CN106270706A - A kind of large-scale thin plate milling device and method - Google Patents
A kind of large-scale thin plate milling device and method Download PDFInfo
- Publication number
- CN106270706A CN106270706A CN201610794649.4A CN201610794649A CN106270706A CN 106270706 A CN106270706 A CN 106270706A CN 201610794649 A CN201610794649 A CN 201610794649A CN 106270706 A CN106270706 A CN 106270706A
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- China
- Prior art keywords
- milling
- cutter blade
- thin plate
- ultrasonic
- elliptically vibrating
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23C—MILLING
- B23C5/00—Milling-cutters
- B23C5/16—Milling-cutters characterised by physical features other than shape
- B23C5/20—Milling-cutters characterised by physical features other than shape with removable cutter bits or teeth or cutting inserts
- B23C5/22—Securing arrangements for bits or teeth or cutting inserts
- B23C5/2204—Securing arrangements for bits or teeth or cutting inserts with cutting inserts clamped against the walls of the recess in the cutter body by a clamping member acting upon the wall of a hole in the insert
- B23C5/2234—Securing arrangements for bits or teeth or cutting inserts with cutting inserts clamped against the walls of the recess in the cutter body by a clamping member acting upon the wall of a hole in the insert for plate-like cutting inserts fitted on a ring or ring segment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23C—MILLING
- B23C3/00—Milling particular work; Special milling operations; Machines therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23C—MILLING
- B23C2270/00—Details of milling machines, milling processes or milling tools not otherwise provided for
- B23C2270/10—Use of ultrasound
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Milling Processes (AREA)
Abstract
The invention discloses a kind of large-scale thin plate milling device and method, this processing unit (plant) includes wire rod quality handle, ultrasonic elliptically vibrating cutter blade unit and shell, shell is welded on ultrasonic elliptically vibrating cutter blade unit outward flange, ultrasonic elliptically vibrating cutter blade unit is evenly distributed on the cutterhead of wire rod quality handle by bolt, being spaced 45 degree one group, wire rod quality handle is connected with milling machine spindle hole.Described ultrasonic elliptically vibrating cutter blade unit includes ultrasonic elliptically vibrating transducer body, piezoelectric ceramic piece, little handle of a knife and milling cutter blade capable of rotating positions, and piezoelectric ceramic piece is bonded on ultrasonic elliptically vibrating transducer body by resin glue.The present invention makes Milling Force during large-scale thin plate Milling Process significantly reduce, and reduces the thin plate deformation that Milling Force causes.Meanwhile, improve milling process dynamic rate, suppress the tremor produced in large-scale thin plate Milling Process, improve the stability of large-scale thin plate Milling Process system, large-scale thin plate Milling Accuracy and surface quality.
Description
Technical field
The present invention relates to Machining Technology field, a kind of large-scale thin plate milling device and method.
Background technology
Due to large-scale thin plate poor rigidity, make large-scale thin plate Milling Process is easily generated deformation and produces tremor, cause large-scale
The Milling Process lack accuracy of thin plate, machined surface quality deteriorate.Therefore, the Milling Process of large-scale thin plate is Machining Technology
One difficult problem in field.Finding by prior art documents, Han Yingfei et al. is in " Wuhan Engineering Vocational College
Report " to write articles " Milling Process of large-scale sheet member " on the 9th phase in 2010, the method is to use Test-cut met to eliminate to resonate and reasonable
The method of cooling and repeatedly timeliness, is possible to prevent the deformation after the processing of large-scale sheet member and constant product quality.But the method does not has
Have and consider how to reduce the thin plate deformation that Milling Force causes, and the mismachining tolerance produced.Additionally, it is by placing parallels raising
The rigidity of workpiece, overcomes covibration, does not accounts for how improving milling process dynamic rate, suppresses large-scale thin plate milling
The tremor produced in processing.
Summary of the invention
It is an object of the invention to provide a kind of large-scale thin plate milling device and method, based on ultrasonic elliptically vibrating
Milling cutting insert, makes Milling Force during large-scale thin plate Milling Process significantly reduce, and reduces the thin plate deformation that Milling Force causes.Meanwhile,
Improve milling process dynamic rate, suppress the tremor produced in large-scale thin plate Milling Process, improve large-scale thin plate Milling Process system
Stability, large-scale thin plate Milling Accuracy and the surface quality of system, realizes the precision milling processing of large-scale thin plate.
The purpose of the present invention is achieved through the following technical solutions: a kind of large-scale thin plate milling device, including dish milling
Handle of a knife, ultrasonic elliptically vibrating cutter blade unit and shell, shell is welded on ultrasonic elliptically vibrating cutter blade unit outward flange
On, ultrasonic elliptically vibrating cutter blade unit is evenly distributed on the cutterhead of wire rod quality handle by bolt, is spaced 45 degree one group,
Wire rod quality handle is connected with milling machine spindle hole.
