CN106244061A - Manufacture method for high temperature resistant acrylic adhesive tape - Google Patents

Manufacture method for high temperature resistant acrylic adhesive tape Download PDF

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Publication number
CN106244061A
CN106244061A CN201610617968.8A CN201610617968A CN106244061A CN 106244061 A CN106244061 A CN 106244061A CN 201610617968 A CN201610617968 A CN 201610617968A CN 106244061 A CN106244061 A CN 106244061A
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Prior art keywords
acrylic acid
acid adhesive
parts
matte acrylic
resistance matte
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Inventor
金闯
张庆杰
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Sidike New Materials Jiangsu Co Ltd
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Sidike New Materials Jiangsu Co Ltd
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Priority to CN201610617968.8A priority Critical patent/CN106244061A/en
Publication of CN106244061A publication Critical patent/CN106244061A/en
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/10—Homopolymers or copolymers of methacrylic acid esters
    • C09J133/12—Homopolymers or copolymers of methyl methacrylate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/14—Methyl esters, e.g. methyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/04—Presence of homo or copolymers of ethene
    • C09J2423/046—Presence of homo or copolymers of ethene in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2477/00—Presence of polyamide
    • C09J2477/006—Presence of polyamide in the substrate

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

A kind of manufacture method for high temperature resistant acrylic adhesive tape of the present invention, comprising the following steps: the first step. preparation resistance matte acrylic acid adhesive, this resistance matte acrylic acid adhesive is obtained by following technique further: methyl methacrylate, ethyl acrylate and dimethyldiethoxysilane is added in toluene and carries out mechanical agitation acquisition polymer solution；Pre-dispersed liquid, polymer solution after modulation are mixed and be sequentially added into rosin resin, note olefine resin, azo-compound, N nitroso compound, carries out mechanical high-speed stirring and ultrasonic stirring, thus obtain resistance matte acrylic acid adhesive mixture；The heating in the environment sealed of resistance matte acrylic acid adhesive mixture is obtained described resistance matte acrylic acid adhesive；Second step. the surface formation resistance matte acrylic acid that the resistance matte acrylic acid adhesive that the first step obtains is coated on substrate layer sticks layer.The present invention improves resistance to elevated temperatures, and the stability of the viscosity under difference variation.

