CN106273425B - 焊接热塑性结构 - Google Patents

焊接热塑性结构 Download PDF

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Publication number
CN106273425B
CN106273425B CN201610333645.6A CN201610333645A CN106273425B CN 106273425 B CN106273425 B CN 106273425B CN 201610333645 A CN201610333645 A CN 201610333645A CN 106273425 B CN106273425 B CN 106273425B
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China
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magnetic flux
base
flux
tool
flux guide
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CN106273425A (zh
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M·R·马森
M·A·尼格利
W·C·戴克斯特拉
R·J·米勒
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Boeing Co
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Boeing Co
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
    • B29C65/24—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools characterised by the means for heating the tool
    • B29C65/30—Electrical means
    • B29C65/32—Induction
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Remote Sensing (AREA)
  • Composite Materials (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Textile Engineering (AREA)
  • Transportation (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Thermal Sciences (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
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Abstract

本发明涉及用于焊接热塑性结构的方法和设备。所述设备包括基部、盖和通道。所述基部由对30KHz到350KHz范围内的频率是不透磁的材料形成。所述盖由所述材料形成。所述通道在所述基部和所述盖之间延伸。

Description

焊接热塑性结构
技术领域
本公开总体涉及复合结构的形成。更具体地，本公开涉及焊接热塑性复合结构。还更具体地，本公开涉及一种用于引导磁通来焊接包括热塑性材料的结构的方法和设备。
背景技术
飞行器的设计和制造使用的复合材料具有越来越大的百分比。复合材料用在飞行器中以降低飞行器的重量。这种降低的重量改进了性能特征，诸如有效载荷能力和燃料效率。进一步，复合材料为飞行器中的各种部件提供了更长的使用寿命。
复合材料可以是通过组合两种或更多种功能组分而产生的坚韧的轻质材料。例如，复合材料可包括约束在聚合物树脂基体中的增强纤维。用在复合材料中的树脂可包括热塑性树脂或热固性树脂。热塑性材料在加热时可变软，并在冷却时可硬化。热塑性材料能够被反复加热和冷却。热固性材料可在加热时变硬。纤维可以是单向的或可采取织造布或织物的形式。
在制造复合结构时，复合材料层通常被铺放在模具上。所述层可由片材纤维构成。这些片材可采取织物、带、丝束的形式或其它合适的形式。在某些情况下，树脂可注入或预浸渍到片材中。预浸渍有树脂的片材通常被称为预浸料。
不同的预浸料层可铺放成不同的取向，并且不同数量的层可取决于被制造的复合结构的厚度来使用。这些层可用手或者通过使用自动化装备(诸如纤维铺放系统)进行铺放。在复合材料层已被铺放在工具上之后，复合材料层可在暴露于温度和压力下时加固或固化，由此形成最终的复合部件。
三种主要接合技术一般用于复合结构：机械紧固、粘结和焊接。当两个复合部件的表面上的热塑性材料被加热至熔化或软化点并且使这两个表面接触时，创建热塑性焊接，使得熔融的热塑性材料混合。然后，这些表面保持接触，同时热塑性材料冷却到软化温度以下，以将热塑性材料熔合成热塑性焊缝。
在复合焊接中，可使用感应焊接工艺。复合部件在感应焊接工艺期间可放置成大致平行于磁通。当磁通并不大致平行于复合部件时，在复合材料中可发生非期望的加热。例如，当纤维导电时，在复合材料中可发生非期望的加热。例如，在除焊接表面之外的位置可发生加热。当频率高于30KHz时，非期望的加热可能较大。
