top has spherical surface hill, for support wafer, measures ceramics pole with height gauge
3 spherical surface hills and the height of hot plate 1 upper surface, be higher or lower than according to the height of reality measurement and require height
Degree, entangles the wedge-shaped slot of ceramics pole, extracts ceramics pole 3, change corresponding ceramics pole with clamp specially 4
3 reach desired height, with same method, the whole support mechanisms in hot plate 1 are adjusted to sustained height
?.
Claims (2)
1. one kind is conveniently replaceable wafer support mechanism, it is characterised in that: this mechanism include hot plate (1),
Ceramic jacket (2), ceramics pole (3) and clamp specially (4), described hot plate (1) is machined with circular counter bore,
Ceramic jacket (2) is put into counterbore, then ceramics pole (3) is put into ceramic jacket (2)；Described ceramic jacket (2)
Inner port edge is shaped with chamfering (5), ceramics pole (3) land portions can be made to expose, the ball of ceramics pole (3)
Face part is shaped with wedge-shaped slot, and during clamp specially (4) relaxation state, clamp opening (6) part can be passed through
The land portions of ceramics pole (3), is enclosed within the land portions of ceramics pole (3), firmly clutches exclusive clamps
During pincers (4), the opening part of clamp specially (4), less than the diameter of ceramics pole land portions, upwards pulls up,
Ceramics pole (3) can be extracted in ceramic jacket (2).
The wafer support mechanism being conveniently replaceable the most as claimed in claim 1, it is characterised in that: described
Ceramics pole (3) top has spherical surface hill, for support wafer, measures ceramics pole (3) with height gauge
Spherical surface hill and the height of hot plate (1) upper surface, be higher or lower than according to the height of reality measurement and require
Highly, entangle the wedge-shaped slot of ceramics pole with clamp specially (4), extract ceramics pole (3), change corresponding
Ceramics pole (3) reach desired height, with same method by the whole support machines in hot plate (1)
Structure is adjusted to sustained height.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510367887.2A CN106298624B (en) | 2015-06-29 | 2015-06-29 | Wafer bearing mechanism convenient to replace and used for semiconductor film coating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510367887.2A CN106298624B (en) | 2015-06-29 | 2015-06-29 | Wafer bearing mechanism convenient to replace and used for semiconductor film coating equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106298624A true CN106298624A (en) | 2017-01-04 |
| CN106298624B CN106298624B (en) | 2020-10-30 |
Family
ID=57650501
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510367887.2A Active CN106298624B (en) | 2015-06-29 | 2015-06-29 | Wafer bearing mechanism convenient to replace and used for semiconductor film coating equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106298624B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113818003A (en) * | 2020-06-19 | 2021-12-21 | 拓荆科技股份有限公司 | Film preparation method and equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10151725A (en) * | 1996-11-25 | 1998-06-09 | Matsushita Electric Ind Co Ltd | Sheet and method for step replacement of screen printing machine |
| JP2003188068A (en) * | 2001-12-17 | 2003-07-04 | Hirata Corp | Heat treatment apparatus for substrate |
| JP2013232512A (en) * | 2012-04-27 | 2013-11-14 | Sharp Corp | Substrate processing apparatus |
| CN204760366U (en) * | 2015-06-29 | 2015-11-11 | 沈阳拓荆科技有限公司 | Removable wafer bearing structure |
-
2015
- 2015-06-29 CN CN201510367887.2A patent/CN106298624B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10151725A (en) * | 1996-11-25 | 1998-06-09 | Matsushita Electric Ind Co Ltd | Sheet and method for step replacement of screen printing machine |
| JP2003188068A (en) * | 2001-12-17 | 2003-07-04 | Hirata Corp | Heat treatment apparatus for substrate |
| JP2013232512A (en) * | 2012-04-27 | 2013-11-14 | Sharp Corp | Substrate processing apparatus |
| CN204760366U (en) * | 2015-06-29 | 2015-11-11 | 沈阳拓荆科技有限公司 | Removable wafer bearing structure |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113818003A (en) * | 2020-06-19 | 2021-12-21 | 拓荆科技股份有限公司 | Film preparation method and equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106298624B (en) | 2020-10-30 |
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Address after: No.900 Shuijia, Hunnan District, Shenyang City, Liaoning Province Patentee after: Tuojing Technology Co.,Ltd. Address before: 110179 3rd floor, No.1-1 Xinyuan street, Hunnan New District, Shenyang City, Liaoning Province Patentee before: PIOTECH Co.,Ltd. |
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