CN106298453A - A kind of method maintaining wafer back pressure stable - Google Patents
A kind of method maintaining wafer back pressure stable Download PDFInfo
- Publication number
- CN106298453A CN106298453A CN201610795383.5A CN201610795383A CN106298453A CN 106298453 A CN106298453 A CN 106298453A CN 201610795383 A CN201610795383 A CN 201610795383A CN 106298453 A CN106298453 A CN 106298453A
- Authority
- CN
- China
- Prior art keywords
- back pressure
- wafer
- wafer back
- technological requirement
- stable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a kind of method maintaining wafer back pressure stable, including: wafer is placed on electrostatic chuck；Electrostatic chuck is made to provide the pallet voltage set to wafer；It is passed through gas to wafer；Make wafer back pressure stable after being passed through gas to wafer；After wafer back pressure is stable, judge whether wafer back pressure meets technological requirement；When judging that wafer back pressure does not meets technological requirement, according to the numerical value of the pallet voltage that wafer backpressure regulation sets, then back again into second step；Judging that wafer back pressure meets technological requirement, execution processes technique.
Description
Technical field
The present invention relates to field of semiconductor manufacture, maintain wafer back pressure stable it is more particularly related to a kind of
Method.
Background technology
When wafer-process, typically after wafer arrives on electrostatic chuck, first provided a perseverance by electrostatic chuck to wafer
Fixed pallet (chuck) voltage, so that wafer is by a downward pressure, then is passed through gas at wafer rear, waits the back of the body
After pressure is stablized and arrived the range intervals of technological requirement, then start to process.
But, at wafer during stable, when the brilliant back of the body of wafer has scuffing or passivation, crystalline substance can be directly resulted in
Circle back pressure can not enter the scope of technological requirement, thus causes board alarm.When reworking, need by regulating manually
Pallet magnitude of voltage, so that after back pressure enters in the range of technological requirement, being further continued for follow-up process.
Accordingly, it is desirable to a kind of method being able to maintain that wafer back pressure is stable can be provided.
Summary of the invention
The technical problem to be solved is for there is drawbacks described above in prior art, it is provided that one is able to maintain that
The method that wafer back pressure is stable.
In order to realize above-mentioned technical purpose, according to the present invention, it is provided that a kind of method maintaining wafer back pressure stable, bag
Include:
First step: wafer is placed on electrostatic chuck；
Second step: make electrostatic chuck provide the pallet voltage set to wafer；
Third step: be passed through gas to wafer；
4th step: make wafer back pressure stable after being passed through gas to wafer；
5th step: judge whether wafer back pressure meets technological requirement after wafer back pressure is stable；
6th step: when judging that wafer back pressure does not meets technological requirement, the pallet electricity set according to wafer backpressure regulation
The numerical value of pressure, then backs again into second step.
Preferably, judging that wafer back pressure meets technological requirement, execution processes technique.
Preferably, at third step, it is passed through gas to the back side of wafer.
Preferably, read back pressure value when wafer back pressure is stablized in the 5th step by pressure meter, and judge wafer
Whether back pressure meets technological requirement.
Preferably, in the 5th step, it is judged that whether wafer back pressure meets technological requirement refers to whether judge wafer back pressure
Less than technological requirement.
Preferably, in the 5th step, judge wafer back pressure symbol when wafer back pressure is not less than the wafer back pressure of technological requirement
Close technological requirement.
Preferably, in the 5th step, judge that wafer back pressure is not inconsistent when wafer back pressure is less than the wafer back pressure of technological requirement
Close technological requirement.
Preferably, in the 6th step, when judging that wafer back pressure does not meets technological requirement, it is automatically increased according to wafer back pressure
The numerical value of the pallet voltage set.
The present invention reads back pressure value during wafer stabilizing by pressure meter, when the back pressure value read is beyond technological requirement
Scope time, the voltage of the system wafer by being automatically adjusted on pallet, so that back pressure reaches the scope of technological requirement.This
The voltage of the bright method wafer by being automatically adjusted on pallet, thus ensure that wafer back pressure is stable in the scope district of technological requirement
In, it is ensured that during wafer-process, back pressure is stable in the range intervals of technological requirement.
Accompanying drawing explanation
In conjunction with accompanying drawing, and by with reference to detailed description below, it will more easily the present invention is had more complete understanding
And its adjoint advantage and feature is more easily understood, wherein:
Fig. 1 schematically shows the flow process of the method that maintenance wafer back pressure is stable according to the preferred embodiment of the invention
Figure.
It should be noted that accompanying drawing is used for illustrating the present invention, and the unrestricted present invention.Note, represent that the accompanying drawing of structure can
Can be not necessarily drawn to scale.Further, in accompanying drawing, same or like element indicates same or like label.
