CN106247254A - A kind of LED headlamp with semiconductor cooling device - Google Patents
A kind of LED headlamp with semiconductor cooling device Download PDFInfo
- Publication number
- CN106247254A CN106247254A CN201610790860.9A CN201610790860A CN106247254A CN 106247254 A CN106247254 A CN 106247254A CN 201610790860 A CN201610790860 A CN 201610790860A CN 106247254 A CN106247254 A CN 106247254A
- Authority
- CN
- China
- Prior art keywords
- cooling device
- semiconductor cooling
- light source
- lamp body
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
- F21V17/164—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting the parts being subjected to bending, e.g. snap joints
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/54—Cooling arrangements using thermoelectric means, e.g. Peltier elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/767—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
Abstract
The present invention relates to a kind of LED headlamp with semiconductor cooling device, belong to automotive lighting field.Specifically, LED light source part, lamp body housing portion and heat sink part should mainly be included with the LED headlamp of semiconductor cooling device.LED light source is mounted on substrate top surface, forms LED light source part；LED shell arranges window, it is simple to LED light source goes out light；Heat sink part includes radiator and semiconductor cooling device.LED light source part is set among lamp body housing portion and heat sink part；Rotate screens and be sheathed on lamp body housing portion.The present invention has the advantages such as simple in construction and radiating effect are good.
Description
Technical field
The present invention relates to automotive lighting field, particularly relate to a kind of LED headlamp with semiconductor cooling device.
Background technology
Automobile front is the core component in automotive lighting field, is not only necessary at driving at night, in daily driving
During meeting etc. also can play the biggest effect.The most existing a part of headlight uses LED scheme.Trace it to its cause still
Be LED headlamp have energy-conservation, brightness is high, life-span length, response is fast, luminescence unit is little, moulding is abundant and attractive in appearance advantage.Existing
In commercially available a certain amount of use.
Although LED headlamp the most commercially has certain occupancy volume, but it is also to hinder that LED obtains heat dissipation problem always
Its development.Therefore, it is badly in need of developing the LED headlamp of a kind of high efficiency and heat radiation.
Summary of the invention
The present invention is exactly for solving the problems referred to above and to provide a kind of LED headlamp with semiconductor cooling device, main
By semiconductor refrigerating technology, LED chip is effectively dispelled the heat.
The present invention is to solve that above-mentioned technical problem is achieved through the following technical solutions:
A kind of LED headlamp with semiconductor cooling device, including LED light source part, lamp body housing portion, revotating card
Position, heat sink part and electric wire, described LED light source part one end is sheathed in lamp body housing portion, and the other end is sheathed on heat radiation
In device part, described LED light source part include LED light source and substrate, described heat sink part include semiconductor cooling device and
Radiator.
Further, being provided with groove in described radiator, described semiconductor cooling device is arranged in groove.
Further, described semiconductor cooling device and described substrate and described radiator are close to arrange and contact surface setting
Lead heat-curable glue.
Further, described LED light source uses middle temperature tin cream to be affixed on described substrate.
Further, described lamp body housing portion includes that lamp body shell, described lamp body shell are provided with and is easy to LED light source and goes out
The housing window of light.
Further, described rotation screens is set in described lamp body housing portion.
Further, described electric wire exports from described heat sink part bottom.
Further, described spreader surface arranges radiating fin.
Further, described lamp body housing portion is made up of upper and lower two housings, and described upper-lower casing is fixed by screw.
Further, described lamp body housing portion includes that housing window and shell, described housing window are arranged on shell
And be correspondingly arranged with described LED light source.
Beneficial effects of the present invention: present configuration is simple, convenient and practical, has good radiating effect, simultaneously facilitates
Install and replace.
Accompanying drawing explanation
Fig. 1 is the LED light source partial schematic diagram of the present invention；
Fig. 2 is lamp body housing portion and the heat sink part structural representation of the present invention；
Fig. 3 is the internal structure schematic diagram of Fig. 2；
Fig. 4 is the population structure schematic diagram of the present invention；
Wherein: 1-LED light source part, 101-LED light source, 102-substrate, 2-lamp body housing portion, 201-housing window,
202-shell, 203-screw, 3-heat sink part, 301-semiconductor cooling device, 302-radiator, 4-rotate screens, 5-electricity
Line.
