CN106252262A - The spray structure of wafer - Google Patents
The spray structure of wafer Download PDFInfo
- Publication number
- CN106252262A CN106252262A CN201610881590.2A CN201610881590A CN106252262A CN 106252262 A CN106252262 A CN 106252262A CN 201610881590 A CN201610881590 A CN 201610881590A CN 106252262 A CN106252262 A CN 106252262A
- Authority
- CN
- China
- Prior art keywords
- spray
- spray head
- wafer
- controller
- vertical cylinder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention relates to the spray structure of a kind of wafer, including the wafer support stage being fixedly installed in frame and be positioned at the spray head installing plate above wafer support stage, being installed with multiple vertical cylinder on described spray head installing plate, the piston-rod lower end of described vertical cylinder is installed with spray head and diastimeter；Also including that a controller, the outfan of described diastimeter are connected with the input of controller, the outfan of described controller is connected with the stroke controlling unit of vertical cylinder.The present invention uses detection spray distance in real time, and regulates in real time, improves the uniformity of spray.
Description
Technical field
The present invention relates to technical field of integrated circuits, particularly to the sprinkling equipment of wafer.
Background technology
In semiconductor coated film technique, spray head is generally used to spray high-temperature metal gas facing to wafer, in order to ensure spray
Uniformity, need by spray head flatten so that the distance between all spray heads and wafer is equal.The spray knot used at present
Structure, before can only spraying, the height and position to spray head regulates, and cannot regulate in real time during spraying, thus due to spray process
The change of middle spray head height, causes the phenomenon that there is also non-uniform spraying.
Summary of the invention
The problems referred to above existed for prior art, applicant studies and improves, it is provided that the spray knot of a kind of wafer
Structure, can regulate spray height, it is ensured that uniformly spray in real time.
In order to solve the problems referred to above, the present invention uses following scheme:
The spray structure of a kind of wafer, including the wafer support stage being fixedly installed in frame and be positioned in wafer support stage
The spray head installing plate of side, described spray head installing plate is installed with multiple vertical cylinder, the piston of described vertical cylinder
Bar lower end is installed with spray head and diastimeter；Also including a controller, the outfan of described diastimeter is defeated with controller
Entering end to connect, the outfan of described controller is connected with the stroke controlling unit of vertical cylinder.
The method have technical effect that:
The present invention uses detection spray distance in real time, and regulates in real time, improves the uniformity of spray.
Accompanying drawing explanation
Fig. 1 is the structural representation of the present invention.
In figure: 1, wafer support stage；2, spray head installing plate；3, vertical cylinder；4, spray head；5, diastimeter；6, wafer.
Detailed description of the invention
Below in conjunction with the accompanying drawings the detailed description of the invention of the present invention is described further.
As it is shown in figure 1, the spray structure of the wafer of the present embodiment, including the wafer support stage 1 being fixedly installed in frame
And it is positioned at the spray head installing plate 2 above wafer support stage 1, spray head installing plate 2 is installed with multiple vertical cylinder 3,
The piston-rod lower end of vertical cylinder 3 is installed with spray head 4 and diastimeter 5；Present invention additionally comprises a controller, diastimeter 5
Outfan be connected with the input of controller, the outfan of controller is connected with the stroke controlling unit of vertical cylinder 3.
During use, detect the distance between spray head 4 and wafer 6 by diastimeter 5, when the distance of detection is more than or less than
During the distance set, controller sends signal to the stroke controlling unit of corresponding vertical cylinder 3, thus controls vertical cylinder 3
Piston rod extension elongation, until detecting distance is equal to original setpoint distance.
Embodiment provided above is the better embodiment of the present invention, is only used for the convenient explanation present invention, not to this
Bright make any pro forma restriction, any art has usually intellectual, if without departing from the carried skill of the present invention
In the range of art feature, utilize the Equivalent embodiments that the done local of disclosed technology contents is changed or modified, and
Without departing from the technical characteristic content of the present invention, all still fall within the range of the technology of the present invention feature.
Claims (1)
1. the spray structure of a wafer, it is characterised in that: include the wafer support stage (1) being fixedly installed in frame and be positioned at
The spray head installing plate (2) of wafer support stage (1) top, described spray head installing plate (2) is installed with multiple vertical gas
Cylinder (3), the piston-rod lower end of described vertical cylinder (3) is installed with spray head (4) and diastimeter (5)；
Also include that a controller, the outfan of described diastimeter (5) are connected with the input of controller, the output of described controller
End is connected with the stroke controlling unit of vertical cylinder (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610881590.2A CN106252262A (en) | 2016-10-09 | 2016-10-09 | The spray structure of wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610881590.2A CN106252262A (en) | 2016-10-09 | 2016-10-09 | The spray structure of wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106252262A true CN106252262A (en) | 2016-12-21 |
Family
ID=57612497
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610881590.2A Withdrawn CN106252262A (en) | 2016-10-09 | 2016-10-09 | The spray structure of wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106252262A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113178374A (en) * | 2021-04-21 | 2021-07-27 | 长鑫存储技术有限公司 | Semiconductor processing apparatus and control method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5947134A (en) * | 1996-09-23 | 1999-09-07 | Samsung Electronics Co., Ltd. | Scrubbing equipment for a semiconductor device using laser distance sensor to automatically adjust brush height above the wafer |
| JPH11260782A (en) * | 1998-03-09 | 1999-09-24 | Oki Electric Ind Co Ltd | Substrate cleaning equipment |
| US20050058775A1 (en) * | 2003-07-31 | 2005-03-17 | Akio Oku | Method and apparatus for forming coating film |
| CN105772323A (en) * | 2014-12-18 | 2016-07-20 | 沈阳芯源微电子设备有限公司 | Semiconductor made thick photoresist film coating device and application method thereof |
-
2016
- 2016-10-09 CN CN201610881590.2A patent/CN106252262A/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5947134A (en) * | 1996-09-23 | 1999-09-07 | Samsung Electronics Co., Ltd. | Scrubbing equipment for a semiconductor device using laser distance sensor to automatically adjust brush height above the wafer |
| JPH11260782A (en) * | 1998-03-09 | 1999-09-24 | Oki Electric Ind Co Ltd | Substrate cleaning equipment |
| US20050058775A1 (en) * | 2003-07-31 | 2005-03-17 | Akio Oku | Method and apparatus for forming coating film |
| CN105772323A (en) * | 2014-12-18 | 2016-07-20 | 沈阳芯源微电子设备有限公司 | Semiconductor made thick photoresist film coating device and application method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113178374A (en) * | 2021-04-21 | 2021-07-27 | 长鑫存储技术有限公司 | Semiconductor processing apparatus and control method thereof |
| CN113178374B (en) * | 2021-04-21 | 2022-06-10 | 长鑫存储技术有限公司 | Semiconductor processing apparatus and control method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20161221 |