CN106229293B - The manufacturing method of flexible organic LED display device and panel - Google Patents
The manufacturing method of flexible organic LED display device and panel Download PDFInfo
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- CN106229293B CN106229293B CN201610632182.3A CN201610632182A CN106229293B CN 106229293 B CN106229293 B CN 106229293B CN 201610632182 A CN201610632182 A CN 201610632182A CN 106229293 B CN106229293 B CN 106229293B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L2021/775—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate comprising a plurality of TFTs on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
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Abstract
The invention discloses the manufacturing methods of a kind of flexible organic LED display device and panel.The manufacturing method of flexible organic LED display device includes: A, forms flexible organic LED display panel；B, flexible organic LED display panel is connect with driving circuit and power supply；Step A includes: a1, the first pothole array layer and the second pothole array layer, the first pothole array layer and the overlapping of the second pothole array layer is arranged on flexible substrates；A2, buffer layer is set on flexible substrates, at least part of buffer layer fills the first pothole and the second pothole；A3, switching device layer is set on the buffer layer；A4, display device layer is set on switching device layer；A5, cover board is set on display device layer.The present invention effectively improves flexible organic LED display panel to the tolerance of bending operation or folding operation.
Description
Technical field
The present invention relates to flexible display technologies field, in particular to a kind of flexible organic LED display device and face
The manufacturing method of plate.
Background technique
In traditional flexible Organic Light Emitting Diode (OLED, Organic Light Emitting Diode) display panel
Switching device layer be typically all to be arranged on flexible substrates.
Traditional flexible organic LED display panel allows to be bent or fold.
It is described in above-mentioned traditional flexible organic LED display panel after the bending of certain number or folding
Switching device layer is easy to be detached from the substrate portion or be all detached from, the reason is that at least one of the switching device
The cohesive force divided between the flexible base board breaks ring by bending operation or folding operation.
Therefore, the unbearable multiple bending of above-mentioned traditional flexible organic LED display panel or folding use
Restricted lifetime.
Summary of the invention
The purpose of the present invention is to provide the manufacturing method of a kind of flexible organic LED display device and panel,
The flexible organic LED display panel can be effectively improved to the tolerance of bending operation or folding operation, so as to
Improve the service life of the flexible organic LED display panel.
To solve the above problems, technical scheme is as follows:
A kind of manufacturing method of flexibility organic LED display device, the described method comprises the following steps: A, being formed
Flexible organic LED display panel；B, by the flexible organic LED display panel and driving circuit and power supply
Connection；Wherein, the step A includes: a1, the first pothole array layer and the second pothole array layer is arranged on flexible substrates,
In, the flexible base board includes display area and peripheral region, the first pothole array layer and the second pothole array layer
Overlapping, the first pothole array layer include at least two first potholes, and the second pothole array layer includes at least two second recessed
Hole, first pothole and second pothole are respectively positioned at the display area, and first pothole has the first depth, institute
The second pothole is stated with the second depth, first depth is less than second depth, and first pothole is in the flexible base
The first projection and second Projection Division of second pothole in the plane where the flexible base board in plane where plate
Divide overlapping or all overlapping, the flexible base board is plastic base；A2, buffer layer is set on the flexible base board, it is described slow
It rushes layer to be located at the display area, at least part of the buffer layer fills first pothole and second pothole；
A3, switching device layer is set on the buffer layer, the switching device layer includes that scan line, data line, thin film transistor (TFT) are opened
It closes；A4, display device layer is set on the switching device layer；A5, cover board is set on the display device layer, wherein institute
Cover board is stated to be connected at the peripheral region with the flexible base board.
In the manufacturing method of above-mentioned flexible organic LED display device, the step A further include: a6, in institute
State at peripheral region setting sealant component, wherein the sealant component at the peripheral region with the cover board and institute
State flexible base board contact, the sealant component be used to seal at the peripheral region cover board and the flexible base board it
Between gap, structure is mixed in the sealant component and consolidates particle, the structure consolidates particle for reinforcing the sealing
The structural strength of glue component.
In the manufacturing method of above-mentioned flexible organic LED display device, it is plastics that the structure, which consolidates particle,
Grain.
In the manufacturing method of above-mentioned flexible organic LED display device, the step A further include: a7, in institute
State setting securing structure at peripheral region, wherein the fixing component is used for the cover board and institute at the peripheral region
Flexible base board is stated mutually to fix.