因此，将期望具有一种考虑上述至少一些问题以及其它可能问题的方法和设备。例如，可期望具有一种允许未定位成大致平行于磁通的复合部件的感应焊接的方法和设备。
发明内容
在说明性实施方式中，提供了一种设备。所述设备包括基部、盖和通道。所述基部由对30KHz到350KHz范围内的频率是不透磁的材料形成。所述盖由所述材料形成。所述通道在所述基部和所述盖之间延伸。
在另一说明性实施方式中，提供了一种设备。所述设备包括工具和磁通引导器。所述工具包括多个管芯和多个感应线圈。所述多个管芯限定管芯空腔。所述多个感应线圈的节段被嵌入到所述多个管芯中。所述磁通引导器被定位在所述管芯空腔内。
在再一说明性实施方式中，提供了一种方法。使用工具的多个感应线圈来产生磁通。所述工具包括多个管芯和所述多个感应线圈。所述多个管芯创建管芯空腔。将所述多个感应线圈的节段嵌入到所述多个管芯中。使用定位在所述管芯空腔内的磁通引导器来引导所述磁通。
所述特征和功能可以在本公开的各实施方式中独立地实现，或者可与其它实施方式组合，其中可以参考以下描述和附图看到进一步细节。
附图说明
认为是说明性实施方式特性的新颖特征被阐述在所附权利要求书中。然而，当结合附图阅读时，说明性实施方式以及优选使用模式、进一步目标及其特征将参考本公开的说明性实施方式的以下详细描述得到最佳理解，其中：
图1是依据说明性实施方式可实施的飞行器的图示；
图2是依据说明性实施方式的制造环境的框图的图示；
图3是依据说明性实施方式的工具的立体图的图示；
图4是依据说明性实施方式的工具的横截面图的图示；
图5是依据说明性实施方式的磁通引导器和工具内的结构的横截面图的图示；
图6是依据说明性实施方式的磁通引导器和工具内的结构的横截面图的图示；
图7是依据说明性实施方式的磁通引导器和工具内的结构的横截面图的图示；
图8是依据说明性实施方式生产的结构的图示；
图9是依据说明性实施方式用于焊接热塑性结构的工艺流程图的图示；
图10是依据说明性实施方式采取框图形式的飞行器制造和保养方法的图示；以及
图11是可实施说明性实施方式采取框图形式的飞行器的图示。
具体实施方式
不同的说明性实施方式认识并考虑到许多不同的考虑。例如，说明性实施方式认识并考虑到，均匀而平行的磁通线可产生在螺管线圈的内部中。具有螺管线圈的工具可用于焊接由复合材料形成的部件以形成结构件。
目前，复合部件可包括石墨纤维或其它导电纤维。目前，对于具有石墨纤维并焊接在感应工具中的复合部件，该部件放置成大致平行于施加的振荡磁通。例如，复合加强件可放置成大致平行于施加的振荡磁通。当磁通平行于复合部件的蒙皮时，在热塑性复合部件内没有电流路径。
当部件可能不平行于由线圈产生的振荡磁通时，可能发生复合材料本身的内部感应加热。具体地，当频率高于30KHz时，非期望的加热可发生在复合部件的定位成大致垂直于振荡磁通的部分中。当复合部件大致垂直于磁通时，涡流能够在部件的表面中以圆形图案旋流。电子可以以圆形图案被从复合部件的石墨纤维驱动到石墨纤维。当复合部件大致垂直于磁通时，涡流可产生非期望的加热。
现在参照附图，并且特别是参考图1，描绘了依据说明性实施方式的飞行器的图示。在该说明性示例中，飞行器100具有附接至机体106的机翼102和机翼104。飞行器100包括附接至机翼102的发动机108并包括附接至机翼104的发动机110。
机体106具有尾段112。水平稳定器114、水平稳定器116和竖直稳定器118附接至机体106的尾段112。机体106可具有复合蒙皮120。
飞行器100是可依据说明性实施方式实施被焊接的热塑性结构的飞行器的示例。在一个说明性示例中，诸如梁、肋的结构支撑件或机翼102、机翼104或机体106的焊接到另一部件的其它结构支撑件可包括热塑性结构。例如，机体106的焊接到复合蒙皮120的结构支撑件可包括被焊接的热塑性结构。
图1中的飞行器100的图示并不意在暗示物理或架构方面限于可实施说明性配置的方式。例如，虽然飞行器100是商用飞行器，但是飞行器100可以是军用飞行器、旋翼飞行器、直升机、无人驾驶飞行器或任何其它合适的飞行器。
虽然相对于飞行器描述了说明性实施方式的说明性示例，但是说明性实施方式可应用到其它类型的平台。例如，所述平台可以是活动平台、静止平台、基于陆地的结构、基于水域的结构和基于空间的结构。更具体地，所述平台可以是水面舰艇、坦克、人员运输车、火车、宇宙飞船、空间站、卫星、潜艇、汽车、发电厂、桥梁、大坝、房子、风车、制造工厂、架构及其它合适的平台。
现在参考图2，描绘了依据说明性实施方式的制造环境的框图的图示。在该说明性示例中，图2中的制造环境200以框的形式描绘，以图示一个或多个说明性实施方式的不同部件。在该描绘的示例中，制造环境200包括工具202、结构206、磁通引导器208、控制器210、电源212、冷却剂供给装置214和传感器216。
工具202被配置成焊接结构206。如本文中使用的，焊接包括向热塑性材料施加升高的温度、升高的压力或升高的温度和压力，使得热塑性材料流动。焊接可造成接合至少两个部件以形成结构206。
工具202包括由多个支撑件220支撑的多个负载约束218。工具202还包括位于多个负载约束218内的多个管芯222。管芯空腔224可以是由多个管芯222创建的空间。管芯空腔224可配置成在固结过程中容纳结构206。