Preferably, described ultrasonic elliptically vibrating cutter blade unit include ultrasonic elliptically vibrating transducer body,
Piezoelectric ceramic piece, little handle of a knife and milling cutter blade capable of rotating positions, piezoelectric ceramic piece is bonded in ultrasonic elliptically vibrating transducing by resin glue
On device body, little handle of a knife is connected with ultrasonic elliptically vibrating transducer body by screw thread, and milling cutter blade capable of rotating positions is solid by screw
It is scheduled on little handle of a knife.
The embodiment of the present invention additionally provides a kind of large-scale thin plate milling method, comprises the steps:
S1, on 4 piezoelectric ceramic pieces, add sine voltage 150 volts simultaneously, and make ultrasonic elliptically vibrating transducer
Body occurs flexible in orthogonal both direction, produces small bidimensional ultrasonic elliptically vibrating, major axis at its outfan
2-3 μm is reached with short axle；
S2, little handle of a knife is designed to cylindric, makes the bidimensional elliptical vibration that ultrasonic elliptically vibrating transducer body produces
Increasing further, major axis and short axle reach 10-12 μm；
S3, milling cutter blade capable of rotating positions is fixed on the end of little handle of a knife, and makes ultrasonic elliptical vibratory at milling cutter blade capable of rotating positions
Reach maximum at blade, by reconciling the phase contrast of bidimensional ultrasonic elliptically vibrating, make milling cutter blade capable of rotating positions in a circumferential direction
Cutting the ultrasonic elliptical vibratory course bearing of main sword, to relatively rotate velocity attitude with workpiece contrary, it is ensured that milling cutter blade capable of rotating positions cuts
Main sword is at cutting state；
S4, it is applied to sine voltage on two groups of piezoelectric ceramic pieces by regulation, milling cutter blade capable of rotating positions blade obtains:
Major axis: 10 μm, short axle: 5 μm, angle: 90 °, the ultrasonic elliptical vibratory track of resonant frequency: about 22.5kHz；Simultaneously by with
Wire rod quality handle 1 drives indexable milling cutter to be rotated and feed motion, it is achieved large-scale thin plate ultrasonic elliptical vibratory milling adds
Work.
Compared with prior art, the present invention has two obvious characteristics: (1) stalling characteristic, i.e. milling cutter rake face and chip
With workpiece stalling characteristic；(2) direction has reverse speed characterisstic, i.e. direction tool between milling cutter rake face and chip
There is reverse speed characterisstic；This causes Milling Force to be dramatically reduced, can reduce significantly deformation that large-scale thin plate causes due to Milling Force,
Effectively suppress the generation of tremor in the large-scale membrane cutting blades course of processing, the stability improving large-scale thin plate Milling Process and raising
Large-scale thin plate Milling Process precision and surface quality.
Accompanying drawing explanation
Fig. 1 is the structural representation of facing cutter device in the embodiment of the present invention.
Fig. 2 is the structural representation of ultrasonic elliptically vibrating cutter blade unit in the embodiment of the present invention.
Fig. 3 is the structural representation of embodiment of the present invention mid-game milling cutter shank.
Detailed description of the invention
Below in conjunction with specific embodiment, the present invention is described in detail.Following example will assist in the technology of this area
Personnel are further appreciated by the present invention, but limit the present invention the most in any form.It should be pointed out that, the ordinary skill to this area
For personnel, without departing from the inventive concept of the premise, it is also possible to make some deformation and improvement.These broadly fall into the present invention
Protection domain.
As shown in Figure 1-Figure 3, a kind of large-scale thin plate milling device is embodiments provided, including wire rod quality handle
1, ultrasonic elliptically vibrating cutter blade unit 2 and shell 3, shell 3 is welded on ultrasonic elliptically vibrating cutter blade unit 2 outward flange
On, ultrasonic elliptically vibrating cutter blade unit 2 is evenly distributed on the cutterhead of wire rod quality handle 1 by bolt, is spaced 45 degree one
Group, wire rod quality handle 1 is connected with milling machine spindle hole.
As in figure 2 it is shown, described ultrasonic elliptically vibrating cutter blade unit includes ultrasonic elliptically vibrating transducer originally
Body 5, piezoelectric ceramic piece 6, little handle of a knife 7 and milling cutter blade capable of rotating positions 8, it is oval that piezoelectric ceramic piece 6 is bonded in ultrasound wave by resin glue
On vibration transducer body 5, little handle of a knife 7 is connected with ultrasonic elliptically vibrating transducer body 5 by screw thread, and little handle of a knife 7 designs
It is designed to cylindric, makes the bidimensional elliptical vibration that ultrasonic elliptically vibrating transducer body 5 produces, increase further, indexable
Cutter blade 8 is fixed on little handle of a knife 7 by screw 9.