In the manufacturing method of above-mentioned flexible organic LED display device, the step a4 includes: a41, in institute
It states and planarization layer is set on switching device layer；A42, anode layer is set on the planarization layer；A43, on the anode layer
Hole injection layer is set；A44, hole transmission layer is set on the hole injection layer；A45, it sets on the hole transport layer
Set luminous material layer；A46, electron transfer layer is set on the luminous material layer；A47, it is arranged on the electron transport layer
Electron injecting layer；A48, cathode layer is set on the electron injecting layer.
A kind of manufacturing method of flexibility organic LED display panel, the described method comprises the following steps: C, soft
Property substrate on the first pothole array layer and the second pothole array layer are set, wherein the flexible base board includes display area and outer
Region, the first pothole array layer and the second pothole array layer overlapping are enclosed, the first pothole array layer includes at least
Two first potholes, the second pothole array layer include at least two second potholes, and first pothole and second pothole are equal
At the display area, first pothole have the first depth, second pothole have the second depth, described first
Depth is less than second depth, first projection and described the of first pothole in the plane where the flexible base board
Second projection section overlapping or all overlapping of two potholes in the plane where the flexible base board, the flexible base board is modeling
Expect substrate；D, buffer layer is set on the flexible base board, and the buffer layer is located at the display area, the buffer layer
At least part fills first pothole and second pothole；E, switching device layer is set on the buffer layer, it is described
Switching device layer includes scan line, data line, thin film transistor switch；F, display device is set on the switching device layer
Layer；G, cover board is set on the display device layer, wherein the cover board at the peripheral region with the flexible base board phase
Even.
In the manufacturing method of above-mentioned flexible organic LED display panel, the method also includes following steps:
H, at the peripheral region be arranged sealant component, wherein the sealant component at the peripheral region with the lid
Plate and flexible base board contact, the sealant component are used to seal the cover board and the flexibility at the peripheral region
Gap between substrate is mixed with structure in the sealant component and consolidates particle, and the structure consolidates particle for reinforcing institute
State the structural strength of sealant component.
In the manufacturing method of above-mentioned flexible organic LED display panel, it is plastics that the structure, which consolidates particle,
Grain.
In the manufacturing method of above-mentioned flexible organic LED display panel, the method also includes following steps:
I, securing structure is set at the peripheral region, wherein the fixing component is used for the lid at the peripheral region
Plate is mutually fixed with the flexible base board.
In the manufacturing method of above-mentioned flexible organic LED display panel, the step F includes: f1, described
Planarization layer is set on switching device layer；F2, anode layer is set on the planarization layer；F3, it is arranged on the anode layer
Hole injection layer；F4, hole transmission layer is set on the hole injection layer；F5, setting shines on the hole transport layer
Material layer；F6, electron transfer layer is set on the luminous material layer；F7, electron injection is set on the electron transport layer
Layer；F8, cathode layer is set on the electron injecting layer.
Compared with the prior art, the present invention can effectively improve the flexible organic LED display panel to bending operation
Or the tolerance of folding operation, so as to improve the service life of the flexible organic LED display panel.
Detailed description of the invention
Fig. 1 is the flow chart of the manufacturing method of flexible organic LED display device of the invention.
The flow chart for the step of Fig. 2 is the formation flexibility organic LED display panel in Fig. 1.
Fig. 3 is flow chart the step of display device layer is arranged on switching device layer in Fig. 2.
Specific embodiment
With reference to Fig. 1, Fig. 2 and Fig. 3, Fig. 1 is the manufacturing method of flexible organic LED display device of the invention
The flow chart of the step of flow chart, Fig. 2 is the formation flexibility organic LED display panel in Fig. 1, Fig. 3 is in Fig. 2
In the flow chart for the step of display device layer is arranged on switching device layer.
The manufacturing method of flexible organic LED display device of the invention the following steps are included:
A, flexible organic LED display panel is formed.
B, the flexible organic LED display panel is connect with driving circuit and power supply.
Wherein, the step A includes:
A1, the first pothole array layer and the second pothole array layer are set on flexible substrates, wherein the flexible base board packet
Include display area and peripheral region, the first pothole array layer and the second pothole array layer overlapping, first pothole
Array layer include at least two first potholes, the second pothole array layer include at least two second potholes, first pothole and
Second pothole is respectively positioned at the display area, and first pothole has the first depth, and second pothole has the
Two depth, first depth are less than second depth, and first pothole is in the plane where the flexible base board
First projection is Chong Die with second projection section of second pothole in the plane where the flexible base board or is all overlapped,
The flexible base board is plastic base.
A2, buffer layer is set on the flexible base board, the buffer layer is located at the display area, the buffer layer
At least part fill first pothole and second pothole.