多个管芯222可由不易于感应加热的材料形成。在一些说明性示例中，多个管芯222可由陶瓷、复合材料、酚醛或一些其它期望的材料形成。在一个说明性示例中，用于多个管芯222的材料可基于热膨胀系数、耐热冲击性和抗压强度来选择。在该说明性示例中，所述材料可选择为具有低的热膨胀系数、期望的耐热冲击性和相对较高的抗压强度。在一个说明性示例中，多个管芯222可以是可浇注的熔融石英陶瓷。
如描绘的，多个管芯222包含多个感应线圈226和多个杆228。多个感应线圈226具有节段230和柔性节段232。多个感应线圈226的节段230可嵌入在多个管芯222中。在一些说明性示例中，节段230可沿着多个管芯222的每个管芯的长度延伸。多个感应线圈226的柔性节段232可接合多个管芯222中的不同管芯的节段230。在一个说明性示例中，柔性节段232可具有足够的柔性，足以随着多个管芯222的移动而移动。在一个说明性示例中，柔性节段232可具有足够的柔性来移动以连接节段230。多个感应线圈226可经由附接至柔性节段232的连接器234连接到控制器210、电源212、冷却剂供给装置214和传感器216。
控制器210可配置成控制由电源212馈送到多个感应线圈226的输入功率。通过控制输入功率，控制器210可控制由多个感应线圈226产生的磁通。通过控制由多个感应线圈226产生的磁通，控制器210可控制工具202的操作温度。
控制器210可实施在软件、硬件、固件或它们的组合中。当使用软件时，由控制器210执行的操作可实施于配置成在处理器单元上运行的程序代码中。当使用固件时，由控制器210执行的操作可实施在程序代码和数据中并储存在持久性存储器中以在处理器单元上运行。当采用硬件时，所述硬件可包括操作成执行控制器210的操作的电路。
冷却剂供给装置214可配置成将冷却剂供给到多个感应线圈226。流过多个感应线圈226的冷却剂可充当将热传送出工具202的热交换器。传感器216可配置成测量工具202的一部分在操作期间的温度。
多个杆228可嵌入多个管芯222内。多个杆228可提供对多个管芯222的加强。在一个说明性示例中，多个杆228由玻璃纤维形成。多个杆228可以旋拧在端部上并且可由多个螺母236保持到位。可装设多个螺母236以将张力施加到多个杆228。在一些说明性示例中，多个杆228可纵向地延伸穿过多个管芯222中的管芯。在一些说明性示例中，多个杆228可横向地延伸穿过多个管芯222中的管芯。在一些说明性示例中，多个杆228可既纵向又横向地延伸穿过多个管芯222中的管芯。
管芯空腔224与惰性气体供给装置238关联。在结构206固结期间，惰性气体可从惰性气体供给装置238存在于管芯空腔224中。
多个感应线圈226可生成磁通240。磁通240可在方向242上延伸。方向242可大致垂直于管芯空腔224中的多个感应线圈226。
当结构206定位在管芯空腔224中时，方向242可不平行于结构206的至少一部分。例如，当结构206定位在管芯空腔224中时，方向242可大致垂直于结构206的至少一部分。
结构206可由热塑性材料244形成。结构206可包括第一部件246和第二部件248。第一部件246和第二部件248可由若干接头250连接。第一部件246可采取蒙皮252的形式。在一些说明性示例中，当结构206位于工具202的管芯空腔224中时，蒙皮252可大致平行于磁通240的方向242。
第二部件248可具有部分254，当结构206位于工具202的管芯空腔224中时，部分254基本不平行于磁通240的方向242。在一些说明性示例中，第二部件248可采取加强件256的形式。在一些说明性示例中，加强件256可呈梯形258。在一些说明性示例中，部分254可以是加强件256的梯形258的腿。
结构206还可包括若干焊接促进剂260。若干焊接促进剂260可定位在若干接头250中。在焊接之前，若干焊接促进剂260可定位成使得若干焊接促进剂260接触第一部件246的表面和第二部件248的表面。在焊接之后，若干焊接促进剂260可包含在若干接头250中。
若干焊接促进剂260可包括智能基座262。智能基座262可由配置成当暴露于磁通240时发热的材料形成。智能基座262的材料可选自金属、金属合金、陶瓷、金属膜或任何其它合适的材料。在一些说明性示例中，智能基座262包括具有铁磁属性的金属合金。在一些说明性示例中，用于智能基座262的铁磁材料可基于期望的焊接温度来选择。例如，用于智能基座262的材料可基于铁磁材料变为非磁性的温度来选择。该温度也被称为居里温度。铁磁材料可针对智能基座262进行选择，使得铁磁材料的居里温度对应于期望的焊接温度。
智能基座262可在暴露于由多个感应线圈226产生的磁通240时发热。在焊接过程中，智能基座262可用于将热施加到结构206的若干接头250。
在一些说明性示例中，智能基座262可采取线材264的形式。当若干焊接促进剂260放置在第一部件246和第二部件248之间时，若干焊接促进剂260可放置成使得线材264大致平行于磁通240的方向242。在一些说明性示例中，若干焊接促进剂260可采取焊接带266的形式，智能基座262呈线材264的形式。
为了焊接结构206，磁通引导器208可放置到工具202的管芯空腔224中。第一部件246和第二部件248可放置在工具202中的磁通引导器208中。然后，可启用多个感应线圈226以产生磁通240。磁通引导器208可将磁通240引导到若干接头250。在一些说明性示例中，当磁通引导器208改变磁通240的方向242时，磁通引导器208可指聚集、指引或引导磁通240。在一些说明性示例中，磁通引导器208可阻挡磁通240防止其遇到部分254。
