CN106281169B - Structure glue applied to precast segment assembly bridge - Google Patents
Structure glue applied to precast segment assembly bridge Download PDFInfo
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- CN106281169B CN106281169B CN201610742462.XA CN201610742462A CN106281169B CN 106281169 B CN106281169 B CN 106281169B CN 201610742462 A CN201610742462 A CN 201610742462A CN 106281169 B CN106281169 B CN 106281169B
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a kind of structure glue applied to precast segment assembly bridge, the component As and B component for being 3:1 including weight fraction ratio；Wherein, every part of component A includes the following raw material: E51 epoxy resin, EL50 epoxy resin, diluent, toughener, filler, γ aminopropyltriethoxy silane, thixotropic agent and defoaming agent；Every part of B component includes the following raw material: curing agent, filler, γ aminopropyltriethoxy silane, fumed silica, iron oxide black and curing accelerator.High comprehensive performance of the present invention has preferable temperature tolerance, durability, and under the conditions of lower bound temperature, 12h compression strength is greater than 60MPa；Compression strength is greater than 80MPa for 24 hours；7d compression strength is greater than 120MPa, is a kind of high strength structural adhesion.
Description
Technical field
The present invention relates to bridge Material Fields.It is more particularly related to which a kind of be applied to precast segment assembly bridge
Structure glue.
Background technique
The design strength of bridge prefabrication box beam concrete is generally 50MPa at present, and according to construction process requirement, only exist
Intersegmental splicing glue intensity reach just can be carried out tensioning after concrete design strength and will not be in stretching process to splicing glue
It generates and destroys and influence to use.So the time that the intensity for splicing glue in splicing method bridge construction technique reaches design requirement is
Control the very crucial factor of speed of application.
Splice the requirement of method engineering construction and the requirement of the various performances of bridge itself, international prestressing force to meet bridge subsection
Association proposes sectional type assembly bridge adhesive performance and requires standard:
(1) there is preferable workability, be easy to apply and scrape and no sag, meet the requirement of brushing work, do not trickle, and it is wet
There is good caking property in base；
(2) the epoxy adhesive applicable time is greater than 30min, and the primary solidification time is greater than 1h, meets brushing, tensioning work with this
The demand of sequence working time；
(3) under the conditions of the lower bound temperature of each model structure glue Applicable temperature range, 12h compression strength is greater than 60MPa；
Compression strength is greater than 80MPa for 24 hours；7d compression strength is greater than 120MPa；
(4) epoxy adhesive should have good ageing-resistant performance, and heat distortion temperature is not less than 50 DEG C；
(5) without having corrosion to reinforcing bar and influencing the ingredient of concrete structure durability, volatile solvent (solid is free of
99%) content is greater than.
Foreign countries to the special bonding agent constructed for bridge subsection are accompanied with the research and application of this construction method
Interpromoting relation in five elements, it is studied and is paid much attention to, begins to study and widely apply early in the sixties in last century, and in the hair of construction method
Exhibition and binder gradually develop during matching.Girder segment splicing glue used in large bridge construction has at home at present
The Sika dur-31SBA glue of Sequa Corp, Switzerland production and the Araldite of Huntsman company production (love jail reaches)
XH111Normal A/B product.Wherein using it is more be Sequa Corp product, the trade mark is Sika Dur-31SBA, root
According to adaptive temperature difference, and it is divided into 02/03/04/08 type, the Applicable temperature section having nothing in common with each other.
In contrast, domestic splicing colloidality can be by taking K-801 product as an example at present, and compression strength is much not achieved international pre-
The sectional type assembly bridge adhesive performance that stress association proposes requires standard and high-intensitive bridge subsection splicing glue technology to want
It asks.
Summary of the invention
It is an object of the invention to solve at least the above problems, and provide the advantages of at least will be described later.