Detailed description of the invention
The present invention is further illustrated below in conjunction with the accompanying drawings.
As it is shown in figure 1, the LED light source part 1 of a kind of LED headlamp with semiconductor cooling device, it includes LED light
Source 101 and substrate 102, LED light source 101 utilizes middle temperature tin cream to be mounted on substrate 102 top surface, and LED light source part is whole
Quantity in individual LED headlamp is 2, and the material of substrate 102 is copper.
As in figure 2 it is shown, the lamp body housing portion 2 of a kind of LED headlamp with semiconductor cooling device and radiator portion
Dividing 3, lamp body housing portion 2 includes housing window 201, shell 202, and housing window 201 is arranged on shell 202, it is simple to LED light
Source 101 goes out light, and half heat sink part 3 includes semiconductor cooling device 301 and radiator 302.It is provided with recessed in radiator 302
Groove, semiconductor cooling device 301 is arranged among the groove of radiator 302, semiconductor cooling device 301 and substrate 102 and scattered
Setting is close to by hot device 302 and contact surface arranges and leads heat-curable glue, it is simple to efficiently quick, and heat radiation radiator 302 is provided with heat radiating fin
Sheet, it is simple to high efficiency and heat radiation.
As shown in Figures 1 to 3, the LED light source part 1 of a kind of LED headlamp with semiconductor cooling device, lamp body shell
Part 2 and radiator 3 part, LED light source part 1 is set among lamp body housing portion 2 and heat sink part 3, LED light source portion
Dividing 1 one end to be sheathed in lamp body housing portion 2, the other end is sheathed in heat sink part 3, and LED light source 101 is just from shell window
Passing in mouth 201, substrate 102 is close to semiconductor cooling device 301, and both contact surfaces scribble and lead heat-curable glue.
As shown in Figures 1 to 4, the overall construction drawing of a kind of LED headlamp with semiconductor cooling device, including LED light
Source part 1, lamp body housing portion 2, heat sink part 3 and other parts, other parts mainly include rotating screens 4 and electric wire 5.
Lamp body housing portion 2 and heat sink part 3 quantity are 2, and it utilizes screw 203 to fasten；Rotate screens 4 and be set in lamp body shell
In part 2, it is simple to the installation of this LED car lamp；Electric wire 5 exports from heat sink part 3 bottom.
The invention discloses a kind of LED headlamp with semiconductor cooling device, the advantage with high efficiency and heat radiation.
The above, only presently preferred embodiments of the present invention, it is impossible to limit, with this, the scope that the present invention implements, the most greatly
All simple equivalence changes made according to patent application the scope of the claims and description of the present invention and modification, the most still belong to the present invention special
In the range of profit contains.
Claims (9)
1. the LED headlamp with semiconductor cooling device, it is characterised in that: include LED light source part, lamp body housing department
Dividing, rotate screens, heat sink part and electric wire, described LED light source part one end is sheathed in lamp body housing portion, other end set
Being located in heat sink part, described LED light source part includes that LED light source and substrate, described heat sink part include quasiconductor system
Device for cooling and radiator.
A kind of LED headlamp with semiconductor cooling device the most according to claim 1, it is characterised in that: described scattered
Being provided with groove in hot device, described semiconductor cooling device is arranged in groove.
A kind of LED headlamp with semiconductor cooling device the most according to claim 1 and 2, it is characterised in that: described
Semiconductor cooling device and described substrate and described radiator are close to setting and contact surface arranges and leads heat-curable glue.
A kind of LED headlamp with semiconductor cooling device the most according to claim 1, it is characterised in that: described LED
Light source uses middle temperature tin cream to be affixed on described substrate.
A kind of LED headlamp with semiconductor cooling device the most according to claim 1, it is characterised in that: described lamp
Body case part includes that lamp body shell, described lamp body shell are provided with and is easy to LED light source and goes out the housing window of light.
A kind of LED headlamp with semiconductor cooling device the most according to claim 1, it is characterised in that: described rotation
Turn screens to be set in described lamp body housing portion.
A kind of LED headlamp with semiconductor cooling device the most according to claim 1, it is characterised in that: described electricity
Line exports from described heat sink part bottom.