Description

Manufacture method for high temperature resistant acrylic adhesive tape
Technical field
The present invention relates to a kind of adhesive tape manufacture method, particularly to a kind of manufacturer for high temperature resistant acrylic adhesive tape Method.
Background technology
Acrylic acid adhesive for sticking in another kind of object by certain object.People produce for various furniture or electronics The visual requirements such as the style of product, color are more paid attention to, and therefore the outward appearance of electronic product is particularly important, and this is to adhesive tape Requirement more and more higher, it is often necessary to adhesion strength is strong and thickness is at relatively thin adhesive tape.For electronic product or other product Product, once use adhesive tape, then need this adhesive tape can maintain viscosity in the case of difference variation is big always, and can easily by Adhesive is peeled off from thin film, and secondly, prior art, under taking into account other performances such as uniformity, improves cloudy surface roughness and there is bottle Neck.
Summary of the invention
The present invention provides a kind of manufacture method for high temperature resistant acrylic adhesive tape, and this is used for high temperature resistant acrylic adhesive tape Manufacture method improves the cloudy surface Coating Surface Roughness uniformity with mould release coating layer touch, solve the leaching membrane layer of release paper with The technical problem that mould release coating binding force is unstable, is conducive to peeling off and avoid remain pressure sensitive adhesive and residued in by mould release On pressure-sensitive adhesive layer.
For reaching above-mentioned purpose, the technical solution used in the present invention is: a kind of manufacture for high temperature resistant acrylic adhesive tape Method, comprises the following steps:
The first step. preparation resistance matte acrylic acid adhesive, this resistance matte acrylic acid adhesive is obtained by following technique further:
Step 1. is by 0.4 part of micron order SiO2Powder body, 0.45 part of micron order Al2O3Powder body and 0.8 part of silane coupler add 15 Part butanone carries out ultrasonic Treatment and obtains pre-dispersed liquid；
Step 2. is by 2.3 parts of nanoscale SiO2Powder body, 1.6 parts of nanoscale Al2O3Powder body and isocyanates 0.6 part addition are pre-dispersed Liquid carries out ultrasonic Treatment and obtains pre-dispersed liquid after modulation；
Methyl methacrylate 78 parts, ethyl acrylate 30 parts and dimethyldiethoxysilane 17 parts are added 26 by step 3. Part toluene carries out mechanical agitation and obtains polymer solution；
Pre-dispersed liquid, the polymer solution of step 3 after the modulation of step 2 are mixed and are sequentially added into rosin resin 6 by step 4. Part, note olefine resin 3.2 parts, azo-compound 1.2 parts, N-nitroso compound 5.2 parts, carry out mechanical high-speed stirring and ultrasound wave Stirring, thus obtain resistance matte acrylic acid adhesive mixture；
The heating in the environment sealed of the resistance matte acrylic acid adhesive mixture of step 4 is obtained described cloudy surface propylene by step 5. Acid adhesive；
Second step. the surface that the resistance matte acrylic acid adhesive that the first step obtains is coated on substrate layer forms cloudy surface acrylic acid Adhesive layer；
3rd step. the resistance matte acrylic acid obtained at second step sticks another surface of layer laminating separated type material layer.
The technical scheme improved further in technique scheme is as follows:
1., in such scheme, described substrate layer is the one in PE thin layer, PP thin layer, PA thin layer, PC thin layer.
2. in such scheme, in the described first step, solvent evaporation obtained is collected, and condensation is reclaimed.
3., in such scheme, described 3rd step is the most further comprising the steps of: the 4th step. baking；5th step. rolling.
Owing to technique scheme is used, the present invention compared with prior art has following advantages and an effect:
1. the present invention is for the manufacture method of high temperature resistant acrylic adhesive tape, and it uses nanoscale and micron order SiO2Powder body, Al2O3 Powder body and methyl methacrylate, ethyl acrylate, dimethyldiethoxysilane is common in mechanical agitation and ultrasonic stirring Effect acts on jointly with silane coupler, isocyanates, the most single use nanoscale or micron order SiO2Powder body, Al2O3Powder Body, improves acrylic acid adhesive roughness, is also beneficial to SiO2Powder body, Al2O3Powder body is uniformly distributed and dividing in system Dissipate；Secondly, azo-compound, the addition of N-nitroso compound, it also avoid SiO2Powder body, Al2O3Powder body is in system Sedimentation, improves and base material adhesion.
2. the present invention is for the manufacture method of high temperature resistant acrylic adhesive tape, rosin resin, note olefine resin and methacrylic acid Methyl ester, ethyl acrylate, dimethyldiethoxysilane acts on jointly, it is to avoid know clearly by SiO2Powder body, Al2O3Powder body adds leads The decline of the resistance to elevated temperatures caused, improves resistance to elevated temperatures, and the stability of the viscosity under difference variation, thus improves The reliability of product.
Detailed description of the invention
Below in conjunction with embodiment, the invention will be further described:
Embodiment: a kind of manufacture method for high temperature resistant acrylic adhesive tape, comprises the following steps:
The first step. preparation resistance matte acrylic acid adhesive, this resistance matte acrylic acid adhesive is obtained by following technique further:
Step 1. is by 0.4 part of micron order SiO2Powder body, 0.45 part of micron order Al2O3Powder body and 0.8 part of silane coupler add 15 Part butanone carries out ultrasonic Treatment and obtains pre-dispersed liquid；
Step 2. is by 2.3 parts of nanoscale SiO2Powder body, 1.6 parts of nanoscale Al2O3Powder body and isocyanates 0.6 part addition are pre-dispersed Liquid carries out ultrasonic Treatment and obtains pre-dispersed liquid after modulation；
Methyl methacrylate 78 parts, ethyl acrylate 30 parts and dimethyldiethoxysilane 17 parts are added 26 by step 3. Part toluene carries out mechanical agitation and obtains polymer solution；
Pre-dispersed liquid, the polymer solution of step 3 after the modulation of step 2 are mixed and are sequentially added into rosin resin 6 by step 4. Part, note olefine resin 3.2 parts, azo-compound 1.2 parts, N-nitroso compound 5.2 parts, carry out mechanical high-speed stirring and ultrasound wave Stirring, thus obtain resistance matte acrylic acid adhesive mixture；
The heating in the environment sealed of the resistance matte acrylic acid adhesive mixture of step 4 is obtained described cloudy surface propylene by step 5. Acid adhesive；
Second step. the surface that the resistance matte acrylic acid adhesive that the first step obtains is coated on substrate layer 1 forms cloudy surface acrylic acid Adhesive layer 2；
3rd step. the resistance matte acrylic acid obtained at second step sticks another surface of layer 2 laminating separated type material layer 3；
4th step. baking；
5th step. rolling.
In the above-mentioned first step, solvent evaporation obtained is collected, and condensation is reclaimed.
Above-mentioned substrate layer uses PE thin layer.
Using above-mentioned when the manufacture method of high temperature resistant acrylic adhesive tape, it uses nanoscale and micron order SiO2Powder Body, Al2O3Powder body and methyl methacrylate, ethyl acrylate, dimethyldiethoxysilane stirs in mechanical agitation and ultrasound wave Mix common effect jointly to act on silane coupler, isocyanates, the most single use nanoscale or micron order SiO2Powder body, Al2O3Powder body, improves acrylic acid adhesive roughness, is also beneficial to SiO2Powder body, Al2O3Powder body is uniformly distributed and in system Dispersion；Secondly, azo-compound, the addition of N-nitroso compound, it also avoid SiO2Powder body, Al2O3Powder body is in system In sedimentation, improve and base material adhesion.
Above-described embodiment, only for technology design and the feature of the explanation present invention, its object is to allow person skilled in the art Scholar will appreciate that present disclosure and implements according to this, can not limit the scope of the invention with this.All according to the present invention The equivalence that spirit is made changes or modifies, and all should contain within protection scope of the present invention.