Detailed description of the invention
In order to make present disclosure more clear and understandable, below in conjunction with specific embodiments and the drawings in the present invention
Appearance is described in detail.
In the present invention, read back pressure value during wafer stabilizing by pressure meter, when the back pressure value read is less than work
During the scope that skill requires, improve back pressure value by automatically increasing the voltage of the wafer on pallet, until back pressure enters technique and wants
After the scope asked, maintain this pallet voltage, until this wafer process terminates.This method is by the wafer being automatically adjusted on pallet
Voltage, thus ensure that wafer back pressure is stable in the range intervals of technological requirement.
Fig. 1 schematically shows the flow process of the method that maintenance wafer back pressure is stable according to the preferred embodiment of the invention
Figure.
As it is shown in figure 1, maintain the method that wafer back pressure is stable to include according to the preferred embodiment of the invention:
First step S1: wafer is placed on electrostatic chuck；
Second step S2: make electrostatic chuck provide the pallet voltage set to wafer；
Third step S3: be passed through gas to wafer；
In general technique, at third step S3, it is passed through gas to the back side of wafer.
4th step S4: make wafer back pressure stable after being passed through gas to wafer；
5th step S5: judge whether wafer back pressure meets technological requirement after wafer back pressure is stable；
Preferably, read back pressure value when wafer back pressure is stablized in the 5th step S5 by pressure meter, and judge crystalline substance
Whether circle back pressure meets technological requirement.
It is further preferred that in the 5th step S5, it is judged that whether wafer back pressure meets technological requirement refers to judge wafer
Whether back pressure is less than technological requirement；Judge that when wafer back pressure is not less than the wafer back pressure of technological requirement wafer back pressure meets technique
When wafer back pressure is less than the wafer back pressure of technological requirement, requirement, judges that wafer back pressure does not meets technological requirement.
6th step S6: when judging that wafer back pressure does not meets technological requirement, the pallet set according to wafer backpressure regulation
The numerical value of voltage, performs second step S2 the most again；
Preferably, the 6th step S6: when judging that wafer back pressure does not meets technological requirement, be automatically increased according to wafer back pressure
The numerical value of the pallet voltage set.
On the other hand, the 7th step S7: judging that wafer back pressure meets technological requirement, execution processes technique.
The present invention reads back pressure value during wafer stabilizing by pressure meter, when the back pressure value read is beyond technological requirement
Scope time, the voltage of the system wafer by being automatically adjusted on pallet, so that back pressure reaches the scope of technological requirement.This
The voltage of the bright method wafer by being automatically adjusted on pallet, thus ensure that wafer back pressure is stable in the scope district of technological requirement
In, it is ensured that during wafer-process, back pressure is stable in the range intervals of technological requirement.
Furthermore, it is necessary to explanation, unless stated otherwise or point out, otherwise the term in description " first ", " the
Two ", " the 3rd " etc. describe be used only for distinguishing in description each assembly, element, step etc. rather than for representing each
Logical relation between assembly, element, step or ordering relation etc..
Although it is understood that the present invention discloses as above with preferred embodiment, but above-described embodiment being not used to
Limit the present invention.For any those of ordinary skill in the art, without departing under technical solution of the present invention ambit,
Technical solution of the present invention is made many possible variations and modification by the technology contents that all may utilize the disclosure above, or is revised as
Equivalent embodiments with change.Therefore, every content without departing from technical solution of the present invention, according to the technical spirit pair of the present invention
Any simple modification made for any of the above embodiments, equivalent variations and modification, all still fall within the scope of technical solution of the present invention protection
In.
Claims (8)
1. one kind maintains the method that wafer back pressure is stable, it is characterised in that including:
First step: wafer is placed on electrostatic chuck；
Second step: make electrostatic chuck provide the pallet voltage set to wafer；
Third step: be passed through gas to wafer；
4th step: make wafer back pressure stable after being passed through gas to wafer；
5th step: judge whether wafer back pressure meets technological requirement after wafer back pressure is stable；
6th step: when judging that wafer back pressure does not meets technological requirement, the pallet voltage set according to wafer backpressure regulation
Numerical value, then backs again into second step.
The method that maintenance wafer back pressure the most according to claim 1 is stable, it is characterised in that also include the 7th step: sentencing
Determining wafer back pressure and meet technological requirement, execution processes technique.
The method that maintenance wafer back pressure the most according to claim 1 and 2 is stable, it is characterised in that at third step, Xiang Jing
The back side of circle is passed through gas.
The method that maintenance wafer back pressure the most according to claim 1 and 2 is stable, it is characterised in that pass through in the 5th step
Pressure meter reads back pressure value when wafer back pressure is stablized, and judges whether wafer back pressure meets technological requirement.