The embodiment of the present invention additionally provides a kind of large-scale thin plate milling method, comprises the steps:
S1, on 4 piezoelectric ceramic pieces 6, add sine voltage 150 volts simultaneously, and make ultrasonic elliptically vibrating transducer
Body 5 occurs flexible in orthogonal both direction, produces small bidimensional ultrasonic elliptically vibrating at its outfan, long
Axle and short axle reach 2-3 μm；
S2, being designed to cylindric by little handle of a knife 7, the bidimensional ellipse making ultrasonic elliptically vibrating transducer body 5 produce shakes
Dynamic increase further, major axis and short axle reach 10-12 μm；
S3, milling cutter blade capable of rotating positions 8 is fixed on the end of little handle of a knife 7, and makes ultrasonic elliptical vibratory at indexable milling cutter
Reach maximum at sheet blade, by reconciling the phase contrast of bidimensional ultrasonic elliptically vibrating, make indexable milling cutter in a circumferential direction
It is contrary that the ultrasonic elliptical vibratory course bearing of the sheet main sword of cutting relatively rotates velocity attitude with workpiece, it is ensured that milling cutter blade capable of rotating positions is cut
Cut main sword at cutting state；
S4, it is applied to sine voltage on two groups of piezoelectric ceramic pieces 6 by regulation, on milling cutter blade capable of rotating positions blade
Arrive: major axis: 10 μm, short axle: 5 μm, angle: 90 °, the ultrasonic elliptical vibratory track of resonant frequency: about 22.5kHz；Lead to simultaneously
Cross and drive indexable milling cutter 8 to be rotated and feed motion with wire rod quality handle 1, it is achieved large-scale thin plate ultrasonic elliptical vibratory milling
Cut processing.
When being originally embodied as carrying out large-scale thin plate Milling Process based on the facing cutter device that ultrasonic elliptically vibrating designs, milling
Cutter blade produces ultrasonic elliptically vibrating on Milling Process circumferential level face, the elliptical vibration maximal rate on circumference is tangential
During more than the rotary cutting speed of edge of milling cutter tangential direction, milling cutter rake face separates with between chip and workpiece, generally
Processing conditions set and to meet this condition.After each high frequency machining cycle just starts, ultrasonic elliptically vibrating
Edge of milling cutter vibration velocity diametrically be less than the chip rate of outflow, the direction between milling cutter rake face and chip with
Chip flow outgoing direction is contrary, hinders chip to flow out；After this, ultrasonic elliptically vibrating milling cutter vibration velocity diametrically is gradually
Increasing, when the vibration velocity of the direction is more than the chip rate of outflow, the direction between milling cutter rake face and chip is sent out
Raw reversion, different from common fly cutter machining worm wheel, at this moment the direction of frictional force is identical with chip flow outgoing direction, promotes chip flow
Go out, make average Milling Force be dramatically reduced.Ultrasonic elliptically vibrating milling cutter rake face separates with between chip and workpiece
Direction generation reverse speed characterisstic between characteristic and milling cutter rake face and chip, can make Milling Force during large-scale thin plate milling
Significantly reduce, the deformation that large-scale thin plate is caused by Milling Force can be significantly reduced, can effectively suppress large-scale thin plate Milling Process
During the generation of tremor, improve large-scale thin plate Milling Process precision and surface quality.
High frequency positive negative pulse stuffing function characterizes the process of the separation ultrasonic elliptically vibrating milling cutter large-scale thin plate of processing can use following formula
Represent:
In formula:
tbMilling cutter processing start time in a dither cycle
tiIn each dither cycle, the direction generation reversion between milling cutter rake face and chip starts
Moment
teIn a dither cycle, processing ends the moment
The T ultrasonic elliptically vibrating cycle
N=0,1,2 ...
This high frequency positive negative pulse stuffing function journey characterizes the separation during large-scale thin plate processed by ultrasonic elliptically vibrating milling cutter
Characteristic and frictional direction reverse speed characterisstic, to significantly reducing the deformation of large-scale thin plate, effectively suppressing large-scale thin plate Milling Process mistake
The generation of tremor in journey, improve the stability of large-scale thin plate Milling Process system and improve machining accuracy and the surface of large-scale thin plate
Quality has important impact.
Above the specific embodiment of the present invention is described.It is to be appreciated that the invention is not limited in above-mentioned
Particular implementation, those skilled in the art can make various deformation or amendment within the scope of the claims, this not shadow
Ring the flesh and blood of the present invention.