A3, switching device layer is set on the buffer layer, the switching device layer includes scan line, data line, film
Transistor switch.
A4, display device layer is set on the switching device layer.
A5, cover board is set on the display device layer, wherein the cover board at the peripheral region with the flexibility
Substrate is connected.
In the above-mentioned methods, the step A further include:
A6, sealant component is set at the peripheral region, wherein the sealant component is at the peripheral region
Contacted with the cover board and the flexible base board, the sealant component be used to seal at the peripheral region cover board with
Gap between the flexible base board is mixed with structure in the sealant component and consolidates particle, and the structure consolidates particle use
In the structural strength for reinforcing the sealant component.
In the above-mentioned methods, it is plastic grain that the structure, which consolidates particle,.
In the above-mentioned methods, the step A further include:
A7, securing structure is set at the peripheral region, wherein the fixing component is used at the peripheral region
The cover board is mutually fixed with the flexible base board.
In the above-mentioned methods, the step a4 includes:
A41, planarization layer is set on the switching device layer.
A42, anode layer is set on the planarization layer.
A43, hole injection layer is set on the anode layer.
A44, hole transmission layer is set on the hole injection layer.
A45, luminous material layer is set on the hole transport layer.
A46, electron transfer layer is set on the luminous material layer.
A47, electron injecting layer is set on the electron transport layer.
A48, cathode layer is set on the electron injecting layer.
Through the above technical solutions, can effectively improve the flexible organic LED display panel to bending operation
Or the tolerance of folding operation, so as to improve the service life of the flexible organic LED display panel.
As an improvement after the step a4, and before the step a5, the step A further include:
A8, buffer protection plate is formed, wherein the buffer protection plate includes flexible plate body and sphere.
A9, the buffer protection plate is set between the cover board and the cathode layer.
Wherein, the step a8 includes:
A81, it is arranged to accommodate on the flexible plate body and cheats array, receiving hole array includes at least two receiving holes, appearance
Na Keng has opening portion, and the opening portion is towards the cover board.
A82, the setting sphere, the sphere are flexibly connected with receiving hole in the receiving is cheated, the sphere
For being in contact with the cover board, and for the sliding in the receiving is cheated, and in the flexible organic light-emitting diodes
Movable supporting is carried out to the cover board according to the bending situation of the cover board when pipe display panel is bent, so that the cover board and institute
The spacing stated between cathode layer is maintained within a predetermined range.
That is, the sphere is used to move back in receiving hole in the flexible organic LED display panel bending
It is reduced to predetermined position, to carry out movable supporting to the cover board in the predetermined position, wherein the predetermined position is to be conducive to
The position of the cover board bending.
Wherein, the depth for accommodating hole is less than the diameter of the sphere.
The buffer protection plate further includes at least two flexible connection chain combinations, and the flexible connection chain combination includes at least four
It is flexibly connected chain.The step a8 further include:
A83, the four flexible connection chains in the flexible connection chain are connected with the sphere and receiving hole.
Specifically, the step a83 are as follows:
Described one end for being flexibly connected chain is connect with the side wall for accommodating hole, and is flexibly connected the another of chain for described
One end is connect with the sphere.
The step A further include:
A10, anti-static coating is coated on the sphere.
A11, in the cover board towards being coated with anti-static coating on the surface of the flexible plate body.
The corresponding shape in hole that accommodates is round or regular polygon.
As an improvement the buffer protection plate further includes structural strengthening component array, the step a8 further include:
A84, the structural strengthening component array, institute are set backwards to the one side for accommodating hole array in the flexible plate body
Stating structural strengthening component array includes at least two structural strengthening components.
The position of the structural strengthening component is corresponding with the position for accommodating hole.The structural strengthening component is used for institute
It states flexible plate body and carries out structural strengthening at the corresponding position in hole in described accommodate.
The area of the structural strengthening component is greater than the area for accommodating hole, and the structural strengthening component is described
The projection covering projection for accommodating hole on the flexible plate body on flexible plate body.
The structural strengthening component is mutually fixed with the cathode layer.
The structural strengthening component is rigid member.
The step a8 further include:
A85, through-hole is set at the bottom for accommodating hole, the through-hole is through the flexible plate body.
A86, the inner wall setting becket in the through-hole.
A87, the flexible connection chain is passed through into the becket, and is connect with the structural strengthening component, that is, the work
Dynamic connection chain passes through the flexible plate body and connect with the structural strengthening component.