The method that maintenance wafer back pressure the most according to claim 1 and 2 is stable, it is characterised in that in the 5th step, it is judged that
Whether wafer back pressure meets technological requirement refers to judge that whether wafer back pressure is less than technological requirement.
The method that maintenance wafer back pressure the most according to claim 1 and 2 is stable, it is characterised in that in the 5th step, at crystalline substance
Circle back pressure judges that wafer back pressure meets technological requirement when being not less than the wafer back pressure of technological requirement.
The method that maintenance wafer back pressure the most according to claim 1 and 2 is stable, it is characterised in that in the 5th step, at crystalline substance
Circle back pressure judges that wafer back pressure does not meets technological requirement when being less than the wafer back pressure of technological requirement.
The method that maintenance wafer back pressure the most according to claim 1 and 2 is stable, it is characterised in that in the 6th step, sentencing
Determine wafer back pressure when not meeting technological requirement, be automatically increased the numerical value of the pallet voltage of setting according to wafer back pressure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610795383.5A CN106298453A (en) | 2016-08-31 | 2016-08-31 | A kind of method maintaining wafer back pressure stable |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610795383.5A CN106298453A (en) | 2016-08-31 | 2016-08-31 | A kind of method maintaining wafer back pressure stable |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106298453A true CN106298453A (en) | 2017-01-04 |
Family
ID=57672488
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610795383.5A Pending CN106298453A (en) | 2016-08-31 | 2016-08-31 | A kind of method maintaining wafer back pressure stable |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106298453A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010052319A1 (en) * | 2000-06-07 | 2001-12-20 | Mitsubishi Denki Kabushiki Kaisha | Plasma processing apparatus and plasma processing method |
| CN101681870A (en) * | 2007-03-12 | 2010-03-24 | 东京毅力科创株式会社 | Dynamic temperature backside gas control for improved within-substrate processing uniformity |
| CN102299091A (en) * | 2010-05-20 | 2011-12-28 | 东京毅力科创株式会社 | Plasma processing apparatus, substrate holding mechanism, and method for substrate position deviation detection |
-
2016
- 2016-08-31 CN CN201610795383.5A patent/CN106298453A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010052319A1 (en) * | 2000-06-07 | 2001-12-20 | Mitsubishi Denki Kabushiki Kaisha | Plasma processing apparatus and plasma processing method |
| CN101681870A (en) * | 2007-03-12 | 2010-03-24 | 东京毅力科创株式会社 | Dynamic temperature backside gas control for improved within-substrate processing uniformity |
| CN102299091A (en) * | 2010-05-20 | 2011-12-28 | 东京毅力科创株式会社 | Plasma processing apparatus, substrate holding mechanism, and method for substrate position deviation detection |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102707883B (en) | The method and apparatus of icon intelligent display | |
| CN104571871A (en) | Method and system for selecting files | |
| CN103793140A (en) | Application icon arranging method and mobile terminal | |
| CN106298453A (en) | A kind of method maintaining wafer back pressure stable | |
| CN107861926A (en) | Document template configuration method and device | |
| CN101511040B (en) | Method for automatically detecting display usage mode | |
| CN106250594A (en) | Method for automatically detecting Place _ Bound in PCB | |
| CN104184835A (en) | Automatic data interaction triggering method and system | |
| CN103489809A (en) | Defect detection system for particles on surface of wafer and working method of defect detection system | |
| CN103631283A (en) | Semiconductor device and temperature control method thereof and test system | |
| CN108515243B (en) | A method of making bevel gear | |
| Radeke et al. | Evaluating breakthrough curves with the method of moments for systems obeying the Langmuir isotherm | |
| CN207798046U (en) | A kind of automobile forged hub on-line detecting system | |
| Yu et al. | Construction safety management using FMEA technique for selecting priority order | |
| CN207215680U (en) | The detection tool of housing unit | |
| CN107817695A (en) | A kind of batch detection is with setting the soft spacing method and system of robot simulation | |
| CN106446463B (en) | The product nargin evaluation method of spacecraft structure | |
| CN205749148U (en) | A kind of in-site installation component static(al) classification prestrain assay device | |
| CN204639453U (en) | A kind of device preventing chopper from polluting | |
| CN105740490B (en) | A kind of dummy strain piece implementation method | |
| CN104699019B (en) | Board restores checking system and board restores the method for inspection | |
| Zheng et al. | The design of elevator control system based on PLC and configuration | |
| CN104091773B (en) | The how parallel dynamic flow control method of semiconductor manufacturing | |
| CN208275996U (en) | The automatic assembly line of punching machine exception involution | |
| CN111099289B (en) | Control equipment and method for track equipment in production line |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170104 |