磁通引导器208包括形成通道270的若干部分268。若干部分268可具有材料属性272。材料属性272可包括磁通引导器208的导电性、可加工性、熔化温度、弹性、材料成本和其它材料特性中的至少一个的期望属性。材料属性272可包括材料是不透磁的274。当若干部分268是不透磁的274时候，磁通240无法穿过若干部分268。若干部分268的材料可阻挡磁通240。当若干部分268是不透磁的274时候，若干部分268无法阻挡磁场的所有频率。材料可针对若干部分268基于磁通240的频率276来选择。在一些说明性示例中，频率276可介于30KHz到350KHz的范围内。结果，不透磁的274可意指对具有30KHz到350KHz范围内的频率276的磁通240是不透明的。在一些说明性示例中，磁通引导器208可由铝或铝合金形成。
若干部分268可包括基部278和盖280。基部278可包括若干空腔282，若干空腔282包括空腔284。结构206可插入到基部278的空腔284中。盖280可放置在结构206上。通道270可在基部278和盖280之间延伸。磁通240无法流过基部278。基部278可防止磁通240以基本不平行的角度遇到结构206的部分(诸如部分254)。磁通240可流过通道270。通道270可引导磁通240穿过结构206的至少一部分。通道270可引导磁通240朝向若干焊接促进剂260。
在一些示例中，盖280可以是大致平面的。在一些示例中，盖280可包括突起286。突起286可延伸到空腔284中。改变突起286或空腔284中的至少一个中的形状或大小的至少一个可改变通道270的大小或形状中的至少一个。如本文中使用的，短语“……中的至少一个”在与一列条目一起使用时，意指可使用列出的条目中的一个或多个的不同组合并且列出的每个条目中仅有一个可能是需要的。例如，“条目A、条目B和条目C中的至少一个”可非限制性地包括：条目A；或条目A和条目B。该示例还可包括条目A；条目B；和条目C或条目B；以及条目C。所述条目可能是特定的物体、事物或类别。换句话说，“……中的至少一个”意指可能使用所述列中的条目的任何组合和条目数，但并非需要列中的所有条目。
在一些说明性示例中，磁通引导器208可以任选地包括若干插入件288。在一些说明性示例中，若干插入件288可由不透磁的274材料形成。若干插入件288可任选地放置在若干空腔282内。在一个可选示例中，插入件290可放置到空腔284中。第二部件248可放置在插入件290上。第一部件246可放置在第二部件248上。
在一些说明性示例中，为了向结构206的每个部件施加压力，磁通引导器208可包括若干压力施加器292。例如，可选的压力施加器294可与插入件290关联。压力施加器294可定位在基部278和插入件290之间。可启用压力施加器294以向第二部件248施加压力。
图2中的制造环境200的图示并不意在暗示物理或架构方面限于可实施说明性实施方式的方式。可使用除了或代替图示的其它部件。一些部件可能是不必要的。另外，方框的存在是为了图示一些功能部件。这些方框中的一个或多个可在说明性实施方式中实施时被组合、划分或者组合并划分成不同的方框。
例如，第二部件248可能不具有不平行于方向242的部分254。在一些说明性示例中，当结构206位于工具202的管芯空腔224中时，蒙皮252的至少一部分可基本不平行于磁通240的方向242。
作为另一示例，虽然加强件256描述为梯形258，但是加强件256可具有任何期望的形状。加强件256可为V形、U形、I形、J形、Z形、方形或任何其它期望的形状。
例如，多个杆228可代替地由除玻璃纤维之外的材料形成。在该示例中，多个加强杆可由优选不导电的材料形成。在另一示例中，多个加强杆可由导电材料形成，并且布置成使得多个加强杆不易于感应加热。
现在转向图3，描绘了依据说明性实施方式的工具的立体图的图示。在该描绘的示例中，工具300是工具202及工具202中的部件(图2中以方框的形式示出)的物理实施方案的示例。
在该说明性示例中，工具300包括第一管芯302和第二管芯304。第一管芯302和第二管芯304可以是图2的多个管芯222的物理实施方案。如描绘的，第一管芯302安装到负载约束306内，并且第二管芯304安装到负载约束308内。负载约束306和负载约束308可以是图2的多个负载约束218的物理实施方案。第一管芯302和第二管芯304可通过诸如栓接或夹紧的任何合适的紧固装置分别附接至负载约束306和负载约束308。
如描绘的，负载约束306和负载约束308安装在柱支撑件310、柱支撑件312、柱支撑件314和柱支撑件316上。柱支撑件310、柱支撑件312、柱支撑件314和柱支撑件316可以是图2的多个支撑件220的物理实施方案。负载约束306和负载约束308为第一管芯302和第二管芯304提供了承载表面。负载约束306和负载约束308可防止第一管芯302和第二管芯304在制造操作期间弯曲和开裂。负载约束306和负载约束308可由钢、铝或任何其它期望材料形成。用于负载约束306和负载约束308的材料可基于成形或固化期间存在的负载来选择。在一些说明性示例中，所述材料可以是非磁性的，以减少由多个感应线圈320产生的磁通的任何失真。在一些说明性示例中，负载约束306和负载约束308可能不存在。在这些说明性示例中，第一管芯302和第二管芯304可能足够坚固，足以防止弯曲或开裂。
第一管芯302和第二管芯304用多个杆324加强，多个杆324用多个螺母326保持。多个杆324可以是图2的多个杆228的物理实施方案。多个螺母326可以是图2的多个螺母236的物理实施方案。多个杆324纵向且横向地以格栅形式延伸穿过第一管芯302和第二管芯304。