Claims (3)

1. the manufacture method for high temperature resistant acrylic adhesive tape, it is characterised in that: comprise the following steps:
The first step. preparation resistance matte acrylic acid adhesive, this resistance matte acrylic acid adhesive is obtained by following technique further:
Step 1. is by 0.4 part of micron order SiO2Powder body, 0.45 part of micron order Al2O3Powder body and 0.8 part of silane coupler add 15 Part butanone carries out ultrasonic Treatment and obtains pre-dispersed liquid；
Step 2. is by 2.3 parts of nanoscale SiO2Powder body, 1.6 parts of nanoscale Al2O3Powder body and isocyanates 0.6 part addition are pre-dispersed Liquid carries out ultrasonic Treatment and obtains pre-dispersed liquid after modulation；
Methyl methacrylate 78 parts, ethyl acrylate 30 parts and dimethyldiethoxysilane 17 parts are added 26 by step 3. Part toluene carries out mechanical agitation and obtains polymer solution；
Pre-dispersed liquid, the polymer solution of step 3 after the modulation of step 2 are mixed and are sequentially added into rosin resin 6 by step 4. Part, note olefine resin 3.2 parts, azo-compound 1.2 parts, N-nitroso compound 5.2 parts, carry out mechanical high-speed stirring and ultrasound wave Stirring, thus obtain resistance matte acrylic acid adhesive mixture；
The heating in the environment sealed of the resistance matte acrylic acid adhesive mixture of step 4 is obtained described cloudy surface propylene by step 5. Acid adhesive；
Second step. the surface that the resistance matte acrylic acid adhesive that the first step obtains is coated on substrate layer forms cloudy surface acrylic acid Adhesive layer；
3rd step. the resistance matte acrylic acid obtained at second step sticks another surface of layer laminating separated type material layer.
Manufacture method for high temperature resistant acrylic adhesive tape the most according to claim 1, it is characterised in that: described substrate layer For PC thin layer.
Manufacture method for high temperature resistant acrylic adhesive tape the most according to claim 1, it is characterised in that: the described 3rd Step is the most further comprising the steps of: the 4th step. baking；5th step. rolling.
CN201610617968.8A 2014-01-09 2014-01-09 Manufacture method for high temperature resistant acrylic adhesive tape Pending CN106244061A (en)

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CN201610617968.8A CN106244061A (en) 2014-01-09 2014-01-09 Manufacture method for high temperature resistant acrylic adhesive tape
CN201410008862.9A CN104774568A (en) 2014-01-09 2014-01-09 Preparation method of mist-surface adhesive tape

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CN201610617718.4A Pending CN106189907A (en) 2014-01-09 2014-01-09 The manufacture method of high-bond pressure sensitive adhesive tape
CN201610778322.8A Pending CN106281094A (en) 2014-01-09 2014-01-09 Preparation method for resistance matte acrylic acid band
CN201610617969.2A Pending CN106189908A (en) 2014-01-09 2014-01-09 Acrylic pressure sensitive adhesive tape
CN201610617968.8A Pending CN106244061A (en) 2014-01-09 2014-01-09 Manufacture method for high temperature resistant acrylic adhesive tape
CN201410008862.9A Pending CN104774568A (en) 2014-01-09 2014-01-09 Preparation method of mist-surface adhesive tape
CN201610617695.7A Pending CN106189906A (en) 2014-01-09 2014-01-09 Manufacture method for acrylic adhesive tape

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CN201610617718.4A Pending CN106189907A (en) 2014-01-09 2014-01-09 The manufacture method of high-bond pressure sensitive adhesive tape
CN201610778322.8A Pending CN106281094A (en) 2014-01-09 2014-01-09 Preparation method for resistance matte acrylic acid band
CN201610617969.2A Pending CN106189908A (en) 2014-01-09 2014-01-09 Acrylic pressure sensitive adhesive tape

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CN201610617695.7A Pending CN106189906A (en) 2014-01-09 2014-01-09 Manufacture method for acrylic adhesive tape

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CN109589445A (en) * 2018-12-05 2019-04-09 广东高璐美数码科技有限公司 A kind of improved aqueous medical pressure sensitive adhesive band of antiperspirant and preparation method thereof
CN109795207B (en) * 2019-01-08 2021-02-02 信维通信（江苏）有限公司 Electromagnetic shielding sheet and manufacturing method thereof

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CN1977015A (en) * 2005-01-19 2007-06-06 Lg化学株式会社 Acrylic pressure-sensitive adhesive composition with good re-workability
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CN104774568A (en) 2015-07-15

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Application publication date: 20161221