The becket is for protecting the through-hole, to prevent the through-hole under the rubbing action for being flexibly connected chain
Damage.Expand to be beneficial to prevent the area of the through-hole.
The buffer protection plate further includes at least two connecting rods, the step a8 further include:
The connecting rod is connect with the two structural strengthening components, the connecting rod is flexible link.
Wherein, the gap location between the two structural strengthening components is arranged in the flexible link.The connecting rod with it is described
Structural strengthening component is flexibly connected.
In conclusion although the present invention has been disclosed above in the preferred embodiment, but above preferred embodiment is not to limit
The system present invention, those skilled in the art can make various changes and profit without departing from the spirit and scope of the present invention
Decorations, therefore protection scope of the present invention subjects to the scope of the claims.
Claims (4)
1. a kind of manufacturing method of flexibility organic LED display device, which is characterized in that the method includes following steps
It is rapid:
A, flexible organic LED display panel is formed；
B, the flexible organic LED display panel is connect with driving circuit and power supply；
Wherein, the step A includes:
A1, the first pothole array layer and the second pothole array layer are set on flexible substrates, wherein the flexible base board includes aobvious
Show region and peripheral region, the first pothole array layer and the second pothole array layer overlapping, the first pothole array
Layer includes at least two first potholes, and the second pothole array layer includes at least two second potholes, first pothole and described
Second pothole is respectively positioned at the display area, and first pothole has the first depth, and second pothole is deep with second
Degree, first depth be less than second depth, first pothole in the plane where the flexible base board first
Or all overlapping Chong Die with second projection section of second pothole in the plane where the flexible base board is projected, it is described
Flexible base board is plastic base；
A2, buffer layer is set on the flexible base board, the buffer layer is located at the display area, and the buffer layer is extremely
Few a part fills first pothole and second pothole；
A3, switching device layer is set on the buffer layer, the switching device layer includes scan line, data line, film crystal
Pipe switch；
A4, display device layer is set on the switching device layer；
A41, planarization layer is set on the switching device layer；
A42, anode layer is set on the planarization layer；
A43, hole injection layer is set on the anode layer；
A44, hole transmission layer is set on the hole injection layer；
A45, luminous material layer is set on the hole transport layer；
A46, electron transfer layer is set on the luminous material layer；
A47, electron injecting layer is set on the electron transport layer；
A48, cathode layer is set on the electron injecting layer；
A5, cover board is set on the display device layer, the cover board is connected at the peripheral region with the flexible base board；
A6, sealant component is set at the peripheral region, wherein the sealant component is at the peripheral region and institute
State cover board and flexible base board contact, the sealant component be used to seal at the peripheral region cover board with it is described
Gap between flexible base board is mixed with structure in the sealant component and consolidates particle, the structure consolidate particle for plus
The structural strength of the strong sealant component；
A7, securing structure is set at the peripheral region, wherein the securing structure is used for institute at the peripheral region
Cover board is stated mutually to fix with the flexible base board；
After the step a4, and before the step a5, the step A further include:
A8, buffer protection plate is formed, the buffer protection plate includes flexible plate body and sphere；
A9, the buffer protection plate is set between the cover board and cathode layer；
Wherein, the step a8 includes:
A81, it is arranged to accommodate on the flexible plate body and cheats array, receiving hole array includes at least two receiving holes, receiving hole
With opening portion, the opening portion is towards the cover board；
A82, the setting sphere, the sphere are flexibly connected with receiving hole in the receiving is cheated, and the sphere is used for
It is in contact with the cover board, and for the sliding in the receiving is cheated, and for aobvious in the flexible Organic Light Emitting Diode
Show and movable supporting carried out to the cover board according to the bending situation of the cover board when panel bending so that the cover board with it is described
Spacing between cathode layer is maintained within a predetermined range；
The sphere is used to move back in receiving hole in the flexible organic LED display panel bending pre-
Positioning is set, and to carry out movable supporting to the cover board in the predetermined position, the predetermined position is curved to be conducive to the cover board
The position of folding；
The depth for accommodating hole is less than the diameter of the sphere；
The buffer protection plate further includes at least two flexible connection chain combinations, and the flexible connection chain combination is living including at least four
Dynamic connection chain；
A83, the four flexible connection chains in the flexible connection chain are connected with the sphere and receiving hole；It will be described
Be flexibly connected chain one end with it is described accommodate hole side wall connect, and by it is described flexible connection chain the other end and the ball
Body connection；
A84, the buffer protection plate further include structural strengthening component array, cheat array backwards to the receiving in the flexible plate body
One side the structural strengthening component array is set, the structural strengthening component array includes at least two structural strengthening components；
The position of the structural strengthening component is corresponding with the position for accommodating hole；The structural strengthening component is used for described soft
Property plate body in described accommodate carry out structural strengthening at the corresponding position in hole；
A85, through-hole is set at the bottom for accommodating hole, the through-hole is through the flexible plate body；
A86, the inner wall setting becket in the through-hole；
A87, the flexible connection chain is passed through into the becket, and is connect with the structural strengthening component；
The buffer protection plate further includes at least two connecting rods, the connecting rod is connect with the two structural strengthening components, institute
Stating connecting rod is flexible link.