多个感应线圈320与第一管芯302和第二管芯304关联。多个感应线圈320可以是图2的多个感应线圈226的物理实施方案。多个感应线圈320包括节段328和柔性节段330。如描绘的，节段328沿着第一管芯302和第二管芯304的长度延伸。节段328可嵌入在第一管芯302和第二管芯304中。节段328可以是图2的节段230的物理实施方案。柔性节段330接合第一管芯302和第二管芯304中的节段328。柔性节段330可以是图2的柔性节段232的物理实施方案。位于多个感应线圈320的端部处的连接器332可将多个感应线圈320连接到控制器、电源、冷却剂供给装置或其它外部工具。连接器332可以是图2的连接器234的物理实施方案。
图3的工具300的图示并不意在暗示物理或架构方面限于可实施说明性实施方式的方式。可使用除了或代替图示部件的其它部件。一些部件可能是不必要的。
例如，多个杆324可在第一管芯302和第二管芯304内仅在一个方向上延伸。作为另一示例，虽然仅描绘了第一管芯302和第二管芯304，但是工具300可另选地具有三个或更多个管芯。
现在转向图4，描绘了依据说明性实施方式的工具的横截面图的图示。视图400可以是图3的工具300的横截面图。具体地，视图400可以是图3的工具300沿着线4-4截取的横截面图。工具402可以是工具202(图2中以方框的形式示出)的物理实施方案。
如描绘的，工具402具有形成工具402的管芯空腔408的第一管芯404和第二管芯406。多个感应线圈410延伸穿过第一管芯404和第二管芯406。多个感应线圈410由柔性节段(未描绘)接合。多个杆412延伸穿过第一管芯404。多个杆414延伸穿过第二管芯406。第一管芯404和第二管芯406保持在负载约束416和负载约束418内。
多个感应线圈410产生磁通420。磁通420在垂直于管芯空腔408中的多个感应线圈410的方向422上延伸。
现在转向图5，描绘了依据说明性实施方式的磁通引导器和工具内的结构的横截面图的图示。视图500可以是磁通引导器502和图4的工具402内的结构504的视图。结构504可以是结构206(图2中以方框的形式示出)的物理实施方案。磁通引导器502可以是图2的磁通引导器208的物理实施方案。
为了焊接第一部件506和第二部件508以形成结构504，可向多个感应线圈410供电以产生磁通510。如描绘的，第一部件506可采取蒙皮的形式。如描绘的，第二部件508可采取梯形加强件的形式。焊接促进剂512定位在接头514处。焊接促进剂516定位在接头518处。焊接促进剂512和焊接促进剂516可在暴露于磁通510时生成热。使用磁通引导器502来引导磁通510。引导磁通510使得磁通510遇到焊接促进剂512和焊接促进剂516。进一步，磁通引导器502阻挡磁通510防止其遇到不平行方向上的第二部件508的腿520或腿522。
磁通引导器502包括具有空腔526的基部524。基部524可由不透磁的材料形成。所述材料可选择成对包括磁通510的频率范围是不透磁的。如描绘的，第二部件508可抵靠在空腔526内。结果，基部524可阻挡磁通510遇到第二部件508的腿520或腿522。磁通引导器502还包括盖528。如描绘的，盖528是大致平面的。盖528可由不透磁的材料形成。所述材料可选择成对包括磁通510的频率范围是不透磁的。盖528和基部524形成使磁通510流过的通道530。磁通510的路径532可通过改变通道530而改变。
视图500可以是在焊接结构504之前的视图。为了开始焊接过程，基部524可放置到工具402中。第二部件508可放置到基部524的空腔526中。焊接促进剂512和焊接促进剂516可相对于第二部件508放置。第一部件506可放置在第二部件508、焊接促进剂512和焊接促进剂516上。盖528可放置在第一部件506上。工具402可闭合以接触磁通引导器502。感应线圈410可被通电以创建磁通510。感生电流可在焊接促进剂512和焊接促进剂516中的智能基座线材周围沿圆周生成。由于智能基座线材的磁特性的衰减，加热的智能基座线材的热调平可达到期望的焊接温度。通过用第一管芯404和第二管芯406施加压力，压力可施加到磁通引导器502。一旦焊接实现，可停止向感应线圈410供能。之后，结构504可冷却并进行卸载和检查。
现在转向图6，描绘了依据说明性实施方式的磁通引导器和工具内的结构的横截面图的图示。视图600可以是磁通引导器602和图4的工具402内的结构604的视图。结构604可以是结构206(图2中以方框的形式示出)的物理实施方案。磁通引导器602可以是图2的磁通引导器208的物理实施方案。
为了焊接第一部件606和第二部件608以形成结构604，可向多个感应线圈410供电以产生磁通610。如描绘的，第一部件606可采取条的形式。如描绘的，第二部件608可采取梯形加强件的形式。焊接促进剂612定位在接头614处。焊接促进剂612可在暴露于磁通610时生成热。使用磁通引导器602来引导磁通610。引导磁通610使得磁通610遇到焊接促进剂612。进一步，磁通引导器602阻挡磁通610防止其遇到不平行方向上的第二部件608的腿616或腿618。