A further object of the invention is especially compression strength state to be much not achieved for domestic splicing colloidality at present
The sectional type assembly bridge adhesive performance that border prestressing force association proposes requires standard and high-intensitive bridge subsection to splice glue skill
The problem of art requires provides a kind of sectional type assembly bridge adhesive performance that the international prestressing force association of comprehensive performance satisfaction proposes
It is required that the structure glue of standard and high-intensitive bridge subsection splicing glue technical requirements, can increase substantially splicing method bridge construction speed
Degree.
In order to realize these purposes and other advantages according to the present invention, provide a kind of applied to precast segment assembly bridge
Structure glue, including weight fraction ratio be 3:1 component A and B component；
Wherein, every part of component A includes the following raw material of part by weight: 70-100 parts of E51 epoxy resin, EL50 ring
10-30 parts of oxygen resin, 10-20 parts of diluent, 5-10 parts of toughener, 100-150 parts of filler, gamma-amino propyl-triethoxysilicane
2-3 parts of alkane, 3-6 parts of thixotropic agent and 1-2 parts of defoaming agent；Every part of B component includes the following raw material of part by weight: solidification
0-60 parts of agent, 100-150 parts of filler, 2-3 parts of γ aminopropyltriethoxy silane, 3-6 parts of fumed silica, iron oxide black 1-2
Part and 1-3 parts of curing accelerator；
The diluent is one of benzyl glycidyl ether and CYH-277；
The structural formula of the toughener isWherein M1、M2、M3Table respectively
Show polyester, polyurethane, pfpe molecule segment；N1, n2, n3 are 0~1, and n1, n2, n3 are not 0 simultaneously；A expression epoxy group,
One of hydroxyl and carboxyl group；
The filler is gradation quartz sand: 50-100 mesh quartz sand, 200 mesh quartz sands, 300 mesh quartz sands and 400 mesh
The mass ratio of quartz sand is 2:1:1:1；
The curing agent is that polyamide-based epoxy curing agent, aliphatic amine modified amine curing agent and aromatic series change
One of property amine hardener.
Preferably, the curing accelerator is 2,4,6 ,-three-(dimethylamino methyl)-phenol.
Preferably, the polyamide-based epoxy curing agent is 651 curing agent.
Preferably, the aliphatic amine modified amine curing agent is tetra-methylenedimine.
Preferably, the aromatic modified amine hardener N, N, N', N'- tetramethyl-para-phenylene diamine.
The present invention is include at least the following beneficial effects: the structure glue high comprehensive performance in the application, is had preferable resistance to
Warm nature, durability meet the sectional type assembly bridge adhesive performance that international prestressing force association proposes and require standard and bridge
Segment high intensity splices the technical requirements of glue, can increase substantially splicing method bridge construction speed.
Further advantage, target and feature of the invention will be partially reflected by the following instructions, and part will also be by this
The research and practice of invention and be understood by the person skilled in the art.
Specific embodiment
The present invention will be further described in detail below with reference to the embodiments, to enable those skilled in the art referring to specification
Text can be implemented accordingly.
It should be noted that experimental method described in following embodiments is unless otherwise specified conventional method, institute
Reagent and material are stated, unless otherwise specified, is commercially obtained.
Embodiment 1
A kind of structure glue applied to precast segment assembly bridge, the component A and B component for being 3:1 including weight fraction ratio；
Wherein, every part of component A includes the following raw material of part by weight: 70 parts of E51 epoxy resin, EL50 asphalt mixtures modified by epoxy resin
10 parts of rouge, 10 parts of diluent, 5 parts of toughener, 100 parts of filler, 2 parts of γ aminopropyltriethoxy silane, 3 parts of thixotropic agent with
And 1 part of defoaming agent；Every part of B component includes the following raw material of part by weight: 651 curing agent of 25-45 parts by weight, filler
100 parts, 2 parts of γ aminopropyltriethoxy silane, 3 parts of fumed silica, 1 part and 1 part of curing accelerator of iron oxide black；
The diluent is benzyl glycidyl ether；
The structural formula of the toughener isWherein M1、M2、M3Respectively
Indicate polyester, polyurethane, pfpe molecule segment；N1, n2, n3 are 0~1, and n1, n2, n3 are not 0 simultaneously；A indicates epoxy
One of base, hydroxyl and carboxyl group；
The filler is gradation quartz sand: 50-100 mesh quartz sand, 200 mesh quartz sands, 300 mesh quartz sands and 400 mesh
The mass ratio of quartz sand is 2:1:1:1；
The curing accelerator is 2,4,6 ,-three-(dimethylamino methyl)-phenol.