A kind of LED headlamp with semiconductor cooling device the most according to claim 1, it is characterised in that: described scattered
Hot device surface configuration radiating fin.
A kind of LED headlamp with semiconductor cooling device the most according to claim 1, it is characterised in that: described lamp
Body case part is made up of upper and lower two housings, and described upper-lower casing is fixed by screw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610790860.9A CN106247254A (en) | 2016-08-31 | 2016-08-31 | A kind of LED headlamp with semiconductor cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610790860.9A CN106247254A (en) | 2016-08-31 | 2016-08-31 | A kind of LED headlamp with semiconductor cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106247254A true CN106247254A (en) | 2016-12-21 |
Family
ID=58079599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610790860.9A Pending CN106247254A (en) | 2016-08-31 | 2016-08-31 | A kind of LED headlamp with semiconductor cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106247254A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112097221A (en) * | 2020-09-23 | 2020-12-18 | 济南得德环保科技有限公司 | LED headlight bulb system with semiconductor refrigeration and heat pipe double heat dissipation |
| CN112097220A (en) * | 2020-09-23 | 2020-12-18 | 济南得德环保科技有限公司 | LED headlight bulb system with semiconductor refrigeration and heat pipe double heat dissipation |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102331800A (en) * | 2011-05-18 | 2012-01-25 | 东南大学 | Multi-heat-source temperature touch representing device |
| CN202532778U (en) * | 2012-05-03 | 2012-11-14 | 南昌奥特多电器有限公司 | Improved liquid heat exchanger of electronic temperature box |
| CN202930743U (en) * | 2012-02-02 | 2013-05-08 | 袁志雷 | Small constant-temperature laser module |
| CN104048244A (en) * | 2014-06-30 | 2014-09-17 | 上海信耀电子有限公司 | Automobile lamp device with semiconductor cooler |
| CN203880570U (en) * | 2014-03-26 | 2014-10-15 | 皇家飞利浦有限公司 | Led lamp and lamp |
| CN204693248U (en) * | 2014-12-01 | 2015-10-07 | 东莞市耀弘光电有限公司 | A kind of LED automobile head lamp |
| CN204829639U (en) * | 2015-08-07 | 2015-12-02 | 潘殿波 | LED car light |
| CN205026543U (en) * | 2015-09-18 | 2016-02-10 | 王�华 | Heat dissipation type car headlight |
| CN206072928U (en) * | 2016-08-31 | 2017-04-05 | 广州光为照明科技有限公司 | A kind of LED headlamp with semiconductor cooling device |
-
2016
- 2016-08-31 CN CN201610790860.9A patent/CN106247254A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102331800A (en) * | 2011-05-18 | 2012-01-25 | 东南大学 | Multi-heat-source temperature touch representing device |
| CN202930743U (en) * | 2012-02-02 | 2013-05-08 | 袁志雷 | Small constant-temperature laser module |
| CN202532778U (en) * | 2012-05-03 | 2012-11-14 | 南昌奥特多电器有限公司 | Improved liquid heat exchanger of electronic temperature box |
| CN203880570U (en) * | 2014-03-26 | 2014-10-15 | 皇家飞利浦有限公司 | Led lamp and lamp |
| CN104048244A (en) * | 2014-06-30 | 2014-09-17 | 上海信耀电子有限公司 | Automobile lamp device with semiconductor cooler |
| CN204693248U (en) * | 2014-12-01 | 2015-10-07 | 东莞市耀弘光电有限公司 | A kind of LED automobile head lamp |
| CN204829639U (en) * | 2015-08-07 | 2015-12-02 | 潘殿波 | LED car light |
| CN205026543U (en) * | 2015-09-18 | 2016-02-10 | 王�华 | Heat dissipation type car headlight |
| CN206072928U (en) * | 2016-08-31 | 2017-04-05 | 广州光为照明科技有限公司 | A kind of LED headlamp with semiconductor cooling device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112097221A (en) * | 2020-09-23 | 2020-12-18 | 济南得德环保科技有限公司 | LED headlight bulb system with semiconductor refrigeration and heat pipe double heat dissipation |
| CN112097220A (en) * | 2020-09-23 | 2020-12-18 | 济南得德环保科技有限公司 | LED headlight bulb system with semiconductor refrigeration and heat pipe double heat dissipation |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161221 |