磁通引导器602包括具有空腔622的基部620。基部620可由不透磁的材料形成。所述材料可选择成对包括磁通610的频率范围是不透磁的。如描绘的，第一部件606和第二部件608两者均可抵靠在空腔622内。磁通引导器602还包括盖624。盖624可由不透磁的材料形成。所述材料可选择成对包括磁通610的频率范围是不透磁的。如描绘的，盖624具有突起626。盖624和基部620形成供磁通610流过的通道628。磁通610的路径630可通过改变通道628而改变。如描绘的，磁通610的路径630穿过第二部件608的腿616和腿618。
现在转向图7，描绘了依据说明性实施方式的磁通引导器和工具内的结构的横截面图的图示。视图700可以是磁通引导器702和图4的工具402内的结构704的视图。结构704可以是结构206(图2中以方框的形式示出)的物理实施方案。磁通引导器702可以是图2的磁通引导器208的物理实施方案。
为了将第一部件706焊接到第二部件708、第三部件710、第四部件712和第五部件714以形成结构704，可向多个感应线圈410供电以产生磁通716。如描绘的，第一部件706可采取蒙皮的形式。如描绘的，第二部件708、第三部件710、第四部件712和第五部件714均可采取梯形加强件的形式。若干焊接促进剂718定位在若干接头720处。若干焊接促进剂718可在暴露于磁通716时产生热。使用磁通引导器702来引导磁通716。引导磁通716使得磁通716遇到若干焊接促进剂718。进一步，磁通引导器702阻挡磁通716防止其遇到不平行方向上的第二部件708、第三部件710、第四部件712或第五部件714中的至少一个的腿。
磁通引导器702包括具有若干空腔724的基部722。基部722可由不透磁的材料形成。所述材料可选择成对包括磁通716的频率范围是不透磁的。如描绘的，若干空腔724包括第一空腔726、第二空腔728、第三空腔730和第四空腔732。如描绘的，第二部件708可抵靠在第一空腔726内。如描绘的，第三部件710可抵靠在第二空腔728内。如描绘的，第四部件712可抵靠在第三空腔730内。如描绘的，第五部件714可抵靠在第四空腔732内。
磁通引导器702还包括盖734。盖734可由不透磁的材料形成。所述材料可选择成对包括磁通716的频率范围是不透磁的。如描绘的，盖734具有弧形表面736。弧形表面736接触第一部件706。
磁通引导器702还包括若干插入件738。在一些说明性示例中，若干插入件738可由与基部722和盖734中的至少一个相同的不透磁的材料形成。若干插入件738放置在若干空腔724中。若干插入件738包括第一插入件740、第二插入件742、第三插入件744和第四插入件746。若干压力施加器748与若干插入件738关联。若干压力施加器748包括第一压力施加器750、第二压力施加器752、第三压力施加器754和第四压力施加器756。在该说明性示例中，若干压力施加器748可以是气囊758。通过启用气囊758，施加给第二部件708、第三部件710、第四部件712和第五部件714中的每个的压力可单独控制。
盖734、基部722和若干插入件738形成供磁通716流过的通道760。磁通716的路径762可通过改变通道760而改变。如描绘的，磁通716的路径762与弧形表面736大致相同。
图5至图7的图示并不意在暗示物理或架构方面限于可实施说明性实施方式的方式。可使用除了或代替图示的其它部件。一些部件可能是不必要的。
例如，磁通引导器702可能不具有若干插入件738。在一些说明性示例中，并非具有若干插入件738，磁通引导器702可具有接触第二部件708、第三部件710、第四部件712和第五部件714中的每个的基部722。在该说明性示例中，基部722是具有若干空腔724的实体，所述若干空腔配置成接触第二部件708、第三部件710、第四部件712和第五部件714中的每个。
现在转向图8，描绘了依据说明性实施方式的所产生的结构的图示。结构800可以是结构206(图2中以方框的形式示出)的物理实施方案。结构800可以是使用图7的磁通引导器702焊接的结构的物理实施方案。
结构800包括蒙皮802、加强件804、加强件806、加强件808和加强件810。加强件804、加强件806、加强件808和加强件810中的每个均可在加强件804、加强件806、加强件808或加强件810与蒙皮802之间的相应接头中具有焊接促进剂。
图1和图3至图8所示的不同部件可与图2的部件组合、与图2的部件一起使用、或两者的组合。另外，图1和图3至图8中的一些部件可以是图2中以方框的形式示出的部件可以如何实施为物理结构的说明性示例。
图9是依据说明性实施方式用于焊接热塑性结构的工艺流程图的图示。工艺900可用于引导磁通240(图2中以框的形式示出)。工艺900可阻挡磁通240防止其以基本不平行的角度遇到复合材料。
工艺900开始于：使用工具的多个感应线圈产生磁通，其中所述工具包括创建管芯空腔的多个管芯并包括多个感应线圈，其中将多个感应线圈的各节段嵌入到所述多个管芯中(操作902)。所述工具可以是图2的工具202的实施方案。
然后，工艺900使用定位在管芯空腔内的磁通引导器来引导磁通(操作904)。磁通引导器可以是图2的磁通引导器208。之后，该工艺可终止。
描绘的不同实施方式的流程图和框图图示了说明性实施方式中的设备和方法的一些可能实施方案的架构、功能性和操作。在这方面，流程图或框图中的每个方框均可表示模块、节段、功能以及操作或步骤的一部分中的至少一者。
在说明性实施方式的一些另选实施方案中，方框中指出的一个或多个功能可不按图中指出的顺序发生。例如，在某些情况下，取决于涉及的功能性，相继示出的两个方框可基本同时执行，或者各方框可能有时按相反的顺序执行。另外，可添加除了流程图或框图中图示的方框以外的其它方框。