Claims (3)
1. one kind large-scale thin plate milling device, it is characterised in that include wire rod quality handle, ultrasonic elliptically vibrating cutter blade list
Unit and shell, shell is welded on ultrasonic elliptically vibrating cutter blade unit outward flange, ultrasonic elliptically vibrating cutter blade unit
Being evenly distributed on the cutterhead of wire rod quality handle by bolt, be spaced 45 degree one group, wire rod quality handle is connected with milling machine spindle hole.
One the most according to claim 1 large-scale thin plate milling device, it is characterised in that described ultrasound wave is oval
Vibration cutter blade unit includes ultrasonic elliptically vibrating transducer body, piezoelectric ceramic piece, little handle of a knife and milling cutter blade capable of rotating positions,
Piezoelectric ceramic piece is bonded on ultrasonic elliptically vibrating transducer body by resin glue, and little handle of a knife is ellipse with ultrasound wave by screw thread
Circular vibration transducer body is connected, and milling cutter blade capable of rotating positions is fixed by screws on little handle of a knife.
3. one kind large-scale thin plate milling method, it is characterised in that comprise the steps:
S1, on 4 piezoelectric ceramic pieces, add sine voltage 150 volts simultaneously, and make ultrasonic elliptically vibrating transducer body
Orthogonal both direction occurs flexible, produces small bidimensional ultrasonic elliptically vibrating at its outfan, major axis and
Short axle reaches 2-3 μm；
S2, being designed to cylindric by little handle of a knife, the bidimensional elliptical vibration making ultrasonic elliptically vibrating transducer body produce enters one
Step increases, and major axis and short axle reach 10-12 μm；
S3, milling cutter blade capable of rotating positions is fixed on the end of little handle of a knife, and makes ultrasonic elliptical vibratory at milling cutter blade capable of rotating positions blade
Place reaches maximum, by reconciling the phase contrast of bidimensional ultrasonic elliptically vibrating, makes milling cutter blade capable of rotating positions cut in a circumferential direction
It is contrary that the ultrasonic elliptical vibratory course bearing of main sword relatively rotates velocity attitude with workpiece, it is ensured that milling cutter blade capable of rotating positions cuts main sword
At cutting state；
S4, it is applied to sine voltage on two groups of piezoelectric ceramic pieces by regulation, milling cutter blade capable of rotating positions blade obtains: be long
Axle: 10 μm, short axle: 5 μm, angle: 90 °, the ultrasonic elliptical vibratory track of resonant frequency: about 22.5kHz；Simultaneously by with dish
Milling cutter shank 1 drives indexable milling cutter to be rotated and feed motion, it is achieved large-scale thin plate ultrasonic elliptical vibratory Milling Process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610794649.4A CN106270706A (en) | 2016-08-31 | 2016-08-31 | A kind of large-scale thin plate milling device and method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610794649.4A CN106270706A (en) | 2016-08-31 | 2016-08-31 | A kind of large-scale thin plate milling device and method |
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| CN106270706A true CN106270706A (en) | 2017-01-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610794649.4A Pending CN106270706A (en) | 2016-08-31 | 2016-08-31 | A kind of large-scale thin plate milling device and method |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1745965A (en) * | 2005-09-15 | 2006-03-15 | 上海交通大学 | Elliptical ultrasonic vibration inhibition |
| CN101942547A (en) * | 2010-07-13 | 2011-01-12 | 北京航空航天大学 | Ultrasonic elliptical vibration extrusion device and vibration extrusion processing method for carrying out surface finishing of part by using same |
| CN202963590U (en) * | 2012-11-14 | 2013-06-05 | 遵义宏港机械有限公司 | Processing device for organic glass material |
| CN103817355A (en) * | 2014-03-04 | 2014-05-28 | 哈尔滨工业大学 | Bending mode supersonic vibration auxiliary cutting device for precision or ultra-precision turning |
-
2016
- 2016-08-31 CN CN201610794649.4A patent/CN106270706A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1745965A (en) * | 2005-09-15 | 2006-03-15 | 上海交通大学 | Elliptical ultrasonic vibration inhibition |
| CN101942547A (en) * | 2010-07-13 | 2011-01-12 | 北京航空航天大学 | Ultrasonic elliptical vibration extrusion device and vibration extrusion processing method for carrying out surface finishing of part by using same |
| CN202963590U (en) * | 2012-11-14 | 2013-06-05 | 遵义宏港机械有限公司 | Processing device for organic glass material |
| CN103817355A (en) * | 2014-03-04 | 2014-05-28 | 哈尔滨工业大学 | Bending mode supersonic vibration auxiliary cutting device for precision or ultra-precision turning |
Non-Patent Citations (1)
| Title |
|---|
| 马春翔等: "超声波椭圆振动切削技术", 《机械工程学报》 * |
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Application publication date: 20170104 |
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