2. the manufacturing method of flexibility organic LED display device according to claim 1, which is characterized in that described
It is plastic grain that structure, which consolidates particle,.
3. a kind of manufacturing method of flexibility organic LED display panel, which is characterized in that the method includes following steps
It is rapid:
C, the first pothole array layer and the second pothole array layer are set on flexible substrates, wherein the flexible base board includes aobvious
Show region and peripheral region, the first pothole array layer and the second pothole array layer overlapping, the first pothole array
Layer includes at least two first potholes, and the second pothole array layer includes at least two second potholes, first pothole and described
Second pothole is respectively positioned at the display area, and first pothole has the first depth, and second pothole is deep with second
Degree, first depth be less than second depth, first pothole in the plane where the flexible base board first
Or all overlapping Chong Die with second projection section of second pothole in the plane where the flexible base board is projected, it is described
Flexible base board is plastic base；
D, buffer layer is set on the flexible base board, and the buffer layer is located at the display area, and the buffer layer is extremely
Few a part fills first pothole and second pothole；
E, switching device layer is set on the buffer layer, and the switching device layer includes scan line, data line, thin film transistor (TFT)
Switch；
F, display device layer is set on the switching device layer；
F1, planarization layer is set on the switching device layer；
F2, anode layer is set on the planarization layer；
F3, hole injection layer is set on the anode layer；
F4, hole transmission layer is set on the hole injection layer；
F5, luminous material layer is set on the hole transport layer；
F6, electron transfer layer is set on the luminous material layer；
F7, electron injecting layer is set on the electron transport layer；
F8, cathode layer is set on the electron injecting layer；
G, cover board is set on the display device layer, wherein the cover board at the peripheral region with the flexible base board
It is connected；
H, sealant component is set at the peripheral region, wherein the sealant component is at the peripheral region and institute
State cover board and flexible base board contact, the sealant component be used to seal at the peripheral region cover board with it is described
Gap between flexible base board is mixed with structure in the sealant component and consolidates particle, the structure consolidate particle for plus
The structural strength of the strong sealant component；
I, securing structure is set at the peripheral region, wherein the securing structure is used for institute at the peripheral region
Cover board is stated mutually to fix with the flexible base board.
4. the manufacturing method of flexibility organic LED display panel according to claim 3, which is characterized in that described
It is plastic grain that structure, which consolidates particle,.
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| CN202693965U (en) * | 2012-07-25 | 2013-01-23 | 北京京东方光电科技有限公司 | Array substrate and display device |
| CN103681742A (en) * | 2012-08-29 | 2014-03-26 | 乐金显示有限公司 | Organic light emitting display and manufacturing method thereof |
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| US7394153B2 (en) * | 1999-12-17 | 2008-07-01 | Osram Opto Semiconductors Gmbh | Encapsulation of electronic devices |
| US6936131B2 (en) * | 2002-01-31 | 2005-08-30 | 3M Innovative Properties Company | Encapsulation of organic electronic devices using adsorbent loaded adhesives |
| CN1826689A (en) * | 2003-07-24 | 2006-08-30 | 松下电器产业株式会社 | Wiring board embedded with spherical semiconductor element |
| JP4614652B2 (en) * | 2003-11-27 | 2011-01-19 | 株式会社半導体エネルギー研究所 | Thin film transistor manufacturing method and display device manufacturing method |
| JP4396827B2 (en) * | 2004-02-12 | 2010-01-13 | 東北パイオニア株式会社 | Manufacturing method of organic EL panel |
| CN105702624A (en) * | 2016-03-30 | 2016-06-22 | 武汉华星光电技术有限公司 | Laminated flexible substrate and production method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202693965U (en) * | 2012-07-25 | 2013-01-23 | 北京京东方光电科技有限公司 | Array substrate and display device |
| CN103681742A (en) * | 2012-08-29 | 2014-03-26 | 乐金显示有限公司 | Organic light emitting display and manufacturing method thereof |
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