在一个说明性示例中，工艺900可进一步包括：将磁通引导器的基部插入到管芯空腔中。所述基部可由对30KHz到350KHz范围内的频率是不透磁的材料形成。工艺900可进一步包括：相对于基部定位磁通引导器的盖以形成通道。所述盖可由所述材料形成。
在一些说明性示例中，工艺900可进一步包括：将第一部件和第二部件定位成相对于基部接合。在一些示例中，使用磁通引导器来引导磁通的步骤包括：将磁通引导到第一部件和第二部件之间的若干接头。在一些示例中，使用磁通引导器来引导磁通的步骤包括：将第一部件的基本不平行于所述多个管芯的部分与磁通屏蔽。在一些说明性示例中，工艺900进一步包括：在基部的空腔中启用压力施加器，以将压力施加到第一部件和第二部件。
可在如图10所示的飞行器制造和保养方法1000和如图11所示的飞行器1100的背景下描述本公开的说明性实施方式。首先转向图10，以框图的形式描绘了依据说明性实施方式的飞行器制造和保养方法的图示。在前期生产过程中，飞行器制造和保养方法1000可包括图11中的飞行器1100的规格和设计1002及材料采购1004。
在生产过程中，进行图11中的飞行器1100的部件和子组件制造1006以及系统整合1008。此后，图11中的飞行器1100可经过检定和交付1010以便投入服役1012。在由客户使用的服役1012期间，图11中的飞行器1100被安排进行例行维护检修1014(这可包括改造、重构、翻新及其它维护检修)。
可由系统集成商、第三方及/或经营商进行或执行飞行器制造和保养方法1000的各个过程。在这些示例中，经营商可以是客户。为了本描述之目的，系统集成商可包括但不限于任一数量的飞行器制造商与主系统分包商；第三方可包括但不限于任一数量的供应商、转包商以及供货商；并且经营商可以是航空公司、租赁公司、军事实体、服务组织等。
现在参考图11，以框图的形式描绘了可实施说明性实施方式的飞行器的图示。在该示例中，由图10中的飞行器制造和保养方法1000生产的飞行器1100可包括具有多个系统1104与内饰1106的机体1102。系统1104的示例包括推进系统1108、电气系统1110、液压系统1112以及环境系统1114中的一个或多个。可包括任一数量的其它系统。尽管示出了航空航天的示例，但是不同的说明性实施方式可应用于诸如汽车工业的其它工业。
本文中体现的设备和方法可在图10中的飞行器制造和保养方法1000的至少一个阶段期间采用。一个或多个说明性实施方式可在部件和子组件制造1006期间使用。例如，图2中以方框的形式示出的结构206可在部件和子组件制造1006期间使用图2的磁通引导器208焊接。进一步，结构206还可用于在维护检修1014期间执行替换。
说明性实施方式提供了一种用于焊接热塑性结构的方法和设备。磁通引导器改变由工具的感应线圈产生的磁通的方向。
说明性示例呈现一种包括不透磁的内模插入件的磁通引导器。所述磁通引导器可用在使用智能基座的大型线圈感应焊接中。所述磁通引导器可针对焊接工艺的多个用途具有期望的材料属性。进一步，所述磁通引导器可具有期望的材料属性，这在于所述磁通引导器对感应线圈产生的磁通的频率是不透磁的。铝可以是用于磁通引导器的一个非限制性材料的示例。铝可为磁通引导器提供期望的材料属性。
所述磁通引导器在阻挡磁通防止其遇到非期望区域方面是有效的。所述磁通引导器可仅允许期望区域(诸如智能基座)接收磁通。通过遇到智能基座，磁通可导致智能基座进行感应加热。铝是导电的并且可在铝质量的表面上产生感生电流。该电流可有效地阻挡磁通的穿透，并且可将磁通导至磁通引导器的开口。磁通引导器可在期望的方向上引导磁通。提供的设备和方法实现磁通的导向，使之平行于被焊接的复合结构的表面。所述设备和方法还可阻挡磁通防止其进入不平行于磁场的复合结构的任何表面。在一些说明性示例中，可以进行磁通引导器的水冷却，以消除任何非期望的热积聚。
磁通引导器可减少复合结构在焊接期间的任何非期望加热。磁通引导器可在期望的位置中聚集加热。例如，磁通引导器可减少复合结构的不平行于所产生的磁通的部分中的任何加热。进一步，所述磁通引导器可在复合结构的部件之间的接头位置中聚集加热。
所述磁通引导器可造成制造成本低、返修率低或制造时间短中的至少一个。例如，使用磁通引导器焊接之后的检查时间可减少。降低检查时间可减少制造时间或制造成本中的至少一个。进一步，所述磁通引导器可造成复合结构具有更高的质量。结果，很少有复合结构在焊接之后可能需要返修。
进一步，本公开包括根据以下条款的实施方式：
1、一种设备，所述设备包括：
基部，所述基部由对30KHz到350KHz范围内的频率是不透磁的材料形成；
盖，所述盖由所述材料形成；和
通道，所述通道在所述基部和所述盖之间延伸。
2、根据条款1所述的设备，所述设备进一步包括：
工具，所述工具包括限定管芯空腔的多个管芯并包括多个感应线圈，其中所述多个感应线圈的节段被嵌入到所述多个管芯中，并且其中所述基部和所述盖被定位在所述管芯空腔中。
3、根据条款1所述的设备，其中，所述基部包括空腔。
4、根据条款3所述的设备，其中，所述盖包括延伸到所述空腔中的突起。
5、根据条款3所述的设备，所述设备进一步包括：
插入件，所述插入件由所述材料形成并被定位在所述空腔中。
6、根据条款5所述的设备，所述设备进一步包括：
压力施加器，所述压力施加器定位在所述插入件和所述基部之间。
7、一种设备，所述设备包括：
工具，所述工具包括限定管芯空腔的多个管芯并包括多个感应线圈，其中所述多个感应线圈的部分被嵌入到所述多个管芯中；和
磁通引导器，所述磁通引导器定位在所述管芯空腔内。