Embodiment 2
A kind of structure glue applied to precast segment assembly bridge, the component A and B component for being 3:1 including weight fraction ratio；
Wherein, every part of component A includes the following raw material of part by weight: 100 parts of E51 epoxy resin, EL50 epoxy
30 parts of resin, 20 parts of diluent, 10 parts of toughener, 150 parts of filler, 3 parts of γ aminopropyltriethoxy silane, 6 parts of thixotropic agent
And 2 parts of defoaming agent；Every part of B component includes the following raw material of part by weight: 0-20 parts by weight tetra-methylenedimine is solid
Agent, 150 parts of filler, 3 parts of γ aminopropyltriethoxy silane, 6 parts of fumed silica, iron black 2 parts and solidification promotion
3 parts of agent；
The diluent is CYH-277；
The structural formula of the toughener isWherein M1、M2、M3Table respectively
Show polyester, polyurethane, pfpe molecule segment；N1, n2, n3 are 0~1, and n1, n2, n3 are not 0 simultaneously；A expression epoxy group,
One of hydroxyl and carboxyl group；
The filler is gradation quartz sand: 50-100 mesh quartz sand, 200 mesh quartz sands, 300 mesh quartz sands and 400 mesh
The mass ratio of quartz sand is 2:1:1:1；
The curing accelerator is 2,4,6 ,-three-(dimethylamino methyl)-phenol.
Embodiment 3
A kind of structure glue applied to precast segment assembly bridge, the component A and B component for being 3:1 including weight fraction ratio；
Wherein, every part of component A includes the following raw material of part by weight: 80 parts of E51 epoxy resin, EL50 asphalt mixtures modified by epoxy resin
20 parts of rouge, 15 parts of diluent, 8 parts of toughener, 120 parts of filler, 2 parts of Y- aminopropyltriethoxywerene werene, 4 parts of thixotropic agent and
1 part of defoaming agent；Every part of B component includes the following raw material of part by weight: N, N, N', N'- tetramethyl-para-phenylene diamine 30-60
Part, 120 parts of filler, 2 parts of Y- aminopropyltriethoxywerene werene, 5 parts of fumed silica, iron black 1 part and curing accelerator 2
Part；
The diluent is benzyl glycidyl ether；
The structural formula of the toughener isWherein M1、M2、M3Respectively
Indicate polyester, polyurethane, pfpe molecule segment；N1, n2, n3 are 0~1, and n1, n2, n3 are not 0 simultaneously；A indicates epoxy
One of base, hydroxyl and carboxyl group；
The filler is gradation quartz sand: 50-100 mesh quartz sand, 200 mesh quartz sands, 300 mesh quartz sands and 400 mesh
The mass ratio of quartz sand is 2:1:1:1；
The curing accelerator is 2,4,6 ,-three-(dimethylamino methyl)-phenol.
Embodiment 4
It is studied to splicing glue gel time and the influence of compression strength for 24 hours by changing the dosage of curing agent, wherein
A1 indicates the structure glue using the preparation of 651 curing agent, and A2 indicates the structure glue of tetra-methylenedimine curing agent preparation, and A3 indicates N,
The structure glue of N, N', N'- tetramethyl-para-phenylene diamine preparation is as a result as follows:
1, when increasing to 35 parts by weight from 25 parts by weight with the dosage of curing agent as the cementitious matter of curing agent using Al, resistance to compression
Intensity is improved from 74MPa to 80MPa accordingly, and when the dosage of curing agent continues to increase to 45 parts by weight, compression strength
It reduces instead, this is because molecular weight is small between resin crosslinking points when curing agent excess, meanwhile, extra curing agent is filled in
Among network, plasticization is played.Therefore, when the dosage of diluent is fixed, it is 35 that the dosage of curing agent, which has an optimal value,
Parts by weight.