8、根据条款7所述的设备，其中，所述磁通引导器由对30KHz到350KHz范围内的频率是不透磁的材料形成。
9、根据条款8所述的设备，其中，所述磁通引导器具有延伸穿过所述材料的通道。
10、根据条款9所述的设备，其中，所述磁通引导器包括基部和盖，其中所述基部和所述盖形成所述通道。
11、根据条款10所述的设备，其中，所述磁通引导器进一步包括：
若干插入件，所述若干插入件位于所述基部的若干空腔中。
12、根据条款10所述的设备，其中，若干空腔容纳若干压力施加器。
13、一种方法，所述方法包括：
使用工具的多个感应线圈来生成磁通，其中所述工具包括创建管芯空腔的多个管芯并包括所述多个感应线圈，其中将所述多个感应线圈的节段嵌入到所述多个管芯中；以及
使用定位在所述管芯空腔内的磁通引导器来引导所述磁通。
14、根据条款13所述的方法，所述方法进一步包括：
将所述磁通引导器的基部插入到所述管芯空腔中，其中所述基部由对30KHz到350KHz范围内的频率是不透磁的材料形成。
15、根据条款14所述的方法，所述方法进一步包括：
相对于所述基部定位所述磁通引导器的盖以形成通道，其中所述盖由所述材料形成。
16、根据条款14所述的方法，所述方法进一步包括：
将第一部件和第二部件定位成相对于所述基部接合。
17、根据条款16所述的方法，其中，使用磁通引导器来引导所述磁通的步骤包括：
将所述磁通引导至所述第一部件和所述第二部件之间的若干接头。
18、根据条款17所述的方法，其中，将所述磁通引导至所述第一部件和所述第二部件之间的若干接头的步骤包括：
将所述磁通引导穿过由所述基部和所述磁通引导器的盖形成的通道。
19、根据条款16所述的方法，其中，使用磁通引导器来引导所述磁通的步骤包括：
将所述第一部件的不平行于所述多个管芯的部分与所述磁通屏蔽。
20、根据条款16所述的方法，所述方法进一步包括：
在所述基部的空腔中启用压力施加器，以向所述第一部件和所述第二部件施加压力。
不同说明性实施方式的描述已经出于说明和描述的目的加以呈现，并非意在穷举或限于所公开形式的实施方式。许多修改和变型对本领域普通技术人员将是明显的。进一步，与其它说明性实施方式比较，不同的说明性实施方式可提供不同的特征。选择的一个或多个实施方式被选中并描述，以便最佳解释实施方式的原理、实际应用，并且使本领域普通技术人员能够理解本公开的各种实施方式，各种修改适于设想的特定用途。

Claims (13)

1.一种包括磁通引导器(208)的设备，所述磁通引导器包括：
基部(278)，所述基部(278)由对30KHz到350KHz范围内的频率是不透磁的(274)材料形成；
盖(280)，所述盖(280)由所述材料形成；和
通道(270)，所述通道(270)在所述基部和所述盖之间延伸，其中，磁通能够流过所述通道(270)，
其中，所述基部和所述盖被构成为容纳一结构，并且所述通道被构成为阻挡磁通沿不平行于所述结构的一部分的方向遇到所述结构的所述部分，所述设备进一步包括：
工具(202)，所述工具(202)包括限定管芯空腔(224)的多个管芯(222)并包括多个感应线圈(226)，其中所述多个感应线圈的节段被嵌入到所述多个管芯中，并且其中所述基部(278)和所述盖(280)被定位在所述管芯空腔中。
2.根据权利要求1所述的设备，其中，所述基部(278)包括空腔(284)。
3.根据权利要求2所述的设备，其中，所述盖(280)包括延伸到所述空腔(284)中的突起(286)。
4.根据权利要求2或3所述的设备，所述设备进一步包括：
插入件(290)，所述插入件(290)由所述材料形成并被定位在所述空腔(284)中。
5.根据权利要求4所述的设备，所述设备进一步包括：
压力施加器(294)，所述压力施加器(294)定位在所述插入件(290)和所述基部(278)之间。
6.一种使用根据权利要求1所述的设备引导磁通的方法，所述方法包括：
使用所述工具(202)的所述多个感应线圈(226)来产生所述磁通(240)；以及
使用所述磁通引导器(208)来引导所述磁通。
7.根据权利要求6所述的方法，所述方法进一步包括：
将所述磁通引导器(208)的所述基部(278)插入到所述管芯空腔(224)中。
8.根据权利要求7所述的方法，所述方法进一步包括：
相对于所述基部(278)定位所述磁通引导器(208)的所述盖(280)以形成所述通道(270)。
9.根据权利要求7所述的方法，所述方法进一步包括：
将第一部件(246)和第二部件(248)定位成相对于所述基部(278)接合。
10.根据权利要求9所述的方法，其中，使用磁通引导器(208)来引导所述磁通的步骤包括：
将所述磁通(240)引导至所述第一部件(246)和所述第二部件(248)之间的若干接头(250)。
11.根据权利要求10所述的方法，其中，将所述磁通(240)引导至所述第一部件(246)和所述第二部件(248)之间的若干接头(250)的步骤包括：
将所述磁通引导穿过所述通道(270)。
12.根据权利要求9至11中的任一项所述的方法，其中，使用磁通引导器(208)来引导所述磁通(240)的步骤包括：
将所述第一部件(246)的不平行于所述多个管芯(222)的部分与所述磁通(240)屏蔽。
13.根据权利要求9至11中的任一项所述的方法，所述方法进一步包括：
在所述基部(278)的空腔(284)中启用压力施加器(294)，以向所述第一部件(246)和所述第二部件(248)施加压力。
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