2. using A2 as the cementitious matter of curing agent with hardener dose from 0 increase to 20 parts by weight when, intensity significantly increases
Add, when hardener dose is increased to 30 parts by weight from 20 parts by weight, compression strength continues to improve, when the dosage of curing agent is
When 30 parts by weight, intensity is up to 86MPa.
3. being further added by as 30 parts by weight of hardener dose increase to 45 parts by weight to 60 using A3 as the cementitious matter of curing agent
Parts by weight, though intensity has reduction, variation is little, therefore A3 hardener dose is that 30 parts by weight are optimal.
In numerous adhesive types, the adhesive developed using epoxy resin as base-material is with its unique superiority
Can and neo-epoxy resin, Novel curing agent and additive continue to bring out, using E51 epoxy resin and EL50 epoxy resin into
Row is compound, containing the energy cured hydroxyl of catalyzed epoxies in the molecular structure of EL50 epoxy resin, therefore E51 ring can be improved
The reactivity of oxygen resin, meanwhile, EL50 epoxy resin viscosity is low, and the E51 epoxy resin big to viscosity has preferable dilution property,
And it can prevent epoxy resin from generating crystallization.The resin based on E51 epoxy resin is added EL50 epoxy resin and is mixed,
The uniformity for having upset epoxy resinous molecular structure in mixture reduces the formation of crystallization nucleus, therefore can be significantly low
The crystallization temperature of resin mixture in this way can not only guarantee the low tempertaure storage stability for splicing glue matrix resin, Er Qiewei
Its gain in strength provides guarantee.
Although what the application selected is the low epoxy resin of molecular weight, viscosity is still higher, and 20 DEG C of E-51 viscosity are
2500mPa.S, when being lower than 15 DEG C, its viscosity is big, for the viscosity for further decreasing epoxy-resin systems, improves the flowing of glue
Property, its wetting capacity to base is improved, guarantees that colloid has preferable application property and caking property, it is necessary to suitable dilution be added
Agent, the application provide two kinds of diluents, benzyl glycidyl ether intramolecular ether-containing key and epoxy group, energy for summer and winter
Infinitely miscible with epoxy resin, dilution epoxy resin effect is good, and when solidification participates in curing reaction, forms uniform system.Especially
Contain phenyl ring in its molecular structure, it is smaller and not volatile on the influence of the modulus of structure glue, construction environment is influenced small；
CYH-277 is both epoxy resin high-performance plasticized modifier and good reactive diluent, CYH-277 be containing it is multiple oneself
The low molecule liquid polymer of ring structure and multiple active groups contains two or more phenolic hydroxyl groups etc. in strand
Polar bond, thus have good toughening performance and reactivity, can be significantly increased epoxy resin cured product impact resistance,
The physical mechanical properties such as compression resistant, cracking resistance and bond strength.Epoxy resin is diluted, common epoxy resin can be fully solved
Winter crystallization is not easy the problem of constructing.In addition, CYH-277 diluent price is low, it is ensured that splicing glue has preferable price advantage.
In summer and autumn, temperature is higher, and splicing glue gain in strength is easier to reach requirement, therefore the emphasis of formulating and master at this time
What is considered is the contradiction between the applicable time of colloid and gain in strength.Summer temp is high, and curing reaction speed is fast, diluent
It is small to intensity effect, so summer selects the diluent of benzyl glycidyl ether.And in winter, temperature is lower, curing reaction by
Temperature influences greatly, and structure glue gain in strength selects the diluent of CYH-27 at principal contradiction.
Toughener in the application is a kind of liquid polymeric that active group is had as made of different soft segment blocks
Object, the toughener be low-viscosity (mobile) liquid in the application epoxy resin and curing agent compatibility it is good, and without polysulfide rubber or
The viscosity of nitrile rubber, therefore construction is smooth, glue-line is uniform and thin, glue consumption is also than generally using the building of rubber-type toughener
Structure glue uses nearly a quarter less, has not only saved cost, but also improve performance.
Coupling agent in the application is Y- aminopropyltriethoxywerene werene, not only increases adhesive strength, and improve
Water resistance, heat resistance, moisture resistance etc., so it can be obviously improved the performance of construction structure glue.
This application provides the curing agent that three kinds are applied to different scenes, wherein contains longer fat in 651 curing agent
Sour carbochain and amino can make cured product have high elasticity and bonding force and water resistance, its workability is preferable, charge ratio
Wider, the small toxicity of example, substantially non-volatile object can be in moist metal and concrete surface construction；Tetra-methylenedimine solidification
The curing rate of agent is fast, and gain in strength is fast, can low temperature and moisture ambient cure；N, N, N', N'- tetramethyl-para-phenylene diamine were solidifying
Cheng Fare is small, and gain in strength is fast, and solidfied material heat resistance is high, and summer and autumn is suitble to use.
Curing accelerator selection 2,4,6, the dosages of-three-(dimethylamino methyl)-phenol is from when increasing to 3 parts for 1 part, power
It learns performance to have obtained largely improving, when dosage is 2 parts, compression strength for 24 hours/25 DEG C reaches 80MPa or more, continues to increase
Add dosage, gel time continues to shorten, but compression strength is substantially reduced, so curing accelerator is most preferably 2 parts by weight.
The proportion of filler has the advantages that and mutually fills between varigrained quartz sand and silicon powder in the application, energy
Paste structure the most closely knit is formed, obtained colloid does not settle when storing, stirring, application property are good well, and it is not viscous, adjust filler
Intensity after dosage is significantly increased.
Embodiment 5
Intensity test
Compression strength is to embody one of most important index of structure glue performance, and the main target of this project is to research and develop a kind of resist
Compressive Strength is higher than the high-intensitive bridge jointing application specific architecture glue of 120MPa.
The reference standard of this test is GB/T2567.1995 " the generals of test methods for properties of resin casting body "；
The method of this test are as follows: sample standing time under conditions of 23 ± 2 DEG C of temperature, relative humidity 50 ± 5% is many
In 24 hours, every group of effective sample was no less than 3.This experiment point carries out the inspection of compression strength to tri- kinds of structure glues of A1, A2, A3
Survey experiment, every kind of structure glue acquire respectively its 12h, for 24 hours, the compression strength of 48h and 7d, and sample is at 23 ± 2 DEG C of temperature, relatively
It is placed under conditions of humidity 50 ± 5%, every group of effective sample is no less than 3.
Experimental result are as follows: the compression strength of 3 kinds of structure glues increases fastly, and 12h resistance to compression reaches 60MPa or more, is higher than for 24 hours
80MPa, much higher than traditional bridge jointing glue, and 7d compression strength reaches 120MPa or more.
The comprehensive performance data of structure glue are as shown in the table in the application:
Note: working life measuring temperature is the upper limit in Applicable temperature section；
As seen from the above table, this structure glue glue high comprehensive performance has preferable temperature tolerance, durability, meets bridge section
The technical requirements of the high-intensitive splicing glue of section.
Although the embodiments of the present invention have been disclosed as above, but its is not only in the description and the implementation listed
With it can be fully applied to various fields suitable for the present invention, for those skilled in the art, can be easily
Realize other modification, therefore without departing from the general concept defined in the claims and the equivalent scope, the present invention is simultaneously unlimited
In specific details and embodiment shown and described herein.
Claims (5)
1. a kind of structure glue applied to precast segment assembly bridge, which is characterized in that the component A for being 3:1 including weight fraction ratio
And B component；
Wherein, every part of component A includes the following raw material of part by weight: 70-100 parts of E51 epoxy resin, EL50 asphalt mixtures modified by epoxy resin
10-30 parts of rouge, 10-20 parts of diluent, 5-10 parts of toughener, 100-150 parts of filler, γ aminopropyltriethoxy silane 2-3
Part, 3-6 parts of thixotropic agent and 1-2 parts of defoaming agent；Every part of B component includes the following raw material of part by weight: curing agent 0-
60 parts, 100-150 parts of filler, 2-3 parts of γ aminopropyltriethoxy silane, 3-6 parts of fumed silica, 1-2 parts of iron oxide black with
And 1-3 parts of curing accelerator, the content of curing agent is not 0；
The diluent is one of benzyl glycidyl ether and CYH-277；
The structural formula of the toughener isWherein M1、M2、M3It respectively indicates poly-
Ester, polyurethane, pfpe molecule segment；N1, n2, n3 are 0~1, and n1, n2, n3 are not 0 simultaneously；A indicates epoxy group, hydroxyl
With one of carboxyl group；
The filler is gradation quartz sand: 50-100 mesh quartz sand, 200 mesh quartz sands, 300 mesh quartz sands and 400 mesh quartz
The mass ratio of sand is 2:1:1:1；
The curing agent is polyamide-based epoxy curing agent, aliphatic amine modified amine curing agent and aromatic modified amine
One of curing agent.
2. being applied to the structure glue of precast segment assembly bridge as described in claim 1, which is characterized in that the curing accelerator
It is 2,4,6 ,-three-(dimethylamino methyl)-phenol.
3. being applied to the structure glue of precast segment assembly bridge as described in claim 1, which is characterized in that the polyamide-based ring
Oxygen resin curing agent is 651 curing agent (A1).
4. being applied to the structure glue of precast segment assembly bridge as described in claim 1, which is characterized in that the aliphatic amine changes
Property amine curing agent be tetra-methylenedimine (A2).
5. being applied to the structure glue of precast segment assembly bridge as described in claim 1, which is characterized in that described aromatic modified
Amine hardener N, N, N', N'- tetramethyl-para-phenylene diamine (A3).
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| CN201610742462.XA CN106281169B (en) | 2016-08-26 | 2016-08-26 | Structure glue applied to precast segment assembly bridge |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108929645A (en) * | 2017-05-22 | 2018-12-04 | 卡本复合材料（天津）有限公司 | Epoxy structural rubber is used in a kind of bridge subsection splicing of high thixotropic |
| CN110144184A (en) * | 2018-10-15 | 2019-08-20 | 卡本科技股份有限公司 | Epoxy structural rubber is used in a kind of bridge subsection splicing under low temperature environment |
| CN110144185A (en) * | 2018-10-29 | 2019-08-20 | 卡本科技股份有限公司 | Epoxy structural rubber is used in a kind of bridge subsection resistant to high temperature splicing |
| CN109957367A (en) * | 2019-03-24 | 2019-07-02 | 河南工业大学 | A kind of preparation method of modified epoxy type repairing concrete crack potting compound |
| CN110205069B (en) * | 2019-06-04 | 2021-05-11 | 中国铁路设计集团有限公司 | Epoxy structure adhesive for bridge segment prefabrication and splicing |
| CN110484181A (en) * | 2019-08-30 | 2019-11-22 | 南京海拓复合材料有限责任公司 | Precast Concrete Segmental Bridges epoxy structural rubber |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103468189A (en) * | 2013-08-16 | 2013-12-25 | 武汉健桥新材料科技有限公司 | Structural adhesive for building of bridge with precast segmental matching method |
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2016
- 2016-08-26 CN CN201610742462.XA patent/CN106281169B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103468189A (en) * | 2013-08-16 | 2013-12-25 | 武汉健桥新材料科技有限公司 | Structural adhesive for building of bridge with precast segmental matching method |
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